Summary

Semiconductor bonding market was valued at USD 887 million in 2021 and is anticipated to reach USD 1,059 million by 2026, growing at a CAGR of 3.6% between 2021 to 2026. The growing demand for semiconductor bonding in applications such as electric and hybrid vehicles is driving the growth of semiconductor bonding market.
The semiconductor industry plays a vital role in electric and hybrid vehicles. The key components required in electric and hybrid vehicles include power semiconductor devices such as freewheeling diodes, ICs, MEMS, voltage boost DC-DC converters, fuel cell air compressors, motor drives, insulated gate bipolar transistors (IGBTs), and low-voltage power MOSFETs. Innovations in automobiles to build energy-efficient and environment-friendly vehicles have increased the demand for semiconductor devices such as ICs and sensors. Automobile companies also focus on using system on chip (SoC), which offers faster control and secure communication.
To reduce carbon emissions, the use of electric and hybrid vehicles is expanding gradually in some countries because of government support and substantial investments from the automotive industry. Advanced electric cars provided by some of the key car manufacturers, such as Bayerische Motoren Werke AG (BMW) (Germany), Ford Motor Company (US), and Toyota Motor Corporation (Japan), and the initiatives by several countries to reduce carbon emissions have increased the use of hybrid and electric vehicles. As more semiconductor devices are used in electric vehicles, the demand for semiconductor bonding equipment is expected to increase.

According to the International Energy Agency, the adoption of electric vehicles is continuously increasing across the globe, and their demand is expected to grow rapidly in the coming years. According to the Bloomberg New Energy Finance report, the sales of electric vehicles are estimated to grow to 41 million by 2040, thereby leading to a rise in the demand for electronic components used in electric vehicles.
Advanced systems, such as idling stop systems (ISS), would result in the growth in the semiconductor content in traditional fuel-based vehicles. For instance, in 2014, ROHM Semiconductor developed high-performance microcontrollers for various automotive systems, especially in electric and hybrid vehicles. Such advancements in the automotive sector increase the demand for semiconductor devices, subsequently driving the growth of the semiconductor bonding market.
Growing adoption of IoT and AI in automotive sector
The advent of Industry 4.0 and technologies such as IoT and AI in the automotive sector would contribute significantly toward the growth of the semiconductor bonding market. The increasing demand for vehicle connectivity would encourage new developments in the industry. With ongoing trends such as touch-free human–machine interfaces revolutionizing the automotive sector, there is a growing significance of connected cars. According to a report published by the GSM Association (GSMA) in 2019, the number of IoT connections is projected to reach 24.6 billion globally by 2025. Integration of IoT in automotive safety and communication technologies is one of the major reasons for the anticipated growth of IoT connections. The introduction of technologies such as advanced driver assistance systems (ADAS), adaptive cruise control, and intelligent parking assistance systems would further drive the market growth.
Cellular IoT connectivity and AI play a vital role in automotive and transportation sectors, with major use cases being shared mobility, autonomous vehicles, connected vehicles, telematics, smart public transportation, and C-V2sx vehicles. The development of smart infrastructures such as smart cities and intelligent transportation systems would accelerate the implementation of AI and IoT technologies in automotive and transportation. As per MarketsandMarkets, the connected car market is expected to grow from USD 53.9 billion in 2019 to USD 166 billion by 2025; it is anticipated to register a CAGR of 25.2% during 2020–2025.
The implementation of IoT and AI technologies in automobiles is leading to the integration of a large number of intelligent sensors and actuators, as well as AI chips such as ADAS, LiDAR, and neuromorphic chips. These components do not use standard packaging, as different customers have different packaging designs. The manufacturing process of these components comprises high-precision dispensing and stamping of epoxy. Some use eutectic and ultraviolet (UV) processes. This necessitates the demand for flexible multi-die and multi-process die bonding machines with high speed and high accuracy.

Asia Pacific is the fastest-growing region in the semiconductor bonding market

In 2020, APAC accounted for a 62.6% share of the global semiconductor bonding market. The growth of the semiconductor bonding in APAC is attributed to the presence of several OSAT players in China and Taiwan. The region also houses semiconductor fabrication facilities of a few of the major IDMs, such as Intel (US), Micron (US), NXP Semiconductors (Netherlands), SK Hynix (South Korea). Samsung (South Korea), Texas Instruments (US). ASM Pacific Technology Ltd. (Singapore), SHIBUYA CORPORATION (Japan), Kulicke & Soffa (Singapore), and Shinkawa Ltd. (Japan) are among the major players in this market that have their headquarters in APAC.
