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ウェハーレベルパッケージング市場。世界の産業動向、シェア、サイズ、成長、機会、および2021-2026年の予測Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026 The global wafer level packaging market experienced strong growth during 2015-2020. Looking forward, IMARC Group expects the market to grow at a CAGR of around 11% during 2021-2026. The wafer-level... もっと見る
サマリーThe global wafer level packaging market experienced strong growth during 2015-2020. Looking forward, IMARC Group expects the market to grow at a CAGR of around 11% during 2021-2026. The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption. Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.Key Market Segmentation: IMARC Group provides an analysis of the key trends in each sub-segment of the global wafer level packaging market, along with forecasts at the global, regional and country level from 2021-2026. Our report has categorized the market based on region, packaging technology and end use industry. Breakup by Packaging Technology: 3D TSV WLP 2.5D TSV WLP WLCSP Nano WLP Others Breakup by End Use Industry: Aerospace and Defense Consumer Electronics IT & Telecommunication Healthcare Automotive Others Breakup by Region: North America United States Canada Asia-Pacific China Japan India South Korea Australia Indonesia Others Europe Germany France United Kingdom Italy Spain Russia Others Latin America Brazil Mexico Others Middle East and Africa Competitive Landscape: The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation. Key Questions Answered in This Report: How has the global wafer level packaging market performed so far and how will it perform in the coming years? What has been the impact of COVID-19 on the global wafer level packaging market? What are the key regional markets? What is the breakup of the market based on the packaging type? What is the breakup of the market based on the end use industry? What are the various stages in the value chain of the industry? What are the key driving factors and challenges in the industry? What is the structure of the global wafer level packaging market and who are the key players? What is the degree of competition in the industry? 目次1 Preface2 Scope and Methodology 2.1 Objectives of the Study 2.2 Stakeholders 2.3 Data Sources 2.3.1 Primary Sources 2.3.2 Secondary Sources 2.4 Market Estimation 2.4.1 Bottom-Up Approach 2.4.2 Top-Down Approach 2.5 Forecasting Methodology 3 Executive Summary 4 Introduction 4.1 Overview 4.2 Key Industry Trends 5 Global Wafer Level Packaging Market 5.1 Market Overview 5.2 Market Performance 5.3 Impact of COVID-19 5.4 Market Forecast 6 Market Breakup by Packaging Technology 6.1 3D TSV WLP 6.1.1 Market Trends 6.1.2 Market Forecast 6.2 2.5D TSV WLP 6.2.1 Market Trends 6.2.2 Market Forecast 6.3 WLCSP 6.3.1 Market Trends 6.3.2 Market Forecast 6.4 Nano WLP 6.4.1 Market Trends 6.4.2 Market Forecast 6.5 Others 6.5.1 Market Trends 6.5.2 Market Forecast 7 Market Breakup by End Use Industry 7.1 Aerospace and Defense 7.1.1 Market Trends 7.1.2 Market Forecast 7.2 Consumer Electronics 7.2.1 Market Trends 7.2.2 Market Forecast 7.3 IT & Telecommunication 7.3.1 