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Flexible Hybrid Electronics 2024-2034


フレキシブル・ハイブリッド・エレクトロニクス 2024-2034

この調査レポートは、FHE回路の製造に必要な材料、部品、製造方法の動向と革新について詳細に調査・分析しています。   主な掲載内容（目次より抜粋） 市場予測 材料、... もっと見る

　

　

出版社 出版年月 電子版価格 ページ数 言語
IDTechEx
アイディーテックエックス 		2023年7月17日 US$7,000
電子ファイル（1-5ユーザライセンス）
ライセンス・価格情報
注文方法はこちら 		305 英語

※ 調査会社の事情により、予告なしに価格が変更になる場合がございます。
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Summary

この調査レポートは、FHE回路の製造に必要な材料、部品、製造方法の動向と革新について詳細に調査・分析しています。
 
主な掲載内容（目次より抜粋）
  • 市場予測
  • 材料、部品、製造方法
  • FHEの使用例
  • 会社概要
 
Report Summary
'Flexible Hybrid Electronics 2024-2034' evaluates the status and prospects of this emerging manufacturing methodology, which aims to combine the best aspects of printed and conventional electronics. Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) brings the benefits of digital additive electronics manufacturing without compromising on the processing capabilities of integrated circuits. Drawing on years of following the printed electronics industry and 40 interviews, the report outlines trends and innovations in the materials, components, and manufacturing methods required to produce FHE circuits.
 
Furthermore, the report explores the application sectors where FHE is most likely to be adopted, drawing on both current activity and an evaluation of FHE's value proposition. Granular market forecasts break down the opportunities for FHE circuits across 5 application sectors (automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial) into 39 specific opportunities such as skin temperature sensors and printed RFID tags.
 
Inputs, assembly, and applications for FHE circuits. Source IDTechEx
 
IDTechEx analyses and concludes in this report how the global demand for flexible hybrid electronic circuits will reach a value of around US$1.8 billion by 2034 - more if the infrastructure, software and services are included. Our detailed and highly granular market forecasts take account of projected demand for a wide range of applications, along with the technological readiness level of the required components.
 
Defining flexible hybrid electronics
We define FHE as a circuit that comprises a flexible substrate, printed functionality (typically the conductive interconnects) and mounted components (typically an externally manufactured integrated circuit (IC)). Other functionalities such as sensors, batteries and energy harvesting capabilities may be either printed or mounted.
 
Assessing product-market fit
With so many potential addressable markets, establishing where FHE offers the most compelling value proposition relative to alternative electronics manufacturing approaches is essential. As a manufacturing methodology rather than a specific product, the benefits of using FHE are highly dependent on the application.
 
For prototyping and high mix volume production, printing with digital methods such as inkjet rather than chemically etching the conductive traces enables straightforward adjustments to design parameters. This brings multiple benefits, including shortening the product development process by reducing the time between design iterations, and facilitating product 'versioning' to meet specific customer requirements without substantially increasing production costs.
 
Alternatively, for very high-volume applications such as RFID tags, smart packaging and even large area lighting, the compatibility of FHE with high throughput roll-to-roll (R2R) manufacturing via rotary printing methods such as flexography and gravure offers the potential for reduced costs. Rapid production can be expedited by low temperature and/or high-speed component attachment methods, with competing approaches analyzed in detail within the report. The benefits of R2R manufacturing are especially pronounced if variable costs can be reduced, for example by utilizing cheaper copper-based conductive inks and printing directly onto existing packaging rather than separate substrates.
 
Flexibility and stretchability of course also form part of FHE's value proposition. While conventionally manufactured flexible PCBs already meet some application requirements, such as for making electrical connections in confined spaces, the resilience of many printed conductive inks to repeated bending and tighter curvatures offers a clear differentiator. FHE is thus well suited for wearable applications such as electronic skin patches, and for applications where the conformality enabled by stretchability such as integrated lighting.
 
Enabling technologies
Manufacturing FHE circuits requires many current and developing emerging technologies which are essential to circuits. These include:
  • Low cost thermally stabilised PET substrates that are dimensionally stable.
  • Component attachment materials compatible with flexible thermally fragile substrates, such as low temperature solder and field aligned anisotropic conductive adhesives.
  • Flexible integrated circuits, based on both thinned Si and metal oxides.
  • Conductive inks, based on both silver and copper.
  • Thin film batteries, especially if printable.
  • Printed sensors of all types.
  • Manufacturing methods for mounting components on flexible substrates.
 
