モールドインターコネクトデバイス(MID)市場:製品タイプ(アンテナ&コネクティビティ、センサー)、プロセス(レーザー直接構造化、2ショットモールド)、産業(家電、通信、医療)、地域別 - 2027年までの世界予測Molded Interconnect Device (MID) Market by Product Type (Antennae & Connectivity, Sensor),by Process (Laser Direct Structuring, Two-shot Molding), by Industry (Consumer Electronics, Telecommunication, Medical) and Geography - Global Forecast to 2027 モールド配線デバイス(MID)市場は、2022年の14億米ドルから2027年には27億米ドルに成長すると予測されており、予測期間中の年平均成長率は13.6%と予想されています。モールド配線デバイス(MID)市場成長の主な原... もっと見る
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サマリーモールド配線デバイス(MID)市場は、2022年の14億米ドルから2027年には27億米ドルに成長すると予測されており、予測期間中の年平均成長率は13.6%と予想されています。モールド配線デバイス(MID)市場成長の主な原動力は、自動車産業における進歩の拡大です。モールド配線デバイス(MID)市場は、コネクタとスイッチの市場規模が予測期間中大きい コネクターとスイッチは、主に自動車産業と医療産業で使用されています。自動車業界では、コネクターはナビゲーション機器、インフォテインメント・システム、カメラなどに使用されています。コネクターには、組立作業性の向上、電気的・機械的信頼性、小型化などを目的にMID技術が採用されています。スイッチの限られたスペースをMID技術で解決する。 通信分野では、予測期間中に2番目に高いCAGRを記録する。 通信分野では、MIDは携帯電話や固定電話、リモコン、衛星、基地局、ネットワーク機器などのグローバルな通信インフラに使用されている。一般に、ネットワークを利用した通信は、セントラルオフィス、アウトサイドプラント、モビリティという3つの大きなビジネス分野で利用されている。セントラルオフィスとは、大量の通信を交換処理する大規模な施設、アウトサイドプラントとは、商用および家庭用固定電話の分配交換を行う交換局、そしてモビリティとは、タワー型の電源とアースを用いて移動体通信の伝送を支援する分野である。 予測期間中、北米で最も高いCAGRで成長するのは米国。 米国は、北米でMIDを扱うプレイヤーの主要な収益源である。2021年、米国は、モレックス、Arlington Plating Company、Amphenol Corporation、京セラAVX Corporationなどの大手メーカーの存在により、北米のMID市場で最高のCAGRを占めた。これらのメーカーは、さまざまな用途の機器やデバイスの電気的接続性と性能を向上させるために、包括的なMID製品を提供しています。米国では、コンシューマーエレクトロニクス、医療、テレコミュニケーション、産業用途がMIDの需要を牽引しています。米国のコンシューマーエレクトロニクス市場は継続的に成長しています。また、民生用電子機器、自動車部品、医療機器、その他の機器において、小型化されたパッケージへの需要が高まり始めていることが確認されています。 本調査では、二次調査によって得られたいくつかのセグメントとサブセグメントの市場規模を決定・検証する過程で、モールド配線デバイス(MID)市場の主要関係者に対して広範な一次インタビューを実施した。以下は、本レポートの主要参加者のプロフィールの内訳である。 - 企業タイプ別:ティア1:35%、ティア2:45%、ティア3:20%。 - 役職別:Cレベル経営者35%、取締役25%、その他40 - 地域別:北米45%、アジア太平洋地域30%、ヨーロッパ20%、RoW 5 モールドインターコネクトデバイス(MID)市場は、モレックス(米国)、TE Connectivity(スイス)、アンフェノール(米国)、LPKF Laser & Electronics(ドイツ)、タオグラス(ダブリン)、ハーティング(ドイツ)、Arlington Plating Company(米国)、MID Solutions(ドイツ)、2E Mechatronic(ドイツ)、京セラAVX(米国)、Johnan(日本)、Teprosa(ドイツ)で構成されている。Sunway Communication(中国)、Axon Cable(フランス)、S2P(フランス)、Suzhou Cicor Technology(中国)、TactoTek(フィンランド)、DuraTech(アメリカ)、Tekra(アメリカ)、Yomura Technologies(台湾)、MacDermid Alpha Electronics(アメリカ)、Galtronics(アメリカ)、Yazaki Corporation(日本)、Chogori Technology(日本)、 Suzhou Zeeteq Electronics(日本)、Toyo Connector(日本)およびSINOPLAST(中国)です。 調査対象範囲 このレポートでは、モールド配線デバイス(MID)市場を製品タイプ、プロセス、業種、地域別に定義、説明、予測しています。モールド配線デバイス(MID)市場の成長に影響を与える推進要因、阻害要因、機会、課題などに関する詳細な情報を提供しています。また、製品の発売、買収、拡大、契約、パートナーシップ、市場での成長のために主要企業が行った開発など、競争力のある開発についても分析しています。 本レポートを購入する理由 本レポートは、モールド型インターコネクトデバイス(MID)市場のリーダー/新規参入企業に対して、以下のような点で貢献します。 1.モールド配線デバイス(MID)市場を包括的にセグメント化し、地域ごとのすべてのサブセグメントについて最も近い市場規模の推定を提供します。 2.本レポートは、利害関係者が市場の鼓動を理解するのに役立ち、モールド配線デバイス(MID)市場に関する主要な推進要因、阻害要因、課題、機会に関する情報を提供する。 3.本レポートは、利害関係者が競合他社をより良く理解し、モールド配線デバイス(MID)市場における自社のポジションを向上させるための洞察を得るのに役立つものです。競合環境のセクションでは、競合のエコシステムを説明しています。 目次1 INTRODUCTION 251.1 STUDY OBJECTIVES 25 1.2 MARKET DEFINITION 25 1.3 INCLUSIONS AND EXCLUSIONS 26 1.4 STUDY SCOPE 26 1.4.1 MARKETS COVERED 26 FIGURE 1 MOLDED INTERCONNECT DEVICE (MID) MARKET: SEGMENTATION 26 FIGURE 2 GEOGRAPHIC SCOPE 27 FIGURE 3 YEARS CONSIDERED 27 1.5 CURRENCY CONSIDERED 27 1.6 LIMITATIONS 28 1.7 STAKEHOLDERS 28 1.8 SUMMARY OF CHANGES 28 2 RESEARCH METHODOLOGY 29 2.1 RESEARCH DATA 29 FIGURE 4 PROCESS FLOW: MOLDED INTERCONNECT DEVICE (MID) MARKET SIZE ESTIMATION 29 FIGURE 5 MOLDED INTERCONNECT DEVICE (MID) MARKET: RESEARCH DESIGN 30 2.1.1 SECONDARY AND PRIMARY RESEARCH 31 2.1.2 SECONDARY DATA 31 2.1.2.1 Secondary sources 32 2.1.2.2 List of key secondary sources 32 2.1.3 PRIMARY DATA 32 2.1.3.1 Primary sources 33 2.1.3.2 Key industry insights 33 2.1.3.3 Primary interviews with experts 34 2.1.3.4 List of key primary respondents 34 2.1.3.5 Breakdown of primaries 34 2.2 MARKET SIZE ESTIMATION 35 2.2.1 BOTTOM-UP APPROACH 35 2.2.1.1 Approach for arriving at market size by bottom-up analysis 35 FIGURE 6 MOLDED INTERCONNECT DEVICE MARKET: BOTTOM-UP APPROACH 36 2.2.2 TOP-DOWN APPROACH 36 2.2.2.1 Approach for deriving market size by top-down analysis 36 FIGURE 7 MOLDED INTERCONNECT DEVICE (MID) MARKET: TOP-DOWN APPROACH 37 2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 37 FIGURE 8 DATA TRIANGULATION 37 2.4 RESEARCH ASSUMPTIONS 38 2.5 LIMITATIONS 39 2.6 RISK ASSESSMENT 39 TABLE 1 RISK ASSESSMENT 39 3 EXECUTIVE SUMMARY 40 FIGURE 9 LASER DIRECT STRUCTURING SEGMENT TO LEAD MOLDED INTERCONNECT DEVICE MARKET DURING FORECAST PERIOD 40 FIGURE 10 ANTENNAE AND CONNECTIVITY MODULES TO HOLD LARGEST SHARE OF MOLDED INTERCONNECT DEVICE MARKET BY 2027 41 FIGURE 11 AUTOMOTIVE TO RECORD HIGHEST CAGR IN MOLDED INTERCONNECT DEVICE MARKET DURING FORECAST PERIOD 41 FIGURE 12 ASIA PACIFIC LIKELY TO BE FASTEST-GROWING MARKET FOR MOLDED INTERCONNECT DEVICES DURING FORECAST PERIOD 42 4 PREMIUM INSIGHTS 43 4.1 ATTRACTIVE GROWTH OPPORTUNITIES FOR MARKET PLAYERS 43 FIGURE 13 INCREASING USE OF MOLDED INTERCONNECT DEVICES IN AUTOMOTIVE INDUSTRY TO OFFER OPPORTUNITIES FOR MARKET GROWTH FROM 2022 TO 2027 43 4.2 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY TYPE 44 FIGURE 14 SENSORS TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD 44 4.3 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL 44 FIGURE 15 CONSUMER ELECTRONICS VERTICAL TO HOLD LARGEST SHARE OF MID MARKET DURING FORECAST PERIOD 44 4.4 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS AND REGION 45 FIGURE 16 LDS TO HAVE LARGEST MARKET SIZE FOR LDS PROCESS DURING