モールドインターコネクトデバイス（MID）市場：製品タイプ（アンテナ＆コネクティビティ、センサー）、プロセス（レーザー直接構造化、2ショットモールド）、産業（家電、通信、医療）、地域別 - 2027年までの世界予測

Molded Interconnect Device (MID) Market by Product Type (Antennae & Connectivity, Sensor),by Process (Laser Direct Structuring, Two-shot Molding), by Industry (Consumer Electronics, Telecommunication, Medical) and Geography - Global Forecast to 2027

モールド配線デバイス（MID）市場は、2022年の14億米ドルから2027年には27億米ドルに成長すると予測されており、予測期間中の年平均成長率は13.6%と予想されています。モールド配線デバイス(MID)市場成長の主な原... もっと見る

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モールド配線デバイス（MID）市場は、2022年の14億米ドルから2027年には27億米ドルに成長すると予測されており、予測期間中の年平均成長率は13.6%と予想されています。モールド配線デバイス(MID)市場成長の主な原動力は、自動車産業における進歩の拡大です。

モールド配線デバイス(MID)市場は、コネクタとスイッチの市場規模が予測期間中大きい
コネクターとスイッチは、主に自動車産業と医療産業で使用されています。自動車業界では、コネクターはナビゲーション機器、インフォテインメント・システム、カメラなどに使用されています。コネクターには、組立作業性の向上、電気的・機械的信頼性、小型化などを目的にMID技術が採用されています。スイッチの限られたスペースをMID技術で解決する。
通信分野では、予測期間中に2番目に高いCAGRを記録する。
通信分野では、MIDは携帯電話や固定電話、リモコン、衛星、基地局、ネットワーク機器などのグローバルな通信インフラに使用されている。一般に、ネットワークを利用した通信は、セントラルオフィス、アウトサイドプラント、モビリティという3つの大きなビジネス分野で利用されている。セントラルオフィスとは、大量の通信を交換処理する大規模な施設、アウトサイドプラントとは、商用および家庭用固定電話の分配交換を行う交換局、そしてモビリティとは、タワー型の電源とアースを用いて移動体通信の伝送を支援する分野である。
予測期間中、北米で最も高いCAGRで成長するのは米国。
米国は、北米でMIDを扱うプレイヤーの主要な収益源である。2021年、米国は、モレックス、Arlington Plating Company、Amphenol Corporation、京セラAVX Corporationなどの大手メーカーの存在により、北米のMID市場で最高のCAGRを占めた。これらのメーカーは、さまざまな用途の機器やデバイスの電気的接続性と性能を向上させるために、包括的なMID製品を提供しています。米国では、コンシューマーエレクトロニクス、医療、テレコミュニケーション、産業用途がMIDの需要を牽引しています。米国のコンシューマーエレクトロニクス市場は継続的に成長しています。また、民生用電子機器、自動車部品、医療機器、その他の機器において、小型化されたパッケージへの需要が高まり始めていることが確認されています。

本調査では、二次調査によって得られたいくつかのセグメントとサブセグメントの市場規模を決定・検証する過程で、モールド配線デバイス（MID）市場の主要関係者に対して広範な一次インタビューを実施した。以下は、本レポートの主要参加者のプロフィールの内訳である。

- 企業タイプ別：ティア1：35%、ティア2：45%、ティア3：20%。
- 役職別：Cレベル経営者35％、取締役25％、その他40
- 地域別：北米45%、アジア太平洋地域30%、ヨーロッパ20%、RoW 5
モールドインターコネクトデバイス（MID）市場は、モレックス（米国）、TE Connectivity（スイス）、アンフェノール（米国）、LPKF Laser & Electronics（ドイツ）、タオグラス（ダブリン）、ハーティング（ドイツ）、Arlington Plating Company（米国）、MID Solutions（ドイツ）、2E Mechatronic（ドイツ）、京セラAVX（米国）、Johnan（日本）、Teprosa（ドイツ）で構成されている。Sunway Communication（中国）、Axon Cable（フランス）、S2P（フランス）、Suzhou Cicor Technology（中国）、TactoTek（フィンランド）、DuraTech（アメリカ）、Tekra（アメリカ）、Yomura Technologies（台湾）、MacDermid Alpha Electronics（アメリカ）、Galtronics（アメリカ）、Yazaki Corporation（日本）、Chogori Technology（日本）、 Suzhou Zeeteq Electronics（日本）、Toyo Connector（日本）およびSINOPLAST（中国）です。

