3D ICおよび2.5D ICパッケージングの世界市場レポート 2023年以下を含む：1)技術別：3Dウェハレベルチップスケールパッケージング、3D TSV (Through-Silicon Via)、2.5D2)用途別：ロジック; メモリ; イメージングとオプトエレクトロニクス; MEMSまたはセンサー; LED3) エンドユーザー別：テレコミュニケーション、コンシューマーエレクトロニクス、自動車、軍事・航空宇宙、医療機器、スマートテクノロジーサムスン電子Ltd.、Siemens AG、Intel Corporation、Taiwan Semiconductor Manufacturing Company Limited、SK Hynix Inc.

3D IC And 2.5D IC Packaging Global Market Report 2023Including: 1) By Technology: 3D Wafer-Level Chip-Scale Packaging; 3D TSV (Through-Silicon Via); 2.5D2) By Application: Logic; Memory; Imaging And Optoelectronics; MEMS Or Sensors; LED3) By End-user: Telecommunication; Consumer Electronics; Automotive; Military And Aerospace; Medical Devices; Smart TechnologiesCovering: Samsung Electronics Co. Ltd.; Siemens AG; Intel Corporation; Taiwan Semiconductor Manufacturing Company Limited; SK Hynix Inc.

The Business Research Companyの3D ICと2.5D ICパッケージングの世界市場レポート2023は、戦略担当者、マーケティング担当者、経営幹部が市場を評価するために必要な重要情報を提供します。このレポートは力... もっと見る

出版社	出版年月	電子版価格	ページ数	言語
The Business Research Company　(TBRC) ザ・ビジネスリサーチカンパニー	2023年9月27日	US$4,000 シングルユーザライセンスライセンス・価格情報注文方法はこちら	175	英語

英語原文をAIを使って翻訳しています。

サマリー

The Business Research Companyの3D ICと2.5D ICパッケージングの世界市場レポート2023は、戦略担当者、マーケティング担当者、経営幹部が市場を評価するために必要な重要情報を提供します。

このレポートは力強い成長を遂げている3D ICと2.5D ICパッケージング市場に焦点を当てています。今後10年間とそれ以降の市場を形成するトレンドのガイドを提供します。

購入の理由
- 50以上の地域をカバーするこの市場に関する最も包括的なレポートにより、真にグローバルな視点を得ることができます。
- 市場がコロナウイルスからどのような影響を受けたか、またウイルスの影響が和らぐにつれて市場がどのように対応しているかを理解する。
- ロシア・ウクライナ戦争が農業、エネルギー、鉱物資源供給に与える影響と、市場への直接的・間接的影響を評価する。
- 世界的な高インフレが市場成長に与える影響を測定する。
- 現地のデータと分析に基づき、地域戦略と国別戦略を策定する。
- 投資の対象となる成長セグメントを特定する。
- 予測データと市場を形成する原動力とトレンドを活用し、競合他社を凌駕する。
- 最新の市場シェアに基づいて顧客を理解する。
- 主要な競合他社に対する業績のベンチマーク
- 信頼性の高い高品質のデータと分析により、社内外でのプレゼンテーションをサポートするのに適しています。
- レポートは最新データに更新され、データ抽出と分析が簡単にできるExcelデータシートとともに、ご注文から3～5営業日以内にお届けします。
- レポートの全データは、エクセルのダッシュボード形式でも納品されます。

説明
3d ICおよび2.5d ICパッケージングで最大かつ急成長している市場はどこか？この市場は経済全体、人口動態、その他の類似市場とどのように関連しているのか？今後の市場を形成する力は何か？ビジネスリサーチ社の3d icおよび2.5d icパッケージング世界市場レポートは、これらすべての質問とその他多くの質問に回答します。

当レポートでは、市場の特徴、規模および成長、セグメンテーション、地域別および国別内訳、競合環境、市場シェア、トレンド、戦略を網羅しています。地域別に市場の過去および予測市場成長を追跡します。

調査範囲

対象市場：1）技術別：3Dウェハレベルチップスケールパッケージング、3D TSV（貫通電極）、2.5D
2) アプリケーション別ロジック、メモリー、イメージングとオプトエレクトロニクス、MEMSまたはセンサー、LED、その他のアプリケーション
3) エンドユーザー別通信；家電；自動車；軍事・航空宇宙；医療機器；スマートテクノロジー；その他エンドユーザー

言及された企業サムスン電子Ltd.; Siemens AG; Intel Corporation; Taiwan Semiconductor Manufacturing Company Limited; SK Hynix Inc.

