1. |
EXECUTIVE SUMMARY |
1.1. |
Introduction to conductive inks |
1.2. |
Market evolution and new opportunities |
1.3. |
Key growth markets for conductive inks |
1.4. |
Balancing differentiation and ease of adoption (I) |
1.5. |
Balancing differentiation and ease of adoption (II) |
1.6. |
Capturing value from conductive ink facilitated digitization via collaboration |
1.7. |
Reducing adoption barriers by supplying both printer and ink |
1.8. |
Strategies for conductive ink cost reduction |
1.9. |
Rising material prices expected to drive alternatives to flake-based inks |
1.10. |
Segmenting the conductive ink market |
1.11. |
Segmentation of conductive ink technologies |
1.12. |
Readiness level of conductive inks |
1.13. |
Overview of flake-based silver inks |
1.14. |
Overview of nanoparticle-based silver inks |
1.15. |
Overview of particle-free conductive inks |
1.16. |
Overview of copper inks |
1.17. |
Overview of carbon-based inks (incl. graphene & CNTs) |
1.18. |
Overview of stretchable/thermoformable inks |
1.19. |
Overview of silver nanowires |
1.20. |
Overview of conductive polymer inks |
1.21. |
Overview of applications for conductive inks |
1.22. |
Technological and commercial readiness of conductive ink applications |
1.23. |
Forecast: Overall conductive ink volume (segmented by ink type) |
1.24. |
Forecast: Overall conductive ink revenue (segmented by ink type) |
2. |
INTRODUCTION |
2.1. |
Mapping conductivity requirements by application |
2.2. |
Conductivity requirements by application |
2.3. |
Challenges of comparing conductive inks |
2.4. |
Converting conductivity to sheet resistance |
2.5. |
Motivation for using printed electronics |
2.6. |
Frequency dependent conductivity for antennas and EMI shielding |
2.7. |
Conductive ink suppliers: Specialization vs broad portfolio |
2.8. |
Conductive ink companies segmented by conductive material |
2.9. |
Analysis of company segmentation by conductive material |
2.10. |
Conductive ink companies segmented by ink composition |
2.11. |
Analysis of company segmentation by ink composition |
3. |
FORECASTS |
3.1. |
Market forecasting methodology |
3.2. |
Forecasting across conductive ink applications (I) |
3.3. |
Information acquired for conductive ink forecasts |
3.4. |
Overall conductive ink volume (segmented by ink type) |
3.5. |
Overall conductive ink revenue (segmented by ink type) |
3.6. |
Conductive inks for flexible hybrid electronics (FHE) |
3.7. |
Conductive inks for in-mold electronics (IME) |
3.8. |
Conductive inks for 3D electronics (partially additive) |
3.9. |
Conductive inks for 3D electronics (fully additive) |
3.10. |
Conductive inks for e-textiles |
3.11. |
Conductive inks for circuit prototyping |
3.12. |
Conductive inks for capacitive sensors |
3.13. |
Conductive inks for pressure sensors |
3.14. |
Conductive inks for biosensors |
3.15. |
Conductive inks for strain sensors |
3.16. |
Conductive inks for wearable electrodes |
3.17. |
Conductive inks for photovoltaics (conventional/rigid) |
3.18. |
Conductive inks for photovoltaics (flexible) |
3.19. |
Conductive inks for printed heaters |
3.20. |
Conductive inks for EMI shielding |
3.21. |
Conductive inks for antennas (for communications) |
3.22. |
Conductive inks for RFID and smart packaging |
4. |
CONDUCTIVE INK TECHNOLOGY |
4.1. |
Overview |