調査対象範囲
このレポートでは、モールド配線デバイス（MID）市場を製品タイプ、プロセス、業種、地域別に定義、説明、予測しています。モールド配線デバイス（MID）市場の成長に影響を与える推進要因、阻害要因、機会、課題などに関する詳細な情報を提供しています。また、製品の発売、買収、拡大、契約、パートナーシップ、市場での成長のために主要企業が行った開発など、競争力のある開発についても分析しています。
本レポートを購入する理由
本レポートは、モールド型インターコネクトデバイス（MID）市場のリーダー/新規参入企業に対して、以下のような点で貢献します。
1.モールド配線デバイス（MID）市場を包括的にセグメント化し、地域ごとのすべてのサブセグメントについて最も近い市場規模の推定を提供します。
2.本レポートは、利害関係者が市場の鼓動を理解するのに役立ち、モールド配線デバイス（MID）市場に関する主要な推進要因、阻害要因、課題、機会に関する情報を提供する。
3.本レポートは、利害関係者が競合他社をより良く理解し、モールド配線デバイス（MID）市場における自社のポジションを向上させるための洞察を得るのに役立つものです。競合環境のセクションでは、競合のエコシステムを説明しています。

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1 INTRODUCTION 25
1.1 STUDY OBJECTIVES 25
1.2 MARKET DEFINITION 25
1.3 INCLUSIONS AND EXCLUSIONS 26
1.4 STUDY SCOPE 26
1.4.1 MARKETS COVERED 26
FIGURE 1 MOLDED INTERCONNECT DEVICE (MID) MARKET: SEGMENTATION 26
FIGURE 2 GEOGRAPHIC SCOPE 27
FIGURE 3 YEARS CONSIDERED 27
1.5 CURRENCY CONSIDERED 27
1.6 LIMITATIONS 28
1.7 STAKEHOLDERS 28
1.8 SUMMARY OF CHANGES 28
2 RESEARCH METHODOLOGY 29
2.1 RESEARCH DATA 29
FIGURE 4 PROCESS FLOW: MOLDED INTERCONNECT DEVICE (MID) MARKET SIZE ESTIMATION 29
FIGURE 5 MOLDED INTERCONNECT DEVICE (MID) MARKET: RESEARCH DESIGN 30
2.1.1 SECONDARY AND PRIMARY RESEARCH 31
2.1.2 SECONDARY DATA 31
2.1.2.1 Secondary sources 32
2.1.2.2 List of key secondary sources 32
2.1.3 PRIMARY DATA 32
2.1.3.1 Primary sources 33
2.1.3.2 Key industry insights 33
2.1.3.3 Primary interviews with experts 34
2.1.3.4 List of key primary respondents 34
2.1.3.5 Breakdown of primaries 34
2.2 MARKET SIZE ESTIMATION 35
2.2.1 BOTTOM-UP APPROACH 35
2.2.1.1 Approach for arriving at market size by bottom-up analysis 35
FIGURE 6 MOLDED INTERCONNECT DEVICE MARKET: BOTTOM-UP APPROACH 36
2.2.2 TOP-DOWN APPROACH 36
2.2.2.1 Approach for deriving market size by top-down analysis 36
FIGURE 7 MOLDED INTERCONNECT DEVICE (MID) MARKET: TOP-DOWN APPROACH 37
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 37
FIGURE 8 DATA TRIANGULATION 37
2.4 RESEARCH ASSUMPTIONS 38
2.5 LIMITATIONS 39
2.6 RISK ASSESSMENT 39
TABLE 1 RISK ASSESSMENT 39
3 EXECUTIVE SUMMARY 40
FIGURE 9 LASER DIRECT STRUCTURING SEGMENT TO LEAD MOLDED INTERCONNECT DEVICE MARKET DURING FORECAST PERIOD 40
FIGURE 10 ANTENNAE AND CONNECTIVITY MODULES TO HOLD LARGEST SHARE OF MOLDED INTERCONNECT DEVICE MARKET BY 2027 41
FIGURE 11 AUTOMOTIVE TO RECORD HIGHEST CAGR IN MOLDED INTERCONNECT DEVICE MARKET DURING FORECAST PERIOD 41
FIGURE 12 ASIA PACIFIC LIKELY TO BE FASTEST-GROWING MARKET FOR MOLDED INTERCONNECT DEVICES DURING FORECAST PERIOD 42
4 PREMIUM INSIGHTS 43
4.1 ATTRACTIVE GROWTH OPPORTUNITIES FOR MARKET PLAYERS 43
FIGURE 13 INCREASING USE OF MOLDED INTERCONNECT DEVICES IN AUTOMOTIVE INDUSTRY TO OFFER OPPORTUNITIES FOR MARKET GROWTH FROM 2022 TO 2027 43
4.2 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY TYPE 44
FIGURE 14 SENSORS TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD 44
4.3 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL 44
FIGURE 15 CONSUMER ELECTRONICS VERTICAL TO HOLD LARGEST SHARE OF MID MARKET DURING FORECAST PERIOD 44
4.4 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS AND REGION 45
FIGURE 16 LDS TO HAVE LARGEST MARKET SIZE FOR LDS PROCESS DURING FORECAST PERIOD 45
4.5 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY GEOGRAPHY (2027) 46
FIGURE 17 MID MARKET TO RECORD HIGHEST CAGR IN CHINA IN 2027 46
5 MARKET OVERVIEW 47
5.1 INTRODUCTION 47
5.2 MARKET DYNAMICS 47
FIGURE 18 RISING DEMAND FOR MINIATURIZATION IN CONSUMER ELECTRONICS VERTICAL DRIVING MID MARKET 47
5.2.1 DRIVERS 48
5.2.1.1 Growing use of LDS in production of 5G antennas 48