The breakup of primaries conducted during the study is depicted below:
• By Company Type: Tier 1 – 45 %, Tier 2 – 32%, and Tier 3 –23%
• By Designation: C-Level Executives – 30%, Directors – 45%, and Others – 25%
• By Region: North America– 26%, Europe – 40%, APAC – 22% and ROW – 12%
Research Coverage
The report segments the semiconductor bonding market and forecasts its size, by volume and value, based on region (North America, Europe, Asia Pacific, and RoW), Semiconductor Bonding Market by Type (Die Bonder, Wafer Bonder and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type(Die-to-die bonding, Die-to wafer bonding and Wafer-to-wafer bonding), Technology(Die bonding technology ( Eutectic Die Bonding (Epoxy Die Bonding, Flip Chip Attachment, Hybrid Bonding (for 3D-NAND)) and Wafer Bonding Technology (Direct Wafer Bonding, Anodic Wafer Bonding, Tcb Wafer Bonding, Hybrid Bonding, Others)). The report also provides a comprehensive review of market drivers, restraints, opportunities, and challenges in the semiconductor bonding market. The report also covers qualitative aspects in addition to the quantitative aspects of these markets.
Key Benefits of Buying This Report
• This report includes market statistics pertaining to the process type, type, application, technology and region.
• An in-depth value chain analysis has been done to provide deep insight into the semiconductor bonding market.
• Major market drivers, restraints, challenges, and opportunities have been detailed in this report.
• Illustrative segmentation, analyses, and forecasts for the market based on process type, type, application, technology, and region have been conducted to provide an overall view of the semiconductor bonding market.
• The report includes an in-depth analysis and ranking of key players.

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Table of Contents

1 INTRODUCTION 24
1.1 STUDY OBJECTIVES 24
1.2 MARKET DEFINITION AND SCOPE 24
1.2.1 INCLUSIONS AND EXCLUSIONS 25
1.3 SCOPE 25
1.3.1 MARKETS COVERED 25
1.3.2 YEARS CONSIDERED 26
1.4 CURRENCY 26
1.5 LIMITATIONS 26
1.6 STAKEHOLDERS 26
2 RESEARCH METHODOLOGY 28
2.1 RESEARCH DATA 28
FIGURE 1 SEMICONDUCTOR BONDING EQUIPMENT MARKET: RESEARCH DESIGN 28
2.1.1 SECONDARY DATA 29
2.1.1.1 Secondary sources 29
2.1.2 PRIMARY DATA 30
2.1.2.1 Primary sources 30
2.1.2.2 Breakdown of primary interviews 30
2.2 MARKET SIZE ESTIMATION 31
FIGURE 2 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3—BOTTOM-UP MARKET ESTIMATION FOR SEMICONDUCTOR BONDING EQUIPMENT, BY TYPE 31
2.2.1 BOTTOM-UP APPROACH 31
2.2.1.1 Approach for estimating market size by bottom-up approach (demand side) 31
FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 32
2.2.2 TOP-DOWN APPROACH 32
2.2.2.1 Approach for estimating market size by top-down approach
(supply side) 32
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 32
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 33
FIGURE 5 DATA TRIANGULATION 33
2.4 ASSUMPTIONS 34
FIGURE 6 ASSUMPTIONS FOR THE RESEARCH STUDY 34
2.5 RISK ASSESSMENT 34
2.6 LIMITATIONS 35
2.7 PRIMARY INSIGHTS 35
TABLE 1 MARKET FORECASTING METHODOLOGY ADOPTED FROM 2019 TO 2026 36

3 EXECUTIVE SUMMARY 37
FIGURE 7 MARKET FOR WAFER BONDER TO GROW AT HIGHEST CAGR DURING
2021–2026 38
FIGURE 8 SEMICONDUCTOR BONDING MARKET FOR LED TO GROW AT HIGHEST CAGR DURING 2021–2026 38
FIGURE 9 APAC TO BE FASTEST-GROWING REGIONAL MARKET FOR SEMICONDUCTOR BONDING DURING FORECAST PERIOD 39
3.1 IMPACT OF COVID-19 ON SEMICONDUCTOR BONDING MARKET 40