国々オーストラリア、ブラジル、中国、フランス、ドイツ、インド、インドネシア、日本、ロシア、韓国、英国、米国、カナダ、イタリア、スペイン

地域アジア太平洋; 西ヨーロッパ; 東ヨーロッパ; 北アメリカ; 南アメリカ; 中東; アフリカ

時系列：過去5年間および過去10年間の予測。

データ市場規模と成長率の関連市場に対する比率、GDP比率、一人当たり支出、

データ区分：国別・地域別の過去データと予測データ、競合他社の市場シェア、市場セグメント。

ソーシングと参照：本レポート中のデータおよび分析は、エンドノートを使用しています。

納品形式PDF、Word、Excel データダッシュボード。

ページTOPに戻る

1. Executive Summary
2. 3D IC And 2.5D IC Packaging Market Characteristics
3. 3D IC And 2.5D IC Packaging Market Trends And Strategies
4. 3D IC And 2.5D IC Packaging Market - Macro Economic Scenario
4.1. Impact Of High Inflation On Online Therapy Services Market
4.2. Ukraine-Russia War Impact On Online Therapy Services Market
4.3. COVID-19 Impact On Online Therapy Services Market
5.1. Global 3D IC And 2.5D IC Packaging Historic Market Size and Growth, 2017 - 2022, Value ($ Billion)
5.2. Global 3D IC And 2.5D IC Packaging Forecast Market Size and Growth, 2022 - 2027, 2032F, Value ($ Billion)
5.3. Global 3D IC And 2.5D IC Packaging Market Drivers and Restraints
5.3.1. Drivers Of The Market
5.3.2. Restraints Of The Market
6. 3D IC And 2.5D IC Packaging Market Segmentation
6.1. Global 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
3D Wafer-Level Chip-Scale Packaging
3D TSV (Through-Silicon Via)
2.5D
6.2. Global 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
Logic
Memory
Imaging And Optoelectronics
MEMS Or Sensors
Light-Emitting Diode (LED)
Other Applications
6.3. Global 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
Telecommunication
Consumer Electronics
Automotive
Military And Aerospace
Medical Devices
Smart Technologies
Other End Users
7. 3D IC And 2.5D IC Packaging Market Regional And Country Analysis
7.1. Global 3D IC And 2.5D IC Packaging Market, Split By Region, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
7.2. Global 3D IC And 2.5D IC Packaging Market, Split By Country, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
8. Asia-Pacific 3D IC And 2.5D IC Packaging Market
8.1. Asia-Pacific 3D IC And 2.5D IC Packaging Market Overview
Region Information, Impact Of COVID-19, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
8.2. Asia-Pacific 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
8.3. Asia-Pacific 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
8.4. Asia-Pacific 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
9. China 3D IC And 2.5D IC Packaging Market
9.1. China 3D IC And 2.5D IC Packaging Market Overview
9.2. China 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F,$ Billion
9.3. China 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F,$ Billion
9.4. China 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F,$ Billion
10. India 3D IC And 2.5D IC Packaging Market
10.1. India 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
10.2. India 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
10.3. India 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
11. Japan 3D IC And 2.5D IC Packaging Market
11.1. Japan 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
11.2. Japan 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
11.3. Japan 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
12. Australia 3D IC And 2.5D IC Packaging Market
12.1. Australia 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
12.2. Australia 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
12.3. Australia 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
13. Indonesia 3D IC And 2.5D IC Packaging Market
13.1. Indonesia 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
13.2. Indonesia 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
13.3. Indonesia 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
14. South Korea 3D IC And 2.5D IC Packaging Market
14.1. South Korea 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
14.2. South Korea 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
14.3. South Korea 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
15. Western Europe 3D IC And 2.5D IC Packaging Market
15.1. Western Europe 3D IC And 2.5D IC Packaging Market Overview
15.2. Western Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
15.3. Western Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
15.4. Western Europe 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
16. UK 3D IC And 2.5D IC Packaging Market
16.1. UK 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
16.2. UK 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
16.3. UK 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
17. Germany 3D IC And 2.5D IC Packaging Market
17.1. Germany 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
17.2. Germany 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
17.3. Germany 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
18. France 3D IC And 2.5D IC Packaging Market
18.1. France 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
18.2. France 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
18.3. France 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
19. Italy 3D IC And 2.5D IC Packaging Market
19.1. Italy 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
19.2. Italy 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
19.3. Italy 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
20. Spain 3D IC And 2.5D IC Packaging Market
20.1. Spain 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
20.2. Spain 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
20.3. Spain 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
21. Eastern Europe 3D IC And 2.5D IC Packaging Market
21.1. Eastern Europe 3D IC And 2.5D IC Packaging Market Overview
21.2. Eastern Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
21.3. Eastern Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
21.4. Eastern Europe 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
22. Russia 3D IC And 2.5D IC Packaging Market
22.1. Russia 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