5.2.1.2 Increasing use of MIDs in medical devices 48
5.2.1.3 Rising demand for miniaturization in consumer electronics industry 48
5.2.1.4 Intensifying need to reduce e-waste 48
5.2.2 RESTRAINTS 49
5.2.2.1 Technological monopoly of LDS equipment manufacturers 49
5.2.3 OPPORTUNITIES 49
5.2.3.1 Rising use of MIDs in automotive industry 49
5.2.3.2 Expanding IoT ecosystem 49
5.2.3.3 Opportunities for chip-level optical interconnects 49
5.2.4 CHALLENGES 49
5.2.4.1 Incompatibility with electronic packages 49
5.3 VALUE CHAIN ANALYSIS 50
FIGURE 19 MID MARKET: VALUE CHAIN 50
5.3.1 RESEARCH AND DEVELOPMENT 50
5.3.2 MANUFACTURING 50
5.3.3 ASSEMBLY 51
5.3.4 MARKETING AND SALES 51
5.3.5 END-USERS 51
5.4 MID ECOSYSTEM ANALYSIS 51
FIGURE 20 MID ECOSYSTEM 51
TABLE 2 MID MARKET: ECOSYSTEM 52
5.5 PRICING ANALYSIS 53
TABLE 3 AVERAGE SELLING PRICE TRENDS FOR PRODUCTS 53
5.6 TRENDS AND DISTRIBUTION 53
FIGURE 21 REVENUE SHIFT FOR MID MARKET 54
5.7 TECHNOLOGY ANALYSIS 54
5.7.1 3D MOLDED INTERCONNECT DEVICES 54
5.7.2 LASER PLASMA PATTERNING 54
5.8 PORTER’S FIVE FORCES ANALYSIS 55
TABLE 4 MID MARKET: PORTER’S FIVE FORCES ANALYSIS 55
5.9 KEY STAKEHOLDERS AND BUYING CRITERIA 56
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS 56
FIGURE 22 INFLUENCE OF STAKEHOLDERS IN BUYING PROCESS FOR TOP 3 VERTICALS 56
TABLE 5 INFLUENCE OF STAKEHOLDERS IN BUYING PROCESS FOR TOP 3 VERTICALS (%) 56
5.9.2 BUYING CRITERIA 56
FIGURE 23 KEY BUYING CRITERIA FOR TOP 3 VERTICALS 56
TABLE 6 KEY BUYING CRITERIA FOR TOP 3 VERTICALS 57
5.10 CASE STUDY ANALYSIS 57
5.10.1 MID SOLUTIONS 57
TABLE 7 SIEMENS COLLABORATED WITH LPKF LASER & ELECTRONICS FOR DEVELOPING MID-BASED HEARING AID 57
5.10.2 3D MID TECHNOLOGY 58
TABLE 8 3D MID COMPONENTS INSPECTION USING VISCOM S6056 MID 58
5.11 TRADE ANALYSIS 58
5.11.1 TRADE DATA FOR HS CODE 947330 58
FIGURE 24 IMPORT DATA FOR HS CODE 947330, BY COUNTRY, 2017−2021 (USD THOUSAND) 58
FIGURE 25 EXPORT DATA FOR HS CODE 947330, BY COUNTRY, 2017−2021 (USD THOUSAND) 59
5.12 TARIFF ANALYSIS 59
TABLE 9 TARIFFS DATA FOR HS 947330 59
5.13 PATENT ANALYSIS 60
FIGURE 26 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS 60
TABLE 10 TOP 10 PATENT OWNERS IN US IN LAST 10 YEARS 60
FIGURE 27 NUMBER OF PATENTS GRANTED PER YEAR FROM 2012 TO 2022 61
TABLE 11 LIST OF PATENTS 62
5.14 KEY CONFERENCES AND EVENTS, 2022–2023 63
TABLE 12 MID MARKET: DETAILED LIST OF CONFERENCES AND EVENTS 63
5.15 REGULATORY LANDSCAPE 64
5.15.1 REGULATIONS PERTAINING TO ELECTRIC AND ELECTRONIC PRODUCTS 64
TABLE 13 REGULATIONS IN US 64
5.15.2 STANDARDS RELATED TO ELECTRICAL EQUIPMENT 65
TABLE 14 STANDARDS AND DESCRIPTION 65
5.15.3 RESTRICTION OF HAZARDOUS SUBSTANCES (ROHS) AND WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT (WEEE) 65
6 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PRODUCT TYPE 67
6.1 INTRODUCTION 68
FIGURE 28 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PRODUCT TYPE 68
FIGURE 29 ANTENNAE AND CONNECTIVITY MODULES TO ACCOUNT FOR LARGEST MARKET SIZE DURING FORECAST PERIOD 68
TABLE 15 MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 69
TABLE 16 MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 69
6.2 ANTENNAE AND CONNECTIVITY MODULES 69
6.2.1 EXTENSIVELY USED IN CONSUMER ELECTRONICS 69
TABLE 17 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 70
TABLE 18 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 70
TABLE 19 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 70
TABLE 20 ANTENNAE AND CONNECTIVITY MODULES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 71
