Summary

The global Advanced IC Substrate market is experiencing significant transformation, driven primarily by increasing demand for high-performance computing, AI accelerators, and advanced packaging solutions. The industry is witnessing a technological shift from traditional organic substrates to more advanced solutions, including glass core substrates (GCS) and high-end FC-BGA substrates, particularly for AI and data center applications. Major Asian manufacturers, including companies from Taiwan, Japan, and South Korea, dominate the market, while China is rapidly expanding its capabilities through substantial investments in high-end substrate manufacturing.

The market is seeing increased competition in the build-up substrate segment, particularly in ABF substrate production, which has traditionally been dominated by Ajinomoto. New entrants, especially in China, are challenging established players, while companies like Unimicron, Ibiden, and Samsung Electro-Mechanics continue to lead in high-end substrate production. The industry is experiencing significant capacity expansion, with major investments in new facilities and technology upgrades, particularly for FC-BGA substrates supporting AI applications. Technical advancement is focused on achieving finer line/space dimensions, improved thermal management, and enhanced signal integrity, with some manufacturers pushing below 8/8µm line/space capabilities. The market is also seeing the emergence of glass core substrates as a potential game-changer, with companies like Absolics, Intel, and Samsung leading development efforts.

Future growth is expected to be driven by continued expansion in AI computing, 5G/6G infrastructure, automotive electronics, and high-performance computing applications, with particular emphasis on supporting heterogeneous integration and chiplet technologies. Geopolitical factors are influencing supply chain strategies, leading to increased investments in regional manufacturing capabilities, particularly in the United States through government incentives and support programs, although Asia remains the dominant manufacturing hub. The industry faces challenges in scaling production to meet growing demand while managing increasing technical complexity and cost pressures, but opportunities exist in emerging applications and new technology platforms.

The Global Market for Advanced IC Substrates 2025-2035 analyzes the rapidly evolving Advanced IC Substrates industry, which forms a critical component of the global semiconductor packaging ecosystem. The market, following a correction in 2023, is projected to experience robust growth, driven by increasing demand for high-performance computing, artificial intelligence, and advanced packaging solutions. The report provides detailed analysis of all major substrate types including FC-BGA, FC-CSP, SiP, Glass Core Substrates, and Substrate-like PCB, along with emerging technologies and manufacturing processes. Special focus is given to the transition from traditional organic substrates to advanced solutions, particularly glass core substrates for AI and data center applications.

Key market drivers examined include AI accelerator adoption, data center expansion, 5G/6G infrastructure development, and growing automotive electronics demand. The analysis covers manufacturing processes, including traditional methods, Semi-Additive Process (SAP), and Modified Semi-Additive Process (mSAP), while exploring emerging technologies like glass core substrates and advanced organic substrates.

The study provides comprehensive regional analysis, focusing on Asia Pacific's manufacturing dominance, North American technology development, and European market dynamics. It examines capacity expansion plans, particularly in Taiwan, Japan, South Korea, and China's emerging capabilities, while analyzing the impact of government initiatives and geopolitical factors on regional manufacturing strategies.

Technical aspects covered include line/space development, via technologies, surface treatments, and material innovations. The report analyzes challenges in achieving finer line/space dimensions, improving thermal management, and enhancing signal integrity, with detailed examination of solutions pushing below 8/8µm line/space capabilities.

Market forecasts through 2035 include:

• Revenue projections by technology type
• Volume forecasts by application
• Regional market development
• Technology adoption rates
• Price trends and cost structures

The competitive landscape section profiles 112 companies, including substrate manufacturers, equipment suppliers, material providers, and end-users. Companies profiled include AaltoSemi, Absolics, AGC, Ajinomoto, AMD, Applied Materials, ASE, Asahi Kasei, Calumet, Corning, Daeduck, DNP, Doosan, Dupont, Fujikura, Haesung, Han's Laser, HiSilicon, Horexs, Ibiden, Infineon, Intel, Innolux, ITEQ, Joong Woo, Kinwong, Kinsus, Korea Circuit, Kyocera, Lam Research, LG Chem, LG Innotek, Macdermid Alpha, Manz, Meiko, MKS Atotech, Nan Ya PCB, NEG, NSG, Nvidia, Okuno, Onto Innovation, Oppo, Panasonic, Philoptics, Phoenix Pioneer Technology, RENA, Resonac, Samsung, Schmid, Schott, Schweizer, Sekisui, Semco, Shennan Circuits, ShinEtsu, Shinko, Simmtech, SKC, SKY Semi, Sumitomo Bakelite, SweGan AB and more......