FIGURE 10 IMPACT OF COVID-19 ON SEMICONDUCTOR BONDING MARKET,
2018–2026 (USD MILLION) 40
3.2 PRE-COVID-19 40
3.3 PESSIMISTIC SCENARIO (POST-COVID-19) 41
3.4 OPTIMISTIC SCENARIO (POST-COVID-19) 41
3.5 REALISTIC SCENARIO (POST-COVID-19) 42
4 PREMIUM INSIGHTS 43
4.1 ATTRACTIVE OPPORTUNITIES IN SEMICONDUCTOR BONDING MARKET 43
FIGURE 11 RISING NEED FOR 3D CHIPS IS ACTING AS POTENTIAL OPPORTUNITY FOR MARKET 43
4.2 SEMICONDUCTOR BONDING MARKET, BY TYPE 43
FIGURE 12 MARKET FOR WAFER BONDER TO GROW AT HIGHER CAGR DURING FORECAST PERIOD 43
4.3 MARKET FOR CLOUD SEMICONDUCTOR BONDING, BY COUNTRY 44
FIGURE 13 SEMICONDUCTOR BONDING MARKET IN JAPAN TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 44
4.4 SEMICONDUCTOR BONDING MARKET IN APAC IN 2026, BY COUNTRY & APPLICATION 44
FIGURE 14 LED TO HOLD LARGEST SHARE OF SEMICONDUCTOR BONDING MARKET IN APAC IN 2026 44
4.5 SEMICONDUCTOR BONDING MARKET, BY APPLICATION 45
FIGURE 15 MARKET FOR LED TO GROW AT HIGHEST CAGR BETWEEN 2021 AND 2026 45
5 MARKET OVERVIEW 46
5.1 INTRODUCTION 46
5.2 MARKET DYNAMICS 46
FIGURE 16 GROWING DEMAND FOR MINIATURIZATION OF ELECTRONIC DEVICES TO DRIVE SEMICONDUCTOR BONDING MARKET 46
5.2.1 DRIVERS 47
5.2.1.1 Growing demand for miniature electronic components 47
FIGURE 17 MEMS MARKET, 2017–2020 (USD MILLION) 47
5.2.1.2 Increasing adoption of stacked die technology in IoT devices 47
FIGURE 18 INDUSTRIAL IOT MARKET, BY DEVICE AND TECHNOLOGY,
2017–2020 (USD BILLION) 48
5.2.1.3 Rising demand for electric and hybrid vehicles 48
FIGURE 19 ELECTRIC VEHICLE SALES, 2013–2018 (MILLION UNITS) 49
FIGURE 20 SEMICONDUCTOR BONDING MARKET DRIVERS AND THEIR IMPACT 50
5.2.2 RESTRAINTS 50
5.2.2.1 High cost of ownership 50
FIGURE 21 SEMICONDUCTOR BONDING MARKET RESTRAINTS AND THEIR IMPACT 50
5.2.3 OPPORTUNITIES 51
5.2.3.1 Increasing demand for 3D semiconductor assembly and packaging 51
TABLE 2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
FOR 3D ICS, 2020–2025 (USD MILLION) 51
5.2.3.2 Expanding IC industry in China 51
TABLE 3 CHINA'S PROVINCES HAVE SIGNIFICANT INVESTMENT IN CHIP
FUNDS (AS OF JUNE 2020) 52
5.2.3.3 Growing adoption of IoT and AI in automotive sector 52
FIGURE 22 PROJECTED IOT CONNECTIONS BY 2025 (BILLION) 53
FIGURE 23 SEMICONDUCTOR BONDING MARKET OPPORTUNITIES AND THEIR IMPACT 53
5.2.4 CHALLENGES 54
5.2.4.1 Mechanical unbalance of moving parts and thin wafers being volatile and susceptible to damage caused by pressure or stress 54
5.2.4.2 Increased complexities related to miniaturized structures of circuits 54
FIGURE 24 SEMICONDUCTOR BONDING MARKET CHALLENGES AND THEIR IMPACT 55
5.3 VALUE CHAIN ANALYSIS 55
5.3.1 SEMICONDUCTOR BONDING VALUE CHAIN 55
FIGURE 25 VALUE CHAIN OF SEMICONDUCTOR BONDING MARKET: MAJOR VALUE IS ADDED BY SEMICONDUCTOR BONDING EQUIPMENT PROVIDERS 56
5.3.2 ASP ANALYSIS 57
TABLE 4 AVERAGE SELLING PRICES OF DIFFERENT TYPES OF BONDING MACHINES 57
5.3.3 REGULATIONS 57
5.3.4 EXPORTS–IMPORTS REGULATIONS 57
5.3.5 RESTRICTION OF HAZARDOUS SUBSTANCES (ROHS) AND WASTE
ELECTRICAL AND ELECTRONIC EQUIPMENT (WEEE) 58
5.3.6 REGISTRATION, EVALUATION, AUTHORIZATION, AND RESTRICTION
OF CHEMICALS (REACH) 58
5.4 ECOSYSTEM 59
TABLE 5 ECOSYSTEM PLAYERS 59
5.5 TECHNOLOGY ANALYSIS 60
5.5.1 MEMS AND MOEMS 60
5.5.2 WAFER BONDING 60
5.5.3 DIE BONDING 61
5.5.4 SOFT SOLDER 62
5.6 CASE STUDIES 62
5.6.1 LATEST DIE BONDING SOLUTIONS FOR PHOTONICS MANUFACTURING 62
5.6.2 MRSI SOLVES ONE OF GREATEST CHALLENGES IN MODERN PHOTONICS MANUFACTURING 63
5.6.3 QUICK SETTING RFID TAG BONDING – GLUTAG BONDING 63