22.2. Russia 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
22.3. Russia 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
23. North America 3D IC And 2.5D IC Packaging Market
23.1. North America 3D IC And 2.5D IC Packaging Market Overview
23.2. North America 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
23.3. North America 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
23.4. North America 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
24. USA 3D IC And 2.5D IC Packaging Market
24.1. USA 3D IC And 2.5D IC Packaging Market Overview
24.2. USA 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
24.3. USA 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
24.4. USA 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
25. Canada 3D IC And 2.5D IC Packaging Market
25.1. Canada 3D IC And 2.5D IC Packaging Market Overview
25.2. Canada 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
25.3. Canada 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
25.4. Canada 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
26. South America 3D IC And 2.5D IC Packaging Market
26.1. South America 3D IC And 2.5D IC Packaging Market Overview
26.2. South America 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
26.3. South America 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
26.4. South America 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
27. Brazil 3D IC And 2.5D IC Packaging Market
27.1. Brazil 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
27.2. Brazil 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
27.3. Brazil 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
28. Middle East 3D IC And 2.5D IC Packaging Market
28.1. Middle East 3D IC And 2.5D IC Packaging Market Overview
28.2. Middle East 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
28.3. Middle East 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
28.4. Middle East 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
29. Africa 3D IC And 2.5D IC Packaging Market
29.1. Africa 3D IC And 2.5D IC Packaging Market Overview
29.2. Africa 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
29.3. Africa 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
29.4. Africa 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
30. 3D IC And 2.5D IC Packaging Market Competitive Landscape And Company Profiles
30.1. 3D IC And 2.5D IC Packaging Market Competitive Landscape
30.2. 3D IC And 2.5D IC Packaging Market Company Profiles
30.2.1. Samsung Electronics Co. Ltd.
30.2.1.1. Overview
30.2.1.2. Products and Services
30.2.1.3. Strategy
30.2.1.4. Financial Performance
30.2.2. Siemens AG
30.2.2.1. Overview
30.2.2.2. Products and Services
30.2.2.3. Strategy
30.2.2.4. Financial Performance
30.2.3. Intel Corporation
30.2.3.1. Overview
30.2.3.2. Products and Services
30.2.3.3. Strategy
30.2.3.4. Financial Performance
30.2.4. Taiwan Semiconductor Manufacturing Company Limited
30.2.4.1. Overview
30.2.4.2. Products and Services
30.2.4.3. Strategy
30.2.4.4. Financial Performance
30.2.5. SK Hynix Inc.
30.2.5.1. Overview
30.2.5.2. Products and Services
30.2.5.3. Strategy
30.2.5.4. Financial Performance
31. 3D IC And 2.5D IC Packaging Market Other Major And Innovative Companies
31.1. Broadcom Inc.
31.2. Fujitsu Limited
31.3. Toshiba Corporation
31.4. ASE Technology Holding Co. Ltd.
31.5. Texas Instruments Incorporated
31.6. STMicroelectronics NV
31.7. Infineon Technologies AG
31.8. Renesas Electronics Corporation
31.9. United Microelectronics Corporation
31.10. GlobalFoundries Inc.
31.11. Amkor Technology Inc.
31.12. Unimicron Technology Corporation
31.13. Jiangsu Changjiang Electronics Technology Co. Ltd.
31.14. Cadence Design Systems Inc.
31.15. Siliconware Precision Industries Co. Ltd.
32. Global 3D IC And 2.5D IC Packaging Market Competitive Benchmarking
33. Global 3D IC And 2.5D IC Packaging Market Competitive Dashboard
34. Key Mergers And Acquisitions In The 3D IC And 2.5D IC Packaging Market
35. 3D IC And 2.5D IC Packaging Market Future Outlook and Potential Analysis
35.1 3D IC And 2.5D IC Packaging Market In 2027 - Countries Offering Most New Opportunities
35.2 3D IC And 2.5D IC Packaging Market In 2027 - Segments Offering Most New Opportunities
35.3 3D IC And 2.5D IC Packaging Market In 2027 - Growth Strategies
35.3.1 Market Trend Based Strategies
35.3.2 Competitor Strategies
36. Appendix
36.1. Abbreviations
36.2. Currencies
36.3. Historic And Forecast Inflation Rates
36.4. Research Inquiries
36.5. The Business Research Company
36.6. Copyright And Disclaimer

ページTOPに戻る

Table of Contents

Summary

3D IC And 2.5D IC Packaging Global Market Report 2023 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on 3d ic and 2.5d ic packaging market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase
• Gain a truly global perspective with the most comprehensive report available on this market covering 50+ geographies.
• Understand how the market has been affected by the coronavirus and how it is responding as the impact of the virus abates.
• Assess the Russia – Ukraine war’s impact on agriculture, energy and mineral commodity supply and its direct and indirect impact on the market.
• Measure the impact of high global inflation on market growth.
• Create regional and country strategies on the basis of local data and analysis.
• Identify growth segments for investment.
• Outperform competitors using forecast data and the drivers and trends shaping the market.
• Understand customers based on the latest market shares.
• Benchmark performance against key competitors.
• Suitable for supporting your internal and external presentations with reliable high quality data and analysis
• Report will be updated with the latest data and delivered to you within 3-5 working days of order along with an Excel data sheet for easy data extraction and analysis.
• All data from the report will also be delivered in an excel dashboard format.

