Summary

This report addresses a number of important factors that will impact the consumption of chemicals and materials for manufacturing ICs with feature sizes <100nm: Technological issues and trends; Purity and particulate requirements; Chemical dispensing practices; Acid reprocessing; Strategic considerations for chemical users; Analysis and projection of the worldwide chemical market; and Trends in usage as devices features decrease.

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Table of Contents

TABLE OF CONTENTS

Chapter 1    Introduction    1-1

Chapter 2    Executive Summary    2-1

2.1    Key Industry Trends    2-1
2.2    Market Outlook    2-4
2.3    Supplier Opportunities    2-6

Chapter 3    IC Industry Trends    3-1

3.1    IC Industry Growth Forecast    3-1
3.2    Trends in IC Processing Technology    3-4

Chapter 4    Liquid Chemicals    4-1

4.1    Technology Issues    4-1
4.1.1    Acids and Solvents    4-1
4.1.2    Resists    4-5
4.2    Purity Requirements    4-14
4.2.1    Purification Methods    4-14
o    Trends For Purity - Trace Elements    4-15
4.2.2    Particulates    4-16
o    Effects on Yield    4-16
o    Particulate Removal Techniques    4-22
o    Particle Monitoring    4-23
4.3    Chemical Management    4-24
4.3.1    Introduction    4-24
4.3.2    Chemical Usage Reduction    4-26

Chapter 5    Gases    5-1

5.1    Technology Issues    5-1
5.2    Requirements    5-3
5.2.1    Purification Alternatives    5-3
o    Historical Perspective    5-3
o    Trends For Purity - Consistency    5-5
5.2.2    Particulate Considerations    5-7
o    Particle Monitoring    5-7
o    Filtration Methods    5-9
5.2.3    Summary    5-13

Chapter 6    Sputtering and Evaporation Materials    6-1

6.1    Technology Issues    6-1
6.2    Purity Requirements    6-10

Chapter 7    Market Forecast    7-1

7.1    Market Driving Forces & Assumptions    7-1
7.2    Chemicals and Materials Forecast    7-6
7.2.1    Forecast By Chemical and Material    7-6
7.2.2    Chemical Use Per Unit Area Of Silicon Processed    7-25
7.2.3    Market Shares    7-27

Chapter 8    Strategic Customer Issues    8-1

8.1    Benchmarking a Vendor    8-1
8.1.1    Statistical Quality Control    8-1
o    Assay and Related Items    8-3
o    Trace Elements    8-4
o    Particles    8-5
8.1.2    Analytical Capabilities    8-6
8.1.3    Product Manufacturing And/Or Sourcing    8-8
8.1.4    General Considerations    8-9
o    Installation and Retrofitting Costs    8-9
8.2    In-House Quality Control And Assurance    8-13
8.2.1    Analytical Tools    8-13
8.2.2    How Much Testing    8-15
8.2.3    Exhaust Gas Analysis    8-16

List of Figures

4.1    Relationship Between Device Yield and Particles    4-18
4.2    Relationship Between Die Yield and Chip Size    4-20
4.3    Chemical Management Services Tasks    4-25
6.1    ITRS Roadmap    6-3
6.2    Gate-Last Approach    6-8
6.3    Gate-First Approach    6-9
7.1    Segmentation of Stepper/Scan Shipments    7-13
7.2    Worldwide Resist Market    7-15
7.3    Lithography Extensions    7-16
7.4    2014 Silicon Wafer Market    7-21
7.5    2020 Silicon Wafer Market    7-22
7.6    Cost of Chemicals Per Square Inch of Silicon    7-26
7.7    Worldwide Market Shares for Gas Suppliers    7-28
7.8    Worldwide Market Shares for Liquid Chemical Suppliers    7-29
7.9    Worldwide Market Shares for Photoresist Suppliers    7-30
7.10    Worldwide Market Shares for Silicon Wafer Companies    7-31
7.11    Worldwide Market Shares for Sputtering Target Suppliers    7-32
7.12    Pricing Trend For Silicon Wafers    7-34

List of Tables

4.1    Common Wafer Processing Chemicals    4-2
4.2    Photoresist Stripping Solutions    4-10
5.1    Gas Control System Issues    5-2
5.2    Potential Hazards of Processing Gases    5-8
7.1    Worldwide Forecast of Chemicals and Materials for IC Manufacturing    7-8
7.2    Worldwide Market Forecast of Si Wafers    7-19
7.3    Worldwide Market Forecast of Sputtering Targets    7-24