5.6.4 WORLD'S FIRST 300 MM COMPATIBLE 3D-INTEGRATED LSI ROOM TEMPERATURE WAFER BONDING DEVICE 64
5.7 PATENTS ANALYSIS 65
FIGURE 26 KEY PATENT HOLDERS DURING 2010–2020 65
TABLE 6 LIST OF PATENTS 66
5.8 PORTER’S FIVE FORCES ANALYSIS 68
TABLE 7 SEMICONDUCTOR BONDING MARKET: PORTER’S FIVE FORCES ANALYSIS 68
5.8.1 BARGAINING POWER OF SUPPLIERS 68
5.8.2 BARGAINING POWER OF BUYERS 68
5.8.3 THREAT OF NEW ENTRANTS 69
5.8.4 THREAT OF SUBSTITUTES 69
5.8.5 INTENSITY OF COMPETITIVE RIVALRY 69
TABLE 8 IMPACT OF EACH FORCE ON MARKET, 2020 VS. 2026 69
5.9 TRENDS/DISRUPTIONS IMPACTING CUSTOMER’S BUSINESS 70
FIGURE 27 REVENUE SHIFT FOR SEMICONDUCTOR BONDING MARKET 70
5.10 TRADE ANALYSIS 70
TABLE 9 IMPORTS DATA FOR MACHINES AND APPARATUSES USED FOR MANUFACTURING SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS, BY COUNTRY, 2015– 2019 (USD MILLION) 71
TABLE 10 EXPORTS DATA OF MACHINES AND APPARATUSES USED FOR MANUFACTURING SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS, BY COUNTRY, 2015– 2019 (USD MILLION) 72
6 SEMICONDUCTOR BONDING MARKET, BY PROCESS TYPE 73
6.1 INTRODUCTION 74
FIGURE 28 DIE-TO-WAFER BONDING IS EXPECTED TO GROW AT HIGHEST RATE BETWEEN 2021 AND 2026 74
TABLE 11 SEMICONDUCTOR BONDING MARKET SIZE, BY PROCESS TYPE,
2018–2020 (USD MILLION) 74
TABLE 12 SEMICONDUCTOR BONDING MARKET SIZE, BY PROCESS TYPE,
2021–2026 (USD MILLION) 75
6.2 DIE-TO-DIE BONDING 75
6.2.1 DIE-TO-DIE BONDING SEGMENT IS EXPECTED TO GROW AT 4.3% CAGR 75
TABLE 13 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-DIE BONDING,
BY REGION, 2018–2020 (USD MILLION) 75
TABLE 14 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-DIE BONDING,
BY REGION, 2021–2026 (USD MILLION) 76
6.3 DIE-TO-WAFER BONDING 76
6.3.1 SEVERAL DIFFERENT DIE-TO-WAFER BONDING APPROACHES ARE BEING CONSIDERED FOR HETEROGENEOUS INTEGRATION 76
TABLE 15 TYPES OF DIE-TO-WAFER BONDING 77
TABLE 16 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-WAFER BONDING,
BY REGION, 2018–2020 (USD MILLION) 77
TABLE 17 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-WAFER BONDING,
BY REGION, 2021–2026 (USD MILLION) 77
6.4 WAFER-TO-WAFER BONDING 78
6.4.1 WAFER-TO-WAFER IS USED FOR APPLICATIONS SUCH AS CMOS IMAGE SENSORS AND VARIOUS MEMORY AND LOGIC TECHNOLOGIES 78
TABLE 18 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER-TO-WAFER BONDING, BY REGION, 2018–2020 (USD MILLION) 78
TABLE 19 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER-TO-WAFER BONDING, BY REGION, 2021–2026 (USD MILLION) 79
7 SEMICONDUCTOR BONDING MARKET, BY TECHNOLOGY 80
7.1 INTRODUCTION 81
7.2 DIE BONDING 81
FIGURE 29 EPOXY DIE BONDING TECHNOLOGY IS PROJECTED TO HOLD LARGEST MARKET SHARE DURING FORECAST PERIOD 81
TABLE 20 DIE BONDING MARKET, BY TECHNOLOGY, 2018–2020 (USD MILLION) 82
TABLE 21 DIE BONDING MARKET, BY TECHNOLOGY, 2021–2026 (USD MILLION) 82
7.2.1 EPOXY DIE BONDING 83
7.2.1.1 Epoxy bonding to account for largest share of die bonder equipment market due to low cost and low curing temperature 83
7.2.2 EUTECTIC DIE BONDING 83
7.2.2.1 Eutectic die bonding is primarily used for fabrication of electronic components 83
7.2.3 FLIP CHIP ATTACHMENT 84
7.2.3.1 Flip chip attachment method is used for making electrical connections to chips 84
7.2.4 HYBRID BONDING (FOR 3D NAND) 85
7.2.4.1 Main application of hybrid bonding is in advanced 3D device stacking 85
7.3 WAFER BONDING 85
FIGURE 30 MARKET FOR HYBRID BONDING TECHNOLOGY TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 85
