Summary
This report covers the market landscape and supply - chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.
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Provides market and technical trend information on organic and inorganic precursors, addressing CVD, ALD applications including high κ metal - oxides, barrier layers, metal interconnects, and capping layers, among others.
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Provides focused information for supply - chain managers, process integration and R&D directors, as well as business development and financial analysts
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Covers information about key suppliers, issues/trends in the electronics material supply chain, estimates on supplier market share, and forecast for the electronics material segments
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Table of Contents
2024 - 2025 ALD/CVD, HI-K AND METAL PRECURSOR
SUPPLY-CHAIN and MARKET ANALYSIS A CRITICAL MATERIALS REPORT(TM)
Table of Contents
EXECUTIVE SUMMARY 12
1.1 PRECURSORS BUSINESS – MARKET OVERVIEW 13
1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK 14
1.3 5 - YEAR UNIT SHIPMENT FORECAST BY SEGMENT: METAL AND HIGH-K PRECURSORS 15
1.4 PRECURSOR TRENDS 16
1.5 PRECURSOR TECHNOLOGY TRENDS 17
1.6 COMPETITIVE LANDSCAPE METAL and HIGH-K PRECURSORS 18
1.7 PRECURSOR EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS 19
1.8 ANALYST ASSESSMENT OF METAL AND HIGH-K PRECURSORS 20
2 SCOPE, PURPOSE AND METHODOLOGY 21
2.1 SCOPE 22
2.2 METHODOLOGY 23
2.3 OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS 24
3 SEMICONDUCTOR INDUSTRY MARKET STATUS and OUTLOOK 25
3.1 WORLDWIDE ECONOMY AND OUTLOOK 26
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 28
3.1.2 SEMICONDUCTOR SALES GROWTH 29
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS 30
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT 31
3.2.1 ELECTRONICS OUTLOOK 32
3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK 33
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS 34
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 35
3.2.3 SMARTPHONE OUTLOOK 36
3.2.4 PC OUTLOOK 37
3.2.5 SERVERS / IT MARKET 38
3.3 SEMICONDUCTOR FABRICATION GROWTH and EXPANSION 39
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS 40
3.3.2 NEW FABS IN THE US 41
3.3.3 WW FAB EXPANSION DRIVING GROWTH 42
3.3.4 EQUIPMENT SPENDING TRENDS 43
3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS 44
3.3.5.1 DRAM TECHNOLOGY ROADMAPS 45
3.3.5.2 3D NAND TECHNOLOGY ROADMAPS 46
3.3.6 FAB INVESTMENT ASSESSMENT 47
3.4 POLICY and TRADE TRENDS AND IMPACT 48
3.5 SEMICONDUCTOR MATERIALS OVERVIEW 49
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028 50
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028 51
4 MATERIAL MARKETTRENDS 52
4.1 CVD, ALD METAL and HIGH-K AND ADVANCED DIELECTRIC PRECURSORS MARKET TRENDS 53
4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024 54
4.1.2 PRECURSOR MARKET OUTLOOK 55
4.1.3 METAL AND HIGH - K PRECURSORS 5 - YEAR UNIT SHIPMENT FORECAST BY SEGMENT 56
4.2 PRECURSORS SUPPLY CAPACITY AND DEMAND, INVESTMENTS 57
4.2.1 METAL and HIGH - K PRECURSOR PRODUCTION CAPACITY OF TOP SUPPLIERS 58
4.2.2 METAL and HIGH - K PRODUCTION BY REGION 59
4.2.3 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS 60
4.2.4 INVESTMENT ANNOUNCEMENTS OVERVIEW 62
4.2.5 PRECURSORS SUPPLY VS. DEMAND BALANCE – OVERVIEW 63
4.3 PRICING TRENDS 64
4.4 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE 65
4.4.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW and TECHNOLOGY TRENDS 66
4.4.2 CUSTOMER DRIVEN TECHNOLOGIES 67
4.4.3 NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS 68
