Global Graphene Electronics Market Size study & Forecast, by Product (Display, Memories, Batteries, Solar Cell, Integrated Circuits and Chips, Others) by Industry Vertical (Consumer Electronics, Automotive, Healthcare, Industrial Robotics, Aerospace and Défense, Others) and Regional Analysis, 2022-2029
High-k and CVD ALD Metal Precursors Market by Technology (Interconnect, Capacitor/Memory, Gates), End Use (Consumer Electronics, Aerospace and Defense, IT and Telecommunication, Industrial, Automotive, Healthcare, and Others), and Region 2023-2028
Radiation Hardened Electronics Market (Component: Mixed Signal ICs, Processors & Controllers, Memory, Power Management, Logic, and Others) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2023-2031
India Semiconductor Market, By Component (Memory Devices, Microprocessors, Analog IC, Sensors, Discrete Power Devices, Others), By Application (IT & Telecom, Automotive, Consumer Electronics, Other Industries), By Type (Extrinsic Semiconductor, Intrinsic Semiconductor), By Material Type (Silicon, Germanium, Gallium Arsenide), By Region, Competition, Forecast & Opportunities, 2018-2028F
Automotive Semiconductor Global Market Opportunities And Strategies To 2031Including: 1) By Component: Processor; Analog IC; Discrete Power; Sensor; Memory2) By Application: Powertrain; Safety; Body Electronics; Chassis; Telematics And Infotainment3) By Vehicle Type: Passenger Vehicle; Light Commercial Vehicle; Medium and Heavy Commercial Vehicle4) By Propulsion Type: Internal Combustion Engine; Electric; HybridCovering: Infineon Technologies AG; STMicroelectronics N.V; Texas Instruments, Inc.; Renesas Electronics Corp; NXP Semiconductors N.V.
Global Semiconductor in Healthcare Market Size study & Forecast, by Application (Portable & Telehealth Monitoring, Consumer Medical Electronics, Medical Imaging, Clinical, Diagnostics, and Therapy), Component (Integrated Circuits (Analog, Logic, Memory, and Micro Components), Optoelectronics, Sensors, and Discrete Components), and Regional Analysis, 2022-2029
Smart Card IC Market by Type (Microprocessor, Memory), Architecture (16-bit, 32-bit), Interface, Application (USIMs/eSIMs, ID Cards, Financial Cards), End-user Industry (Telecommunications, BFSI) and Region - Global Forecast to 2027
High Bandwidth Memory Market: Segmented: By Product (GPU, CPU, APU, FPGA, ASIC); By Application (Graphics, High-Performance Computing, Networking, And Data Centers); , And Region – Global Analysis of Market Size, Share & Trends For 2019–2020 And Forecasts To 2031
Semiconductor Intellectual Property (IP) Market: By Design IP (Interface IP, Memory IP and Processor IP); By IP Source (Licensing, Royalty and Servicing); By Application (Consumer Electronics, Telecom, Automotive, Aerospace, Healthcare, Agriculture, and Others); and Region – Analysis of Market Size, Share & Trends for 2014 – 2019 and Forecasts to 2030
Next Generation Computing Market By Component (Hardware, Software, Services), By Offering (Cloud Based, On Premise), By Type (High Performance Computing, Quantum Computing, Brain Type Computing, Approximate And Probabilistic Computing, Energy Efficiency Computing, Thermodynamic Computing, Memory Based Computing, Optical Computing, Others), By Enterprise Size (Smes, Large Enterprises), By End Use Industry (Bfsi, Healthcare, Space And Defence, Energy And Power, Transportation And Logistics, Chemicals, Academia, Government, Telecom, Others): Global Opportunity Analysis and Industry Forecast, 2020-2030
Global Memory Integrated Circuits Market Size study, by Product (DRAM, NAND Flash Memory, Other Types) by Application (Consumer Electronics, Automotive, IT and Telecommunication, Healthcare, Industrial, Other) and Regional Forecasts 2022-2028
Global Semiconductor Manufacturing Equipment Market Size study, By Front-End Equipment (Lithography Equipment, Water Surface Conditioning Equipment, Wafer Cleaning Equipment, Deposition Equipment, Other Front-End Equipment), By Back-End Equipment (Assembly and Packaging, Dicing, Metrology, Bonding, Water Testing), By Fab Facility Equipment (Automation Equipment, Chemical Control Equipment, Gas Control Equipment, Others), By Product Type (Memory, Foundry, Logic, MPU, Discrete, Others), By Dimension (2D ICs, 2.5D ICs, 3D ICs), By Supply Chain Participant (IDM Firms, OSAT Companies, Foundries), and Regional Forecasts 2022-2028
Global Semiconductor Intellectual Property (IP) Market Size study, By Design IP (Processor IP, Interface IP, Memory IP, Other Ips), By IP Source (Royalty, Licensing), By IP Core (Soft IP, Hard IP), By Vertical (Consumer Electronics, Telecommunications & Data Center, Automotive, Industrial, Commercial, Other Verticals), and Regional Forecasts 2022-2028