弊社(LP Info Research)の最新調査によると、NANDメモリスロットの世界市場規模は2022年に100万米ドルと評価されました。川下市場での需要の増加とCOVID-19やロシア・ウクライナ戦争の影響からの回復により、NANDメモリスロットは2029年までに100万米ドルの再調整された規…
弊社(LP Info Research)の最新調査によると、LPDDRメモリテストソケットの世界市場規模は2022年に100万米ドルと評価されました。下流市場での需要拡大とCOVID-19やロシア・ウクライナ戦争の影響からの回復により、LPDDRメモリテストソケットは2029年までに100万米ドルの再…
Next-Generation Memory Market by Technology (Non-Volatile Memory (MRAM (STT-MRAM, SOT-MRAM, Toggle Mode MRAM), FRAM, RERAM/CBRAM, 3D XPoint, NRAM), and Volatile Memory (HBM, and HMC)), Wafer Size (200 mm, and 300 mm) - Global Forecast to 2028
Global Smart Card IC Market Size Study & Forecast, by Type (Microprocessor, Memory), by Architecture (16-bit, 32-bit), by Interface (Contact, Contactless, Dual Interface), by Application (USIMs/eSIMs, ID Cards, Financial Cards), by End-user Industry (Telecommunications, BFSI, Government & Healthcare, Transportation, Education, others) and Regional Analysis, 2023-2030
India Semiconductor Market Segmented By Component (Memory Devices, Microprocessors, Analog IC, Sensors, Discrete Power Devices, Others), By Application (IT & Telecom, Automotive, Consumer Electronics, Other Industries), By Type (Extrinsic Semiconductor, Intrinsic Semiconductor), By Region, Competition Forecast & Opportunities, 2029F
Semiconductor Market Size, Share, and Analysis, By Component (Logic Devices, Memory Devices, MPU, Analog IC, Sensors, Discrete Power Devices, MCU, and Others), By Semiconductors Materials (Packaging, Fabrication), By Semiconductor Devices (Optoelectronics, Discrete Semiconductors, Sensors, Integrated Circuits), By Node Size (5nm, 7/5nm, 10/7nm, 16/14nm, 22/20nm, 32/28nm, 45/40nm, 65nm, 90nm, 130nm, 180nm), By Material Type (Silicon, Silicon carbide, Gallium Nitride, Gallium arsenide, Germanium), By Application (Consumer Electronics, Networking & Communications, Defence and Military, Data Processing, Industrial, Automotive, Telecommunication and Government, Others), By Type (Intrinsic Material, Extrinsic Material) and Regional Forecasts, 2022-2032
Global Spintronics Market Size study & Forecast, by Device Type (Metal- Based, Semiconductor-Based), by Application (Magnetic Sensor, Magnetoresistive random access memory, Radio frequency and Microwave Devices), by End Use (Automotive, Industrial, Consumer Electronics, Healthcare, IT & Telecom)- and Regional Analysis, 2023-2030
Global Flip Chip Technology Market Size study & Forecast, by Wafer Bumping Process (Copper Pillar, Tin-Lead Eutectic Solder, Lead Free Solder, Gold Stud Bumping), by Packaging Technology (BGA,CSP), by Product (Memory, Light Emitting Diode, CMOS Image Sensor, SoC, GPU, CPU), by End User (Military and Defense, Medical and Healthcare, Industrial Sector, Automotive, Consumer Electronics, Telecommunications) and Regional Analysis, 2023-2030
Global Graphene Electronics Market Size study & Forecast, by Product (Display, Memories, Batteries, Solar Cell, Integrated Circuits and Chips, Others) by Industry Vertical (Consumer Electronics, Automotive, Healthcare, Industrial Robotics, Aerospace and Défense, Others) and Regional Analysis, 2022-2029
High-k and CVD ALD Metal Precursors Market by Technology (Interconnect, Capacitor/Memory, Gates), End Use (Consumer Electronics, Aerospace and Defense, IT and Telecommunication, Industrial, Automotive, Healthcare, and Others), and Region 2023-2028
Radiation Hardened Electronics Market (Component: Mixed Signal ICs, Processors & Controllers, Memory, Power Management, Logic, and Others) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2023-2031
India Semiconductor Market, By Component (Memory Devices, Microprocessors, Analog IC, Sensors, Discrete Power Devices, Others), By Application (IT & Telecom, Automotive, Consumer Electronics, Other Industries), By Type (Extrinsic Semiconductor, Intrinsic Semiconductor), By Material Type (Silicon, Germanium, Gallium Arsenide), By Region, Competition, Forecast & Opportunities, 2018-2028F
Automotive Semiconductor Global Market Opportunities And Strategies To 2031Including: 1) By Component: Processor; Analog IC; Discrete Power; Sensor; Memory2) By Application: Powertrain; Safety; Body Electronics; Chassis; Telematics And Infotainment3) By Vehicle Type: Passenger Vehicle; Light Commercial Vehicle; Medium and Heavy Commercial Vehicle4) By Propulsion Type: Internal Combustion Engine; Electric; HybridCovering: Infineon Technologies AG; STMicroelectronics N.V; Texas Instruments, Inc.; Renesas Electronics Corp; NXP Semiconductors N.V.