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Copper Additive Manufacturing 2020 – Market Database and Outlook


銅による付加製造(積層造形)2020年:市場データベースと概観

米国調査会社スマーテックマーケッツパブリッシング(SmarTech Markets Publishing)の調査レポート 「銅による付加製造(積層造形)2020年:市場データベースと概観」 は、付加製造(積層造形)産業の産業... もっと見る

 

 

出版社 出版年月 電子版価格 言語
Additive Manufacturing Research(旧SmarTech Analysis)
アディティブマニファクチャリング
2020年5月8日 US$2,995
シングルユーザライセンス(1PC)
ライセンス・価格情報
注文方法はこちら
英語

 

Summary

米国調査会社スマーテックマーケッツパブリッシング(SmarTech Markets Publishing)の調査レポート「銅による付加製造(積層造形)2020年:市場データベースと概観」は、付加製造(積層造形)産業の産業データと市場予測を提供している。レポートには、銅付加製造の生産市場におけるマトリクスとビジネスチャンスを具体化する為に、市場モデルの一部になる最重要市場の特徴とダイナミクスの方向性も含まれる。

 


 

As one piece of a two-part market analysis package from SmarTech Analysis, this report supplements a companion database of historical and forecasted market data and opportunities in copper additive manufacturing (AM). The report is based on SmarTech’s methodology for market modeling and forecasting of the AM industry, which have become a strategic source for comprehensive AM market metrics and sizing. The report also includes the direction of chief market features and dynamics that become a part of our market models in order to shape the output market metrics and projected opportunities for copper AM.

A small number of charts are included in order to better elucidate significant tendencies, with varied added references made to the companion database as a means of providing context to the numerical data. Our market and trend analysis deliberately maintains a level that can deliver well-defined and succinct descriptions of the current market and opportunities and how we anticipate them to progress over the course of time.

Together with the supplementary database, this report package is meant to act as a comprehensive, measureable guide to copper AM opportunities, which have shown to be important driving forces behind the metal AM market. This package will be a useful tool for preparing and gauging commercial activities and success for stakeholders with an interest or existing participation in copper AM, including metal material producers, AM hardware manufacturers, and developers of associated end-to-end tools in software and component processing.

Metal powder feedstocks for AM technology serve as the primary focus of this report. While there are other materials that represent opportunities for the metal AM market, particularly metal wire materials for directed energy deposition (DED), SmarTech expects powder-based metal 3D printing to represent the majority of primary opportunities in AM. Other feedstocks bear little to no relevance for the copper segment in particular at this time. In turn, the data exhibited here and in the companion database are linked to powder-based copper materials and AM solutions.

 



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Table of Contents

Chapter One: About this Report
1.1 Methodology
1.2 Plan and Objective of This Report

Chapter Two: Introduction to Additive Manufacturing with Copper

Chapter Three: Technical Status of Additive Manufacturing with Copper Materials
3.1 Adaptations of Blue and Green Wavelength Energy Sources for Use in AM Systems
3.2 Expansion of Copper Powders and Alloys Suited to Additive Manufacturing Technologies
3.3 Alternative Metal AM Processes Suited to Copper Printing
3.3.1 Kinetic Metal AM Processes Suited to Copper Printing
3.3.2 Bound Metal Deposition AM Processes Suited to Copper Printing

Chapter Four: Market Status of Additive Manufacturing with Copper Materials
4.1 Induction Coils for Induction Hardening Processes
4.2 Rocketry and Other Aerospace Components for Thermal Management
4.3 Applications for Thermal Management in Industry
4.4 Tooling Inserts with Conformal Cooling Channels for Plastic Molding and Metal Casting Processes
4.5 Medical Devices with Antimicrobial Properties

Chapter Five: Future Opportunities and Copper AM Market Direction
5.1 Predicted Advancements in Bound Metal Printing Technologies
5.2 Trends in Modular Metal AM System Architecture Expected to Influence Specialty Metal Printing
5.3 The Role of Metal AM Service Providers in Adoption of Copper Printing

