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ウェーハボンディング装置の世界市場インサイト、2031年までの予測

ウェーハボンディング装置の世界市場インサイト、2031年までの予測


Global Wafer Bonding Equipment Market Insights, Forecast to 2031

ウェーハボンディング装置の世界市場は、2025年の3億4,400万米ドルから2031年には4億4,433万米ドルに成長し、予測期間中の年間平均成長率(CAGR)は4.36%になると予測されている。 ウェーハボンディング装置の... もっと見る

 

 

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サマリー

ウェーハボンディング装置の世界市場は、2025年の3億4,400万米ドルから2031年には4億4,433万米ドルに成長し、予測期間中の年間平均成長率(CAGR)は4.36%になると予測されている。
ウェーハボンディング装置の世界主要メーカーは、EV Group、SUSS MicroTec、東京エレクトロン、Applied Microengineering、日本電産マシンツール、あゆみ産業、上海マイクロエレクトロニクス、U-Precision Tech、Hutemなどである。2024年、世界の上位5社の売上高シェアは約84%であった。
生産面では、2020年から2025年まで、そして2031年までの予測として、ウェーハボンディング装置の生産量、成長率、メーカー別市場シェア、地域別市場シェア(地域レベル、国レベル)を調査した。
消費面では、ウェーハボンディング装置の地域別(地域レベル、国レベル)、企業別、タイプ別、用途別の売上高を2020年から2025年まで、2031年までの予測で調査している。

レポートには以下の内容が含まれます:
ウェーハボンディング装置の世界市場概要、生産能力、生産高、収益、価格を紹介します。2020年~2024年の過去の市場収益/売上データ、2025年の予測、2031年までのCAGR予測による世界市場動向の分析。
本レポートでは、ウェーハボンディング装置の主要生産者を調査し、主要地域と国の消費量も掲載しています。ウェハボンディング装置の今後の市場ポテンシャルと、この市場を様々なセグメントとサブセグメントに予測するための主要地域/国の注目点のハイライト。米国、カナダ、メキシコ、ブラジル、中国、日本、韓国、東南アジア、ドイツ、英国、イタリア、中東、アフリカ、その他の国々の国別データと市場価値分析。

本レポートでは、ウェーハボンディング装置の売上高、収益、市場シェア、主要メーカーの業界ランキングに焦点を当て、2020年から2025年までのデータを掲載しています。世界のウェーハボンディング装置市場における主要なステークホルダーを特定し、その競争環境と市場ポジショニングを最近の動向とセグメント別の収益に基づいて分析します。本レポートは、関係者が競争環境を理解し、より多くの洞察を得て、より良い方法で事業と市場戦略を位置づけるのに役立ちます。
本レポートでは、2020年から2031年までのタイプ別、用途別のセグメントデータ、売上高、収益、価格を分析しています。ウェーハボンディング装置の売上高、予測成長動向、生産技術、用途、エンドユーザー産業の市場規模を評価・予測します。
EVグループ、SUSS MicroTec、東京エレクトロン、アプライドマイクロエンジニアリング、日本電産マシンツール、あゆみ産業、上海マイクロエレクトロニクス、U-Precision Tech、Hutemなど、世界の主要企業の詳細な企業プロフィール。

会社別
EVグループ
SUSSマイクロテック
東京エレクトロン
アプライド・マイクロエンジニアリング
日本電産マシンツール
あゆみ産業
上海微電子
U-プレシジョンテック
フテム
キヤノン
ボンドテック
タズモ
アイメカテック

タイプ別
全自動
半自動

用途別セグメント
MEMS
アドバンスト・パッケージング
CIS
その他

地域別売上高
北米
米国
カナダ
メキシコ
アジア太平洋
日本
中国
韓国
インド
東南アジア
その他
ヨーロッパ
ドイツ
フランス
英国
イタリア
ロシア
その他
南米
ブラジル
その他
中東、アフリカ