6.3 SENSORS 71
6.3.1 USED IN INDUSTRIAL APPLICATIONS 71
TABLE 21 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 71
TABLE 22 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 72
TABLE 23 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 72
TABLE 24 SENSORS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 72
6.4 CONNECTORS AND SWITCHES 73
6.4.1 USED IN NAVIGATION DEVICES 73
TABLE 25 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 73
TABLE 26 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 73
TABLE 27 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 74
TABLE 28 CONNECTORS AND SWITCHES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 74
6.5 LIGHTING SYSTEMS 74
6.5.1 MOLDED INTERCONNECT DEVICES MAKE LIGHTING SYSTEMS COST-EFFICIENT AND EFFECTIVE 74
TABLE 29 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 75
TABLE 30 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 75
TABLE 31 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 75
TABLE 32 LIGHTING SYSTEMS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 76
6.6 OTHERS 76
TABLE 33 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 76
TABLE 34 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 77
TABLE 35 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 77
TABLE 36 OTHERS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 77
7 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS 78
7.1 INTRODUCTION 79
FIGURE 30 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY PROCESS 79
FIGURE 31 LASER DIRECT STRUCTURING (LDS) TO REGISTER HIGHEST CAGR IN MID MARKET DURING FORECAST PERIOD 79
TABLE 37 MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 80
TABLE 38 MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 80
7.2 LASER DIRECT STRUCTURING (LDS) 80
7.2.1 CAN INTEGRATE MORE ELECTRONIC CIRCUITS INTO SMALLER SPACES 80
TABLE 39 LASER DIRECT STRUCTURING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION 2018–2021 (USD MILLION) 81
TABLE 40 LASER DIRECT STRUCTURING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION 2022–2027 (USD MILLION) 81
7.3 TWO-SHOT MOLDING 81
7.3.1 USED FOR HIGH-VOLUME PRODUCTION OF MOLDED INTERCONNECT DEVICES 81
TABLE 41 TWO-SHOT MOLDING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 82
TABLE 42 TWO-SHOT MOLDING: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 82
7.4 FILM TECHNIQUES 82
7.4.1 USED FOR PRODUCTION OF FLAT SURFACES 82
TABLE 43 FILM TECHNIQUES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 83
TABLE 44 FILM TECHNIQUES: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 83
8 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL 84
8.1 INTRODUCTION 85
FIGURE 32 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY VERTICAL 85
FIGURE 33 AUTOMOTIVE SEGMENT TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 86
TABLE 45 MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 86
TABLE 46 MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 86
8.2 TELECOMMUNICATIONS 87
8.2.1 USES MOLDED INTERCONNECT DEVICES FOR WIRELESS COMMUNICATIONS 87
TABLE 47 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 87
TABLE 48 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027(USD MILLION) 88
TABLE 49 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 88
TABLE 50 TELECOMMUNICATIONS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027(USD MILLION) 88
8.3 CONSUMER ELECTRONICS 89
8.3.1 USES MOLDED INTERCONNECT DEVICES IN ANTENNAS 89
TABLE 51 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 89