Description:
Where is the largest and fastest growing market for 3d ic and 2.5d ic packaging? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The 3d ic and 2.5d ic packaging market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.

Scope

Markets Covered:1) By Technology: 3D Wafer-Level Chip-Scale Packaging; 3D TSV (Through-Silicon Via); 2.5D
2) By Application: Logic; Memory; Imaging And Optoelectronics; MEMS Or Sensors; LED; Other Applications
3) By End-user: Telecommunication; Consumer Electronics; Automotive; Military And Aerospace; Medical Devices; Smart Technologies; Other End Users

Companies Mentioned: Samsung Electronics Co. Ltd.; Siemens AG; Intel Corporation; Taiwan Semiconductor Manufacturing Company Limited; SK Hynix Inc.

Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain

Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa

Time series: Five years historic and ten years forecast.

Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,

Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.

Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.

Delivery format: PDF, Word and Excel Data Dashboard.

ページTOPに戻る

ご注文は、お電話またはWEBから承ります。お見積もりの作成もお気軽にご相談ください。

webからのご注文・お問合せはこちらのフォームから承ります

本レポートと同分野（電子部品／半導体）の最新刊レポート

The Business Research Company　(TBRC)社の電子機器・部品分野での最新刊レポート

本レポートと同じKEY WORD（memory）の最新刊レポート

よくあるご質問

The Business Research Company　(TBRC)社はどのような調査会社ですか?

The Business Research Company (TBRC)はインドを主要拠点に世界の多様な市場を調査・予測し、調査レポートを積極的に出版しています。調査対象には技術、ライフサイエンス、重... もっと見る

調査レポートの納品までの日数はどの程度ですか?

在庫のあるものは速納となりますが、平均的には 3-４日と見て下さい。
但し、一部の調査レポートでは、発注を受けた段階で内容更新をして納品をする場合もあります。
発注をする前のお問合せをお願いします。

注文の手続きはどのようになっていますか?

1)お客様からの御問い合わせをいただきます。
2)見積書やサンプルの提示をいたします。
3)お客様指定、もしくは弊社の発注書をメール添付にて発送してください。
4)データリソース社からレポート発行元の調査会社へ納品手配します。
5) 調査会社からお客様へ納品されます。最近は、pdfにてのメール納品が大半です。

お支払方法の方法はどのようになっていますか?

納品と同時にデータリソース社よりお客様へ請求書（必要に応じて納品書も）を発送いたします。
お客様よりデータリソース社へ（通常は円払い）の御振り込みをお願いします。
請求書は、納品日の日付で発行しますので、翌月最終営業日までの当社指定口座への振込みをお願いします。振込み手数料は御社負担にてお願いします。
お客様の御支払い条件が60日以上の場合は御相談ください。
尚、初めてのお取引先や個人の場合、前払いをお願いすることもあります。ご了承のほど、お願いします。

データリソース社はどのような会社ですか?

当社は、世界各国の主要調査会社・レポート出版社と提携し、世界各国の市場調査レポートや技術動向レポートなどを日本国内の企業・公官庁及び教育研究機関に提供しております。
世界各国の「市場・技術・法規制などの」実情を調査・収集される時には、データリソース社にご相談ください。
お客様の御要望にあったデータや情報を抽出する為のレポート紹介や調査のアドバイスも致します。

サマリー

目次

Summary

Table of Contents

ご注文は、お電話またはWEBから承ります。お見積もりの作成もお気軽にご相談ください。

本レポートと同分野（電子部品／半導体）の最新刊レポート

The Business Research Company (TBRC)社の電子機器・部品分野での最新刊レポート

本レポートと同じKEY WORD（memory）の最新刊レポート

よくあるご質問

The Business Research Company (TBRC)社はどのような調査会社ですか?

調査レポートの納品までの日数はどの程度ですか?

注文の手続きはどのようになっていますか?

お支払方法の方法はどのようになっていますか?

データリソース社はどのような会社ですか?

The Business Research Company　(TBRC)社の電子機器・部品分野での最新刊レポート

The Business Research Company　(TBRC)社はどのような調査会社ですか?