各章の概要
第1章:報告書のスコープ、各市場セグメント(タイプ別、用途別など)の市場規模、今後の発展可能性などのエグゼクティブサマリーを紹介。市場の現状と、短期・中期・長期的な展開の可能性について、ハイレベルな見解を提供しています。
第2章 ウェーハボンディング装置の世界、地域レベル、国レベルでの販売(消費)、収益。各地域とその主要国の市場規模と発展の可能性を定量的に分析し、世界各国の市場発展、今後の発展見通し、市場空間を紹介しています。
第3章:ウェーハボンディング装置メーカーの競争環境、価格、売上高、市場シェア、業界ランキング、最新開発計画、M&A情報などを詳細に分析。
第4章:各種市場セグメントをタイプ別に分析し、各市場セグメントの売上高、収益、平均価格、発展可能性などを網羅し、読者が各市場セグメントのブルーオーシャン市場を見つけやすくします。
第5章:読者が異なる下流市場のブルーオーシャン市場を見つけるのを助けるために、各市場セグメントの売上高、収益、平均価格、発展の可能性をカバーする、アプリケーション別の様々な市場セグメントの分析を提供します。
第6章から第10章種類別、用途別、国別の地域、セグメント別の売上高、収益。
第11章:主要メーカーのプロフィールを提供し、製品の説明と仕様、ウェーハボンディング装置の売上高、収益、価格、粗利益率、最近の開発など、市場の主要企業の基本状況を詳しく紹介する。
第12章-第14章産業チェーン、販売チャネル、主要原材料、流通業者、顧客の分析。市場ダイナミクス、市場の最新動向、市場の推進要因と制限要因、業界メーカーが直面する課題とリスク、業界の関連政策の分析を紹介します。
第15章 レポートの要点と結論