Chapter Six: Presentation and Discussion of Copper Additive Manufacturing Market and Forecast Data
6.1 Shipments of Copper Powders to Additive Manufacturing Markets
6.1.1 Alloys and Pure Copper – Future Opportunities
6.1.2 Associated Powder Revenues from Copper AM
6.2 Opportunities for AM Hardware for Printing in Copper
Appendix A: Influencing and Innovating Companies in Copper AM
A.1 Additive Manufacturing System Providers
A.1.1 EOS
A.1.2 ExOne
A.1.3 Trumpf
A.1.4 Formalloy
A.2 Metal Powder Producers
A.2.1 Sandvik
A.2.2 Heraeus
A.2.3 Praxair Surface Technologies
About SmarTech Analysis
About the Analyst
Acronyms and Abbreviations Used In this Report

List of Exhibits
Exhibit 2-1: Global Metal AM Powder Shipments (kg) by Metal Group, all Markets and Technologies, 2014-2029(e)

 

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Press Release

[プレスリリース原文]

Over 1.4 Million Kg of Copper Powders for Additive Manufacturing Expected to Ship by 2029

May 18 2020

 

NEW YORK: SmarTech Analysis, the leading provider of additive manufacturing market data and market analysis, has just released a new market report on the quickly growing potential for additive manufacturing with copper and copper alloys.

The new report, “Copper Additive Manufacturing 2020 Market Database and Outlook,” is based on SmarTech’s forecast and market tracking database for copper additive manufacturing (AM) opportunities and shows that shipments of copper powders to AM users is expected to grow to over 1.4 million kilograms by 2029, expanding at a rate of 43 percent CAGR during the 15-year period. The report consists of two parts: a market analysis of the 3D-printed copper sector and a spreadsheet showing SmarTech’s 15-year forecast of copper powder, printers and applications used for 3D printing of copper.  Both volume and value forecasts are provided.

This outstanding growth expected for 3D-printed copper is due to crucial technological improvements in copper 3D printing processes and materials. The report shows AM’s potential to create disruptive copper component applications in industrial markets in the near future, with additional prospects to be found in medical devices and electronics as solutions continue to be adopted and refined.

About the Report:

This two-part resource is part of a series of market intelligence offerings from SmarTech Analysis which offers stakeholders in the worldwide copper production market, and existing additive manufacturing industry, an off-the-shelf resource for market metrics and forecasts specific to a quickly growing segment of the metal AM industry.

The in-depth analysis delivers a deep understanding of the driving variables that make 3D printed copper an attractive market prospect, together with a database providing crucial projection metrics for growth of copper additive manufacturing.

The data sets accompanying the report can easily be entered into existing internal market intelligence resources or examined to provide business intelligence across organizations. The accompanying report also provides context for the data by analyzing the latest events and trends in the copper powders AM market as they relate to various forecasted data.

From the Report:

  • Total systems sales for copper AM are expected to grow by 34 percent across the projection period. This growth will create significant opportunities for copper powder sales; for both pure copper and copper alloys, across all metal 3D printing families. Powder bed fusion (PBF) and bound metal printing will be the largest segments to reap the benefits of increased copper printing, but even directed energy deposition—a comparatively small subsegment of copper 3D printing activity—is expected to grow.
  • As these developments occur, SmarTech expects rapid growth of copper AM adoption, particularly in the Asia Pacific region. In turn, the AM copper powder market is projected to represent a large portion of the copper powder industry as a whole.
  • Although all of the major metal AM technology families are being used for the 3D printing of copper, each present specific obstacles for processing the material using established AM system configurations, due mostly to copper’s physical attributes.

Companies discussed in the report include EOS, ExOne, Trumpf, Formalloy, Sandvik, Heraeus, Praxair Surface Technologies, Markforged, SPEE3D, Stratasys Direct Manufacturing, GKN Additive, Phoenix Contact, GH Induction, 3T, FIT AG and others.

 

 

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