FORECAST PERIOD 45 4.5 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY GEOGRAPHY (2027) 46 FIGURE 17 MID MARKET TO RECORD HIGHEST CAGR IN CHINA IN 2027 46 5 MARKET OVERVIEW 47 5.1 INTRODUCTION 47 5.2 MARKET DYNAMICS 47 FIGURE 18 RISING DEMAND FOR MINIATURIZATION IN CONSUMER ELECTRONICS VERTICAL DRIVING MID MARKET 47 5.2.1 DRIVERS 48 5.2.1.1 Growing use of LDS in production of 5G antennas 48 5.2.1.2 Increasing use of MIDs in medical devices 48 5.2.1.3 Rising demand for miniaturization in consumer electronics industry 48 5.2.1.4 Intensifying need to reduce e-waste 48 5.2.2 RESTRAINTS 49 5.2.2.1 Technological monopoly of LDS equipment manufacturers 49 5.2.3 OPPORTUNITIES 49 5.2.3.1 Rising use of MIDs in automotive industry 49 5.2.3.2 Expanding IoT ecosystem 49 5.2.3.3 Opportunities for chip-level optical interconnects 49 5.2.4 CHALLENGES 49 5.2.4.1 Incompatibility with electronic packages 49 5.3 VALUE CHAIN ANALYSIS 50 FIGURE 19 MID MARKET: VALUE CHAIN 50 5.3.1 RESEARCH AND DEVELOPMENT 50 5.3.2 MANUFACTURING 50 5.3.3 ASSEMBLY 51 5.3.4 MARKETING AND SALES 51 5.3.5 END-USERS 51 5.4 MID ECOSYSTEM ANALYSIS 51 FIGURE 20 MID ECOSYSTEM 51 TABLE 2 MID MARKET: ECOSYSTEM 52 5.5 PRICING ANALYSIS 53 TABLE 3 AVERAGE SELLING PRICE TRENDS FOR PRODUCTS 53 5.6 TRENDS AND DISTRIBUTION 53 FIGURE 21 REVENUE SHIFT FOR MID MARKET 54 5.7 TECHNOLOGY ANALYSIS 54 5.7.1 3D MOLDED INTERCONNECT DEVICES 54 5.7.2 LASER PLASMA PATTERNING 54 5.8 PORTER’S FIVE FORCES ANALYSIS 55 TABLE 4 MID MARKET: PORTER’S FIVE FORCES ANALYSIS 55 5.9 KEY STAKEHOLDERS AND BUYING CRITERIA 56 5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS 56 FIGURE 22 INFLUENCE OF STAKEHOLDERS IN BUYING PROCESS FOR TOP 3 VERTICALS 56 TABLE 5 INFLUENCE OF STAKEHOLDERS IN BUYING PROCESS FOR TOP 3 VERTICALS (%) 56 5.9.2 BUYING CRITERIA 56 FIGURE 23 KEY BUYING CRITERIA FOR TOP 3 VERTICALS 56 TABLE 6 KEY BUYING CRITERIA FOR TOP 3 VERTICALS 57 5.10 CASE STUDY ANALYSIS 57 5.10.1 MID SOLUTIONS 57 TABLE 7 SIEMENS COLLABORATED WITH LPKF LASER & ELECTRONICS FOR DEVELOPING MID-BASED HEARING AID 57 5.10.2 3D MID TECHNOLOGY 58 TABLE 8 3D MID COMPONENTS INSPECTION USING VISCOM S6056 MID 58 5.11 TRADE ANALYSIS 58 5.11.1 TRADE DATA FOR HS CODE 947330 58 FIGURE 24 IMPORT DATA FOR HS CODE 947330, BY COUNTRY, 2017−2021 (USD THOUSAND) 58 FIGURE 25 EXPORT DATA FOR HS CODE 947330, BY COUNTRY, 2017−2021 (USD THOUSAND) 59 5.12 TARIFF ANALYSIS 59 TABLE 9 TARIFFS DATA FOR HS 947330 59 5.13 PATENT ANALYSIS 60 FIGURE 26 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS 60 TABLE 10 TOP 10 PATENT OWNERS IN US IN LAST 10 YEARS 60 FIGURE 27 NUMBER OF PATENTS GRANTED PER YEAR FROM 2012 TO 2022 61 TABLE 11 LIST OF PATENTS 62 5.14 KEY CONFERENCES AND EVENTS, 2022–2023 63 TABLE 12 MID MARKET: DETAILED LIST OF CONFERENCES AND EVENTS 63 5.15 REGULATORY LANDSCAPE 64 5.15.1 REGULATIONS PERTAINING TO ELECTRIC AND ELECTRONIC PRODUCTS 64 TABLE 13 REGULATIONS IN US 64 5.15.2 STANDARDS RELATED TO ELECTRICAL EQUIPMENT 65 TABLE 14 STANDARDS AND DESCRIPTION 65 5.15.3 RESTRICTION OF HAZARDOUS SUBSTANCES (ROHS) AND WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT (WEEE) 65 6 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PRODUCT TYPE 67 6.1 INTRODUCTION 68 FIGURE 28 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PRODUCT TYPE 68 FIGURE 29 ANTENNAE AND CONNECTIVITY MODULES TO ACCOUNT FOR LARGEST MARKET SIZE DURING FORECAST PERIOD 68 TABLE 15 MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 69 TABLE 16 MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 69 6.2 ANTENNAE AND CONNECTIVITY MODULES 69 6.2.1 EXTENSIVELY USED IN CONSUMER ELECTRONICS 69 TABLE 17 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 70 TABLE 18 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 70 TABLE 19 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 70 TABLE 20 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 71 6.3 SENSORS 71 6.3.1 USED IN INDUSTRIAL APPLICATIONS 71 TABLE 21 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 71 TABLE 22 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 72 TABLE 23 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 72 TABLE 24 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 72 6.4 CONNECTORS AND SWITCHES 73 6.4.1 USED IN NAVIGATION DEVICES 73 TABLE 25 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 73 TABLE 26 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 73 TABLE 27 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 74 TABLE 28 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 74 6.5 LIGHTING SYSTEMS 74 6.5.1 MOLDED INTERCONNECT DEVICES MAKE LIGHTING SYSTEMS COST-EFFICIENT AND EFFECTIVE 74 TABLE 29 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 75 TABLE 30 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 75 TABLE 31 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 75 TABLE 32 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 76 6.6 OTHERS 76 TABLE 33 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 76 TABLE 34 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 77 TABLE 35 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 77 TABLE 36 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 77 7 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS 78 7.1 INTRODUCTION 79 FIGURE 30 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS 79 FIGURE 31 LASER DIRECT STRUCTURING (LDS) TO REGISTER HIGHEST CAGR IN MID MARKET DURING FORECAST PERIOD 79 