Application analysis covers:

• High-performance computing and AI
• Data center infrastructure
• Mobile devices
• Automotive electronics
• Consumer electronics

The report examines supply chain dynamics, material requirements, equipment evolution, and manufacturing processes. It analyzes the impact of technical challenges, cost pressures, and material limitations while identifying growth opportunities in emerging applications and new technology platforms. Future outlook sections explore technology trends, market evolution, and industry roadmaps, with particular emphasis on:

• Glass core substrate adoption
• Advanced organic substrate development
• Manufacturing process innovations
• Regional capacity expansion
• Supply chain reorganization

This report serves as an essential resource for:

• Substrate manufacturers
• Semiconductor companies
• Equipment suppliers
• Material providers
• Investment firms
• Research organizations
• Industry strategists

The analysis is based on extensive primary research with industry participants, combined with comprehensive secondary research and proprietary market data. The report includes detailed tables, figures, and charts illustrating market trends, technology developments, and competitive dynamics in the Advanced IC Substrates industry.

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Table of Contents

1 EXECUTIVE SUMMARY 23

1.1 Market Overview 23
1.1.1 Market Size and Growth 23
1.1.2 Regional Distribution 24
1.1.3 Key Market Segments 25
1.1.4 Technology Landscape 25
1.1.5 Industry Trends 26
1.2 Market Growth Drivers 28
1.2.1 AI and HPC Demand 29
1.2.2 5G/6G Infrastructure 30
1.2.3 Automotive Electronics 31
1.2.4 Consumer Electronics 32
1.3 Technology Evolution 32
1.3.1 Organic Substrates 32
1.3.2 Glass Core Substrates 33
1.3.3 Manufacturing Processes 34
1.3.4 Material Innovations 35
1.4 Competitive Landscape 36
1.4.1 Market Leaders 36
1.4.2 Regional Players 37
1.4.3 New Entrants 38
1.4.4 Strategic Initiatives 40

2 INTRODUCTION TO ADVANCED IC SUBSTRATES 41

2.1 Definition and Classification 41
2.1.1 Basic Concepts 41
2.1.2 Evolution of IC Substrates 42
2.1.3 Technical Parameters 42
2.2 Types of Advanced IC Substrates 43
2.2.1 Organic Core Substrates 44
2.2.1.1 FC-BGA (Flip Chip Ball Grid Array) 45
2.2.1.2 FC-CSP (Flip Chip Chip Scale Package) 48
2.2.1.3 Build-up Substrates 50
2.2.1.4 Coreless Substrates 50
2.2.2 SiP (System in Package) Substrates 51
2.2.2.1 Performance Characteristics 51
2.2.2.2 Applications 52
2.2.3 Molded Interconnection Substrate (MIS) 52
2.2.3.1 Performance Characteristics 52
2.2.3.2 Applications 53
2.2.4 Glass Core Substrates 55
2.2.4.1 Properties 55
2.2.4.2 Manufacturing 56
2.2.4.3 Benefits 58
2.2.5 Substrate-like PCB 59
2.2.5.1 Technology 59
2.2.5.2 Applications 60
2.2.6 Embedded Die Technology 61
2.2.6.1 Process Flow 61
2.2.6.2 Benefits 62
2.2.6.3 Applications 63
2.3 Manufacturing Processes 63
2.3.1 Traditional Methods 65
2.3.2 Advanced Processes 65
2.3.2.1 Semi-Additive Process (SAP) 66
2.3.2.2 Modified Semi-Additive Process (mSAP) 67
2.3.2.3 Advanced Manufacturing Techniques 68
2.3.3 Quality Control 69
2.3.4 Testing Methods 70