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目次

1 Study Coverage 1
1.1 Wafer Bonding Equipment Product Introduction 1
1.2 Market by Type 2
1.2.1 Global Wafer Bonding Equipment Market Size by Type, 2020 VS 2024 VS 2031 2
1.2.2 Market by Type 3
1.3 Market by Application 6
1.3.1 Global Wafer Bonding Equipment Market Size by Application, 2020 VS 2024 VS 2031 6
1.3.2 Market by Application 7
1.4 Assumptions and Limitations 8
1.5 Study Objectives 9
1.6 Years Considered 9
2 Executive Summary 10
2.1 Global Wafer Bonding Equipment Revenue Estimates and Forecasts 2020-2031 10
2.2 Global Wafer Bonding Equipment Revenue by Region 11
2.2.1 Global Wafer Bonding Equipment Revenue by Region: 2020 VS 2024 VS 2031 11
2.2.2 Global Wafer Bonding Equipment Revenue by Region (2020-2025) 12
2.2.3 Global Wafer Bonding Equipment Revenue by Region (2026-2031) 13
2.2.4 Global Wafer Bonding Equipment Revenue Market Share by Region (2020-2031) 13
2.3 Global Wafer Bonding Equipment Sales Estimates and Forecasts 2020-2031 14
2.4 Global Wafer Bonding Equipment Sales by Region 15
2.4.1 Global Wafer Bonding Equipment Sales by Region: 2020 VS 2024 VS 2031 15
2.4.2 Global Wafer Bonding Equipment Sales by Region (2020-2025) 16
2.4.3 Global Wafer Bonding Equipment Sales by Region (2026-2031) 16
2.4.4 Global Wafer Bonding Equipment Sales Market Share by Region (2020-2031) 16
2.5 North America 18
2.6 Europe 20
2.7 Asia Pacific 22
2.8 South America 24
2.9 Middle East, Africa 26
3 Competition by Manufacturers 28
3.1 Global Wafer Bonding Equipment Sales by Manufacturers 28
3.1.1 Global Wafer Bonding Equipment Sales by Manufacturers (2021-2024) 28
3.1.2 Global Wafer Bonding Equipment Sales Market Share by Manufacturers (2021-2024) 29
3.2 Global Wafer Bonding Equipment Revenue by Manufacturers 30
3.2.1 Global Wafer Bonding Equipment Revenue by Manufacturers (2021-2024) 30
3.2.2 Global Wafer Bonding Equipment Revenue Market Share by Manufacturers (2021-2024) 31
3.3 Global Wafer Bonding Equipment Sales Price by Manufacturers (2021-2024) 31
3.4 Analysis of Competitive Landscape 32
3.4.1 Manufacturers Market Concentration Ratio 32
3.4.2 Global Wafer Bonding Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3) 33
3.5 Global Key Manufacturers of Wafer Bonding Equipment, Manufacturing Base Distribution and Headquarters 34
3.6 Mergers & Acquisitions, Expansion Plans 34
4 Market Size by Type 37
4.1 Global Wafer Bonding Equipment Sales by Type 37
4.1.1 Global Wafer Bonding Equipment Historical Sales by Type (2020-2025) 37
4.1.2 Global Wafer Bonding Equipment Forecasted Sales by Type (2026-2031) 37
4.1.3 Global Wafer Bonding Equipment Sales Market Share by Type (2020-2031) 38
4.2 Global Wafer Bonding Equipment Revenue by Type 39
4.2.1 Global Wafer Bonding Equipment Historical Revenue by Type (2020-2025) 39
4.2.2 Global Wafer Bonding Equipment Forecasted Revenue by Type (2026-2031) 39
4.2.3 Global Wafer Bonding Equipment Revenue Market Share by Type (2020-2031) 39
4.3 Global Wafer Bonding Equipment Price by Type 40
4.3.1 Global Wafer Bonding Equipment Price by Type (2020-2025) 40
4.3.2 Global Wafer Bonding Equipment Price Forecast by Type (2026-2031) 41
5 Market Size by Application 42
5.1 Global Wafer Bonding Equipment Sales by Application 42
5.1.1 Global Wafer Bonding Equipment Historical Sales by Application (2020-2025) 42
5.1.2 Global Wafer Bonding Equipment Forecasted Sales by Application (2026-2031) 42
5.1.3 Global Wafer Bonding Equipment Sales Market Share by Application (2020-2031) 43
5.2 Global Wafer Bonding Equipment Revenue by Application 44
5.2.1 Global Wafer Bonding Equipment Historical Revenue by Application (2020-2025) 44
5.2.2 Global Wafer Bonding Equipment Forecasted Revenue by Application (2026-2031) 45
5.2.3 Global Wafer Bonding Equipment Revenue Market Share by Application (2020-2031) 45
5.3 Global Wafer Bonding Equipment Price by Application 46
5.3.1 Global Wafer Bonding Equipment Price by Application (2020-2025) 46
5.3.2 Global Wafer Bonding Equipment Price Forecast by Application (2026-2031) 47
6 North America 48
6.1 North America Wafer Bonding Equipment Market Size by Type 48
6.1.1 North America Wafer Bonding Equipment Sales by Type (2020-2031) 48
6.1.2 North America Wafer Bonding Equipment Revenue by Type (2020-2031) 49
6.2 North America Wafer Bonding Equipment Market Size by Application 50
6.2.1 North America Wafer Bonding Equipment Sales by Application (2020-2031) 50
6.2.2 North America Wafer Bonding Equipment Revenue by Application (2020-2031) 52
6.3 North America Wafer Bonding Equipment Market Size by Country 53
6.3.1 North America Wafer Bonding Equipment Revenue by Country (2020-2031) 53
6.3.2 North America Wafer Bonding Equipment Sales by Country (2020-2031) 54
6.3.3 US 56
6.3.4 Canada 57
6.3.5 Mexico 58
7 Europe 59
7.1 Europe Wafer Bonding Equipment Market Size by Type 59
7.1.1 Europe Wafer Bonding Equipment Sales by Type (2020-2031) 59
7.1.2 Europe Wafer Bonding Equipment Revenue by Type (2020-2031) 60
7.2 Europe Wafer Bonding Equipment Market Size by Application 61
7.2.1 Europe Wafer Bonding Equipment Sales by Application (2020-2031) 61
7.2.2 Europe Wafer Bonding Equipment Revenue by Application (2020-2031) 62
7.3 Europe Wafer Bonding Equipment Market Size by Country 64
7.3.1 Europe Wafer Bonding Equipment Revenue by Country (2020-2031) 64
7.3.2 Europe Wafer Bonding Equipment Sales by Country (2020-2031) 65
7.3.3 Germany 67
7.3.4 France 68
7.3.5 U.K. 69
7.3.6 Italy 70
7.3.7 Russia 71
8 Asia Pacific 72
8.1 Asia Pacific Wafer Bonding Equipment Market Size by Type 72
8.1.1 Asia Pacific Wafer Bonding Equipment Sales by Type (2020-2031) 72
8.1.2 Asia Pacific Wafer Bonding Equipment Revenue by Type (2020-2031) 73
8.2 Asia Pacific Wafer Bonding Equipment Market Size by Application 74
8.2.1 Asia Pacific Wafer Bonding Equipment Sales by Application (2020-2031) 74
8.2.2 Asia Pacific Wafer Bonding Equipment Revenue by Application (2020-2031) 76
8.3 Asia Pacific Wafer Bonding Equipment Market Size by Region 77
8.3.1 Asia Pacific Wafer Bonding Equipment Revenue by Region (2020-2031) 77
