Global Semiconductor in Healthcare Market Size study & Forecast, by Application (Portable & Telehealth Monitoring, Consumer Medical Electronics, Medical Imaging, Clinical, Diagnostics, and Therapy), Component (Integrated Circuits (Analog, Logic, Memory, and Micro Components), Optoelectronics, Sensors, and Discrete Components), and Regional Analysis, 2022-2029
Smart Card IC Market by Type (Microprocessor, Memory), Architecture (16-bit, 32-bit), Interface, Application (USIMs/eSIMs, ID Cards, Financial Cards), End-user Industry (Telecommunications, BFSI) and Region - Global Forecast to 2027
High Bandwidth Memory Market: Segmented: By Product (GPU, CPU, APU, FPGA, ASIC); By Application (Graphics, High-Performance Computing, Networking, And Data Centers); , And Region – Global Analysis of Market Size, Share & Trends For 2019–2020 And Forecasts To 2031
Semiconductor Intellectual Property (IP) Market: By Design IP (Interface IP, Memory IP and Processor IP); By IP Source (Licensing, Royalty and Servicing); By Application (Consumer Electronics, Telecom, Automotive, Aerospace, Healthcare, Agriculture, and Others); and Region – Analysis of Market Size, Share & Trends for 2014 – 2019 and Forecasts to 2030
Next Generation Computing Market By Component (Hardware, Software, Services), By Offering (Cloud Based, On Premise), By Type (High Performance Computing, Quantum Computing, Brain Type Computing, Approximate And Probabilistic Computing, Energy Efficiency Computing, Thermodynamic Computing, Memory Based Computing, Optical Computing, Others), By Enterprise Size (Smes, Large Enterprises), By End Use Industry (Bfsi, Healthcare, Space And Defence, Energy And Power, Transportation And Logistics, Chemicals, Academia, Government, Telecom, Others): Global Opportunity Analysis and Industry Forecast, 2020-2030
Global Memory Integrated Circuits Market Size study, by Product (DRAM, NAND Flash Memory, Other Types) by Application (Consumer Electronics, Automotive, IT and Telecommunication, Healthcare, Industrial, Other) and Regional Forecasts 2022-2028
Global Semiconductor Manufacturing Equipment Market Size study, By Front-End Equipment (Lithography Equipment, Water Surface Conditioning Equipment, Wafer Cleaning Equipment, Deposition Equipment, Other Front-End Equipment), By Back-End Equipment (Assembly and Packaging, Dicing, Metrology, Bonding, Water Testing), By Fab Facility Equipment (Automation Equipment, Chemical Control Equipment, Gas Control Equipment, Others), By Product Type (Memory, Foundry, Logic, MPU, Discrete, Others), By Dimension (2D ICs, 2.5D ICs, 3D ICs), By Supply Chain Participant (IDM Firms, OSAT Companies, Foundries), and Regional Forecasts 2022-2028
Global Semiconductor Intellectual Property (IP) Market Size study, By Design IP (Processor IP, Interface IP, Memory IP, Other Ips), By IP Source (Royalty, Licensing), By IP Core (Soft IP, Hard IP), By Vertical (Consumer Electronics, Telecommunications & Data Center, Automotive, Industrial, Commercial, Other Verticals), and Regional Forecasts 2022-2028
Semiconductor Intellectual Property (IP) Market with COVID-19 Impact Analysis by Design IP (Processor IP, Memory IP, Interface IP, Other IPs), IP Source (Royalty, Licensing), IP Core (Hard IP, Soft IP), Vertical and Geography - Global Forecast to 2026
Thin Wafers Market (Thickness: Below 10 um, 10 um - 29 um, 30 um - 49 um, 50 um- 99 um, 100 um - 200 um, and Above 200 um; Wafer Size: Below 100 mm, 100 mm, 125 mm, 150 mm, 200 mm, and 300 mm; Material: Silicon [Si], Gallium Arsenide (GaAs), Gallium Nitride [GaN], Silicon Carbide [SiC], and Others [Indium, etc.]; Application: MEMS, CMOS, Memory, Image Sensor, Light Emitting Diode, Interposer, and Others (Radio Frequency Devices, Logic, etc.); and End-use Industry: Consumer Electronics, Automotive, Healthcare, IT and Telecom, Aerospace and Defense, and Others) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2021-2031