TABLE 52 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 89
TABLE 53 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 90
TABLE 54 CONSUMER ELECTRONICS: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 90
8.4 AUTOMOTIVE 90
8.4.1 DEPLOYS MOLDED INTERCONNECT DEVICES IN SMART VEHICLES 90
TABLE 55 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 91
TABLE 56 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 91
TABLE 57 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 91
TABLE 58 AUTOMOTIVE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 92
8.5 MEDICAL 92
8.5.1 NEED FOR MINIATURIZED MEDICAL DEVICES 92
TABLE 59 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 92
TABLE 60 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 93
TABLE 61 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 93
TABLE 62 MEDICAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 93
8.6 INDUSTRIAL 94
8.6.1 MOLDED INTERCONNECT DEVICES ARE USED IN INDUSTRIAL SENSORS 94
TABLE 63 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 94
TABLE 64 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 94
TABLE 65 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 95
TABLE 66 INDUSTRIAL: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 95
8.7 MILITARY & AEROSPACE 95
8.7.1 GROWING DEMAND FOR RADAR AND ELECTRONIC WARFARE EQUIPMENT 95
TABLE 67 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 96
TABLE 68 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 96
TABLE 69 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 96
TABLE 70 MILITARY & AEROSPACE: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 97
9 MOLDED INTERCONNECT DEVICE (MID) MARKET, BY REGION 98
9.1 INTRODUCTION 99
FIGURE 34 MOLDED INTERCONNECT DEVICE MARKET IN CHINA TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 99
TABLE 71 MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 100
TABLE 72 MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 100
9.2 NORTH AMERICA 100
FIGURE 35 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 101
TABLE 73 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 101
TABLE 74 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 101
TABLE 75 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 102
TABLE 76 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 102
TABLE 77 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 102
TABLE 78 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 103
TABLE 79 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 103
TABLE 80 NORTH AMERICA: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 103
9.2.1 US 104
9.2.1.1 Increase in adoption of miniaturized packages 104
9.2.2 CANADA 104
9.2.2.1 Government initiatives and investments to support semiconductors manufacturing 104
9.3 EUROPE 106
FIGURE 36 EUROPE: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 106
TABLE 81 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 106
TABLE 82 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 107
TABLE 83 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 107
TABLE 84 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 107
TABLE 85 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 108
TABLE 86 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 108
TABLE 87 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 108
TABLE 88 EUROPE: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 109
9.3.1 GERMANY 109
9.3.1.1 Increasing demand for ADAS 109
9.3.2 FRANCE 109
9.3.2.1 Presence of developed communication network 109
9.3.3 UK 110