8.3.2 Asia Pacific Wafer Bonding Equipment Sales by Region (2020-2031) 79
8.3.3 China 81
8.3.4 Japan 82
8.3.5 South Korea 83
8.3.6 India 84
8.3.7 Southeast Asia 85
9 South America 86
9.1 South America Wafer Bonding Equipment Market Size by Type 86
9.1.1 South America Wafer Bonding Equipment Sales by Type (2020-2031) 86
9.1.2 South America Wafer Bonding Equipment Revenue by Type (2020-2031) 87
9.2 South America Wafer Bonding Equipment Market Size by Application 88
9.2.1 South America Wafer Bonding Equipment Sales by Application (2020-2031) 88
9.2.2 South America Wafer Bonding Equipment Revenue by Application (2020-2031) 90
9.3 South America Wafer Bonding Equipment Market Size by Country 91
9.3.1 South America Wafer Bonding Equipment Revenue by Country (2020-2031) 91
9.3.2 South America Wafer Bonding Equipment Sales by Country (2020-2031) 92
9.3.3 Brazil 94
10 Middle East and Africa 95
10.1 Middle East and Africa Wafer Bonding Equipment Market Size by Type 95
10.1.1 Middle East and Africa Wafer Bonding Equipment Sales by Type (2020-2031) 95
10.1.2 Middle East and Africa Wafer Bonding Equipment Revenue by Type (2020-2031) 96
10.2 Middle East and Africa Wafer Bonding Equipment Market Size by Application 97
10.2.1 Middle East and Africa Wafer Bonding Equipment Sales by Application (2020-2031) 97
10.2.2 Middle East and Africa Wafer Bonding Equipment Revenue by Application (2020-2031) 99
10.3 Middle East and Africa Wafer Bonding Equipment Market Size by Country 100
10.3.1 Middle East and Africa Wafer Bonding Equipment Revenue by Country (2020-2031) 100
10.3.2 Middle East and Africa Wafer Bonding Equipment Sales by Country (2020-2031) 101
11 Key Players Profiles 102
11.1 EV Group 102
11.1.1 EV Group Company Details 102
11.1.2 Company and Business Overview 102
11.1.3 Wafer Bonding Equipment Introduction 103
11.1.4 EV Group Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 104
11.2 SUSS MicroTec 104
11.2.1 SUSS MicroTec Company Details 104
11.2.2 Company and Business Overview 105
11.2.3 Wafer Bonding Equipment Introduction 106
11.2.4 SUSS MicroTec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 107
11.3 Tokyo Electron 107
11.3.1 Tokyo Electron Company Details 107
11.3.2 Company and Business Overview 108
11.3.3 Wafer Bonding Equipment Introduction 108
11.3.4 Tokyo Electron Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 109
11.4 Applied Microengineering 109
11.4.1 Applied Microengineering Company Details 109
11.4.2 Company and Business Overview 110
11.4.3 Wafer Bonding Equipment Introduction 110
11.4.4 Applied Microengineering Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 111
11.5 Nidec Machine Tool 112
11.5.1 Nidec Machine Tool Company Details 112
11.5.2 Company and Business Overview 112
11.5.3 Wafer Bonding Equipment Introduction 113
11.5.4 Nidec Machine Tool Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 114
11.6 Ayumi Industry 114
11.6.1 Ayumi Industry Company Details 114
11.6.2 Company and Business Overview 115
11.6.3 Wafer Bonding Equipment Introduction 115
11.6.4 Ayumi Industry Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 116
11.7 Shanghai Micro Electronics 117
11.7.1 Shanghai Micro Electronics Company Details 117
11.7.2 Company and Business Overview 117
11.7.3 Wafer Bonding Equipment Introduction 118
11.7.4 Shanghai Micro Electronics Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 118
11.8 U-Precision Tech 119
11.8.1 U-Precision Tech Company Details 119
11.8.2 Company and Business Overview 119
11.8.3 Wafer Bonding Equipment Introduction 120
11.8.4 U-Precision Tech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 120
11.9 Hutem 121
11.9.1 Hutem Company Details 121
11.9.2 Company and Business Overview 121
11.9.3 Wafer Bonding Equipment Introduction 122
11.9.4 Hutem Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 123
11.10 Canon 123
11.10.1 Canon Company Details 123
11.10.2 Company and Business Overview 124
11.10.3 Wafer Bonding Equipment Introduction 124
11.10.4 Canon Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 125
11.11 Bondtech 125
11.11.1 Bondtech Company Details 125
11.11.2 Company and Business Overview 126
11.11.3 Wafer Bonding Equipment Introduction 126
11.11.4 Bondtech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 127
11.12 TAZMO 127
11.12.1 TAZMO Company Details 127
11.12.2 Company and Business Overview 128
11.12.3 Wafer Bonding Equipment Introduction 128
11.12.4 TAZMO Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 129
11.13 Aimechatec 129
11.13.1 Aimechatec Company Details 129
11.13.2 Company and Business Overview 130
11.13.3 Wafer Bonding Equipment Introduction 130
11.13.4 Aimechatec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 131
12 Wafer Bonding Equipment Manufacturing Cost Analysis 132
12.1 Wafer Bonding Equipment Key Raw Materials Analysis 132
12.1.1 Key Raw Materials 132
12.1.2 Key Raw Materials Price Trend 133
12.2 Key Raw Materials Steel SFE Price Trend (Yuan/MT) 133
12.3 Key Raw Materials Aluminum LME Price Trend (USD/Tonne) 134
12.4 Key Raw Materials Copper LME Price Trend (USD/LBs) 135
12.5 Proportion of Manufacturing Cost Structure 136
12.5.1 Raw Materials 136
12.5.2 Labor Cost 136
12.5.3 Manufacturing Expenses 136
12.6 Manufacturing Process Analysis of Wafer Bonding Equipment 137
13 Sales Channel, Distributors, Traders and Dealers 138
13.1 Sales Channel 138
13.1.1 Direct Channel 138
13.1.2 Indirect Channel 139
13.2 Marketing Channels Status of Wafer Bonding Equipment 140
13.3 Market Positioning 141
13.3.1 Pricing Strategy 141
13.3.2 Brand Strategy 142
13.4 Wafer Bonding Equipment Distributors 143
13.5 Wafer Bonding Equipment Customers 143
14 Market Dynamics 144
14.1 Market Trends 144
14.2 Challenges 145
14.3 Market Favorable Factors and Unfavorable Factors 145
14.4 Market Risks 145
14.5 Industry Enters Major Barriers 146
14.6 Porter's Five Forces Analysis 146
15 Key Findings in the Global Wafer Bonding Equipment Study 148
16 Appendix 150
16.1 Research Methodology 150
16.1.1 Methodology/Research Approach 150
16.1.2 Data Source 153
16.2 Author Details 156
16.3 Disclaimer 158

