Summary
この調査レポートは、中小規模の企業が勝負できる半導体技術分野を特定しています。
In this report we identify areas of semiconductor-related technologies where a small or mid-sized company can compete against larger competitors. These high-tech applications segmented as those are fabricated on 300mm wafers and those built on non-300mm wafers.
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Table of Contents
Table of Contents
Chapter 1 Introduction 1-1
Chapter 2 Niche Markets for PROCESSES for 300mm Wafers 2-1
2.1 Introduction 2-1
2.2 Wafer Level Processing (WLP) 2-3
2.2.1 Introduction 2-3
2.2.2 Flip Chip/WLP Processing Issues and Trends 2-4
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Wafer Bumping 2-4
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Wafer Level Packaging 2-8
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Pad Redistribution 2-12
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Wafer Bumping Costs 2-18
2.2.3 Lithography Issues And Trends 2-20
2.2.4 UBM Etch Issues And Trends 2-21
2.2.5 Metallization Issues and Trends 2-25
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Gold Bumping Metallization 2-25
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Solder Bumping Metallization 2-27
2.2.6 Analysis of WLP Market 2-29
2.3 3-D TSV 2-32
2.3.1 Insight Into Critical Issues 2-32
2.3.2 Cost Structure 2-33
2.3.3 Critical Processing Technologies 2-40
2.3.4 Evaluation Of Critical Development Segments 2-46
2.3.5 TSV Device Forecast 2-52
2.4 Non-volatile Memory Devices MRAM, RRAM and FeRAM 2-55
2.4.1 Processing Requirements for MRAMs 2-60
2.4.2 Processing Requirements for RRAMs 2-62
2.4.3 Processing Requirements for FeRAMs 2-65
2.4.4 Roadmap for Commercialization 2-67
2.5 Ultrathin Wafers 2-70
2.5.1 Applications for Ultrathin Wafers 2-70
2.5.2 Substrate Thinning 2-71
2.5.3 Backside Metallization Requirements 2-77
2.5.4 Surface Stress Relief 2-79
2.5.5 Ultrathin Wafer Market 2-81
Chapter 3 Niche Markets for EQUIPMENT for SUB 300mm Wafers 3-1
3.1 Introduction 3-1
3.2 MEMs 3-3
3.2.1 The MEMS Market Infrastructure 3-3
3.2.2 Forecast Of The Key Applications And Markets 3-4
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MEMS Device Market Forecast 3-4
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MEMS System Market Forecast 3-16
3.2.3 Markets for Equipment and Materials Suppliers 3-19
3.3 HB-LEDs 3-39
3.3.1 Recent Progress in High Brightness LED Technology and Applications 3-39
3.3.2 Processing Equipment 3-48
3.3.3 Materials of Construction 3-60
3.3.4 OLED Manufacturing 3-64
3.3.5 Outlook for the Worldwide OLED Market 3-67
3.3.6 Outlook for the Worldwide HB-LED Market 3-71
3.4 Compound Semiconductors 3-82
3.4.1 GaAs Devices 3-82
3.4.2 Equipment Trends 3-91
3.4.3 Wafer Sizes 3-103
3.4.4 GaAs IC Market Forecast 3-106
3.4.5 Competing Against SiGe 3-108
3.5 Thin Film Read/Write Heads for HDD 3-116
3.5.1 Trends in HDDs 3-116
3.5.2 Recording Head Market Forecast 3-125
3.5.3 Head Processing 3-128
3.5.4 Head Fabrication - CMP, Deposition, Lithography 3-133
3.5.5 CMP Challenges 3-138
3.5.6 Lithography Challenges 3-144
3.6 Bulk Acoustic Wave (BAW) 3-147