TABLE 22 WAFER BONDING MARKET, BY TECHNOLOGY, 2018–2020 (USD MILLION) 86
TABLE 23 WAFER BONDING MARKET, BY TECHNOLOGY, 2021–2026 (USD MILLION) 86
7.3.1 DIRECT WAFER BONDING 86
7.3.1.1 Direct wafer bonding offers strong connection due to covalent forces 86
FIGURE 31 DIRECT WAFER BONDING PROCESS FLOW 87
7.3.2 ANODIC WAFER BONDING 89
7.3.2.1 Anodic wafer bonding offers advantage of wide process window, which helps in MEMS fabrication 89
FIGURE 32 ANODIC WAFER BONDING PROCESS FLOW 89
TABLE 24 DIFFERENCES BETWEEN DIRECT WAFER BONDING AND ANODIC WAFER BONDING 90
7.3.3 TCB WAFER BONDING 90
7.3.3.1 Metals such as Au, Cu, or Al are used for metal thermocompression bonding 90
FIGURE 33 METAL THERMOCOMPRESSION WAFER BONDING PROCESS FLOW 91
7.3.4 HYBRID BONDING 92
7.3.4.1 Xperi has developed new version of its hybrid bonding technology 92

8 SEMICONDUCTOR BONDING MARKET, BY TYPE 94
8.1 INTRODUCTION 95
FIGURE 34 WAFER BONDER SEGMENT IS EXPECTED TO GROW AT HIGHEST CAGR BETWEEN 2021 AND 2026 95
TABLE 25 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE,
2018–2020 (MILLION UNIT) 95
TABLE 26 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE,
2021–2026 (MILLION UNITS) 95
TABLE 27 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE,
2018–2020 (USD MILLION) 96
TABLE 28 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE,
2021–2026 (USD MILLION) 96
8.2 DIE BONDER 96
8.2.1 MANUAL DIE BONDERS 97
8.2.1.1 Manual die bonders play significant role in R&D, testing, and prototyping applications 97
8.2.2 SEMIAUTOMATIC DIE BONDERS 97
8.2.2.1 Semiautomatic die bonders are flexible and easy to use 97
8.2.3 FULLY AUTOMATIC DIE BONDERS 97
8.2.3.1 Fully automatic die bonders are expected to gain more market traction 97
TABLE 29 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE BONDER, BY REGION, 2018–2020 (USD MILLION) 98
TABLE 30 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE BONDER, BY REGION, 2021–2026 (USD MILLION) 98
8.3 WAFER BONDER 98
8.3.1 UV-RELEASE ADHESIVES, THERMAL-RELEASE ADHESIVES, AND
SOLVENT-RELEASE ADHESIVES ARE USED IN WAFER BONDING 98
TABLE 31 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER BONDER, BY REGION, 2018–2020 (USD MILLION) 100
TABLE 32 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER BONDER, BY REGION, 2021–2026 (USD MILLION) 100
8.4 FLIP CHIP BONDER 100
8.4.1 FLIP CHIP BONDING CAN OFFER SEVERAL ADVANTAGES OVER OTHER INTERCONNECTION PROCESSES 100
TABLE 33 SEMICONDUCTOR BONDING MARKET SIZE FOR FLIP CHIP BONDER,
BY REGION, 2018–2020 (USD MILLION) 101
TABLE 34 SEMICONDUCTOR BONDING MARKET SIZE FOR FLIP CHIP BONDER,
BY REGION, 2021–2026 (USD MILLION) 101
9 SEMICONDUCTOR BONDING MARKET, BY APPLICATION 102
9.1 INTRODUCTION 103
FIGURE 35 LED APPLICATION SEGMENT TO GROW AT HIGHEST RATE BETWEEN
2021 AND 2026 103
TABLE 35 SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION,
2018–2020 (USD MILLION) 103
TABLE 36 SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION,
2021–2026 (USD MILLION) 104
9.2 MEMS AND SENSORS 104
9.2.1 GROWTH IS DRIVEN BY HIGH DEMAND FROM CONSUMER ELECTRONICS MANUFACTURERS AND ADOPTION OF PATIENT MONITORING SOLUTIONS DURING COVID-19 PANDEMIC 104
TABLE 37 SEMICONDUCTOR BONDING MARKET SIZE FOR MEMS AND SENSORS,
BY REGION, 2018–2020 (USD MILLION) 105
TABLE 38 SEMICONDUCTOR BONDING MARKET SIZE FOR MEMS AND SENSORS,
BY REGION, 2021–2026 (USD MILLION) 105
9.3 CMOS IMAGE SENSORS (CIS) 105
9.3.1 INCREASING DEMAND FROM AUTOMOTIVE VERTICAL IS EXPECTED TO DRIVE DEMAND FOR CIS 105