 

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Summary

The global Wafer Bonding Equipment market is projected to grow from US$ 344.00 million in 2025 to US$ 444.33 million by 2031, at a Compound Annual Growth Rate (CAGR) of 4.36% during the forecast period.
The global key manufacturers of Wafer Bonding Equipment include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech, and Hutem, etc. In 2024, the global top five players had a share approximately 84% in terms of revenue.
In terms of production side, this report researches the Wafer Bonding Equipment production, growth rate, market share by manufacturers and by region (region level and country level), from 2020 to 2025, and forecast to 2031.
In terms of consumption side, this report focuses on the sales of Wafer Bonding Equipment by region (region level and country level), by company, by Type and by Application. from 2020 to 2025 and forecast to 2031.

Report Includes:
This report presents an overview of global market for Wafer Bonding Equipment, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2020 - 2024, estimates for 2025, and projections of CAGR through 2031.
This report researches the key producers of Wafer Bonding Equipment, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Wafer Bonding Equipment, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.

This report focuses on the Wafer Bonding Equipment sales, revenue, market share and industry ranking of main manufacturers, data from 2020 to 2025. Identification of the major stakeholders in the global Wafer Bonding Equipment market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2020 to 2031. Evaluation and forecast the market size for Wafer Bonding Equipment sales, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech, and Hutem, etc.

By Company
EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machine Tool
Ayumi Industry
Shanghai Micro Electronics
U-Precision Tech
Hutem
Canon
Bondtech
TAZMO
Aimechatec

Segment by Type
Fully Automatic
Semi Automatic

Segment by Application
MEMS
Advanced Packaging
CIS
Others

Sales by Region
North America
U.S.
Canada
Mexico
Asia Pacific
Japan
China
South Korea
India
Southeast Asia
Others
Europe
Germany
France
U.K.
Italy
Russia
Others
South America
Brazil
Others
Middle East, Africa

Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Sales (consumption), revenue of Wafer Bonding Equipment in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 3: Detailed analysis of Wafer Bonding Equipment manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6-10: Region by Type, by Application and by country, sales, and revenue for each segment.
Chapter 11: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Wafer Bonding Equipment sales, revenue, price, gross margin, and recent development, etc.
Chapter 12-14: Analysis of industrial chain, sales channel, key raw materials, distributors and customers. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.



