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 Through-Silicon Vias (TSVs)- Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
The global market for Through-Silicon Vias (TSVs) was estimated to be worth US$ 3510 million in 2024 and is forecast to a readjusted size of US$ 8942 million by 2031 with a CAGR of 14.5% during the... もっと見る
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SummaryThe global market for Through-Silicon Vias (TSVs) was estimated to be worth US$ 3510 million in 2024 and is forecast to a readjusted size of US$ 8942 million by 2031 with a CAGR of 14.5% during the forecast period 2025-2031.Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip. At the regional level, Through-Silicon Vias (TSVs) products are mainly sold in North America, Europe and China, among which China accounts for about 25% of the global market. Currently, major global suppliers include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology, etc. These major enterprises account for more than 80% of the total share. The global Through-Silicon Vias (TSVs) market is poised for significant growth due to the rising demand for high-performance, compact, and energy-efficient electronic devices. TSV technology is a critical enabler of 3D integrated circuits (ICs) and advanced packaging solutions, making it essential for applications like artificial intelligence (AI), 5G, automotive electronics, and high-performance computing (HPC). Market Growth Drivers Demand for 3D Integration: TSVs enable vertical stacking of chips, reducing the interconnect length and enhancing performance, making them indispensable for 3D ICs and heterogeneous integration. Applications in logic-memory integration, MEMS, and CMOS image sensors are key contributors. Proliferation of AI and 5G: TSVs are critical for high-bandwidth memory (HBM), used in AI accelerators and 5G base stations. These technologies require higher data transfer rates, lower latency, and reduced power consumption, driving TSV adoption. Miniaturization and High-Density Packaging: The trend towards smaller, lighter, and more functional devices necessitates the use of TSVs for high-density interconnects. Growth in Automotive Electronics: The demand for advanced driver-assistance systems (ADAS), autonomous driving, and in-vehicle sensors is spurring the adoption of TSV-enabled components. Expansion in Data Centers and HPC: High-performance TSV-based packaging solutions are essential for the increasing processing power demands in cloud computing and data centers. This report aims to provide a comprehensive presentation of the global market for Through-Silicon Vias (TSVs), focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Through-Silicon Vias (TSVs) by region & country, by Type, and by Application. The Through-Silicon Vias (TSVs) market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through-Silicon Vias (TSVs). Market Segmentation By Company ASE Technology Holding Amkor Technology TSMC Intel GlobalFoundries JCET Group Samsung HT-tech Segment by Type 2.5D TSV 3D TSV Segment by Application Mobile and Consumer Electronics Communication Equipment Automotive Electronics Other By Region North America United States Canada Asia-Pacific China Japan South Korea Southeast Asia India Australia Rest of Asia-Pacific Europe Germany France U.K. Italy Netherlands Nordic Countries Rest of Europe Latin America Mexico Brazil Rest of Latin America Middle East & Africa Turkey Saudi Arabia UAE Rest of MEA Chapter Outline Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry. Chapter 2: Detailed analysis of Through-Silicon Vias (TSVs) company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc. Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments. Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets. Chapter 5: Revenue of Through-Silicon Vias (TSVs) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world. Chapter 6: Revenue of Through-Silicon Vias (TSVs) in country level. It provides sigmate data by Type, and by Application for each country/region. Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc. Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry. Chapter 9: Conclusion. Table of Contents1 Market Overview1.1 Through-Silicon Vias (TSVs) Product Introduction 1.2 Global Through-Silicon Vias (TSVs) Market Size Forecast (2020-2031) 1.3 Through-Silicon Vias (TSVs) Market Trends & Drivers 1.3.1 Through-Silicon Vias (TSVs) Industry Trends 1.3.2 Through-Silicon Vias (TSVs) Market Drivers & Opportunity 1.3.3 Through-Silicon Vias (TSVs) Market Challenges 1.3.4 Through-Silicon Vias (TSVs) Market Restraints 1.4 Assumptions and Limitations 1.5 Study Objectives 1.6 Years Considered 2 Competitive Analysis by Company 2.1 Global Through-Silicon Vias (TSVs) Players Revenue Ranking (2024) 2.2 Global Through-Silicon Vias (TSVs) Revenue by Company (2020-2025) 2.3 Key Companies Through-Silicon Vias (TSVs) Manufacturing Base Distribution and Headquarters 2.4 Key Companies Through-Silicon Vias (TSVs) Product Offered 2.5 Key Companies Time to Begin Mass Production of Through-Silicon Vias (TSVs) 2.6 Through-Silicon Vias (TSVs) Market Competitive Analysis 2.6.1 Through-Silicon Vias (TSVs) Market Concentration Rate (2020-2025) 2.6.2 Global 5 and 10 Largest Companies by Through-Silicon Vias (TSVs) Revenue in 2024 2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through-Silicon Vias (TSVs) as of 2024) 2.7 Mergers & Acquisitions, Expansion 3 Segmentation by Type 3.1 Introduction by Type 3.1.1 2.5D TSV 3.1.2 3D TSV 3.2 Global Through-Silicon Vias (TSVs) Sales Value by Type 3.2.1 Global Through-Silicon Vias (TSVs) Sales Value by Type (2020 VS 2024 VS 2031) 3.2.2 Global Through-Silicon Vias (TSVs) Sales Value, by Type (2020-2031) 3.2.3 Global Through-Silicon Vias (TSVs) Sales Value, by Type (%) (2020-2031) 4 Segmentation by Application 4.1 Introduction by Application 4.1.1 Mobile and Consumer Electronics 4.1.2 Communication Equipment 4.1.3 Automotive Electronics 4.1.4 Other 4.2 Global Through-Silicon Vias (TSVs) Sales Value by Application 4.2.1 Global Through-Silicon Vias (TSVs) Sales Value by Application (2020 VS 2024 VS 2031) 4.2.2 Global Through-Silicon Vias (TSVs) Sales Value, by Application (2020-2031) 4.2.3 Global Through-Silicon Vias (TSVs) Sales Value, by Application (%) (2020-2031) 5 Segmentation by Region 5.1 Global Through-Silicon Vias (TSVs) Sales Value by Region 5.1.1 Global Through-Silicon Vias (TSVs) Sales Value by Region: 2020 VS 2024 VS 2031 5.1.2 Global Through-Silicon Vias (TSVs) Sales Value by Region (2020-2025) 5.1.3 Global Through-Silicon Vias (TSVs) Sales Value by Region (2026-2031) 5.1.4 Global Through-Silicon Vias (TSVs) Sales Value by Region (%), (2020-2031) 5.2 North America 5.2.1 North America Through-Silicon Vias (TSVs) Sales Value, 2020-2031 5.2.2 North America Through-Silicon Vias (TSVs) Sales Value by Country (%), 2024 VS 2031 5.3 Europe 5.3.1 Europe Through-Silicon Vias (TSVs) Sales Value, 2020-2031 5.3.2 Europe Through-Silicon Vias (TSVs) Sales Value by Country (%), 2024 VS 2031 5.4 Asia Pacific 5.4.1 Asia Pacific Through-Silicon Vias (TSVs) Sales Value, 2020-2031 5.4.2 Asia Pacific Through-Silicon Vias (TSVs) Sales Value by Region (%), 2024 VS 2031 5.5 South America 5.5.1 South America Through-Silicon Vias (TSVs) Sales Value, 2020-2031 5.5.2 South America Through-Silicon Vias (TSVs) Sales Value by Country (%), 2024 VS 2031 5.6 Middle East & Africa 5.6.1 Middle East & Africa Through-Silicon Vias (TSVs) Sales Value, 2020-2031 5.6.2 Middle East & Africa Through-Silicon Vias (TSVs) Sales Value by Country (%), 2024 VS 2031 6 Segmentation by Key Countries/Regions 6.1 Key Countries/Regions Through-Silicon Vias (TSVs) Sales Value Growth Trends, 2020 VS 2024 VS 2031 6.2 Key Countries/Regions Through-Silicon Vias (TSVs) Sales Value, 2020-2031 6.3 United States 6.3.1 United States Through-Silicon Vias (TSVs) Sales Value, 2020-2031 6.3.2 United States Through-Silicon Vias (TSVs) Sales Value by Type (%), 2024 VS 2031 6.3.3 United States Through-Silicon Vias (TSVs) Sales Value by Application, 2024 VS 2031 6.4 Europe 6.4.1 Europe Through-Silicon Vias (TSVs) Sales Value, 2020-2031 6.4.2 Europe Through-Silicon Vias (TSVs) Sales Value by Type (%), 2024 VS 2031 6.4.3 Europe Through-Silicon Vias (TSVs) Sales Value by Application, 2024 VS 2031 6.5 China 6.5.1 China Through-Silicon Vias (TSVs) Sales Value, 2020-2031 6.5.2 China Through-Silicon Vias (TSVs) Sales Value by Type (%), 2024 VS 2031 6.5.3 China Through-Silicon Vias (TSVs) Sales Value by Application, 2024 VS 2031 6.6 Japan 6.6.1 Japan Through-Silicon Vias (TSVs) Sales Value, 2020-2031 6.6.2 Japan Through-Silicon Vias (TSVs) Sales Value by Type (%), 2024 VS 2031 6.6.3 Japan Through-Silicon Vias (TSVs) Sales Value by Application, 2024 VS 2031 6.7 South Korea 6.7.1 South Korea Through-Silicon Vias (TSVs) Sales Value, 2020-2031 6.7.2 South Korea Through-Silicon Vias (TSVs) Sales Value by Type (%), 2024 VS 2031 6.7.3 South Korea Through-Silicon Vias (TSVs) Sales Value by Application, 2024 VS 2031 6.8 Southeast Asia 6.8.1 Southeast Asia Through-Silicon Vias (TSVs) Sales Value, 2020-2031 6.8.2 Southeast Asia Through-Silicon Vias (TSVs) Sales Value by Type (%), 2024 VS 2031 6.8.3 Southeast Asia Through-Silicon Vias (TSVs) Sales Value by Application, 2024 VS 2031 6.9 India 6.9.1 India Through-Silicon Vias (TSVs) Sales Value, 2020-2031 6.9.2 India Through-Silicon Vias (TSVs) Sales Value by Type (%), 2024 VS 2031 6.9.3 India Through-Silicon Vias (TSVs) Sales Value by Application, 2024 VS 2031 7 Company Profiles 7.1 ASE Technology Holding 7.1.1 ASE Technology Holding Profile 7.1.2 ASE Technology Holding Main Business 7.1.3 ASE Technology Holding Through-Silicon Vias (TSVs) Products, Services and Solutions 7.1.4 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue (US$ Million) & (2020-2025) 7.1.5 ASE Technology Holding Recent Developments 7.2 Amkor Technology 7.2.1 Amkor Technology Profile 7.2.2 Amkor Technology Main Business 7.2.3 Amkor Technology Through-Silicon Vias (TSVs) Products, Services and Solutions 7.2.4 Amkor Technology Through-Silicon Vias (TSVs) Revenue (US$ Million) & (2020-2025) 7.2.5 Amkor Technology Recent Developments 7.3 TSMC 7.3.1 TSMC Profile 7.3.2 TSMC Main Business 7.3.3 TSMC Through-Silicon Vias (TSVs) Products, Services and Solutions 7.3.4 TSMC Through-Silicon Vias (TSVs) Revenue (US$ Million) & (2020-2025) 7.3.5 TSMC Recent Developments 7.4 Intel 7.4.1 Intel Profile 7.4.2 Intel Main Business 7.4.3 Intel Through-Silicon Vias (TSVs) Products, Services and Solutions 7.4.4 Intel Through-Silicon Vias (TSVs) Revenue (US$ Million) & (2020-2025) 7.4.5 Intel Recent Developments 7.5 GlobalFoundries 7.5.1 GlobalFoundries Profile 7.5.2 GlobalFoundries Main Business 7.5.3 GlobalFoundries Through-Silicon Vias (TSVs) Products, Services and Solutions 7.5.4 GlobalFoundries Through-Silicon Vias (TSVs) Revenue (US$ Million) & (2020-2025) 7.5.5 GlobalFoundries Recent Developments 7.6 JCET Group 7.6.1 JCET Group Profile 7.6.2 JCET Group Main Business 7.6.3 JCET Group Through-Silicon Vias (TSVs) Products, Services and Solutions 7.6.4 JCET Group Through-Silicon Vias (TSVs) Revenue (US$ Million) & (2020-2025) 7.6.5 JCET Group Recent Developments 7.7 Samsung 7.7.1 Samsung Profile 7.7.2 Samsung Main Business 7.7.3 Samsung Through-Silicon Vias (TSVs) Products, Services and Solutions 7.7.4 Samsung Through-Silicon Vias (TSVs) Revenue (US$ Million) & (2020-2025) 7.7.5 Samsung Recent Developments 7.8 HT-tech 7.8.1 HT-tech Profile 7.8.2 HT-tech Main Business 7.8.3 HT-tech Through-Silicon Vias (TSVs) Products, Services and Solutions 7.8.4 HT-tech Through-Silicon Vias (TSVs) Revenue (US$ Million) & (2020-2025) 7.8.5 HT-tech Recent Developments 8 Industry Chain Analysis 8.1 Through-Silicon Vias (TSVs) Industrial Chain 8.2 Through-Silicon Vias (TSVs) Upstream Analysis 8.2.1 Key Raw Materials 8.2.2 Raw Materials Key Suppliers 8.2.3 Manufacturing Cost Structure 8.3 Midstream Analysis 8.4 Downstream Analysis (Customers Analysis) 8.5 Sales Model and Sales Channels 8.5.1 Through-Silicon Vias (TSVs) Sales Model 8.5.2 Sales Channel 8.5.3 Through-Silicon Vias (TSVs) Distributors 9 Research Findings and Conclusion 10 Appendix 10.1 Research Methodology 10.1.1 Methodology/Research Approach 10.1.1.1 Research Programs/Design 10.1.1.2 Market Size Estimation 10.1.1.3 Market Breakdown and Data Triangulation 10.1.2 Data Source 10.1.2.1 Secondary Sources 10.1.2.2 Primary Sources 10.2 Author Details 10.3 Disclaimer
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