9.3.3.1 Heightened demand from medical vertical 110
9.3.4 REST OF EUROPE 110
9.4 ASIA PACIFIC 110
FIGURE 37 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 111
TABLE 89 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 111
TABLE 90 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 112
TABLE 91 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 112
TABLE 92 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 112
TABLE 93 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 113
TABLE 94 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 113
TABLE 95 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 113
TABLE 96 ASIA PACIFIC: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 114
9.4.1 CHINA 114
9.4.1.1 Increase in medical equipment manufacturing 114
9.4.2 JAPAN 115
9.4.2.1 Increase in demand for consumer electronics and automobiles 115
9.4.3 SOUTH KOREA 115
9.4.3.1 Expansion of manufacturing sector 115
9.4.4 REST OF ASIA PACIFIC 115
9.5 REST OF THE WORLD (ROW) 115
FIGURE 38 REST OF THE WORLD: MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT 116
TABLE 97 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2018–2021 (USD MILLION) 116
TABLE 98 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2022–2027 (USD MILLION) 117
TABLE 99 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2018–2021 (USD MILLION) 117
TABLE 100 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2022–2027 (USD MILLION) 117
TABLE 101 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2018–2021 (USD MILLION) 118
TABLE 102 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY VERTICAL, 2022–2027 (USD MILLION) 118
TABLE 103 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2018–2021 (USD MILLION) 118
TABLE 104 ROW: MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2022–2027 (USD MILLION) 119
9.5.1 SOUTH AMERICA 119
9.5.1.1 High adoption of wireless communication 119
9.5.2 MIDDLE EAST AND AFRICA 120
9.5.2.1 Favorable government initiatives and high military investments 120
10 COMPETITIVE LANDSCAPE 121
10.1 OVERVIEW 121
10.2 THREE-YEAR REVENUE ANALYSIS OF TOP 5 PLAYERS 121
FIGURE 39 REVENUE ANALYSIS, 2019–2021 (USD BILLION) 121
10.3 KEY PLAYER STRATEGIES/RIGHT TO WIN 122
TABLE 105 KEY STRATEGIES OF TOP PLAYERS IN MID MARKET 122
10.4 MARKET SHARE ANALYSIS (2021) 123
TABLE 106 MID MARKET: MARKET SHARE ANALYSIS 123
FIGURE 40 MARKET SHARE ANALYSIS: MID MARKET, 2021 123
10.5 COMPANY EVALUATION QUADRANT, 2021 125
10.5.1 STARS 125
10.5.2 PERVASIVE PLAYERS 125
10.5.3 EMERGING LEADERS 125
10.5.4 PARTICIPANTS 125
FIGURE 41 MID MARKET: COMPANY EVALUATION QUADRANT, 2021 126
10.5.5 COMPANY FOOTPRINT 127
TABLE 107 COMPANY FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 127
TABLE 108 COMPANY VERTICAL FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 128
TABLE 109 COMPANY PROCESS FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 129
TABLE 110 COMPANY REGIONAL FOOTPRINT: MOLDED INTERCONNECT DEVICE (MID) MARKET 130
10.6 SMALL AND MEDIUM-SIZED ENTERPRISE (SME) EVALUATION QUADRANT, 2021 131
10.6.1 PROGRESSIVE COMPANIES 131
10.6.2 RESPONSIVE COMPANIES 131
10.6.3 DYNAMIC COMPANIES 131
10.6.4 STARTING BLOCKS 131
FIGURE 42 MOLDED INTERCONNECT DEVICE (MID) MARKET: SME EVALUATION QUADRANT, 2021 132
TABLE 111 MID MARKET: DETAILED LIST OF KEY STARTUPS/SMES 133
10.7 COMPETITIVE SCENARIO 133
TABLE 112 MOLDED INTERCONNECT DEVICE (MID) MARKET: PRODUCT LAUNCHES, JANUARY 2020–JANUARY 2022 133
TABLE 113 MOLDED INTERCONNECT DEVICE (MID) MARKET: DEALS, JANUARY 2020–JANUARY 2022 134