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Table of Contents

1 Study Coverage 1
1.1 Wafer Bonding Equipment Product Introduction 1
1.2 Market by Type 2
1.2.1 Global Wafer Bonding Equipment Market Size by Type, 2020 VS 2024 VS 2031 2
1.2.2 Market by Type 3
1.3 Market by Application 6
1.3.1 Global Wafer Bonding Equipment Market Size by Application, 2020 VS 2024 VS 2031 6
1.3.2 Market by Application 7
1.4 Assumptions and Limitations 8
1.5 Study Objectives 9
1.6 Years Considered 9
2 Executive Summary 10
2.1 Global Wafer Bonding Equipment Revenue Estimates and Forecasts 2020-2031 10
2.2 Global Wafer Bonding Equipment Revenue by Region 11
2.2.1 Global Wafer Bonding Equipment Revenue by Region: 2020 VS 2024 VS 2031 11
2.2.2 Global Wafer Bonding Equipment Revenue by Region (2020-2025) 12
2.2.3 Global Wafer Bonding Equipment Revenue by Region (2026-2031) 13
2.2.4 Global Wafer Bonding Equipment Revenue Market Share by Region (2020-2031) 13
2.3 Global Wafer Bonding Equipment Sales Estimates and Forecasts 2020-2031 14
2.4 Global Wafer Bonding Equipment Sales by Region 15
2.4.1 Global Wafer Bonding Equipment Sales by Region: 2020 VS 2024 VS 2031 15
2.4.2 Global Wafer Bonding Equipment Sales by Region (2020-2025) 16
2.4.3 Global Wafer Bonding Equipment Sales by Region (2026-2031) 16
2.4.4 Global Wafer Bonding Equipment Sales Market Share by Region (2020-2031) 16
2.5 North America 18
2.6 Europe 20
2.7 Asia Pacific 22
2.8 South America 24
2.9 Middle East, Africa 26
3 Competition by Manufacturers 28
3.1 Global Wafer Bonding Equipment Sales by Manufacturers 28
3.1.1 Global Wafer Bonding Equipment Sales by Manufacturers (2021-2024) 28
3.1.2 Global Wafer Bonding Equipment Sales Market Share by Manufacturers (2021-2024) 29
3.2 Global Wafer Bonding Equipment Revenue by Manufacturers 30
3.2.1 Global Wafer Bonding Equipment Revenue by Manufacturers (2021-2024) 30
3.2.2 Global Wafer Bonding Equipment Revenue Market Share by Manufacturers (2021-2024) 31
3.3 Global Wafer Bonding Equipment Sales Price by Manufacturers (2021-2024) 31
3.4 Analysis of Competitive Landscape 32
3.4.1 Manufacturers Market Concentration Ratio 32
3.4.2 Global Wafer Bonding Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3) 33
3.5 Global Key Manufacturers of Wafer Bonding Equipment, Manufacturing Base Distribution and Headquarters 34
3.6 Mergers & Acquisitions, Expansion Plans 34
4 Market Size by Type 37
4.1 Global Wafer Bonding Equipment Sales by Type 37
4.1.1 Global Wafer Bonding Equipment Historical Sales by Type (2020-2025) 37
4.1.2 Global Wafer Bonding Equipment Forecasted Sales by Type (2026-2031) 37
4.1.3 Global Wafer Bonding Equipment Sales Market Share by Type (2020-2031) 38
4.2 Global Wafer Bonding Equipment Revenue by Type 39
4.2.1 Global Wafer Bonding Equipment Historical Revenue by Type (2020-2025) 39
4.2.2 Global Wafer Bonding Equipment Forecasted Revenue by Type (2026-2031) 39
4.2.3 Global Wafer Bonding Equipment Revenue Market Share by Type (2020-2031) 39
4.3 Global Wafer Bonding Equipment Price by Type 40
4.3.1 Global Wafer Bonding Equipment Price by Type (2020-2025) 40
4.3.2 Global Wafer Bonding Equipment Price Forecast by Type (2026-2031) 41
5 Market Size by Application 42
5.1 Global Wafer Bonding Equipment Sales by Application 42
5.1.1 Global Wafer Bonding Equipment Historical Sales by Application (2020-2025) 42
5.1.2 Global Wafer Bonding Equipment Forecasted Sales by Application (2026-2031) 42
5.1.3 Global Wafer Bonding Equipment Sales Market Share by Application (2020-2031) 43
5.2 Global Wafer Bonding Equipment Revenue by Application 44
5.2.1 Global Wafer Bonding Equipment Historical Revenue by Application (2020-2025) 44
5.2.2 Global Wafer Bonding Equipment Forecasted Revenue by Application (2026-2031) 45
5.2.3 Global Wafer Bonding Equipment Revenue Market Share by Application (2020-2031) 45
5.3 Global Wafer Bonding Equipment Price by Application 46
5.3.1 Global Wafer Bonding Equipment Price by Application (2020-2025) 46
5.3.2 Global Wafer Bonding Equipment Price Forecast by Application (2026-2031) 47
6 North America 48