3 TECHNOLOGY ANALYSIS 71

3.1 Core Technologies 71
3.1.1 Line/Space Development 71
3.1.1.1 Current Capabilities 72
3.1.1.2 Future Targets 73
3.1.1.3 Technical Challenges 75
3.1.2 Via Technologies 75
3.1.2.1 Through Hole 77
3.1.2.2 Blind Vias 78
3.1.2.3 Buried Vias 79
3.1.3 Surface Treatment 80
3.1.3.1 Finishes 80
3.1.3.2 Coatings 81
3.1.3.3 Protection 82
3.2 Material Technologies 83
3.2.1 Core Materials 83
3.2.1.1 Organic Materials 84
3.2.1.2 Glass Materials 85
3.2.1.3 Composites 86
3.2.2 Build-up Materials 88
3.2.2.1 Dielectrics 89
3.2.2.2 Conductors 89
3.2.2.3 Specialty Materials 91
3.2.3 Surface Finishes 91
3.2.3.1 Types 92
3.2.3.2 Performance 94
3.3 Advanced Features 95
3.3.1 Fine Pitch Capabilities 96
3.3.2 High-Density Interconnect 97
3.3.3 Thermal Management 98
3.3.4 Signal Integrity 99

4 MARKET ANALYSIS 101

4.1 Global Market Overview 101
4.1.1 Market Size and Valuation 101
4.1.1.1 Historical Data (2019-2023) 101
4.1.1.2 Current Market Size 102
4.1.1.3 Growth Projections 103
4.1.2 Market Segmentation 104
4.1.2.1 By Technology 104
4.1.2.2 By Application 105
4.1.2.3 By Region 107
4.1.3 Value Chain Analysis 108
4.2 Market Dynamics 109
4.2.1 Growth Drivers 109
4.2.1.1 AI/ML Applications 109
4.2.1.2 Data Center Expansion 110
4.2.1.3 Automotive Electronics 111
4.2.1.4 5G/6G Infrastructure 112
4.2.2 Market Restraints 114
4.2.2.1 Technical Challenges 114
4.2.2.2 Cost Factors 115
4.2.2.3 Material Limitations 116
4.2.3 Opportunities 117
4.2.3.1 New Applications 117
4.2.3.2 Technology Advancement 118
4.2.3.3 Regional Manufacturing 118
4.3 Pricing Analysis 120
4.3.1 Cost Structure 120
4.3.2 Price Trends 121
4.3.3 Future Price Projections 122

5 APPLICATION ANALYSIS 123

5.1 High-Performance Computing 123
5.1.1 Market Requirements 123
5.1.2 Current Solutions 124
5.1.3 Future Developments 125
5.2 Artificial Intelligence 126
5.2.1 AI Accelerators 127
5.2.2 Machine Learning Processors 128
5.2.3 Neural Network Applications 129
5.3 Data Center Infrastructure 130
5.3.1 Server Applications 130
5.3.2 Storage Systems 131
5.3.3 Network Equipment 132
5.4 Mobile Devices 133
5.4.1 Smartphones 134
5.4.2 Tablets 135
5.4.3 Wearables 136
5.5 Automotive Electronics 137
5.5.1 ADAS Systems 138
5.5.2 Electric Vehicles 140
5.5.3 Infotainment Systems 140

6 REGIONAL MARKET ANALYSIS 141

6.1 Asia Pacific 141
6.2 North America 143
6.3 Europe 145

7 COMPETITIVE LANDSCAPE 147

7.1 Market Structure 147
7.1.1 Key Players 147

8 MANUFACTURING 151

8.1 Production Processes 151
8.1.1 Traditional Methods 151
8.1.2 Advanced Processes 152
8.1.3 Future Technologies 154
8.2 Quality Control 156
8.2.1 Testing Methods 156
8.2.2 Standards 158
8.2.3 Certification 160
8.3 Capacity Analysis 161
8.3.1 Global Capacity 161
8.3.2 Regional Distribution 163
8.3.3 Expansion Plans 164