11 COMPANY PROFILES 136
11.1 KEY COMPANIES 136
(Business overview, Products offered, Recent Developments, MNM view)*
11.1.1 MOLEX 136
TABLE 114 MOLEX: BUSINESS OVERVIEW 136
TABLE 115 MOLEX: PRODUCTS/SOLUTIONS/SERVICES OFFERED 136
TABLE 116 MOLEX: DEALS 137
11.1.2 LPKF LASER & ELECTRONICS 139
TABLE 117 LPKF LASER & ELECTRONICS: BUSINESS OVERVIEW 139
FIGURE 43 LPKF LASER & ELECTRONICS: COMPANY SNAPSHOT 140
TABLE 118 LPKF LASER & ELECTRONICS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 140
TABLE 119 LPKF LASER & ELECTRONICS: PRODUCT LAUNCHES 141
11.1.3 TE CONNECTIVITY 143
TABLE 120 TE CONNECTIVITY: BUSINESS OVERVIEW 143
FIGURE 44 TE CONNECTIVITY: COMPANY SNAPSHOT 144
TABLE 121 TE CONNECTIVITY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 144
TABLE 122 TE CONNECTIVITY: PRODUCT LAUNCHES 145
TABLE 123 TE CONNECTIVITY: DEALS 145
11.1.4 TAOGLAS 146
TABLE 124 TAOGLAS: BUSINESS OVERVIEW 146
TABLE 125 TAOGLAS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 146
TABLE 126 TAOGLAS: PRODUCT LAUNCHES 146
TABLE 127 TAOGLAS: DEALS 147
11.1.5 AMPHENOL CORPORATION 148
TABLE 128 AMPHENOL CORPORATION: BUSINESS OVERVIEW 148
FIGURE 45 AMPHENOL CORPORATION: COMPANY SNAPSHOT 149
TABLE 129 AMPHENOL CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 149
TABLE 130 AMPHENOL CORPORATION: PRODUCT LAUNCHES 150
TABLE 131 AMPHENOL CORPORATION: DEALS 151
TABLE 132 AMPHENOL CORPORATION: OTHERS 151
11.1.6 HARTING 153
TABLE 133 HARTING: BUSINESS OVERVIEW 153
TABLE 134 HARTING: PRODUCTS/SOLUTIONS/SERVICES OFFERED 153
TABLE 135 HARTING: PRODUCT LAUNCHES 153
TABLE 136 HARTING: OTHERS 154
11.1.7 ARLINGTON PLATING COMPANY 155
TABLE 137 ARLINGTON PLATING COMPANY: BUSINESS OVERVIEW 155
TABLE 138 ARLINGTON PLATING COMPANY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 155
TABLE 139 ARLINGTON PLATING COMPANY: DEALS 155
TABLE 140 ARLINGTON PLATING COMPANY: OTHERS 156
11.1.8 MID SOLUTIONS GMBH 157
TABLE 141 MID SOLUTIONS GMBH: BUSINESS OVERVIEW 157
TABLE 142 MID SOLUTIONS GMBH: PRODUCTS/SOLUTIONS/SERVICES OFFERED 157
TABLE 143 MID SOLUTIONS GMBH: OTHERS 157
11.1.9 2E MECHATRONIC 158
TABLE 144 2E MECHATRONIC: BUSINESS OVERVIEW 158
TABLE 145 2E MECHATRONIC: PRODUCTS/SOLUTIONS/SERVICES OFFERED 158
TABLE 146 2E MECHATRONIC: OTHERS 158
11.1.10 KYOCERA AVX 159
TABLE 147 KYOCERA AVX: BUSINESS OVERVIEW 159
TABLE 148 KYOCERA AVX: PRODUCTS/SOLUTIONS/SERVICES OFFERED 159
TABLE 149 KYOCERA AVX: PRODUCT LAUNCHES 160
TABLE 150 KYOCERA AVX: DEALS 160
TABLE 151 KYOCERA AVX: OTHERS 161
11.1.11 JOHNAN 162
TABLE 152 JOHNAN: BUSINESS OVERVIEW 162
TABLE 153 JOHNAN: PRODUCTS/SOLUTIONS/SERVICES OFFERED 162
TABLE 154 JOHNAN: DEALS 162
TABLE 155 JOHNAN: OTHERS 163
11.2 OTHER IMPORTANT PLAYERS 164
11.2.1 TEPROSA 164
11.2.2 SUNWAY COMMUNICATION 164
11.2.3 AXON CABLE 165
11.2.4 S2P 165
11.2.5 SUZHOU CICOR TECHNOLOGY CO. LTD 166
11.2.6 TACTOTEK 166
11.2.7 DURATECH INDUSTRIES 167
11.2.8 TEKRA 167
11.2.9 YOMURA TECHNOLOGIES 168
11.2.10 MACDERMID ALPHA ELECTRONICS 168
11.2.11 GALTRONICS 169
11.2.12 YAZAKI CORPORATION 169
11.2.13 CHOGORI TECHNOLOGY 170
11.2.14 SUZHOU ZEETEK ELECTRONICS 170
11.2.15 TOYO CONNECTORS 171
11.2.16 SINOPLAST 171
*Details on Business overview, Products offered, Recent Developments, MNM view might not be captured in case of unlisted companies.