4.1.1. |
Segmenting the conductive ink market |
4.1.2. |
Segmenting the conductive ink market (incl. applications) |
4.1.3. |
Segmentation of conductive ink technologies |
4.1.4. |
Benchmarking conductive ink properties |
4.2. |
Flake-based silver inks |
4.2.1. |
Introduction to flake-based silver ink |
4.2.2. |
Thinner flakes lead to increase in conductivity and durability |
4.2.3. |
Silver flake producers |
4.2.4. |
Flake-based silver ink value chain |
4.2.5. |
High resolution functional screen printing |
4.2.6. |
Silver electromigration |
4.2.7. |
Comparing properties of flake-based silver inks |
4.2.8. |
SWOT analysis: Flake-based silver inks |
4.2.9. |
Flake-based silver inks: Conclusions |
4.3. |
Nanoparticle-based silver inks |
4.3.1. |
Introduction to nanoparticle-based silver ink |
4.3.2. |
Key value propositions for silver nanoparticle inks |
4.3.3. |
Cost on a "per ink" vs "per conductivity" basis |
4.3.4. |
Microstructural homogeneity increases conductivity |
4.3.5. |
Laser-Generated Inks |
4.3.6. |
Additional benefits of nanoparticle inks |
4.3.7. |
Price competitiveness of silver nanoparticles |
4.3.8. |
Ag nanoparticle inks: Do they really cure fast and at lower temperatures? |
4.3.9. |
Benchmarking parameters for silver nanoparticle production methods |
4.3.10. |
Comparing silver nanoparticle production methods (I) |
4.3.11. |
Comparing silver nanoparticle production methods (II) |
4.3.12. |
Multiple application opportunities for nanoparticle inks |
4.3.13. |
Overview of selected nanoparticle ink manufacturers |
4.3.14. |
Comparing properties of nanoparticle-based silver inks |
4.3.15. |
SWOT analysis: Nanoparticle inks |
4.3.16. |
Nanoparticle-based silver inks: Conclusions |
4.4. |
Particle-free inks |
4.4.1. |
Introduction to particle-free (molecular) inks |
4.4.2. |
Operating principle of particle-free inks |
4.4.3. |
Conductivity close to bulk metals |
4.4.4. |
Benefits of particle-free inks |
4.4.5. |
Permeability of particle-free inks enables conductive textiles |
4.4.6. |
Thermoformable particle-free inks for in-mold electronics |
4.4.7. |
Application opportunities for particle free inks |
4.4.8. |
Particle-free inks adopted for EMI shielding |
4.4.9. |
Value propositions of particle-free inks |
4.4.10. |
Particle-free conductive inks for different metals |
4.4.11. |
Differentiating particle-free conductive inks with sintering requirements |
4.4.12. |
Overview of particle free ink manufacturers |
4.4.13. |
Comparing properties of particle-free silver inks |
4.4.14. |
SWOT analysis: Particle-free conductive inks |
4.4.15. |
Particle-free conductive inks: Conclusions |
4.5. |
Copper inks |
4.5.1. |
Introduction to copper inks |
4.5.2. |
Challenges in developing copper inks |
4.5.3. |
Differentiating particle-free conductive inks with sintering requirements |
4.5.4. |
Commercially unsuccessful strategies to avoid copper oxidation |
4.5.5. |
Strategies to avoid copper oxidation: Reducing agent additives |
4.5.6. |
Strategies to avoid copper oxidation: Photonic sintering |
4.5.7. |
Growing interest in utilizing copper ink for FHE (I) |
4.5.8. |
Growing interest in utilizing copper ink for FHE (II) |
4.5.9. |
Screen printing RFID copper inks |
4.5.10. |
Collaborations utilizing copper inks |
4.5.11. |
PrintCB: Two component copper ink based on micron-scale particles |