4.4.4 3D NAND PROCESS ADVANCES REQUIRED 69
4.4.5 NEW MATERIALS AND ETCH CHEMISTRIES ENABLE 3D NAND SCALING – PF3(G) AND MOO2CL2(S) 70
4.4.6 MOLYBDENUM: THE NEW FRONTIER IN SEMICONDUCTOR METALLIZATION ACCORDING TO LAM RESEARCH 71
4.4.7 DRAM PROCESS ADVANCES REQUIRED 72
4.4.8 DRAM FUTURE TECHNOLOGY CHALLENGES 73
4.4.9 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL - LAYER 32GBIT NON -
VOLATILE FERROELECTRIC MEMORY WITH NEAR - DRAM PERFORMANCE 74
4.4.10 ADVANCED LOGIC ROADMAPS AND CHALLENGES – LOGIC TRANSISTOR EST. ROADMAP 75
4.4.11 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE 76
4.4.12 ADV LOGIC PROCESS ADVANCES REQUIRED 77
4.4.12.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET 78
4.4.13 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES 79
4.4.14 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY 81
4.4.14.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY – DSA 82
4.4.14.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY:
CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING 84
4.4.14.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY:
LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION 85
4.4.15 CFET ARCHITECTURE: CFET SCALING ADVANTAGE 86
4.4.15.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS) 87
4.4.15.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS 90
4.4.16 INORGANIC EUV RESIST – ALD DEPOSITED 92
4.4.17 MOLECULAR LAYER DEPOSITION (MLD) 93
4.4.17.1 TREND IS MLD COMBINED WITH ALD 94
4.4.17.2 DIFFERENT TYPES OF MLD PRECURSORS AND MATERIALS 95
4.4.17.3 MLD APPLICATIONS 96
4.4.18 AREA SELECTIVE DEPOSITION (ASD) 97
4.4.18.1 AREA SELECTIVE DEPOSITION (ASD) – ADEKA PRESENT ASD HF - PRECURSOR 98
4.4.18.2 AREA SELECTIVE DEPOSITION (ASD) – TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT 99
4.4.20 SPECIALTY/EMERGING METAL AND APPLICATIONS 100
4.4.21 SPECIALTY/EMERGING HIGH - K AND APPLICATIONS 101
4.5 REGIONAL CONSIDERATIONS – METAL AND HIGH - K 102
4.5.1 REGIONAL ASPECTS AND DRIVERS 103
4.6 EHS AND TRADE/LOGISTIC ISSUES – METALS, HIGH - K AND DIELECTRICS 105
4.6.1 ESH METALS 106
4.6.2 ESH HIGH - K 107
4.6.3 ESH RECYCLING 108
4.7 TRADE/LOGISTICS ISSUES – METAL MATERIALS 109
4.7.1 TRADE/LOGISTICS ISSUES – HIGH - K MATERIALS 110
4.8 ANALYST ASSESSMENT OF HIGH - K MARKET TRENDS 111
4.8.1 ANALYST ASSESSMENT OF METAL MARKET TRENDS 112
5 SUPPLY - SIDE MARKET LANDSCAPE 113
5.1 PRECURSOR MATERIAL MARKET SHARE 114
5.1.1 CURRENT QUARTER ACTIVITY – MERCK 115
5.1.1.1 MERCK 116
5.1.2 CURRENT QUARTER ACTIVITY – AIR LIQUIDE 118
5.1.2.1 AIR LIQUIDE 119
5.1.3 CURRENT QUARTER ACTIVITY –ENTEGRIS 120
5.1.3.1 ENTEGRIS 121
5.1.4 ADEKA 122
5.1.4.1 ADEKA 123
5.2 MandA ACTIVITY AND PARTNERSHIPS 124
5.3 PLANT CLOSURES 126
5.4 NEW ENTRANTS 127
5.4.1 MSP LAUNCHES TURBO II(TM) VAPORIZERS: NEXT - GEN EFFICIENCY FOR SEMICONDUCTOR FABRICATION 128
5.4.2 A NEW ZR PRECURSOR WAFER - SCALE ZIRCONIUM DIOXIDE FILMS 129
5.4.3 ADVANCES IN MOLYBDENUM THIN FILMS: NEW LIQUID PRECURSORS BOOST VAPOR PHASE DEPOSITION 130
5.4.4 HANWHA TO SUPPLY ALD EQUIPMENT FOR MOLYBDENUM DEPOSITION FOR MEMORY APPLICATIONS 131
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS 132
5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS 133
6 SUB - TIER SUPPLY - CHAIN, PRECURSORS 134
6.1 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW 135
6.1.1 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
TIER 2 EXAMPLES NOURYON AND GELEST 136
6.1.2 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
CHEMICAL and GAS MANAGEMENT SYSTEMS 137
6.1.3 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
CHEMICAL DELIVERY CABINETS 138
6.1.4 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
VALVE MANIFOLD BOXES (VMB) 139