12 APPENDIX 172
12.1 DISCUSSION GUIDE 172
12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 175
12.3 CUSTOMIZATION OPTIONS 177
12.4 RELATED REPORTS 177
12.5 AUTHOR DETAILS 178

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Table of Contents

Summary

The molded interconnect device (MID) market is expected to grow from USD1.4 billion in 2022 to USD 2.7billion by 2027; it is expected to grow at a CAGR of 13.6% during the forecast period. The major driving factors for the growth of the molded interconnect device (MID)market include the growing advancement in automotive vertical.

Connectors and switches to have significant market size of molded interconnect device (MID)market during the forecast period
Connectors and switches are mainly used in automotive and medical industries. In the automotive Vertical, connectors find application in navigation devices, infotainment systems, cameras, and so on. MID technology is used in connectors to improve assembly operability, provide electrical and mechanical reliability, and offer compactness. Limited space issue in switchescan be solved using MID technology
Telecommunication to have second highestCAGR during the forecast period.
In the telecommunications sector, MIDs are used in mobile phones and landline phones, remote controls, and the global telecommunications infrastructure such as satellites, base equipment, and network equipment. Generally, telecommunications based on the network are used in three different broad business areas, namely, central office, outside plants, and mobility. Central office refers to large facilities where very high-volume communications are switched and processed; outside plants refer to switching stations where distributive switching occurs for commercial and home landlines; and the third area is mobility, where tower-based power and grounding supports mobile communication transmission.
USto grow with highest CAGR in North America during the forecast period.
The US is the major revenue generator for players dealing in MIDs in North America. In 2021, the US accounted for highest CAGR of the MID market in North America, owing to the presence of leading manufacturers such as Molex, Arlington Plating Company, Amphenol Corporation, and Kyocera AVX Corporation. These manufacturers provide a comprehensive range of MID products to enhance the electrical connectivity and performance of the equipment or devices across various applications. Consumer electronics, medical, telecommunication, and industrial applications are driving the demand for MIDs in the US. The consumer electronics market in the US has been continuously growing. Moreover, it has been observed that the demand for miniaturized packages has started gaining momentum in consumer electronics, automotive components, medical equipment, and other devices.

In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted with key officials in the molded interconnect device (MID)market. Following is the breakup of the profiles of primary participants for the report.

• By Company Type:Tier 1 – 35 %, Tier 2 – 45%, and Tier 3 – 20%
• By Designation:C-Level Executives – 35%, Directors- 25%, and Others – 40%
• By Region:North America– 45%, Asia Pacific – 30%, Europe- 20% and RoW – 5%
The molded interconnect device (MID)market comprises major players are Molex (US), TE Connectivity (Switzerland), Amphenol Corporation (US), LPKF Laser & Electronics (Germany), and Taoglas (Dublin), Harting (Germany), Arlington Plating Company (US), MID Solutions (Germany), 2E Mechatronic (Germany), KYOCERA AVX (US) and Johnan (Japan),Teprosa(Germany), Sunway Communication(China), Axon Cable(France), S2P (France), Suzhou Cicor Technology (China), TactoTek (Finland), DuraTech (US), Tekra (US), Yomura Technologies (Taiwan), MacDermid Alpha Electronics (US), Galtronics (US), Yazaki Corporation (Japan), Chogori Technology (Japan), Suzhou Zeeteq Electronics (Japan), Toyo Connectors (Japan) and SINOPLAST (China).

Research Coverage
The report defines, describes, and forecasts the molded interconnect device (MID)market based onproduct type, process, verticaland geography. It provides detailed information regarding factors such as drivers, restraints, opportunities, and challenges influencing the growth of the molded interconnect device (MID)market. It also analyzes competitive developments such as product launches, acquisitions, expansions, contracts, partnerships, and developments carried out by the key players to grow in the market.
Reasons to Buy This Report
The report will help leaders/new entrants in the molded interconnect device (MID)market in the following ways:
1. The report segments the molded interconnect device (MID)market comprehensively and provides the closest market size estimation for all subsegments across regions.
2. The report will help stakeholders understand the pulse of the market and provide them with information on key drivers, restraints, challenges, and opportunities about molded interconnect device (MID)market.
3. The report will help stakeholders understand their competitors better and gain insights to improve their position in the molded interconnect device (MID)market. The competitive landscape section describes the competitor ecosystem.

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