TABLE 39 SEMICONDUCTOR BONDING MARKET SIZE FOR CIS, BY REGION,
2018–2020 (USD MILLION) 106
TABLE 40 SEMICONDUCTOR BONDING MARKET SIZE FOR CIS, BY REGION,
2021–2026 (USD MILLION) 106
9.4 RADIOFREQUENCY (RF) DEVICES 107
9.4.1 INCREASING DEMAND FOR RF DEVICES FOR SMARTPHONES TO DRIVE SEMICONDUCTOR BONDING MARKET 107
TABLE 41 SEMICONDUCTOR BONDING MARKET SIZE FOR RF DEVICES, BY REGION, 2018–2020 (USD MILLION) 108
TABLE 42 SEMICONDUCTOR BONDING MARKET SIZE FOR RF DEVICES, BY REGION, 2021–2026 (USD MILLION) 108
9.5 LED 108
9.5.1 INCREASING DEMAND FOR LED COMPONENTS IN HOME AND INFRASTRUCTURE MARKET TO AUGMENT GROWTH DURING FORECAST PERIOD 108
TABLE 43 SEMICONDUCTOR BONDING MARKET SIZE FOR LED, BY REGION,
2018–2020 (USD MILLION) 109
TABLE 44 SEMICONDUCTOR BONDING MARKET SIZE FOR LED, BY REGION,
2021–2026 (USD MILLION) 110
9.6 3D NAND 110
TABLE 45 SEMICONDUCTOR BONDING MARKET SIZE FOR 3D NAND, BY REGION, 2018–2020 (USD MILLION) 111
TABLE 46 SEMICONDUCTOR BONDING MARKET SIZE FOR 3D NAND, BY REGION, 2021–2026 (USD MILLION) 111
10 GEOGRAPHIC ANALYSIS 112
10.1 INTRODUCTION 113
FIGURE 36 SEMICONDUCTOR BONDING IN APAC TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 113
TABLE 47 SEMICONDUCTOR BONDING MARKET, BY REGION,
2018–2020 (USD MILLION) 113
TABLE 48 SEMICONDUCTOR BONDING MARKET, BY REGION,
2021–2026 (USD MILLION) 114

10.2 APAC 115
FIGURE 37 APAC: SEMICONDUCTOR BONDING MARKET SNAPSHOT 115
TABLE 49 SEMICONDUCTOR BONDING MARKET IN APAC, BY TYPE,
2018–2020 (USD MILLION) 116
TABLE 50 SEMICONDUCTOR BONDING MARKET IN APAC, BY TYPE,
2021–2026 (USD MILLION) 116
TABLE 51 SEMICONDUCTOR BONDING MARKET IN APAC, BY PROCESS TYPE,
2018–2020 (USD MILLION) 116
TABLE 52 SEMICONDUCTOR BONDING MARKET IN APAC, BY PROCESS TYPE,
2021–2026 (USD MILLION) 116
TABLE 53 SEMICONDUCTOR BONDING MARKET IN APAC, BY APPLICATION,
2018–2020 (USD MILLION) 117
TABLE 54 SEMICONDUCTOR BONDING MARKET IN APAC, BY APPLICATION,
2021–2026 (USD MILLION) 117
TABLE 55 SEMICONDUCTOR BONDING MARKET IN APAC, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION) 117
TABLE 56 SEMICONDUCTOR BONDING MARKET IN APAC, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION) 118
TABLE 57 SEMICONDUCTOR BONDING MARKET IN APAC, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION) 118
TABLE 58 SEMICONDUCTOR BONDING MARKET IN APAC, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION) 118
TABLE 59 SEMICONDUCTOR BONDING MARKET IN APAC, BY COUNTRY,
2018–2020 (USD MILLION) 119
TABLE 60 SEMICONDUCTOR BONDING MARKET IN APAC, BY COUNTRY,
2021–2026 (USD MILLION) 119
10.2.1 TAIWAN 120
10.2.1.1 Presence of many key OSAT companies drives market growth in Taiwan 120
10.2.2 CHINA 120
10.2.2.1 Growing trend of miniaturization of consumer electronic products spurs market growth in China 120
10.2.3 JAPAN 121
10.2.3.1 Increasing demand for passenger cars and commercial vehicles and expanding presence of market players in country fuel market growth in Japan 121
10.2.4 SOUTH KOREA 122
10.2.4.1 South Korea to continue to account for largest market size
in APAC during 2021–2026 122
10.2.5 REST OF APAC 122
10.2.5.1 Strong presence of semiconductor bonding manufacturers accelerates market growth in Rest of APAC 122
10.3 AMERICAS 123
FIGURE 38 AMERICAS: SEMICONDUCTOR BONDING MARKET SNAPSHOT 123
TABLE 61 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY TYPE,
2018–2020 (USD MILLION) 124
TABLE 62 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY TYPE,
2021–2026 (USD MILLION) 124
TABLE 63 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY PROCESS TYPE, 2018–2020 (USD MILLION) 124