4.5.12. |
A hybrid approach to making flexible circuits from copper ink |
4.5.13. |
Copprint: Commercializing nano-particle based copper |
4.5.14. |
Overview of early-stage copper ink companies |
4.5.15. |
Comparing properties of selected copper inks |
4.5.16. |
SWOT analysis: Copper-based inks |
4.5.17. |
Copper inks: Conclusions |
4.6. |
Carbon-based inks (including graphene & CNTs) |
4.6.1. |
Introduction to carbon-based inks (incl. graphene & CNTs) |
4.6.2. |
Carbon-based inks: Two distinct categories |
4.6.3. |
CNTs as a transparent conductive ink |
4.6.4. |
Material properties of transparent conductive materials |
4.6.5. |
Graphene-based conductive inks |
4.6.6. |
Overview of selected graphene/CNT ink manufacturers |
4.6.7. |
Comparing properties of selected carbon inks |
4.6.8. |
SWOT analysis: Carbon black conductive inks |
4.6.9. |
SWOT analysis: Nanostructured carbon conductive inks |
4.6.10. |
Carbon-based inks (incl. graphene & CNTs): Conclusions |
4.7. |
Stretchable/Thermoformable Inks |
4.7.1. |
Introduction to stretchable/thermoformable inks |
4.7.2. |
Stretchable v Thermoformable conductive inks |
4.7.3. |
The role of particle size in stretchable inks |
4.7.4. |
TRL: Stretchable and thermoformable electronics |
4.7.5. |
Innovations in stretchable conductive ink |
4.7.6. |
Metal gel as a stretchable ink |
4.7.7. |
Efforts to commercialize liquid metal inks continue |
4.7.8. |
Comparing properties of stretchable/thermoformable conductive inks |
4.7.9. |
Overview of stretchable/thermoformable ink manufacturers |
4.7.10. |
SWOT analysis: Stretchable/thermoformable inks |
4.7.11. |
Stretchable/Thermoformable inks: Conclusions |
4.8. |
Silver Nanowires |
4.8.1. |
Introduction to silver nanowires |
4.8.2. |
Benefits of silver nanowire TCFs |
4.8.3. |
Drawbacks of silver nanowire TCFs |
4.8.4. |
Value chain for silver nanowires |
4.8.5. |
Silver nanowire manufacturing: Polyol process |
4.8.6. |
Important parameters for TCFs - Haze, transmission and sheet resistance |
4.8.7. |
Silver nanowire TCFs - Haze, transmission and sheet resistance |
4.8.8. |
Percolation threshold & Aspect ratio |
4.8.9. |
Durability and flexibility of AgNW TCFs |
4.8.10. |
Improving material properties: Gluing or "welding" |
4.8.11. |
Improving material properties: Coating and encapsulation |
4.8.12. |
Capacitive touch sensing for flexible displays |
4.8.13. |
Silver nanowires gain traction in touchscreens |
4.8.14. |
Silver nanowires for transparent heaters |
4.8.15. |
Emerging applications for silver nanowires |
4.8.16. |
TRL snapshot of silver nanowire technology |
4.8.17. |
Global distribution of silver nanowire producers |
4.8.18. |
SWOT analysis: Stretchable/thermoformable inks |
4.8.19. |
Silver nanowires: Conclusions |
4.9. |
Conductive polymers |
4.9.1. |
Introduction to conductive polymers |
4.9.2. |
Polythiophene-based conductive films for flexible devices |
4.9.3. |
Applications for conductive polymers: transparent capacitive touch and e-textiles |
4.9.4. |
Emerging sensitive sensor readout facilitates capacitive touch |
4.9.5. |
Innovative n-type conductive polymer |
4.9.6. |
Biobased conductive polymer inks |
4.9.7. |
SWOT analysis: conductive polymer inks |
4.9.8. |
Conductive polymer inks: Conclusions |
5. |
APPLICATIONS FOR CONDUCTIVE INKS |
5.1. |