TABLE 37 MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 80 TABLE 38 MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 80 7.2 LASER DIRECT STRUCTURING (LDS) 80 7.2.1 CAN INTEGRATE MORE ELECTRONIC CIRCUITS INTO SMALLER SPACES 80 TABLE 39 LASER DIRECT STRUCTURING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION 2018–2021 (USD MILLION) 81 TABLE 40 LASER DIRECT STRUCTURING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION 2022–2027 (USD MILLION) 81 7.3 TWO-SHOT MOLDING 81 7.3.1 USED FOR HIGH-VOLUME PRODUCTION OF MOLDED INTERCONNECT DEVICES 81 TABLE 41 TWO-SHOT MOLDING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 82 TABLE 42 TWO-SHOT MOLDING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 82 7.4 FILM TECHNIQUES 82 7.4.1 USED FOR PRODUCTION OF FLAT SURFACES 82 TABLE 43 FILM TECHNIQUES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 83 TABLE 44 FILM TECHNIQUES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 83 8 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL 84 8.1 INTRODUCTION 85 FIGURE 32 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL 85 FIGURE 33 AUTOMOTIVE SEGMENT TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 86 TABLE 45 MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 86 TABLE 46 MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 86 8.2 TELECOMMUNICATIONS 87 8.2.1 USES MOLDED INTERCONNECT DEVICES FOR WIRELESS COMMUNICATIONS 87 TABLE 47 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 87 TABLE 48 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027(USD MILLION) 88 TABLE 49 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 88 TABLE 50 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027(USD MILLION) 88 8.3 CONSUMER ELECTRONICS 89 8.3.1 USES MOLDED INTERCONNECT DEVICES IN ANTENNAS 89 TABLE 51 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 89 TABLE 52 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 89 TABLE 53 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 90 TABLE 54 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 90 8.4 AUTOMOTIVE 90 8.4.1 DEPLOYS MOLDED INTERCONNECT DEVICES IN SMART VEHICLES 90 TABLE 55 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 91 TABLE 56 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 91 TABLE 57 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 91 TABLE 58 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 92 8.5 MEDICAL 92 8.5.1 NEED FOR MINIATURIZED MEDICAL DEVICES 92 TABLE 59 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 92 TABLE 60 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 93 TABLE 61 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 93 TABLE 62 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 93 8.6 INDUSTRIAL 94 8.6.1 MOLDED INTERCONNECT DEVICES ARE USED IN INDUSTRIAL SENSORS 94 TABLE 63 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 94 TABLE 64 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 94 TABLE 65 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 95 TABLE 66 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 95 8.7 MILITARY & AEROSPACE 95 8.7.1 GROWING DEMAND FOR RADAR AND ELECTRONIC WARFARE EQUIPMENT 95 TABLE 67 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 96 TABLE 68 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 96 TABLE 69 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 96 TABLE 70 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 97 9 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY REGION 98 9.1 INTRODUCTION 99 FIGURE 34 MOLDED INTERCONNECT DEVICE MARKET IN CHINA TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 99 TABLE 71 MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 100 TABLE 72 MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 100 9.2 NORTH AMERICA 100 FIGURE 35 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 101 TABLE 73 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 101 TABLE 74 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 101 TABLE 75 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 102 TABLE 76 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 102 TABLE 77 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 102 TABLE 78 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 103 TABLE 79 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 103 TABLE 80 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 103 9.2.1 US 104 9.2.1.1 Increase in adoption of miniaturized packages 104 9.2.2 CANADA 104 9.2.2.1 Government initiatives and investments to support semiconductors manufacturing 104 9.3 EUROPE 106 FIGURE 36 EUROPE: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 106 TABLE 81 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 106 TABLE 82 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 107 TABLE 83 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 107 TABLE 84 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 107 TABLE 85 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 108 TABLE 86 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 108 TABLE 87 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 108 TABLE 88 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 109 9.3.1 GERMANY 109 9.3.1.1 Increasing demand for ADAS 109 9.3.2 FRANCE 109 9.3.2.1 Presence of developed communication network 109 9.3.3 UK 110 9.3.3.1 Heightened demand from medical vertical 110 9.3.4 REST OF EUROPE 110 9.4 ASIA PACIFIC 