9 EMERGING TECHNOLOGIES 165

9.1 Glass Core Substrates 165
9.1.1 Technology Overview 165
9.1.2 Manufacturing Process 166
9.1.3 Applications 168
9.1.4 Market Potential 170
9.2 Advanced Organic Substrates 170
9.2.1 New Materials 170
9.2.2 Process Innovations 172
9.2.3 Performance Improvements 174
9.3 Novel Manufacturing Approaches 175
9.3.1 Additive Manufacturing 175
9.3.2 Hybrid Processes 177
9.3.3 Advanced Equipment 178
9.4 Next-Generation Solutions 180
9.4.1 Advanced Packaging Integration 181
9.4.2 3D Integration 183
9.4.3 Novel Architectures 185

10 SUPPLY CHAIN ANALYSIS 187

10.1 Raw Material Suppliers 187
10.2 Equipment Manufacturers 189
10.3 Substrate Manufacturers 190

11 MARKET FORECAST 191

11.1 Global Market Projections 192
11.1.1 Revenue Forecast 192
11.1.2 Volume Forecast 193
11.1.3 Technology Adoption 194
11.2 Regional Market Forecast 195
11.2.1 Asia Pacific 195
11.2.2 North America 196
11.2.3 Europe 196
11.3 Application Market Forecast 197
11.3.1 HPC/AI 197
11.3.2 Mobile Devices 198
11.3.3 Automotive 199
11.3.4 Consumer Electronics 201

12 TECHNICAL CHALLENGES AND SOLUTIONS 203

12.1 Design Challenges 203
12.1.1 Fine Line/Space 203
12.1.2 Signal Integrity 204
12.1.3 Thermal Management 205
12.2 Manufacturing Challenges 206
12.2.1 Process Control 206
12.2.2 Yield Management 207
12.2.3 Cost Reduction 208
12.3 Material Challenges 208
12.3.1 Performance Requirements 209
12.3.2 Reliability Issues 210
12.3.3 Cost Considerations 211

13 FUTURE OUTLOOK 212

13.1 Technology Trends 212
13.1.1 Material Evolution 213
13.1.2 Process Development 214
13.1.3 Design Innovation 216
13.2 Market Evolution 217
13.2.1 Growth Sectors 217
13.2.2 Regional Developments 218
13.2.3 Competition Dynamics 219
13.3 Industry Roadmap 220
13.3.1 Short-term Developments 220
13.3.2 Medium-term Outlook 221
13.3.3 Long-term Vision 222