Overview of applications for conductive inks |
5.2. |
Benchmarking conductive ink requirements by application |
5.3. |
Technological and commercial readiness of conductive ink applications |
5.4. |
Applications for conductive inks: Included content |
6. |
CONDUCTIVE INKS FOR CIRCUIT MANUFACTURING |
6.1. |
Overview |
6.1.1. |
Conductive ink for circuit manufacturing |
6.2. |
Flexible hybrid electronics (FHE) |
6.2.1. |
Introduction to flexible hybrid electronics (FHE) |
6.2.2. |
What can be defined as FHE? |
6.2.3. |
FHE overcome the flexibility/functionality compromise |
6.2.4. |
FHE value chain: Many materials and technologies |
6.2.5. |
Wearable skin patches |
6.2.6. |
Condition monitoring multimodal sensor array |
6.2.7. |
Multi-sensor wireless asset tracking system demonstrates FHE potential |
6.2.8. |
Conductive ink requirements for flexible hybrid electronics (FHE) |
6.2.9. |
SWOT analysis: Flexible hybrid electronics (FHE) |
6.2.10. |
Conclusions: Flexible hybrid electronics (FHE) |
6.3. |
In-mold electronics (IME) |
6.3.1. |
Introduction to in-mold electronics (IME) |
6.3.2. |
IME manufacturing process flow |
6.3.3. |
Commercial advantages of IME |
6.3.4. |
IME value chain overview |
6.3.5. |
IME requires a wide range of specialist materials |
6.3.6. |
Silver flake-based ink dominates IME |
6.3.7. |
Conductive ink requirements for in-mold electronics (IME) |
6.3.8. |
SWOT analysis: In-mold electronics (IME) |
6.3.9. |
Conclusions: In-mold electronics (IME) |
6.4. |
3D electronics |
6.4.1. |
Additive electronics and the transition to three dimensions |
6.4.2. |
Introduction to 3D/additive electronics |
6.4.3. |
Partially versus fully additive electronics |
6.4.4. |
3D electronics spans multiple length scales |
6.4.5. |
Advantages of fully additively manufactured 3D electronics |
6.4.6. |
Fully 3D printed electronics |
6.4.7. |
Examples of fully 3D printed circuits |
6.4.8. |
Structural dielectrics with matching thermal expansion coefficients |
6.4.9. |
Conductive ink requirements for 3D electronics |
6.4.10. |
SWOT analysis: 3D electronics |
6.4.11. |
Conclusions: 3D electronics |
6.5. |
E-textiles |
6.5.1. |
Introduction to e-textiles |
6.5.2. |
Industry challenges for e-textiles |
6.5.3. |
Biometric monitoring in apparel |
6.5.4. |
Sensing functionality woven into textiles |
6.5.5. |
Conductive ink requirements for e-textiles |
6.5.6. |
SWOT analysis: e-textiles |
6.5.7. |
Conclusions: In-mold electronics (IME) |
6.6. |
Circuit prototyping |
6.6.1. |
PCB prototyping and 'print-then-plate' methodologies |
6.6.2. |
Circuit prototyping and 3D electronics landscape |
6.6.3. |
Conductive ink requirements for e-textiles |
6.6.4. |
SWOT analysis: e-textiles |
6.6.5. |
Conclusions: e-textiles |
7. |
SENSING APPLICATIONS FOR CONDUCTIVE INKS |
7.1. |
Overview |
7.1.1. |
Sensing applications for conductive inks |
7.1.2. |
Introduction to the printed and flexible sensor market |
7.1.3. |
Multifunctional hybrid sensors are greater than the sum of their parts |
7.1.4. |
Key markets for printed/flexible sensors |
7.2. |
Capacitive sensing |
7.2.1. |
Capacitive sensors: Working principle |
7.2.2. |
Printed capacitive sensor technologies |
7.2.3. |
Conductive inks for capacitive sensing directly applied to a 3D surface |
7.2.4. |
Emerging current mode sensor readout: Principles |
