Microfluidics Market by Product (Chip, Sensor, Valve, Pump, Needle), Material (Silicon, Polymer), Application (Diagnostics (Clinical, PoC), Research (Proteomic, Genomics, Cell), Therapeutics (Drug Delivery, Wearables)), End User- Global Forecast to 2029
Automotive LiDAR Market by Technology (Mechanical LiDAR and Solid-state LiDAR), Image Type, ICE Vehicle Type (PC, LCV, HCV), Location, Electric Vehicle, Range, Laser Wavelength, Measurement Process, Level of Autonomy, and Region - Global Forecast to 2030
Die Attach Machine Market Report by Type (Flip Chip Bonder, Die Bonder), Technique (Epoxy, Soft Solder, Sintering, Eutectic, and Others), Application (RF and MEMS, Optoelectronics, Logic, Memory, CMOS Image Sensors, LED, and Others), and Region 2025-2033
3D IC Market by Type (Stacked 3D, Monolithic 3D), Component (Through-Silicon Via (TSV), Through Glass Via (TGV), Silicon Interposer), Application (Logic, Imaging and Optoelectronics, Memory, MEMS/Sensors, LED, and Others), End User (Consumer Electronics, Telecommunication, Automotive, Military and Aerospace, Medical Devices, Industrial, and Others), and Region 2025-2033
Audio IC Market by IC Type (Audio Amplifier, Audio DSP, Audio Codecs, Microphone IC), Application (Mobile Phones, Computer and Tablets, Headphones, Home Entertainment Systems, Automotive, Smart Home and IoT Devices, Wearables, and Others), and Region 2025-2033
MEMS Pressure Sensors Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2031 - By Product, Technology, Grade, Application, End-user, Region: (North America, Europe, Asia Pacific, Latin America and Middle East and Africa)