TABLE 64 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY PROCESS TYPE, 2021–2026 (USD MILLION) 125
TABLE 65 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY APPLICATION, 2018–2020 (USD MILLION) 125
TABLE 66 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY APPLICATION, 2021–2026 (USD MILLION) 125
TABLE 67 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION) 126
TABLE 68 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION) 126
TABLE 69 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION) 126
TABLE 70 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION) 127
TABLE 71 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY COUNTRY,
2018–2020 (USD MILLION) 127
TABLE 72 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY COUNTRY,
2021–2026 (USD MILLION) 127
10.3.1 US 128
10.3.1.1 US to continue to lead semiconductor bonding market in Americas during 2021–2026 128
10.3.2 CANADA 128
10.3.2.1 Ongoing government initiatives toward development of electric vehicle infrastructure to create market opportunities in near future 128
10.3.3 REST OF AMERICAS 129
10.3.3.1 Increasing demand for IoT and 5G is boosting demand
for die bonding equipment in Rest of Americas 129
10.4 EUROPE 129
FIGURE 39 EUROPE: SEMICONDUCTOR BONDING MARKET SNAPSHOT 130
TABLE 73 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY TYPE,
2018–2020 (USD MILLION) 130
TABLE 74 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY TYPE,
2021–2026 (USD MILLION) 131
TABLE 75 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY PROCESS TYPE,
2018–2020 (USD MILLION) 131
TABLE 76 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY PROCESS TYPE,
2021–2026 (USD MILLION) 131
TABLE 77 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY APPLICATION,
2018–2020 (USD MILLION) 132
TABLE 78 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY APPLICATION,
2021–2026 (USD MILLION) 132
TABLE 79 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION) 132
TABLE 80 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION) 133
TABLE 81 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION) 133
TABLE 82 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION) 133
TABLE 83 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY COUNTRY,
2018–2020 (USD MILLION) 134
TABLE 84 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY COUNTRY,
2021–2026 (USD MILLION) 134
10.4.1 GERMANY 135
10.4.1.1 Adoption of smart homes and connected cars to spur demand in Germany 135
10.4.2 UK 135
10.4.2.1 Deployment of 5G infrastructure is fueling market growth in UK 135
10.4.3 FRANCE 136
10.4.3.1 Developed communication network has prompted market growth in France 136
10.4.4 IRELAND 136
10.4.4.1 Presence of Intel’s fab primarily drives market growth in Ireland 136
10.4.5 ITALY 136
10.4.5.1 Technology enhancements by players such as STMicroelectronics surge growth of semiconductor manufacturing equipment market in Italy 136
10.4.6 REST OF EUROPE 136
10.4.6.1 Initiatives of semiconductor bonding manufacturers to propel market growth in Rest of Europe 136
10.5 ROW 137
TABLE 85 SEMICONDUCTOR BONDING MARKET IN ROW, BY TYPE,
2018–2020 (USD MILLION) 137
TABLE 86 SEMICONDUCTOR BONDING MARKET IN ROW, BY TYPE,
2021–2026 (USD MILLION) 137
TABLE 87 SEMICONDUCTOR BONDING MARKET IN ROW, BY PROCESS TYPE,
2018–2020 (USD MILLION) 137
TABLE 88 SEMICONDUCTOR BONDING MARKET IN ROW, BY PROCESS TYPE,
2021–2026 (USD MILLION) 138
