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Flexible Hybrid Electronics 2024-2034フレキシブル・ハイブリッド・エレクトロニクス 2024-2034 この調査レポートは、FHE回路の製造に必要な材料、部品、製造方法の動向と革新について詳細に調査・分析しています。 主な掲載内容（目次より抜粋） 市場予測 材料、... もっと見る
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Summary
この調査レポートは、FHE回路の製造に必要な材料、部品、製造方法の動向と革新について詳細に調査・分析しています。
主な掲載内容（目次より抜粋）
Report Summary
'Flexible Hybrid Electronics 2024-2034' evaluates the status and prospects of this emerging manufacturing methodology, which aims to combine the best aspects of printed and conventional electronics. Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) brings the benefits of digital additive electronics manufacturing without compromising on the processing capabilities of integrated circuits. Drawing on years of following the printed electronics industry and 40 interviews, the report outlines trends and innovations in the materials, components, and manufacturing methods required to produce FHE circuits.
Furthermore, the report explores the application sectors where FHE is most likely to be adopted, drawing on both current activity and an evaluation of FHE's value proposition. Granular market forecasts break down the opportunities for FHE circuits across 5 application sectors (automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial) into 39 specific opportunities such as skin temperature sensors and printed RFID tags.
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Inputs, assembly, and applications for FHE circuits. Source IDTechEx
IDTechEx analyses and concludes in this report how the global demand for flexible hybrid electronic circuits will reach a value of around US$1.8 billion by 2034 - more if the infrastructure, software and services are included. Our detailed and highly granular market forecasts take account of projected demand for a wide range of applications, along with the technological readiness level of the required components.
Defining flexible hybrid electronics
We define FHE as a circuit that comprises a flexible substrate, printed functionality (typically the conductive interconnects) and mounted components (typically an externally manufactured integrated circuit (IC)). Other functionalities such as sensors, batteries and energy harvesting capabilities may be either printed or mounted.
Assessing product-market fit
With so many potential addressable markets, establishing where FHE offers the most compelling value proposition relative to alternative electronics manufacturing approaches is essential. As a manufacturing methodology rather than a specific product, the benefits of using FHE are highly dependent on the application.
For prototyping and high mix volume production, printing with digital methods such as inkjet rather than chemically etching the conductive traces enables straightforward adjustments to design parameters. This brings multiple benefits, including shortening the product development process by reducing the time between design iterations, and facilitating product 'versioning' to meet specific customer requirements without substantially increasing production costs.
Alternatively, for very high-volume applications such as RFID tags, smart packaging and even large area lighting, the compatibility of FHE with high throughput roll-to-roll (R2R) manufacturing via rotary printing methods such as flexography and gravure offers the potential for reduced costs. Rapid production can be expedited by low temperature and/or high-speed component attachment methods, with competing approaches analyzed in detail within the report. The benefits of R2R manufacturing are especially pronounced if variable costs can be reduced, for example by utilizing cheaper copper-based conductive inks and printing directly onto existing packaging rather than separate substrates.
Flexibility and stretchability of course also form part of FHE's value proposition. While conventionally manufactured flexible PCBs already meet some application requirements, such as for making electrical connections in confined spaces, the resilience of many printed conductive inks to repeated bending and tighter curvatures offers a clear differentiator. FHE is thus well suited for wearable applications such as electronic skin patches, and for applications where the conformality enabled by stretchability such as integrated lighting.
Enabling technologies
Manufacturing FHE circuits requires many current and developing emerging technologies which are essential to circuits. These include:
The status and prospects of each technology is assessed in detail, with recent developments and technological gaps highlighted, and the merits of different approaches compared. This analysis is based on interviews with many of the suppliers, and annual attendance at multiple printed/flexible electronics conferences. Furthermore, we profile 6 government research centres and a range of collaborative projects from around the world that support the adoption of flexible hybrid electronics, demonstrating the major players and technological themes.
Outlook
The growth in printed/flexible/hybrid electronics, especially where it enables new applications and even business models such as electronic skin patches for remote health monitoring and smart packaging, will drive the growth of the conductive ink market over the next decade. Furthermore, many emerging applications, such is in-mold electronics, e-textiles and high-frequency antennas, have specific ink requirements that provides an opportunity for differentiation.
Key questions answered in this report
IDTechEx has 20 years of expertise covering printed and flexible electronics, including conductive inks. Our analysts have closely followed the latest developments in the technology and associated markets by interviewing many conductive ink suppliers and users and annually attending multiple printed electronics conferences such as LOPEC and FLEX. This report provides a complete picture of the fragmented conductive ink landscape, helping to inform product development and positioning.
This report provides market intelligence about the emerging manufacturing methodology of flexible hybrid electronics (FHE), including constituent technologies and use cases. This includes:
Key aspects
A review of the context and technology behind flexible hybrid electronics
Assessment of the current status of FHE across multiple use cases
Market analysis throughout
Table of Contents
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