3.6.1 Basic Elements of the BAW Device 3-151
3.6.2 AlN Layer Quality Requirements 3-154
3.6.3 Equipment Requirements for BAW and FBAR Filtering Devices 3-158
3.6.4 Bulk Acoustic Wave (BAW) Market 3-159
List of Tables
2.1 Common UBM Stacks For Solder And Gold Bumping 2-5
2.2 Solder Bumping Guidelines 2-7
2.3 ITRS Pin Counts For Different Applications 2-9
2.4 Pillar-WLP CSP Guidelines 2-14
2.5 Pad Redistribution Guidelines 2-17
2.6 UBM Film Etchants 2-24
2.7 Common UBM Stacks For Gold And Solder Bumping 2-26
2.8 WLP Demand By Device (Units) 2-30
2.9 WLP Demand By Device (Wafers) 2-31
2.10 Forecast Of TSV Devices By Wafers 2-53
3.1 MEMS Device Markets 3-5
3.2 MEMS System Markets 3-18
3.3 MEMS Equipment Markets 3-20
3.4 Color, Wavelength Material Of LED 3-41
3.5 Comparison of LED, HB-LED, UHB-LED Characteristics 3-47
3.6 Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap 3-54
3.7 Process Control Metrics 3-56
3.8 Production Method for Various LEDs 3-61
3.9 GaAs IC Market Forecast 3-107
3.10 Comparison Of Piezoelectric Materials For BAW Applications 3-155
List of Figures
2.1 Solder Bumping Process 2-6
2.2 Pillar-WLPCSP Process 2-13
2.3 Pad Redistribution Process 2-16
2.4 Via First (iTSV) Cost Of Ownership 2-34
2.5 Via First (iTSV) Cost Of Ownership Front And Back Side 2-36
2.6 Via First (iTSV) Process Flow 2-37
2.7 iTSV Versus pTSV Cost Of Ownership 2-38
2.8 Effect Of TSV Depth And Diameter On Cost 2-39
2.9 Illustration Of Bosch Process 2-43
2.10 Process And Equipment Flow For EMC3D Consortium Members 2-47
2.11 Various TSV Integration Schemes 2-49
2.12 Forecast OF TSV Devices By Wafers 2-54
3.1 Operation of LED 3-40
3.2 Market drivers for LED Biz and Applications 3-44
3.3 SSL vs. Classical Technologies 3-45
3.4 LED Performance vs. Traditional Light Sources 3-46
3.5 Pareto Analysis Of SSL Manufacturing Costs 3-51
3.6 Nanoimprint Lithography System 3-59
3.7 Regular LED (white) Front-End Steps 3-62
3.8 Schematic of AMOLED 3-68
3.9 Active Matrix OLED Capacity and Demand Forecast 3-69
3.10 LED Market by Sector 3-80
3.11 Worldwide LED Market Forecast 3-81
3.12 Schematic of GaAs MESFET 3-83
3.13 Schematic of GaAs HEMT Device 3-85
3.14 Schematic of GaAs HBT Device 3-88
3.15 Schematic of GaAs HBT Device 3-90
3.16 pHEMT MMIC Process Flow Chart 3-92
3.17 0.15 Micron 3MI Process Cross Section 3-98
3.18 InGaP HBT Process 3-101
3.19 Worldwide SiGe Market Forecast 3-114
3.20 Hard Disk Drive Roadmap 3-117
3.21 Decrease In Average Price Of Storage 3-118
3.22 Heads Per Drive 3-120
3.23 Increase In Areal Density 3-122
3.24 Market Forecast Of Recording Head Consumption 3-126
3.25 Heads Per Drive Forecast 3-127
3.26 Thin Film Head Structure 3-129
3.27 Critical Features In Thin Film Head Structure 3-130
3.28 Spin Valve Head Structure 3-131
3.29 Cross-Sectional View TFH Stacks 3-134
3.30 Cross-Sectional View Of A TFH Design 3-135
3.31 CMP Slurry System For Tfh Wafer Polishing 3-142
3.32 Critical Feature Trends In Thin Film Heads 3-145
3.33 Application Space For Rf Filters 3-149
3.34 FBAR Diagram 3-152
3.35 BAW-SMR Diagram 3-153
3.36 RF Front-End Filters In Mobile Devices 3-160