110 FIGURE 37 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 111 TABLE 89 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 111 TABLE 90 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 112 TABLE 91 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 112 TABLE 92 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 112 TABLE 93 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 113 TABLE 94 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 113 TABLE 95 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 113 TABLE 96 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 114 9.4.1 CHINA 114 9.4.1.1 Increase in medical equipment manufacturing 114 9.4.2 JAPAN 115 9.4.2.1 Increase in demand for consumer electronics and automobiles 115 9.4.3 SOUTH KOREA 115 9.4.3.1 Expansion of manufacturing sector 115 9.4.4 REST OF ASIA PACIFIC 115 9.5 REST OF THE WORLD (ROW) 115 FIGURE 38 REST OF THE WORLD: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 116 TABLE 97 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 116 TABLE 98 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 117 TABLE 99 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 117 TABLE 100 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 117 TABLE 101 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 118 TABLE 102 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 118 TABLE 103 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 118 TABLE 104 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 119 9.5.1 SOUTH AMERICA 119 9.5.1.1 High adoption of wireless communication 119 9.5.2 MIDDLE EAST AND AFRICA 120 9.5.2.1 Favorable government initiatives and high military investments 120 10 COMPETITIVE LANDSCAPE 121 10.1 OVERVIEW 121 10.2 THREE-YEAR REVENUE ANALYSIS OF TOP 5 PLAYERS 121 FIGURE 39 REVENUE ANALYSIS, 2019–2021 (USD BILLION) 121 10.3 KEY PLAYER STRATEGIES/RIGHT TO WIN 122 TABLE 105 KEY STRATEGIES OF TOP PLAYERS IN MID MARKET 122 10.4 MARKET SHARE ANALYSIS (2021) 123 TABLE 106 MID MARKET: MARKET SHARE ANALYSIS 123 FIGURE 40 MARKET SHARE ANALYSIS: MID MARKET, 2021 123 10.5 COMPANY EVALUATION QUADRANT, 2021 125 10.5.1 STARS 125 10.5.2 PERVASIVE PLAYERS 125 10.5.3 EMERGING LEADERS 125 10.5.4 PARTICIPANTS 125 FIGURE 41 MID MARKET: COMPANY EVALUATION QUADRANT, 2021 126 10.5.5 COMPANY FOOTPRINT 127 TABLE 107 COMPANY FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 127 TABLE 108 COMPANY VERTICAL FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 128 TABLE 109 COMPANY PROCESS FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 129 TABLE 110 COMPANY REGIONAL FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 130 10.6 SMALL AND MEDIUM-SIZED ENTERPRISE (SME) EVALUATION QUADRANT, 2021 131 10.6.1 PROGRESSIVE COMPANIES 131 10.6.2 RESPONSIVE COMPANIES 131 10.6.3 DYNAMIC COMPANIES 131 10.6.4 STARTING BLOCKS 131 FIGURE 42 MOLDED INTERCONNECT DEVICE (MID) MARKET: SME EVALUATION QUADRANT, 2021 132 TABLE 111 MID MARKET: DETAILED LIST OF KEY STARTUPS/SMES 133 10.7 COMPETITIVE SCENARIO 133 TABLE 112 MOLDED INTERCONNECT DEVICE (MID) MARKET: PRODUCT LAUNCHES, JANUARY 2020–JANUARY 2022 133 TABLE 113 MOLDED INTERCONNECT DEVICE (MID) MARKET: DEALS, JANUARY 2020–JANUARY 2022 134 11 COMPANY PROFILES 136 11.1 KEY COMPANIES 136 (Business overview, Products offered, Recent Developments, MNM view)* 11.1.1 MOLEX 136 TABLE 114 MOLEX: BUSINESS OVERVIEW 136 TABLE 115 MOLEX: PRODUCTS/SOLUTIONS/SERVICES OFFERED 136 TABLE 116 MOLEX: DEALS 137 11.1.2 LPKF LASER & ELECTRONICS 139 TABLE 117 LPKF LASER & ELECTRONICS: BUSINESS OVERVIEW 139 FIGURE 43 LPKF LASER & ELECTRONICS: COMPANY SNAPSHOT 140 TABLE 118 LPKF LASER & ELECTRONICS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 140 TABLE 119 LPKF LASER & ELECTRONICS: PRODUCT LAUNCHES 141 11.1.3 TE CONNECTIVITY 143 TABLE 120 TE CONNECTIVITY: BUSINESS OVERVIEW 143 FIGURE 44 TE CONNECTIVITY: COMPANY SNAPSHOT 144 TABLE 121 TE CONNECTIVITY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 144 TABLE 122 TE CONNECTIVITY: PRODUCT LAUNCHES 145 TABLE 123 TE CONNECTIVITY: DEALS 145 11.1.4 TAOGLAS 146 TABLE 124 TAOGLAS: BUSINESS OVERVIEW 146 TABLE 125 TAOGLAS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 146 TABLE 126 TAOGLAS: PRODUCT LAUNCHES 146 TABLE 127 TAOGLAS: DEALS 147 11.1.5 AMPHENOL CORPORATION 148 TABLE 128 AMPHENOL CORPORATION: BUSINESS OVERVIEW 148 FIGURE 45 AMPHENOL CORPORATION: COMPANY SNAPSHOT 149 TABLE 129 AMPHENOL CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 149 TABLE 130 AMPHENOL CORPORATION: PRODUCT LAUNCHES 150 TABLE 131 AMPHENOL CORPORATION: DEALS 151 TABLE 132 AMPHENOL CORPORATION: OTHERS 151 11.1.6 HARTING 153 TABLE 133 HARTING: BUSINESS OVERVIEW 153 TABLE 134 HARTING: PRODUCTS/SOLUTIONS/SERVICES OFFERED 153 TABLE 135 HARTING: PRODUCT LAUNCHES 153 TABLE 136 HARTING: OTHERS 154 11.1.7 ARLINGTON PLATING COMPANY 155 TABLE 137 ARLINGTON PLATING COMPANY: BUSINESS OVERVIEW 155 TABLE 138 ARLINGTON PLATING COMPANY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 155 TABLE 139 ARLINGTON PLATING COMPANY: DEALS 155 TABLE 140 ARLINGTON PLATING COMPANY: OTHERS 156 11.1.8 MID SOLUTIONS GMBH 157 TABLE 141 MID SOLUTIONS GMBH: BUSINESS OVERVIEW 157 TABLE 142 MID SOLUTIONS GMBH: PRODUCTS/SOLUTIONS/SERVICES OFFERED 157 TABLE 143 MID SOLUTIONS GMBH: OTHERS 157 11.1.9 2E MECHATRONIC 158 TABLE 144 2E MECHATRONIC: BUSINESS OVERVIEW 158 TABLE 145 2E MECHATRONIC: PRODUCTS/SOLUTIONS/SERVICES OFFERED 158 TABLE 146 