TABLE 89 SEMICONDUCTOR BONDING MARKET IN ROW, BY APPLICATION,
2018–2020 (USD MILLION) 138
TABLE 90 SEMICONDUCTOR BONDING MARKET IN ROW, BY APPLICATION,
2021–2026 (USD MILLION) 138
TABLE 91 SEMICONDUCTOR BONDING MARKET IN ROW, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION) 139
TABLE 92 SEMICONDUCTOR BONDING MARKET IN ROW, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION) 139
TABLE 93 SEMICONDUCTOR BONDING MARKET IN ROW, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION) 139
TABLE 94 SEMICONDUCTOR BONDING MARKET IN ROW, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION) 140
TABLE 95 SEMICONDUCTOR BONDING MARKET IN ROW, BY REGION,
2018–2020 (USD MILLION) 140
TABLE 96 SEMICONDUCTOR BONDING MARKET IN ROW, BY REGION,
2021–2026 (USD MILLION) 140
11 COMPETITIVE LANDSCAPE 141
11.1 INTRODUCTION 141
11.2 REVENUE ANALYSIS 141
FIGURE 40 REVENUE ANALYSIS OF TOP THREE COMPANIES, 2020 141
11.3 MARKET SHARE ANALYSIS, 2020 141
TABLE 97 SEMICONDUCTOR BONDING MARKET: MARKET SHARE ANALYSIS (2020) 142
11.4 KEY PLAYER STRATEGIES/RIGHT TO WIN 143
11.4.1 OVERVIEW OF STRATEGIES DEPLOYED BY KEY SEMICONDUCTOR BONDING COMPANIES 143
11.5 COMPETITIVE LEADERSHIP MAPPING 144
11.5.1 STAR 144
11.5.2 EMERGING LEADER 144
11.5.3 PERVASIVE 144
11.5.4 PARTICIPANT 144
FIGURE 41 SEMICONDUCTOR BONDING MARKET: COMPETITIVE LEADERSHIP MAPPING, 2020 145
11.5.5 SEMICONDUCTOR BONDING MARKET: TYPE FOOTPRINT 146
TABLE 98 COMPANY FOOTPRINT 146
TABLE 99 APPLICATION FOOTPRINT OF COMPANIES 147
TABLE 100 REGIONAL FOOTPRINT OF COMPANIES 148
11.6 COMPETITIVE SITUATIONS AND TRENDS 149
11.6.1 SEMICONDUCTOR BONDING MARKET: PRODUCT LAUNCHES,
JANUARY 2018–APRIL 2021 149
11.6.2 SEMICONDUCTOR BONDING MARKET: DEALS, JANUARY 2018–APRIL 2021 149
12 COMPANY PROFILES 151
(Business Overview, Products/services Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats))*
12.1 INTRODUCTION 151
12.2 KEY PLAYERS 151
12.2.1 ASM PACIFIC TECHNOLOGY 151
FIGURE 42 ASM PACIFIC TECHNOLOGY: COMPANY SNAPSHOT 152
12.2.2 BESI 156
FIGURE 43 BESI: COMPANY SNAPSHOT 156
12.2.3 PANASONIC 159
FIGURE 44 PANASONIC: COMPANY SNAPSHOT 159
12.2.4 FASFORD TECHNOLOGY 162
FIGURE 45 FUJI CORPORATION: COMPANY SNAPSHOT 163
12.2.5 SHINKAWA LTD 166
FIGURE 46 YAMAHA MOTOR ROBOTICS HOLDING CO.: COMPANY SNAPSHOT 166
12.2.6 EV GROUP (EVG) 169
12.2.7 SUSS MICROTECH SE 172
FIGURE 47 SUSS MICROTECH SE: COMPANY SNAPSHOT 173
12.2.8 KULICKE & SOFFA INDUSTRIES 176
FIGURE 48 KULICKE & SOFFA INDUSTRIES: COMPANY SNAPSHOT 176
12.2.9 PALOMAR TECHNOLOGIES 178
12.2.10 SHIBAURA MECHATRONICS 180
FIGURE 49 SHIBAURA MECHATRONICS: COMPANY SNAPSHOT 180
12.3 OTHER KEY PLAYERS 182
12.3.1 TDK CORPORATION 182
12.3.2 TOKYO ELECTRON LIMITED 183
12.3.3 MITSUBISHI HEAVY INDUSTRIES MACHINE TOOLS 184
12.3.4 MYCRONIC GROUP 185
12.3.5 INTEL 186
12.3.6 SAMSUNG 187
12.3.7 CANON ANELVA CORPORATION 188
12.3.8 FINETECH 189
12.3.9 DR. TRESKY 190
12.3.10 SET CORPORATION SA 191
12.3.11 TOKYO OHKA KOYGO 192
12.3.12 BONDTECH 193
12.3.13 AYUMI INDUSTRIES 194
12.3.14 APPLIED MICROENGINEERING LIMITED 195
12.3.15 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TSMC) 196
12.3.16 TORAY ENGINEERING 197
*Details on Business Overview, Products/services Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats) might not be captured in case of unlisted companies.
13 APPENDIX 198
13.1 INSIGHTS OF INDUSTRY EXPERTS 198
13.2 DISCUSSION GUIDE 198
13.3 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 202
13.4 AVAILABLE CUSTOMIZATIONS 204
13.5 RELATED REPORTS 204
13.6 AUTHOR DETAILS 205