7.2.5. |
Readiness level of printed capacitive touch sensors materials and technologies |
7.2.6. |
Conductive ink requirements for capacitive sensors |
7.2.7. |
SWOT analysis: Capacitive sensors |
7.2.8. |
Conclusions: Capacitive sensors |
7.3. |
Pressure sensors |
7.3.1. |
Introduction to printed piezoresistive sensors |
7.3.2. |
Force sensitive inks |
7.3.3. |
Manufacturing methods for printed piezoresistive sensors |
7.3.4. |
Innovation in roll-to-roll manufacturing technology |
7.3.5. |
Readiness level snapshot of printed piezoresistive sensors |
7.3.6. |
Conductive ink requirements for pressure sensors |
7.3.7. |
SWOT analysis: Piezoresistive sensors |
7.3.8. |
SWOT analysis: Piezoelectric sensors |
7.3.9. |
Conclusions: Capacitive sensors |
7.4. |
Biosensors |
7.4.1. |
Electrochemical biosensors present a simple sensing mechanism |
7.4.2. |
Screen printing vs sputtering for biosensor electrode deposition |
7.4.3. |
Challenges for printing electrochemical test strips |
7.4.4. |
Printed pH sensors for biological fluids |
7.4.5. |
Readiness level of printed biosensors |
7.4.6. |
Conductive ink requirements for printed biosensors |
7.4.7. |
SWOT analysis: Printed biosensors |
7.4.8. |
Conclusions: Printed biosensors |
7.5. |
Strain sensors |
7.5.1. |
Strain sensors |
7.5.2. |
Capacitive strain sensors using dielectric electroactive polymers (EAPs) |
7.5.3. |
Resistive strain sensors |
7.5.4. |
Emerging opportunities for strain sensors in motion capture for AR/VR |
7.5.5. |
Technology readiness level snapshot of capacitive strain sensors |
7.5.6. |
Conductive ink requirements for printed strain sensors |
7.5.7. |
SWOT analysis: Printed strain sensors |
7.5.8. |
Conclusions: Printed strain sensors |
7.6. |
Wearable electrodes |
7.6.1. |
Applications and product types |
7.6.2. |
Key requirements of wearable electrodes |
7.6.3. |
Wet vs dry electrodes |
7.6.4. |
Skin patches use both wet and dry electrodes depending on the use-case |
7.6.5. |
E-textiles integrate dry electrodes and conductive inks |
7.6.6. |
Stretchable conductive printed electrodes |
7.6.7. |
Technology readiness level snapshot of printed wearable electrodes |
7.6.8. |
Conductive ink requirements for printed wearable electrodes |
7.6.9. |
SWOT analysis: Printed wearable electrodes |
7.6.10. |
Conclusions: Printed wearable electrodes |
8. |
OTHER APPLICATIONS FOR CONDUCTIVE INKS |
8.1. |
Overview |
8.1.1. |
Overview of applications for conductive inks |
8.2. |
Charge extraction from photovoltaics |
8.2.1. |
Introduction to conductive pastes for photovoltaics |
8.2.2. |
Conductive ink is major cost contributor for PVs |
8.2.3. |
Transitioning from PERC to TOPCon and SHJ |
8.2.4. |
Reducing silver content per wafer via ink innovations |
8.2.5. |
Flake-based conductive inks face headwind from alternative solar cell connection technology |
8.2.6. |
Photovoltaic market dynamics |
8.2.7. |
Conductive ink requirements for photovoltaics |
8.2.8. |
SWOT analysis: Photovoltaics |
8.2.9. |
Conclusions: Photovoltaics |
8.3. |
Heaters |
8.3.1. |
Introduction to printed heaters |
8.3.2. |
Automotive applications for printed heaters |
8.3.3. |
Emerging building-integrated opportunities for printed (and flexible) heaters |
8.3.4. |
Stretchable conductive inks for wearable heaters |
8.3.5. |