2E MECHATRONIC: OTHERS 158 11.1.10 KYOCERA AVX 159 TABLE 147 KYOCERA AVX: BUSINESS OVERVIEW 159 TABLE 148 KYOCERA AVX: PRODUCTS/SOLUTIONS/SERVICES OFFERED 159 TABLE 149 KYOCERA AVX: PRODUCT LAUNCHES 160 TABLE 150 KYOCERA AVX: DEALS 160 TABLE 151 KYOCERA AVX: OTHERS 161 11.1.11 JOHNAN 162 TABLE 152 JOHNAN: BUSINESS OVERVIEW 162 TABLE 153 JOHNAN: PRODUCTS/SOLUTIONS/SERVICES OFFERED 162 TABLE 154 JOHNAN: DEALS 162 TABLE 155 JOHNAN: OTHERS 163 11.2 OTHER IMPORTANT PLAYERS 164 11.2.1 TEPROSA 164 11.2.2 SUNWAY COMMUNICATION 164 11.2.3 AXON CABLE 165 11.2.4 S2P 165 11.2.5 SUZHOU CICOR TECHNOLOGY CO. LTD 166 11.2.6 TACTOTEK 166 11.2.7 DURATECH INDUSTRIES 167 11.2.8 TEKRA 167 11.2.9 YOMURA TECHNOLOGIES 168 11.2.10 MACDERMID ALPHA ELECTRONICS 168 11.2.11 GALTRONICS 169 11.2.12 YAZAKI CORPORATION 169 11.2.13 CHOGORI TECHNOLOGY 170 11.2.14 SUZHOU ZEETEK ELECTRONICS 170 11.2.15 TOYO CONNECTORS 171 11.2.16 SINOPLAST 171 *Details on Business overview, Products offered, Recent Developments, MNM view might not be captured in case of unlisted companies. 12 APPENDIX 172 12.1 DISCUSSION GUIDE 172 12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 175 12.3 CUSTOMIZATION OPTIONS 177 12.4 RELATED REPORTS 177 12.5 AUTHOR DETAILS 178
SummaryThe molded interconnect device (MID) market is expected to grow from USD1.4 billion in 2022 to USD 2.7billion by 2027; it is expected to grow at a CAGR of 13.6% during the forecast period. The major driving factors for the growth of the molded interconnect device (MID)market include the growing advancement in automotive vertical. Table of Contents1 INTRODUCTION 251.1 STUDY OBJECTIVES 25 1.2 MARKET DEFINITION 25 1.3 INCLUSIONS AND EXCLUSIONS 26 1.4 STUDY SCOPE 26 1.4.1 MARKETS COVERED 26 FIGURE 1 MOLDED INTERCONNECT DEVICE (MID) MARKET: SEGMENTATION 26 FIGURE 2 GEOGRAPHIC SCOPE 27 FIGURE 3 YEARS CONSIDERED 27 1.5 CURRENCY CONSIDERED 27 1.6 LIMITATIONS 28 1.7 STAKEHOLDERS 28 1.8 SUMMARY OF CHANGES 28 2 RESEARCH METHODOLOGY 29 2.1 RESEARCH DATA 29 FIGURE 4 PROCESS FLOW: MOLDED INTERCONNECT DEVICE (MID) MARKET SIZE ESTIMATION 29 FIGURE 5 MOLDED INTERCONNECT DEVICE (MID) MARKET: RESEARCH DESIGN 30 2.1.1 SECONDARY AND PRIMARY RESEARCH 31 2.1.2 SECONDARY DATA 31 2.1.2.1 Secondary sources 32 2.1.2.2 List of key secondary sources 32 2.1.3 PRIMARY DATA 32 2.1.3.1 Primary sources 33 2.1.3.2 Key industry insights 33 2.1.3.3 Primary interviews with experts 34 2.1.3.4 List of key primary respondents 34 2.1.3.5 Breakdown of primaries 34 2.2 MARKET SIZE ESTIMATION 35 2.2.1 BOTTOM-UP APPROACH 35 2.2.1.1 Approach for arriving at market size by bottom-up analysis 35 FIGURE 6 MOLDED INTERCONNECT DEVICE MARKET: BOTTOM-UP APPROACH 36 2.2.2 TOP-DOWN APPROACH 36 2.2.2.1 Approach for deriving market size by top-down analysis 36 FIGURE 7 MOLDED INTERCONNECT DEVICE (MID) MARKET: TOP-DOWN APPROACH 37 2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 37 FIGURE 8 DATA TRIANGULATION 37 2.4 RESEARCH ASSUMPTIONS 38 2.5 LIMITATIONS 39 2.6 RISK ASSESSMENT 39 TABLE 1 RISK ASSESSMENT 39 3 EXECUTIVE SUMMARY 40 FIGURE 9 LASER DIRECT STRUCTURING SEGMENT TO LEAD MOLDED INTERCONNECT DEVICE MARKET DURING FORECAST PERIOD 40 FIGURE 10 ANTENNAE AND CONNECTIVITY MODULES TO HOLD LARGEST SHARE OF MOLDED INTERCONNECT DEVICE MARKET BY 2027 41 FIGURE 11 AUTOMOTIVE TO RECORD HIGHEST CAGR IN MOLDED INTERCONNECT DEVICE MARKET DURING FORECAST PERIOD 41 FIGURE 12 ASIA PACIFIC LIKELY TO BE FASTEST-GROWING MARKET FOR MOLDED INTERCONNECT DEVICES DURING FORECAST PERIOD 42 4 PREMIUM INSIGHTS 43 4.1 ATTRACTIVE GROWTH OPPORTUNITIES FOR MARKET PLAYERS 43 FIGURE 13 INCREASING USE OF MOLDED INTERCONNECT DEVICES IN AUTOMOTIVE INDUSTRY TO OFFER OPPORTUNITIES FOR MARKET GROWTH FROM 2022 TO 2027 43 4.2 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY TYPE 44 FIGURE 14 SENSORS TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD 44 4.3 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL 44 FIGURE 15 CONSUMER ELECTRONICS VERTICAL TO HOLD LARGEST SHARE OF MID MARKET DURING FORECAST PERIOD 44 4.4 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS AND REGION 45 FIGURE 16 LDS TO HAVE LARGEST MARKET SIZE FOR LDS PROCESS DURING FORECAST PERIOD 45 4.5 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY GEOGRAPHY (2027) 46 FIGURE 17 MID MARKET TO RECORD HIGHEST CAGR IN CHINA IN 2027 46 5 MARKET OVERVIEW 47 5.1 INTRODUCTION 47 5.2 MARKET DYNAMICS 47 FIGURE 18 RISING DEMAND FOR MINIATURIZATION IN CONSUMER ELECTRONICS VERTICAL DRIVING MID MARKET 47 5.2.1 DRIVERS 48 5.2.1.1 Growing use of LDS in production of 5G antennas 48 5.2.1.2 Increasing use of MIDs in medical devices 48 5.2.1.3 Rising demand for miniaturization in consumer electronics industry 48 5.2.1.4 Intensifying need to reduce e-waste 48 5.2.2 RESTRAINTS 49 5.2.2.1 Technological monopoly of LDS equipment manufacturers 49 5.2.3 OPPORTUNITIES 49 5.2.3.1 Rising use of MIDs in automotive industry 49 5.2.3.2 Expanding IoT ecosystem 49 5.2.3.3 Opportunities for chip-level optical interconnects 49 5.2.4 CHALLENGES 49 5.2.4.1 Incompatibility with electronic packages 49 5.3 VALUE CHAIN ANALYSIS 50 FIGURE 19 MID MARKET: VALUE CHAIN 50 5.3.1 RESEARCH AND DEVELOPMENT 50 5.3.2 MANUFACTURING 50 5.3.3 ASSEMBLY 51 5.3.4 MARKETING AND SALES 51 5.3.5 END-USERS 51 5.4 MID ECOSYSTEM ANALYSIS 51 FIGURE 20 MID ECOSYSTEM 51 TABLE 2 MID MARKET: ECOSYSTEM 52 5.5 PRICING ANALYSIS 53 TABLE 3 AVERAGE SELLING PRICE TRENDS FOR PRODUCTS 53 5.6 TRENDS AND DISTRIBUTION 