The status and prospects of each technology is assessed in detail, with recent developments and technological gaps highlighted, and the merits of different approaches compared. This analysis is based on interviews with many of the suppliers, and annual attendance at multiple printed/flexible electronics conferences. Furthermore, we profile 6 government research centres and a range of collaborative projects from around the world that support the adoption of flexible hybrid electronics, demonstrating the major players and technological themes.
 
Outlook
The growth in printed/flexible/hybrid electronics, especially where it enables new applications and even business models such as electronic skin patches for remote health monitoring and smart packaging, will drive the growth of the conductive ink market over the next decade. Furthermore, many emerging applications, such is in-mold electronics, e-textiles and high-frequency antennas, have specific ink requirements that provides an opportunity for differentiation.
 
Key questions answered in this report
  • What is the current status of FHE in different applications?
  • What are the recent innovations and developments in the FHE space?
  • In which applications does FHE represent the most compelling value proposition?
  • What is the forecast market opportunity by application and for materials/components?
  • What are the enabling technologies for FHE, and what are the remaining technological gaps?
  • Which companies and government funded organizations are currently involved in FHE?
 
IDTechEx has 20 years of expertise covering printed and flexible electronics, including conductive inks. Our analysts have closely followed the latest developments in the technology and associated markets by interviewing many conductive ink suppliers and users and annually attending multiple printed electronics conferences such as LOPEC and FLEX. This report provides a complete picture of the fragmented conductive ink landscape, helping to inform product development and positioning.
 
This report provides market intelligence about the emerging manufacturing methodology of flexible hybrid electronics (FHE), including constituent technologies and use cases. This includes:
 
Key aspects
A review of the context and technology behind flexible hybrid electronics
  • Motivation for adopting FHE
  • Assessment of how FHE compares with competing technologies, and where it offers the most substantial value proposition.
  • Technical details and examples of 8 constituent technologies, including flexible ICs and low-temperature component attachment methods.
 
Assessment of the current status of FHE across multiple use cases
  • Review of recent developments within FHE, including highlights from recent conferences.
  • Details of government research centers activities.
  • Examples of how FHE is deployed for each of 6 use cases.
 
Market analysis throughout
  • Reviews of electronic skin patch players throughout each key sector, analyzed from over 130 companies
  • Historic electronic skin patch market data from 2010-2022 for 11 sectors
  • Market forecasts from 2023-2033 for 13 sectors, including full narrative, limitations, and methodologies for each

 