Technology comparison for e-textile heating technologies |
8.3.6. |
Heated clothing is the dominant e-textile sector |
8.3.7. |
Conductive ink requirements for printed heaters |
8.3.8. |
SWOT analysis: Printed heaters |
8.3.9. |
Conclusions: Printed heaters |
8.4. |
EMI Shielding |
8.4.1. |
Introduction to electromagnetic interference (EMI) shielding |
8.4.2. |
Transition from board to package level shielding |
8.4.3. |
Process flow for EMI shielding |
8.4.4. |
Spraying EMI shielding is a cost-effective solution |
8.4.5. |
Overview of conformal shielding technologies |
8.4.6. |
Particle size and morphology influence EMI shielding |
8.4.7. |
Hybrid inks improve shielding performance |
8.4.8. |
Suppliers targeting ink-based conformal EMI shielding |
8.4.9. |
EMI shielding with particle-free Ag ink |
8.4.10. |
EMI shielding and heterogeneous integration |
8.4.11. |
Conductive ink requirements for EMI shielding |
8.4.12. |
SWOT analysis: EMI shielding |
8.4.13. |
Conclusions: EMI shielding |
8.5. |
Printed Antennas |
8.5.1. |
Segmenting printed antennas |
8.5.2. |
Electronics on 3D surfaces with extruded conductive paste and inkjet printing |
8.5.3. |
Extruded conductive paste for antennas |
8.5.4. |
Addressable markets for transparent antennas |
8.5.5. |
Automotive transparent antennas |
8.5.6. |
Building integrated transparent antennas |
8.5.7. |
Transparent antennas for consumer electronic devices |
8.5.8. |
Transparent antennas for smart packaging |
8.5.9. |
Conductive ink requirements for printed antennas |
8.5.10. |
SWOT analysis: Printed antennas |
8.5.11. |
Conclusions: Printed antennas |
8.6. |
RFID & smart packaging |
8.6.1. |
Introduction to RFID and smart packaging |
8.6.2. |
RFID technologies: The big picture |
8.6.3. |
Printed RFID antennas struggle for traction: Is copper ink a solution? |
8.6.4. |
Smart packaging with flexible hybrid electronics |
8.6.5. |
'Sensor-less' sensing of temperature and movement |
8.6.6. |
Conductive ink requirements for RFID and smart packaging |
8.6.7. |
SWOT analysis: RFID and smart packaging |
8.6.8. |
Conclusions: RFID and smart packaging |
9. |
COMPANY PROFILES |
9.1. |
ACI Materials |
9.2. |
Advanced Nano Products (ANP) |
9.3. |
Agfa-Gevaert NV |
9.4. |
Bando Chemical |
9.5. |
C3 Nano |
9.6. |
Cambrios Film Solutions Corp |
9.7. |
ChemCubed |
9.7.1. |
ChemCubed |
9.8. |
Copprint |
9.8.1. |
Copprint |
9.9. |
DuPont (Wearable Technology) |
9.10. |
Dycotec |
9.11. |
E2IP |
9.11.1. |
E2IP |
9.12. |
Elantas |
9.12.1. |
Elantas |
9.13. |
Electroninks |
9.14. |
GenesInk |
9.15. |
Henkel (Printed Electronics) |
9.15.1. |
Henkel (Printed Electronics) |
9.16. |
Heraeus — Conductive Inks |
9.17. |
Inkron |
9.18. |
InkTec Co., Ltd |
9.19. |
Liquid Wire |
9.19.1. |
Liquid Wire |
9.20. |
Liquid X — Functional Electronics Fabrication |
9.20.1. |
Liquid X |
9.21. |
Mateprincs |
9.22. |
N-Ink |
9.23. |
Nano Dimension |
9.23.1. |
Nano Dimension |
9.23.2. |
Nano Dimension |
9.23.3. |
Nano Dimension |
9.24. |
NanoCnet |
9.25. |
Nanorbital Advanced Materials |
9.26. |
NovaCentrix |
9.27. |
OrelTech |
9.27.1. |
OrelTech |
9.28. |
PrintCB |
9.28.1. |
PrintCB / Kundisch |
9.28.2. |
PrintCB |
9.29. |
Promethean Particles |
9.30. |
PV Nano Cell |
9.31. |
Saralon |
9.31.1. |
Saralon |
9.32. |
Sun Chemical |
9.33. |
UT Dots Inc |
9.34. |
ZeroValent Nanometals |