53 FIGURE 21 REVENUE SHIFT FOR MID MARKET 54 5.7 TECHNOLOGY ANALYSIS 54 5.7.1 3D MOLDED INTERCONNECT DEVICES 54 5.7.2 LASER PLASMA PATTERNING 54 5.8 PORTER’S FIVE FORCES ANALYSIS 55 TABLE 4 MID MARKET: PORTER’S FIVE FORCES ANALYSIS 55 5.9 KEY STAKEHOLDERS AND BUYING CRITERIA 56 5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS 56 FIGURE 22 INFLUENCE OF STAKEHOLDERS IN BUYING PROCESS FOR TOP 3 VERTICALS 56 TABLE 5 INFLUENCE OF STAKEHOLDERS IN BUYING PROCESS FOR TOP 3 VERTICALS (%) 56 5.9.2 BUYING CRITERIA 56 FIGURE 23 KEY BUYING CRITERIA FOR TOP 3 VERTICALS 56 TABLE 6 KEY BUYING CRITERIA FOR TOP 3 VERTICALS 57 5.10 CASE STUDY ANALYSIS 57 5.10.1 MID SOLUTIONS 57 TABLE 7 SIEMENS COLLABORATED WITH LPKF LASER & ELECTRONICS FOR DEVELOPING MID-BASED HEARING AID 57 5.10.2 3D MID TECHNOLOGY 58 TABLE 8 3D MID COMPONENTS INSPECTION USING VISCOM S6056 MID 58 5.11 TRADE ANALYSIS 58 5.11.1 TRADE DATA FOR HS CODE 947330 58 FIGURE 24 IMPORT DATA FOR HS CODE 947330, BY COUNTRY, 2017−2021 (USD THOUSAND) 58 FIGURE 25 EXPORT DATA FOR HS CODE 947330, BY COUNTRY, 2017−2021 (USD THOUSAND) 59 5.12 TARIFF ANALYSIS 59 TABLE 9 TARIFFS DATA FOR HS 947330 59 5.13 PATENT ANALYSIS 60 FIGURE 26 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS 60 TABLE 10 TOP 10 PATENT OWNERS IN US IN LAST 10 YEARS 60 FIGURE 27 NUMBER OF PATENTS GRANTED PER YEAR FROM 2012 TO 2022 61 TABLE 11 LIST OF PATENTS 62 5.14 KEY CONFERENCES AND EVENTS, 2022–2023 63 TABLE 12 MID MARKET: DETAILED LIST OF CONFERENCES AND EVENTS 63 5.15 REGULATORY LANDSCAPE 64 5.15.1 REGULATIONS PERTAINING TO ELECTRIC AND ELECTRONIC PRODUCTS 64 TABLE 13 REGULATIONS IN US 64 5.15.2 STANDARDS RELATED TO ELECTRICAL EQUIPMENT 65 TABLE 14 STANDARDS AND DESCRIPTION 65 5.15.3 RESTRICTION OF HAZARDOUS SUBSTANCES (ROHS) AND WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT (WEEE) 65 6 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PRODUCT TYPE 67 6.1 INTRODUCTION 68 FIGURE 28 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PRODUCT TYPE 68 FIGURE 29 ANTENNAE AND CONNECTIVITY MODULES TO ACCOUNT FOR LARGEST MARKET SIZE DURING FORECAST PERIOD 68 TABLE 15 MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 69 TABLE 16 MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 69 6.2 ANTENNAE AND CONNECTIVITY MODULES 69 6.2.1 EXTENSIVELY USED IN CONSUMER ELECTRONICS 69 TABLE 17 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 70 TABLE 18 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 70 TABLE 19 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 70 TABLE 20 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 71 6.3 SENSORS 71 6.3.1 USED IN INDUSTRIAL APPLICATIONS 71 TABLE 21 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 71 TABLE 22 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 72 TABLE 23 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 72 TABLE 24 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 72 6.4 CONNECTORS AND SWITCHES 73 6.4.1 USED IN NAVIGATION DEVICES 73 TABLE 25 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 73 TABLE 26 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 73 TABLE 27 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 74 TABLE 28 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 74 6.5 LIGHTING SYSTEMS 74 6.5.1 MOLDED INTERCONNECT DEVICES MAKE LIGHTING SYSTEMS COST-EFFICIENT AND EFFECTIVE 74 TABLE 29 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 75 TABLE 30 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 75 TABLE 31 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 75 TABLE 32 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 76 6.6 OTHERS 76 TABLE 33 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 76 TABLE 34 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 77 TABLE 35 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 77 TABLE 36 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 77 7 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS 78 7.1 INTRODUCTION 79 FIGURE 30 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS 79 FIGURE 31 LASER DIRECT STRUCTURING (LDS) TO REGISTER HIGHEST CAGR IN MID MARKET DURING FORECAST PERIOD 79 TABLE 37 MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 80 TABLE 38 MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 80 7.2 LASER DIRECT STRUCTURING (LDS) 80 7.2.1 CAN INTEGRATE MORE ELECTRONIC CIRCUITS INTO SMALLER SPACES 80 TABLE 39 LASER DIRECT STRUCTURING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION 2018–2021 (USD MILLION) 81 TABLE 40 LASER DIRECT STRUCTURING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION 2022–2027 (USD MILLION) 81 7.3 TWO-SHOT MOLDING 81 7.3.1 USED FOR HIGH-VOLUME PRODUCTION OF MOLDED INTERCONNECT DEVICES 81 TABLE 41 TWO-SHOT MOLDING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 82 TABLE 42 TWO-SHOT MOLDING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 82 7.4 FILM TECHNIQUES 82 7.4.1 USED FOR PRODUCTION OF FLAT SURFACES 82 TABLE 43 FILM TECHNIQUES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 83 TABLE 44 FILM TECHNIQUES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 83 8 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL 84 8.1 INTRODUCTION 85 FIGURE 32 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL 85 FIGURE 33 AUTOMOTIVE SEGMENT TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 86 TABLE 45 MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 86 TABLE 46 MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 86 8.2 TELECOMMUNICATIONS 87 8.2.1 USES MOLDED INTERCONNECT DEVICES FOR WIRELESS COMMUNICATIONS 87 TABLE 47 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 87 TABLE 48 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027(USD MILLION) 88 TABLE 49 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 88 TABLE 50 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027(USD MILLION) 88 8.3 CONSUMER ELECTRONICS 89 8.3.1 USES MOLDED INTERCONNECT DEVICES IN ANTENNAS 89 TABLE 51 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 89 TABLE 52 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 89 TABLE 53 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 90 TABLE 54 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 90 8.4 AUTOMOTIVE 90 8.4.1 DEPLOYS MOLDED INTERCONNECT DEVICES IN SMART VEHICLES 90 TABLE 55 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 91 TABLE 56 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 91 TABLE 57 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 91 TABLE 58 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 92 8.5 MEDICAL 92 8.5.1 NEED FOR MINIATURIZED MEDICAL DEVICES 92 TABLE 59 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 92 TABLE 60 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 93 TABLE 61 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 93 TABLE 62 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 93 8.6 INDUSTRIAL 94 8.6.1 MOLDED INTERCONNECT DEVICES ARE USED IN INDUSTRIAL SENSORS 94 TABLE 63 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 94 TABLE 64 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 94 TABLE 65 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 95 TABLE 66 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 95 8.7 MILITARY & AEROSPACE 95 8.7.1 GROWING DEMAND FOR RADAR AND ELECTRONIC WARFARE EQUIPMENT 95 TABLE 67 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 96 TABLE 68 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 96 TABLE 69 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 96 TABLE 70 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 97 9 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY REGION 98 9.1 INTRODUCTION 99 FIGURE 34 MOLDED INTERCONNECT DEVICE MARKET IN CHINA TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 99 TABLE 71 MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 100 TABLE 72 MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 100 9.2 NORTH AMERICA 100 FIGURE 35 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 101 TABLE 73 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 101 TABLE 74 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 101 TABLE 75 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 102 TABLE 76 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 102 TABLE 77 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 102 TABLE 78 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 103 TABLE 79 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 103 TABLE 80 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 103 9.2.1 US 104 9.2.1.1 Increase in adoption of miniaturized packages 104 9.2.2 CANADA 104 9.2.2.1 Government initiatives and investments to support semiconductors manufacturing 104 9.3 EUROPE 106 FIGURE 36 EUROPE: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 106 TABLE 81 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 106 TABLE 82 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 107 TABLE 83 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 107 TABLE 84 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 107 TABLE 85 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 108 TABLE 86 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 108 TABLE 87 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 108 TABLE 88 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 109 9.3.1 GERMANY 109 9.3.1.1 Increasing demand for ADAS 109 9.3.2 FRANCE 109 9.3.2.1 Presence of developed communication network 109 9.3.3 UK 110 9.3.3.1 Heightened demand from medical vertical 110 9.3.4 REST OF EUROPE 110 9.4 ASIA PACIFIC 110 FIGURE 37 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 111 TABLE 89 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 111 TABLE 90 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 112 TABLE 91 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 112 TABLE 92 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 112 TABLE 93 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 113 TABLE 94 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 113 TABLE 95 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 113 TABLE 96 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 114 9.4.1 CHINA 114 9.4.1.1 Increase in medical equipment manufacturing 114 9.4.2 JAPAN 115 9.4.2.1 Increase in demand for consumer electronics and automobiles 115 9.4.3 SOUTH KOREA 115 9.4.3.1 Expansion of manufacturing sector 115 9.4.4 REST OF ASIA PACIFIC 115 9.5 REST OF THE WORLD (ROW) 115 FIGURE 38 REST OF THE WORLD: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 116 TABLE 97 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 116 TABLE 98 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 117 TABLE 99 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 117 TABLE 100 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 117 TABLE 101 