6.1.5 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
BULK SPEC GAS SYSTEMS 140
6.1.6 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
GAS CABINETS 141
6.1.7 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
FORMING GAS and DOPANT GAS BLENDERS 142
6.1.8 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
CHEMICAL - MONITORING AND ANALYTICAL SYSTEMS 143
6.2 SUB - TIER MATERIAL CVD and ALD PRECURSOR TRENDS 144
6.3 SUB - TIER MATERIAL INDUSTRIAL VS. SEMICONDUCTOR - GRADE 145
6.4 SEMICONDUCTOR - GRADE SUB - TIER MATERIAL SUPPLIER
GLOBAL NETWORK MERCK 146
6.5 SEMICONDUCTOR - GRADE SUB - TIER MATERIAL SUPPLIER
GLOBAL NETWORK AIR LIQUIDE 147
6.6 SEMICONDUCTOR - GRADE SUB - TIER MATERIAL SUPPLIER NEWS 148
6.7 SUB - TIER SUPPLY - CHAIN: DISRUPTIONS 150
6.8 SUB - TIER SUPPLY - CHAIN PLANT UPDATES 151
6.9 SUB - TIER SUPPLY - CHAIN PLANT UPDATES – HAFNIA AND REO FROM THE DUBBO PROJECT 152
6.10 MINERAL USED IN THE SEMICONDUCTOR INDUSTRY DEPENDENCIES 153
6.11 SUB - TIER SUPPLY - CHAIN PRICING TRENDS - COBALT 154
6.12 SUB - TIER SUPPLY - CHAIN PRICING TRENDS: ZIRCONIUM AND HAFNIUM 156
6.13 SUB - TIER SUPPLY - CHAIN PRICING TRENDS – HAFNIUM 157
6.14 SUB - TIER SUPPLY - CHAIN PRICING TRENDS - GALLIUM 158
6.15 ALUMINUM 160
6.16 TITANIUM 161
6.17 TUNGSTEN 162
6.18 MOLYBDENUM 163
6.19 NIOBIUM AND TANTALUM 164
6.20 RARE EARTHS 165
6.21 SUB - TIER SUPPLY - CHAIN PRICING TRENDS - PGM 166
6.22 SUB - TIER SUPPLY - CHAIN PRICING TRENDS - GERMANIUM 168
6.23 SUB - TIER SUPPLY - CHAIN TECHCET ANALYST ASSESSMENT 170
7 SUPPLIER PROFILES 171
ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
…AND 20+ MORE
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List of Tables/Graphs
FIGURES and TABLES
FIGURES
FIGURE 1.1: METAL and HIGH - K PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT 15
FIGURE 1.2: WW MARKET SHARE - METAL and HIGH - K PRECURSORS 2023 (U$ 811 M) 18
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023) 28
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES 29
FIGURE 3.3: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI) 30
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS 31
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS) 33
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION 34
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION 35
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES 36
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST 37
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND 39
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023 - 2028 40
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US 41
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD 42
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y - O - Y CHANGE 43
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW 44
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW 45
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW 46
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024 47
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS 50
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD) 51
FIGURE 4.1: METAL and HIGH - K PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT 56
FIGURE 4.2: MEMORY SUPPLY/DEMAND SITUATION 2024 57
FIGURE 4.3: WW MARKET SHARE - METAL and HIGH - K PRECURSORS 2023 (U$ 811 M) 58
FIGURE 4.4: REGIONAL MARKET SHARES 59
FIGURE 4.5: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES 67
FIGURE 4.6: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME 68
FIGURE 4.7: 3D NAND PROGRESSION 69
FIGURE 4.8: ETCH DEPTH PERFORMANCE 70
FIGURE 4.9: TOKYO ELECTRON’S NEW CRYOGENIC ETCH TOOL 70
FIGURE 4.10: DRAM MESH BY MICRON 72