6.1 North America Wafer Bonding Equipment Market Size by Type 48
6.1.1 North America Wafer Bonding Equipment Sales by Type (2020-2031) 48
6.1.2 North America Wafer Bonding Equipment Revenue by Type (2020-2031) 49
6.2 North America Wafer Bonding Equipment Market Size by Application 50
6.2.1 North America Wafer Bonding Equipment Sales by Application (2020-2031) 50
6.2.2 North America Wafer Bonding Equipment Revenue by Application (2020-2031) 52
6.3 North America Wafer Bonding Equipment Market Size by Country 53
6.3.1 North America Wafer Bonding Equipment Revenue by Country (2020-2031) 53
6.3.2 North America Wafer Bonding Equipment Sales by Country (2020-2031) 54
6.3.3 US 56
6.3.4 Canada 57
6.3.5 Mexico 58
7 Europe 59
7.1 Europe Wafer Bonding Equipment Market Size by Type 59
7.1.1 Europe Wafer Bonding Equipment Sales by Type (2020-2031) 59
7.1.2 Europe Wafer Bonding Equipment Revenue by Type (2020-2031) 60
7.2 Europe Wafer Bonding Equipment Market Size by Application 61
7.2.1 Europe Wafer Bonding Equipment Sales by Application (2020-2031) 61
7.2.2 Europe Wafer Bonding Equipment Revenue by Application (2020-2031) 62
7.3 Europe Wafer Bonding Equipment Market Size by Country 64
7.3.1 Europe Wafer Bonding Equipment Revenue by Country (2020-2031) 64
7.3.2 Europe Wafer Bonding Equipment Sales by Country (2020-2031) 65
7.3.3 Germany 67
7.3.4 France 68
7.3.5 U.K. 69
7.3.6 Italy 70
7.3.7 Russia 71
8 Asia Pacific 72
8.1 Asia Pacific Wafer Bonding Equipment Market Size by Type 72
8.1.1 Asia Pacific Wafer Bonding Equipment Sales by Type (2020-2031) 72
8.1.2 Asia Pacific Wafer Bonding Equipment Revenue by Type (2020-2031) 73
8.2 Asia Pacific Wafer Bonding Equipment Market Size by Application 74
8.2.1 Asia Pacific Wafer Bonding Equipment Sales by Application (2020-2031) 74
8.2.2 Asia Pacific Wafer Bonding Equipment Revenue by Application (2020-2031) 76
8.3 Asia Pacific Wafer Bonding Equipment Market Size by Region 77
8.3.1 Asia Pacific Wafer Bonding Equipment Revenue by Region (2020-2031) 77
8.3.2 Asia Pacific Wafer Bonding Equipment Sales by Region (2020-2031) 79
8.3.3 China 81
8.3.4 Japan 82
8.3.5 South Korea 83
8.3.6 India 84
8.3.7 Southeast Asia 85
9 South America 86
9.1 South America Wafer Bonding Equipment Market Size by Type 86
9.1.1 South America Wafer Bonding Equipment Sales by Type (2020-2031) 86
9.1.2 South America Wafer Bonding Equipment Revenue by Type (2020-2031) 87
9.2 South America Wafer Bonding Equipment Market Size by Application 88
9.2.1 South America Wafer Bonding Equipment Sales by Application (2020-2031) 88
9.2.2 South America Wafer Bonding Equipment Revenue by Application (2020-2031) 90
9.3 South America Wafer Bonding Equipment Market Size by Country 91
9.3.1 South America Wafer Bonding Equipment Revenue by Country (2020-2031) 91
9.3.2 South America Wafer Bonding Equipment Sales by Country (2020-2031) 92
9.3.3 Brazil 94
10 Middle East and Africa 95
10.1 Middle East and Africa Wafer Bonding Equipment Market Size by Type 95
10.1.1 Middle East and Africa Wafer Bonding Equipment Sales by Type (2020-2031) 95
10.1.2 Middle East and Africa Wafer Bonding Equipment Revenue by Type (2020-2031) 96
10.2 Middle East and Africa Wafer Bonding Equipment Market Size by Application 97
10.2.1 Middle East and Africa Wafer Bonding Equipment Sales by Application (2020-2031) 97
10.2.2 Middle East and Africa Wafer Bonding Equipment Revenue by Application (2020-2031) 99
10.3 Middle East and Africa Wafer Bonding Equipment Market Size by Country 100
10.3.1 Middle East and Africa Wafer Bonding Equipment Revenue by Country (2020-2031) 100
10.3.2 Middle East and Africa Wafer Bonding Equipment Sales by Country (2020-2031) 101
11 Key Players Profiles 102
11.1 EV Group 102
11.1.1 EV Group Company Details 102
11.1.2 Company and Business Overview 102
11.1.3 Wafer Bonding Equipment Introduction 103
11.1.4 EV Group Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 104
11.2 SUSS MicroTec 104
11.2.1 SUSS MicroTec Company Details 104
11.2.2 Company and Business Overview 105
11.2.3 Wafer Bonding Equipment Introduction 106