14 COMPANY PROFILES 224 (112 company profiles)

15 APPENDICES 333

15.1 Glossary of Terms 333
15.2 List of Abbreviations 335
15.3 Research Methodology 337

16 REFERENCES 338

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List of Tables/Graphs

List of Tables

Table 1. Global Advanced IC Substrates Market Overview 2024-2034 (USD Billions). 23
Table 2. Industry trends in Advanced IC Substrates. 26
Table 3. Growth Drivers Impact Analysis (2024-2034). 28
Table 4. Manufacturing process evolution. 34
Table 5. Market Leaders in Advanced IC Substrates. 36
Table 6. Types of Advanced IC Substrates - Comparison Matrix. 44
Table 7. Key Technical Parameters for Different Substrate Types. 44
Table 8. Manufacturing Process Comparison. 64
Table 9. Advanced IC Substate Manufacturing Processes. 65
Table 10. Material Properties Comparison. 70
Table 11. Via Technology Specifications Comparison. 76
Table 12. Core Material Properties Matrix. 83
Table 13. Build-up Material Specifications. 88
Table 14. Surface Finish Comparison. 92
Table 15. Performance Parameters by Technology Type. 94
Table 16. Global Market Size Historical Data (2019-2023). 101
Table 17. Advanced IC Substrates Growth Projections 2025-2035. 103
Table 18. Market Forecast by Technology (2024-2034). 105
Table 19. Market Forecast by Application (2024-2034). 105
Table 20. Regional Market Size and Growth (2024-2034). 107
Table 21. Technical Challenges in Advanced IC Substrates. 114
Table 22. Cost Factors in Advanced IC Substrates. 115
Table 23. Materials Limitations in Advanced IC Substrates. 116
Table 24. Cost Structure Analysis. 120
Table 25. Price Trends by Technology Type (2019-2024). 121
Table 26. HPC Requirements Matrix. 123
Table 27. AI Application Specifications. 126
Table 28. Neural Network Applications. 129
Table 29. Data Center Infrastructure Requirements. 130
Table 30. Mobile Device Specifications. 133
Table 31. Automotive Electronics Standards. 137
Table 32. Asia Pacific Manufacturing Capacity by Country. 141
Table 33. Production Process Parameters. 151
Table 34. Quality Control Standards. 158
Table 35. Global Advanced IC Substrate Capacities. 161
Table 36. Glass Core Substrate Specifications. 165
Table 37. Global Advanced IC Substrates Revenues Forecast 2025-2035 (Billions USD). 192
Table 38. Global Advanced IC Substrates Volume Forecast 2025-2035 (Billions USD). 193
Table 39. Advanced IC Substrates Revenues Forecast, Asia Pacific, 2025-2035 (Billions USD). 195
Table 40. Advanced IC Substrates Revenues Forecast, North America, 2025-2035 (Billions USD). 196
Table 41. Advanced IC Substrates Revenues Forecast, Europe, 2025-2035 (Billions USD). 197
Table 42. Advanced IC Substrates Revenues Forecast, in HPC/AI, 2025-2035 (Billions USD). 198
Table 43. Advanced IC Substrates Revenues Forecast, in Mobile Devices, 2025-2035 (Billions USD). 198
Table 44. Advanced IC Substrates Revenues Forecast, in Automotive, 2025-2035 (Billions USD). 199
Table 45. Advanced IC Substrates Revenues Forecast, in Consumer Electronics, 2025-2035 (Billions USD). 201
Table 46. Glossary of Terms. 333
Table 47. List of Abbreviations. 335

List of Figures

Figure 1. Regional Market Distribution 2024 (% Share). 24
Figure 2. Advanced IC Substrate Construction Diagram. 42
Figure 3 Evolution of Advanced IC Substrates. 42
Figure 4. Manufacturing Process Flow. 66
Figure 5. Quality Control Process Flow. 69
Figure 6. Via Formation Process. 77
Figure 7. Material Layer Structure. 84
Figure 8. Surface Treatment Process. 92
Figure 9. Global Market Size Historical Data (2019-2023). 102
Figure 10. Market Forecast by Technology (2024-2034). 105
Figure 11. Market Forecast by Application (2024-2034). 106
Figure 12. Regional Market Size and Growth (2024-2034). 108
Figure 13. Advanced IC Substrates Value Chain. 109
Figure 14. Glass Core Manufacturing Process. 166
Figure 15. Process Innovation Timeline. 172
Figure 16. Global Advanced IC Substrates Revenues Forecast 2025-2035 (Billions USD). 193
Figure 17. Global Advanced IC Substrates Volume Forecast 2025-2035 (Billions USD). 193
Figure 18. Advanced IC Substrates Revenues Forecast, Asia Pacific, 2025-2035 (Billions USD). 195
Figure 19. Advanced IC Substrates Revenues Forecast, North America, 2025-2035 (Billions USD). 196
Figure 20. Advanced IC Substrates Revenues Forecast, Europe, 2025-2035 (Billions USD). 197
Figure 21. Advanced IC Substrates Revenues Forecast, in HPC/AI, 2025-2035 (Billions USD). 198
Figure 22. Advanced IC Substrates Revenues Forecast, in Mobile Devices, 2025-2035 (Billions USD). 199
Figure 23. Advanced IC Substrates Revenues Forecast, in Automotive, 2025-2035 (Billions USD). 200
Figure 24. Advanced IC Substrates Revenues Forecast, in Consumer Electronics, 2025-2035 (Billions USD). 201