FIGURE 4.11: IMEC CAPACITORLESS IGZO CELL FOR 3D STACKED DRAM 72
FIGURE 4.12: TRANSITION FROM 2D TO 3D DRAM 73
FIGURE 4.13: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS 74
FIGURE 4.14: GATE STRUCTURE ROADMAP 75
FIGURE 4.15: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP 76
FIGURE 4.16: LOGIC TRANSISTOR PROGRESSION 77
FIGURE 4.17: RIBBON FET 78
FIGURE 4.18: MONO LAYER NANO SHEETS CHANNELS 80
FIGURE 4.19: NANO IMPRINT LITHOGRAPHY PROCESS FLOW 81
FIGURE 4.20: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY 81
FIGURE 4.21: DIRECTED SELF - ASSEMBLY 82
FIGURE 4.22: DSA PATENT FILING BY COMPANY 83
FIGURE 4.23: DSA PATEN FILING SINCE 2023 83
FIGURE 4.24: WHAT IS PATTERN SHAPING? 84
FIGURE 4.25: REFINING EUV PATTERNING BY APPLIED MATERIALS 85
FIGURE 4.26: COMPLEMENTARY FET (CFET) 86
FIGURE 4.27: CFET IMPROVES PERFORMANCE IN TRACK SCALING 86
FIGURE 4.28: MONOLITHIC CFET PROCESS FLOW EXAMPLE 87
FIGURE 4.29: MCFET NEW FEATURE: MIDDLE DIELECTRIC ISOLATION 87
FIGURE 4.30: LOW TEMPERATURE GATE STACK OPTION EXAMPLES 88
FIGURE 4.31: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES 88
FIGURE 4.32: BSPDN ADVANTAGE: IR DROP REDUCTION 89
FIGURE 4.33: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA - FET AND CFET 90
FIGURE 4.34: IMEC SUB - 1NM TRANSISTOR ROADMAP, 3D - STACKED CMOS 2.0 PLANS 91
FIGURE 4.35: PATENT FILING FOR MLD DEPOSITED EUV RESIST. SEARCH PERFORMED IN PATBASE 92
FIGURE 4.36: MOLECULAR LAYER DEPOSITION VS ATOMIC LAYER DEPOSITION 93
FIGURE 4.37: INCREASING TREND OF ALD/MLD PUBLICATIONS 94
FIGURE 4.38: ADEKA ASD - HF PRECURSORS 98
FIGURE 4.39: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT 99
FIGURE 4.40: SPECIALTY/EMERGING METAL APPLICATIONS 100
FIGURE 4.41: SPECIALTY/EMERGING HIGH - K APPLICATIONS – NVM DRAM (MICRON IEDM2023) 101
FIGURE 4.42: 2023 METAL and HIGH - K REVENUE SHARE BY REGION 102
FIGURE 4.43: EHS ISSUES – HIGH - K: MINING IN CHINA 107
FIGURE 4.44: SK HYNIX’S RECYCLED AND RENEWABLE MATERIALS TARGETS 108
FIGURE 5.1: 2023 PRECURSOR MATERIAL SUPPLIER MARKET SHARE BY REVENUE 114
FIGURE 5.2: MERCK ELECTRONICS REVENUE 2022 - 2023
(M EUR), LEFT. SEMICONDUCTOR SOLUTIONS ANNUAL REVENUE FORECAST (M EUR), RIGHT. 117
FIGURE 5.3: AIR LIQUIDE ELECTRONICS REVENUE FORECAST (M EUR) 119
FIGURE 5.4: THE MS (MATERIAL SOLUTIONS) DIVISION OF ENTEGRIS REVENUE FORECAST 121
FIGURE 5.5: ADEKA REVENUE ELECTRONICS REVENUE FORECAST (100M JPY) 122
FIGURE 5.6: NEW ZIRCONIUM PRECURSOR CLASS 129
FIGURE 5.7: ADVANCES IN MOLYBDENUM THIN FILMS: NEW LIQUID PRECURSORS BOOST VAPOR PHASE DEPOSITION 130
FIGURE 6.1: FORMING GAS BLENDER CONFIGURATION 142
FIGURE 6.2: TOP COUNTRIES/REGIONS THAT SUPPLY VERSUM MATERIALS US LLC (PANJIVA APRIL 2024) 146
FIGURE 6.3: TOP COUNTRIES/REGIONS THAT SUPPLY AIR LIQUIDE AMERICA CORP. (PANJEIVA APRIL 2024) 147
FIGURE 6.4: TOP COUNTRIES/REGIONS THAT SUPPLY H.C. STARCK INC. (USA) 148
FIGURE 6.5: PRICE TREND IN COBALT 155
FIGURE 6.6: HAFNIUM 5 - YEAR PRICING 157
FIGURE 6.7: GALLIUM PRICE, 5 YEAR HISTORICAL 159
FIGURE 6.8: RUTHENIUM AND PLATINUM, 5 - YEAR HISTORICAL PRICING 167
FIGURE 6.9: GERMANIUM PRICE, 5 - YEAR HISTORICAL 169
TABLES
TABLE 1.1: METAL AND HI - K PRECURSORS REVENUES AND GROWTH RATES 15
TABLE 1.2: ESTIMATED METAL AND HIGH - K PRECURSOR MARKET SHARE BY SUPPLIER 2023 18
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES 26
TABLE 3.2: WORLD BANK ECONOMIC OUTLOOK (JANUARY 2024) 27
TABLE 3.3: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS 34
TABLE 3.4: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023 38
TABLE 4.1: PRECURSORS REVENUE AND GROWTH RATES 53
TABLE 4.2: METAL AND HI - K PRECURSORS REVENUES AND GROWTH RATES 56
