Vietnam Semiconductor Market By Component (Memory Devices, Logic Devices, Analog IC, MPU, MCU, Sensors, Discrete Power Devices, Others), By Node Size (28nm, 40nm, 65nm, 90nm, 120nm, 130nm), By Application (IT & Telecommunication, Defense and Military, Industrial, Consumer Electronics, Automotive, Others), By Type (Intrinsic Semiconductor and Extrinsic Semiconductor), By Material Type (Silicon, Germanium and Gallium Arsenide), By Region, Competition Forecast & Opportunities, 2018-2028
Semiconductor Market Size, Share, and Analysis, By Component (Logic Devices, Memory Devices, MPU, Analog IC, Sensors, Discrete Power Devices, MCU, and Others), By Semiconductors Materials (Packaging, Fabrication), By Semiconductor Devices (Optoelectronics, Discrete Semiconductors, Sensors, Integrated Circuits), By Node Size (5nm, 7/5nm, 10/7nm, 16/14nm, 22/20nm, 32/28nm, 45/40nm, 65nm, 90nm, 130nm, 180nm), By Material Type (Silicon, Silicon carbide, Gallium Nitride, Gallium arsenide, Germanium), By Application (Consumer Electronics, Networking & Communications, Defence and Military, Data Processing, Industrial, Automotive, Telecommunication and Government, Others), By Type (Intrinsic Material, Extrinsic Material) and Regional Forecasts, 2022-2032
NFC Tag ICs Market: By Memory (High (More than 10000 Bytes), Medium (1000 to 10000 Bytes), Low (Less than 1000 Bytes)), By Connection (??People-To-People (Peer-to-Peer), People-To-Devices (Device Pairing)), By Application (Smart Posters, Payment, Marketing, Information, Content, Social Networking, Gaming, Validation) By Industry (BFSI, Media & Entertainment, Retail, Transportation, Hospitality, Healthcare, Automotive, Others) And Region - Global Analysis of Market Size, Share & Trends For 2021-2022 And Forecasts To 2032
3D IC And 2.5D IC Packaging Global Market Report 2023Including: 1) By Technology: 3D Wafer-Level Chip-Scale Packaging; 3D TSV (Through-Silicon Via); 2.5D2) By Application: Logic; Memory; Imaging And Optoelectronics; MEMS Or Sensors; LED3) By End-user: Telecommunication; Consumer Electronics; Automotive; Military And Aerospace; Medical Devices; Smart TechnologiesCovering: Samsung Electronics Co. Ltd.; Siemens AG; Intel Corporation; Taiwan Semiconductor Manufacturing Company Limited; SK Hynix Inc.
The Business Research Companyの3D ICと2.5D ICパッケージングの世界市場レポート2023は、戦略担当者、マーケティング担当者、経営幹部が市場を評価するために必要な重要情報を提供します。
このレポートは力強い成長を遂げている3D ICと2.5D ICパッケージング市場に焦点を…
弊社(LP Info Research)の最新調査によると、NANDメモリスロットの世界市場規模は2022年に100万米ドルと評価されました。川下市場での需要の増加とCOVID-19やロシア・ウクライナ戦争の影響からの回復により、NANDメモリスロットは2029年までに100万米ドルの再調整された規…
弊社(LP Info Research)の最新調査によると、LPDDRメモリテストソケットの世界市場規模は2022年に100万米ドルと評価されました。下流市場での需要拡大とCOVID-19やロシア・ウクライナ戦争の影響からの回復により、LPDDRメモリテストソケットは2029年までに100万米ドルの再…
Next-Generation Memory Market by Technology (Non-Volatile Memory (MRAM (STT-MRAM, SOT-MRAM, Toggle Mode MRAM), FRAM, RERAM/CBRAM, 3D XPoint, NRAM), and Volatile Memory (HBM, and HMC)), Wafer Size (200 mm, and 300 mm) - Global Forecast to 2028
Global Smart Card IC Market Size Study & Forecast, by Type (Microprocessor, Memory), by Architecture (16-bit, 32-bit), by Interface (Contact, Contactless, Dual Interface), by Application (USIMs/eSIMs, ID Cards, Financial Cards), by End-user Industry (Telecommunications, BFSI, Government & Healthcare, Transportation, Education, others) and Regional Analysis, 2023-2030
India Semiconductor Market Segmented By Component (Memory Devices, Microprocessors, Analog IC, Sensors, Discrete Power Devices, Others), By Application (IT & Telecom, Automotive, Consumer Electronics, Other Industries), By Type (Extrinsic Semiconductor, Intrinsic Semiconductor), By Region, Competition Forecast & Opportunities, 2029F
Semiconductor Market Size, Share, and Analysis, By Component (Logic Devices, Memory Devices, MPU, Analog IC, Sensors, Discrete Power Devices, MCU, and Others), By Semiconductors Materials (Packaging, Fabrication), By Semiconductor Devices (Optoelectronics, Discrete Semiconductors, Sensors, Integrated Circuits), By Node Size (5nm, 7/5nm, 10/7nm, 16/14nm, 22/20nm, 32/28nm, 45/40nm, 65nm, 90nm, 130nm, 180nm), By Material Type (Silicon, Silicon carbide, Gallium Nitride, Gallium arsenide, Germanium), By Application (Consumer Electronics, Networking & Communications, Defence and Military, Data Processing, Industrial, Automotive, Telecommunication and Government, Others), By Type (Intrinsic Material, Extrinsic Material) and Regional Forecasts, 2022-2032
Global Spintronics Market Size study & Forecast, by Device Type (Metal- Based, Semiconductor-Based), by Application (Magnetic Sensor, Magnetoresistive random access memory, Radio frequency and Microwave Devices), by End Use (Automotive, Industrial, Consumer Electronics, Healthcare, IT & Telecom)- and Regional Analysis, 2023-2030
Global Flip Chip Technology Market Size study & Forecast, by Wafer Bumping Process (Copper Pillar, Tin-Lead Eutectic Solder, Lead Free Solder, Gold Stud Bumping), by Packaging Technology (BGA,CSP), by Product (Memory, Light Emitting Diode, CMOS Image Sensor, SoC, GPU, CPU), by End User (Military and Defense, Medical and Healthcare, Industrial Sector, Automotive, Consumer Electronics, Telecommunications) and Regional Analysis, 2023-2030