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Table of Contents

1. EXECUTIVE SUMMARY
1.1. Flexible hybrid electronics: Analyst viewpoint (I)
1.2. Analyst viewpoint (II)
1.3. What is flexible hybrid electronics (FHE)?
1.4. Motivating factors for FHE
1.5. Comparing benefits of conventional and flexible hybrid electronics
1.6. Overcoming the flexibility/functionality compromise
1.7. Predicted manufacturing trends for FHE
1.8. Supplier opportunities created by FHE adoption
1.9. Non-technological barriers to FHE adoption
1.10. Where does FHE have a sufficient value proposition?
1.11. FHE value proposition for different applications
1.12. Technology gaps and potential solutions for FHE to meet application requirements
1.13. Materials, components, and manufacturing methods for FHE
1.14. Component attachment materials for FHE: Conclusions
1.15. Flexible ICs: Conclusions
1.16. Flexible batteries for FHE: Conclusions
1.17. Energy harvesting for FHE: Conclusions
1.18. Flexible substrates for FHE: Conclusions
1.19. Conductive inks for FHE: Conclusions
1.20. R2R manufacturing for FHE: Conclusions
1.21. Use cases for FHE
1.22. FHE for electronic skin patches: Conclusions
1.23. FHE for e-textiles: Conclusions
1.24. FHE for smart packaging: Conclusions
1.25. FHE for IoT devices (industrial and domestic): Conclusions
1.26. FHE for large area LED lighting: Conclusions
1.27. Additive circuit prototyping with FHE: Conclusions
1.28. FHE circuit area forecast by application sector
1.29. FHE revenue forecast by application sector
2. INTRODUCTION
2.1. Overview
2.1.1. FHE combines the benefits of conventional and purely printed electronics
2.1.2. What counts as FHE?
2.1.3. Commonality with other established and emerging electronics methodologies
2.1.4. Printed electronics is additive, but can be analogue or digital
2.1.5. Multilayer PCBs - technically challenging for FHE
2.1.6. Overcoming the flexibility/functionality compromise
2.1.7. Readiness of FHE for different application sectors
2.1.8. FHE value chain: Many materials and technologies
2.1.9. Benefits of printing conductive interconnects
2.1.10. SWOT analysis: Flexible hybrid electronics (FHE)
2.1.11. Ensuring reliability of printed/flexible electronics is crucial
2.1.12. Digitization in manufacturing facilitates 'FHE-as-a-service'
2.1.13. Alternative routes to FHE manufacturing
2.1.14. Standards for FHE
2.2. Recent FHE developments
2.2.1. VTT improves FHE pilot line capabilities (I)
2.2.2. FHE manufacturing of capacitive touch interfaces and flexible lighting.
2.2.3. VTT improves FHE pilot line capabilities (II)
2.2.4. Emergence of contract manufacturer TracXon for flexible hybrid electronics (FHE)
2.2.5. CPI focuses on printed/hybrid electronics for healthcare applications
2.2.6. Jabil develops FHE prototypes for healthcare applications
2.2.7. Growing interest in utilizing copper ink for FHE (I)
2.2.8. Growing interest in utilizing copper ink for FHE (II)
2.3. Government funded projects and research centers
2.3.1. Government funded projects dominate
2.3.2. NextFlex focus on prototype system development
2.3.3. Funding of Nextflex project calls
2.3.4. Holst Centre develops
2.3.5. IMEC collaborates with Pragmatic to develop an 8-bit flexible microprocessor
2.3.6. Liten CEA-Tech develops printed batteries and transistors
2.3.7. Korea Institute of Machinery and Materials develops R2R transfer method
2.3.8. EU Smart2Go project aims to integrate energy harvesting into wearable devices
2.3.9. Swedish research center RISE offers hybrid electronics prototyping
2.3.10. ITRI develops armband for contactless EMG detection
2.3.11. Recent US government funded FHE projects: 2022
2.3.12. Recent US government funded FHE projects: 2021
3. MARKET FORECASTS
3.1. Overview
3.1.1. Market forecasting methodology: Applications
3.1.2. Market forecasting methodology: FHE proportion
3.1.3. FHE circuit area forecast by application sector
3.1.4. FHE circuit area forecast by application sector (2023, 2028, 2033)
3.1.5. FHE revenue forecast by application sector
3.1.6. FHE revenue forecast by application sector (2023, 2028, 2033)
3.1.7. FHE circuit area forecast for automotive applications
3.2. Forecasts by application sector
3.2.1. FHE revenue forecast for automotive applications
3.2.2. FHE circuit area forecast for consumer applications
3.2.3. FHE revenue forecast for consumer applications
3.2.4. FHE circuit area forecast for energy applications
3.2.5. FHE revenue forecast for energy applications
3.2.6. FHE circuit area forecast for healthcare/wellness applications
3.2.7. FHE revenue forecast for healthcare/wellness applications
3.2.8. FHE circuit area forecast for infrastructure / buildings / industrial applications
3.2.9. FHE revenue forecast for infrastructure / buildings / industrial applications
4. MATERIALS, COMPONENTS AND MANUFACTURING METHODS
4.1. Overview
4.1.1. Materials, components, and manufacturing methods for FHE
4.2. Component attachment methods and materials
4.2.1. Component attachment material: Introduction
4.2.2. Differentiating factors amongst component attachment materials
4.2.3. Low temperature solder enables thermally fragile substrates
4.2.4. Low temperature solder alloys
4.2.5. Comparing electrical component attachment materials
4.2.6. Photonic soldering gains traction
4.2.7. Component attachment materials (for printed/flexible electronics): SWOT analysis
4.2.8. Low temperature full metal interconnects with liquid metal solder microcapsules
4.2.9. Solder facilitates rapid component assembly via self- alignment
4.2.10. Electrically conductive adhesives: Dominant approach for flexible hybrid electronics
4.2.11. Example of conductive adhesives on flexible substrates
4.2.12. Durable and efficient component attachment is important for FHE circuit development
4.2.13. Field-aligned anisotropic conductive adhesive reaches commercialization
4.2.14. Conductive paste bumping on flexible substrates
4.2.15. Component attachment materials for FHE roadmap
4.2.16. Component attachment materials: Readiness level
　

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