TABLE 4.3: ESTIMATED METAL AND HIGH - K PRECURSOR MARKET SHARE BY SUPPLIER 2023 58
TABLE 4.4: METAL and HIGH - K PRECURSOR MARKET REGIONAL ASSESSMENT 2023 59
TABLE 4.5: OVERVIEW OF ANNOUNCED 2023/2024 MATERIAL SUPPLIER INVESTMENTS 62
TABLE 4.6: LEADING EDGE LOGIC DESCRIPTIONS BY NODE (TSMC, INTEL) 78
TABLE 4.7: SELECTIVE DEPOSITION - SELECTIVELY DEPOSITED MATERIALS 97
TABLE 4.8: REGIONAL PRECURSOR MATERIAL MARKETS 103
TABLE 4.9: REGIONAL PRECURSOR MATERIAL MARKETS, CONTINUED 104
TABLE 5.1: MERCK QUARTER FINANCIALS 115
TABLE 5.2: AIR LIQUIDE CURRENT QUARTER FINANCIALS 118
TABLE 5.3: ENTEGRIS SUPPLIER CURRENT QUARTER FINANCIALS 120
TABLE 6.1: CVD AND ALD PRECURSOR 145
TABLE 6.2: ORIGIN OF MINERALS USED TO MAKE PRECURSORS 153
TABLE 6.3: COBALT MINING AND PRODUCTION BY LOCATION 154
TABLE 6.4: ZIRCONIUM AND HAFNIUM MINERAL PRODUCTION BY LOCATION 156
TABLE 6.5: GALLIUM MINERAL PRODUCTION DESCRIPTION AND DEPENDENCIES 158
TABLE 6.6: ALUMINUM MINERAL REFINING AND PRODUCTION BY LOCATION 160
TABLE 6.7: TITANIUM ORE (ILMENITE AND RUTILE) PRODUCTION LOCATIONS 161
TABLE 6.8: TUNGSTEN ORE PRODUCTION BY LOCATION 162
TABLE 6.9: MOLYBDENUM PRODUCTION AND IMPORT AND EXPORTS 163
TABLE 6.10: MOLYBDENUM PRODUCTION DESCRIPTIONS 163
TABLE 6.11: NIOBIUM AND TANTALUM PRODUCTION BY LOCATION 164
TABLE 6.12: RARE EARTHS PRODUCTION BY LOCATION , I.E. LANTHANUM 165
TABLE 6.13: PGM PRODUCTION BY LOCATION 166
TABLE 6.14: GERMANIUM APPLICATIONS BY PERCENTAGE VOLUME 168
Press Release
August 1, 2024
Semiconductor ALD/CVD Precursors Driven by Advanced Applications
Mo, WF6, and Co precursors to see significant growth
San Diego, CA, August 1, 2024:
TECHCET — the advisory firm providing materials market information for semiconductor supply chain resilience — is forecasting semiconductor metal and oxide precursors to reach US$1.7 B in revenues in 2024, rising 15% over 2023. This is the highest growth rate among all front process materials segments. Metal/Metal-oxide precursors occupy the majority of the market with expected revenues at $972 M, while Dielectric Precursors are expected to total US$742 M. The precursor market is forecasted to increase at a 9% CAGR from 2023-2028. More information on market forecasting and trends is included in TECHCET’s new Critical Materials Reports™ on ALD/CVD Precursors.
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Metal and Dielectric Precursor Market Revenue Forecast
Significant investments are being made in advanced process technologies such as GAA FETs, EUV lithography, and high-k/metal gate transistors, all of which are crucial for next-generation Logic, DRAM, and 3D NAND devices. Recovery of precursor revenue growth is being driven by AI and advanced technology applications. Additionally, metallization for backside power delivery at 2nm logic nodes and beyond is also pushing up growth for metal precursors.
Molybdenum (Mo) precursors, specifically MoO2Cl2, are projected to experience high growth due to their favorable electrical properties and application in next-generation devices. Other precursors strongly tied to advanced device nodes include Cobalt precursors (CoCOCp and CCTBA) and Tungsten Hexafluoride (WF6).
The shift towards more sustainable and efficient production methods is influencing the development of new precursors, with a focus on reducing environmental impact and improving manufacturing efficiency.
Major industry players are expanding their production capacities in order to meet growing demand. Companies such as Air Liquide, Merck, and Gelest/Mitsubishi Chemical Group are making significant investments in production facilities in key regions like Taiwan, South Korea, and the US.
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