11.2.4 SUSS MicroTec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 107
11.3 Tokyo Electron 107
11.3.1 Tokyo Electron Company Details 107
11.3.2 Company and Business Overview 108
11.3.3 Wafer Bonding Equipment Introduction 108
11.3.4 Tokyo Electron Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 109
11.4 Applied Microengineering 109
11.4.1 Applied Microengineering Company Details 109
11.4.2 Company and Business Overview 110
11.4.3 Wafer Bonding Equipment Introduction 110
11.4.4 Applied Microengineering Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 111
11.5 Nidec Machine Tool 112
11.5.1 Nidec Machine Tool Company Details 112
11.5.2 Company and Business Overview 112
11.5.3 Wafer Bonding Equipment Introduction 113
11.5.4 Nidec Machine Tool Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 114
11.6 Ayumi Industry 114
11.6.1 Ayumi Industry Company Details 114
11.6.2 Company and Business Overview 115
11.6.3 Wafer Bonding Equipment Introduction 115
11.6.4 Ayumi Industry Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 116
11.7 Shanghai Micro Electronics 117
11.7.1 Shanghai Micro Electronics Company Details 117
11.7.2 Company and Business Overview 117
11.7.3 Wafer Bonding Equipment Introduction 118
11.7.4 Shanghai Micro Electronics Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 118
11.8 U-Precision Tech 119
11.8.1 U-Precision Tech Company Details 119
11.8.2 Company and Business Overview 119
11.8.3 Wafer Bonding Equipment Introduction 120
11.8.4 U-Precision Tech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 120
11.9 Hutem 121
11.9.1 Hutem Company Details 121
11.9.2 Company and Business Overview 121
11.9.3 Wafer Bonding Equipment Introduction 122
11.9.4 Hutem Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 123
11.10 Canon 123
11.10.1 Canon Company Details 123
11.10.2 Company and Business Overview 124
11.10.3 Wafer Bonding Equipment Introduction 124
11.10.4 Canon Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 125
11.11 Bondtech 125
11.11.1 Bondtech Company Details 125
11.11.2 Company and Business Overview 126
11.11.3 Wafer Bonding Equipment Introduction 126
11.11.4 Bondtech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 127
11.12 TAZMO 127
11.12.1 TAZMO Company Details 127
11.12.2 Company and Business Overview 128
11.12.3 Wafer Bonding Equipment Introduction 128
11.12.4 TAZMO Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 129
11.13 Aimechatec 129
11.13.1 Aimechatec Company Details 129
11.13.2 Company and Business Overview 130
11.13.3 Wafer Bonding Equipment Introduction 130
11.13.4 Aimechatec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024) 131
12 Wafer Bonding Equipment Manufacturing Cost Analysis 132
12.1 Wafer Bonding Equipment Key Raw Materials Analysis 132
12.1.1 Key Raw Materials 132
12.1.2 Key Raw Materials Price Trend 133
12.2 Key Raw Materials Steel SFE Price Trend (Yuan/MT) 133
12.3 Key Raw Materials Aluminum LME Price Trend (USD/Tonne) 134
12.4 Key Raw Materials Copper LME Price Trend (USD/LBs) 135
12.5 Proportion of Manufacturing Cost Structure 136
12.5.1 Raw Materials 136
12.5.2 Labor Cost 136
12.5.3 Manufacturing Expenses 136
12.6 Manufacturing Process Analysis of Wafer Bonding Equipment 137
13 Sales Channel, Distributors, Traders and Dealers 138
13.1 Sales Channel 138
13.1.1 Direct Channel 138
13.1.2 Indirect Channel 139
13.2 Marketing Channels Status of Wafer Bonding Equipment 140
13.3 Market Positioning 141
13.3.1 Pricing Strategy 141
13.3.2 Brand Strategy 142
13.4 Wafer Bonding Equipment Distributors 143
13.5 Wafer Bonding Equipment Customers 143
14 Market Dynamics 144
14.1 Market Trends 144
14.2 Challenges 145
14.3 Market Favorable Factors and Unfavorable Factors 145
14.4 Market Risks 145
14.5 Industry Enters Major Barriers 146
14.6 Porter's Five Forces Analysis 146
15 Key Findings in the Global Wafer Bonding Equipment Study 148
16 Appendix 150
16.1 Research Methodology 150
16.1.1 Methodology/Research Approach 150
16.1.2 Data Source 153
16.2 Author Details 156
16.3 Disclaimer 158

 

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