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 118 TABLE 102 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 118 TABLE 103 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 118 TABLE 104 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 119 9.5.1 SOUTH AMERICA 119 9.5.1.1 High adoption of wireless communication 119 9.5.2 MIDDLE EAST AND AFRICA 120 9.5.2.1 Favorable government initiatives and high military investments 120 10 COMPETITIVE LANDSCAPE 121 10.1 OVERVIEW 121 10.2 THREE-YEAR REVENUE ANALYSIS OF TOP 5 PLAYERS 121 FIGURE 39 REVENUE ANALYSIS, 2019–2021 (USD BILLION) 121 10.3 KEY PLAYER STRATEGIES/RIGHT TO WIN 122 TABLE 105 KEY STRATEGIES OF TOP PLAYERS IN MID MARKET 122 10.4 MARKET SHARE ANALYSIS (2021) 123 TABLE 106 MID MARKET: MARKET SHARE ANALYSIS 123 FIGURE 40 MARKET SHARE ANALYSIS: MID MARKET, 2021 123 10.5 COMPANY EVALUATION QUADRANT, 2021 125 10.5.1 STARS 125 10.5.2 PERVASIVE PLAYERS 125 10.5.3 EMERGING LEADERS 125 10.5.4 PARTICIPANTS 125 FIGURE 41 MID MARKET: COMPANY EVALUATION QUADRANT, 2021 126 10.5.5 COMPANY FOOTPRINT 127 TABLE 107 COMPANY FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 127 TABLE 108 COMPANY VERTICAL FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 128 TABLE 109 COMPANY PROCESS FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 129 TABLE 110 COMPANY REGIONAL FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 130 10.6 SMALL AND MEDIUM-SIZED ENTERPRISE (SME) EVALUATION QUADRANT, 2021 131 10.6.1 PROGRESSIVE COMPANIES 131 10.6.2 RESPONSIVE COMPANIES 131 10.6.3 DYNAMIC COMPANIES 131 10.6.4 STARTING BLOCKS 131 FIGURE 42 MOLDED INTERCONNECT DEVICE (MID) MARKET: SME EVALUATION QUADRANT, 2021 132 TABLE 111 MID MARKET: DETAILED LIST OF KEY STARTUPS/SMES 133 10.7 COMPETITIVE SCENARIO 133 TABLE 112 MOLDED INTERCONNECT DEVICE (MID) MARKET: PRODUCT LAUNCHES, JANUARY 2020–JANUARY 2022 133 TABLE 113 MOLDED INTERCONNECT DEVICE (MID) MARKET: DEALS, JANUARY 2020–JANUARY 2022 134 11 COMPANY PROFILES 136 11.1 KEY COMPANIES 136 (Business overview, Products offered, Recent Developments, MNM view)* 11.1.1 MOLEX 136 TABLE 114 MOLEX: BUSINESS OVERVIEW 136 TABLE 115 MOLEX: PRODUCTS/SOLUTIONS/SERVICES OFFERED 136 TABLE 116 MOLEX: DEALS 137 11.1.2 LPKF LASER & ELECTRONICS 139 TABLE 117 LPKF LASER & ELECTRONICS: BUSINESS OVERVIEW 139 FIGURE 43 LPKF LASER & ELECTRONICS: COMPANY SNAPSHOT 140 TABLE 118 LPKF LASER & ELECTRONICS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 140 TABLE 119 LPKF LASER & ELECTRONICS: PRODUCT LAUNCHES 141 11.1.3 TE CONNECTIVITY 143 TABLE 120 TE CONNECTIVITY: BUSINESS OVERVIEW 143 FIGURE 44 TE CONNECTIVITY: COMPANY SNAPSHOT 144 TABLE 121 TE CONNECTIVITY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 144 TABLE 122 TE CONNECTIVITY: PRODUCT LAUNCHES 145 TABLE 123 TE CONNECTIVITY: DEALS 145 11.1.4 TAOGLAS 146 TABLE 124 TAOGLAS: BUSINESS OVERVIEW 146 TABLE 125 TAOGLAS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 146 TABLE 126 TAOGLAS: PRODUCT LAUNCHES 146 TABLE 127 TAOGLAS: DEALS 147 11.1.5 AMPHENOL CORPORATION 148 TABLE 128 AMPHENOL CORPORATION: BUSINESS OVERVIEW 148 FIGURE 45 AMPHENOL CORPORATION: COMPANY SNAPSHOT 149 TABLE 129 AMPHENOL CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 149 TABLE 130 AMPHENOL CORPORATION: PRODUCT LAUNCHES 150 TABLE 131 AMPHENOL CORPORATION: DEALS 151 TABLE 132 AMPHENOL CORPORATION: OTHERS 151 11.1.6 HARTING 153 TABLE 133 HARTING: BUSINESS OVERVIEW 153 TABLE 134 HARTING: PRODUCTS/SOLUTIONS/SERVICES OFFERED 153 TABLE 135 HARTING: PRODUCT LAUNCHES 153 TABLE 136 HARTING: OTHERS 154 11.1.7 ARLINGTON PLATING COMPANY 155 TABLE 137 ARLINGTON PLATING COMPANY: BUSINESS OVERVIEW 155 TABLE 138 ARLINGTON PLATING COMPANY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 155 TABLE 139 ARLINGTON PLATING COMPANY: DEALS 155 TABLE 140 ARLINGTON PLATING COMPANY: OTHERS 156 11.1.8 MID SOLUTIONS GMBH 157 TABLE 141 MID SOLUTIONS GMBH: BUSINESS OVERVIEW 157 TABLE 142 MID SOLUTIONS GMBH: PRODUCTS/SOLUTIONS/SERVICES OFFERED 157 TABLE 143 MID SOLUTIONS GMBH: OTHERS 157 11.1.9 2E MECHATRONIC 158 TABLE 144 2E MECHATRONIC: BUSINESS OVERVIEW 158 TABLE 145 2E MECHATRONIC: PRODUCTS/SOLUTIONS/SERVICES OFFERED 158 TABLE 146 2E MECHATRONIC: OTHERS 158 11.1.10 KYOCERA AVX 159 TABLE 147 KYOCERA AVX: BUSINESS OVERVIEW 159 TABLE 148 KYOCERA AVX: PRODUCTS/SOLUTIONS/SERVICES OFFERED 159 TABLE 149 KYOCERA AVX: PRODUCT LAUNCHES 160 TABLE 150 KYOCERA AVX: DEALS 160 TABLE 151 KYOCERA AVX: OTHERS 161 11.1.11 JOHNAN 162 TABLE 152 JOHNAN: BUSINESS OVERVIEW 162 TABLE 153 JOHNAN: PRODUCTS/SOLUTIONS/SERVICES OFFERED 162 TABLE 154 JOHNAN: DEALS 162 TABLE 155 JOHNAN: OTHERS 163 11.2 OTHER IMPORTANT PLAYERS 164 11.2.1 TEPROSA 164 11.2.2 SUNWAY COMMUNICATION 164 11.2.3 AXON CABLE 165 11.2.4 S2P 165 11.2.5 SUZHOU CICOR TECHNOLOGY CO. LTD 166 11.2.6 TACTOTEK 166 11.2.7 DURATECH INDUSTRIES 167 11.2.8 TEKRA 167 11.2.9 YOMURA TECHNOLOGIES 168 11.2.10 MACDERMID ALPHA ELECTRONICS 168 11.2.11 GALTRONICS 169 11.2.12 YAZAKI CORPORATION 169 11.2.13 CHOGORI TECHNOLOGY 170 11.2.14 SUZHOU ZEETEK ELECTRONICS 170 11.2.15 TOYO CONNECTORS 171 11.2.16 SINOPLAST 171 *Details on Business overview, Products offered, Recent Developments, MNM view might not be captured in case of unlisted companies. 12 APPENDIX 172 12.1 DISCUSSION GUIDE 172 12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 175 12.3 CUSTOMIZATION OPTIONS 177 12.4 RELATED REPORTS 177 12.5 AUTHOR DETAILS 178
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