Market Trends 7.3.2 Market Forecast 7.4 Healthcare 7.4.1 Market Trends 7.4.2 Market Forecast 7.5 Automotive 7.5.1 Market Trends 7.5.2 Market Forecast 7.6 Others 7.6.1 Market Trends 7.6.2 Market Forecast 8 Market Breakup by Region 8.1 North America 8.1.1 United States 8.1.1.1 Market Trends 8.1.1.2 Market Forecast 8.1.2 Canada 8.1.2.1 Market Trends 8.1.2.2 Market Forecast 8.2 Asia-Pacific 8.2.1 China 8.2.1.1 Market Trends 8.2.1.2 Market Forecast 8.2.2 Japan 8.2.2.1 Market Trends 8.2.2.2 Market Forecast 8.2.3 India 8.2.3.1 Market Trends 8.2.3.2 Market Forecast 8.2.4 South Korea 8.2.4.1 Market Trends 8.2.4.2 Market Forecast 8.2.5 Australia 8.2.5.1 Market Trends 8.2.5.2 Market Forecast 8.2.6 Indonesia 8.2.6.1 Market Trends 8.2.6.2 Market Forecast 8.2.7 Others 8.2.7.1 Market Trends 8.2.7.2 Market Forecast 8.3 Europe 8.3.1 Germany 8.3.1.1 Market Trends 8.3.1.2 Market Forecast 8.3.2 France 8.3.2.1 Market Trends 8.3.2.2 Market Forecast 8.3.3 United Kingdom 8.3.3.1 Market Trends 8.3.3.2 Market Forecast 8.3.4 Italy 8.3.4.1 Market Trends 8.3.4.2 Market Forecast 8.3.5 Spain 8.3.5.1 Market Trends 8.3.5.2 Market Forecast 8.3.6 Russia 8.3.6.1 Market Trends 8.3.6.2 Market Forecast 8.3.7 Others 8.3.7.1 Market Trends 8.3.7.2 Market Forecast 8.4 Latin America 8.4.1 Brazil 8.4.1.1 Market Trends 8.4.1.2 Market Forecast 8.4.2 Mexico 8.4.2.1 Market Trends 8.4.2.2 Market Forecast 8.4.3 Others 8.4.3.1 Market Trends 8.4.3.2 Market Forecast 8.5 Middle East and Africa 8.5.1 Market Trends 8.5.2 Market Breakup by Country 8.5.3 Market Forecast 9 SWOT Analysis 9.1 Overview 9.2 Strengths 9.3 Weaknesses 9.4 Opportunities 9.5 Threats 10 Value Chain Analysis 11 Porters Five Forces Analysis 11.1 Overview 11.2 Bargaining Power of Buyers 11.3 Bargaining Power of Suppliers 11.4 Degree of Competition 11.5 Threat of New Entrants 11.6 Threat of Substitutes 12 Price Analysis 13 Competitive Landscape 13.1 Market Structure 13.2 Key Players 13.3 Profiles of Key Players 13.3.1 Amkor Technology Inc. 13.3.1.1 Company Overview 13.3.1.2 Product Portfolio 13.3.1.3 Financials 13.3.1.4 SWOT Analysis 13.3.2 China Wafer Level CSP Co. Ltd. 13.3.2.1 Company Overview 13.3.2.2 Product Portfolio 13.3.2.3 SWOT Analysis 13.3.3 Chipbond Technology Corporation 13.3.3.1 Company Overview 13.3.3.2 Product Portfolio 13.3.3.3 SWOT Analysis 13.3.4 Deca Technologies Inc. (Infineon Technologies AG) 13.3.4.1 Company Overview 13.3.4.2 Product Portfolio 13.3.5 Fujitsu Limited 13.3.5.1 Company Overview 13.3.5.2 Product Portfolio 13.3.5.3 Financials 13.3.5.4 SWOT Analysis 13.3.6 IQE PLC 13.3.6.1 Company Overview 13.3.6.2 Product Portfolio 13.3.6.3 SWOT Analysis 13.3.7 JCET Group Co. Ltd. 13.3.7.1 Company Overview 13.3.7.2 Product Portfolio 13.3.7.3 SWOT Analysis 13.3.8 Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.) 13.3.8.1 Company Overview 13.3.8.2 Product Portfolio 13.3.8.3 Financials 13.3.9 Tokyo Electron Ltd. 13.3.9.1 Company Overview 13.3.9.2 Product Portfolio 13.3.9.3 Financials 13.3.9.4 SWOT Analysis 13.3.10 Toshiba Corporation 13.3.10.1 Company Overview 13.3.10.2 Product Portfolio 13.3.10.3 Financials 13.3.10.4 SWOT Analysis
SummaryThe global wafer level packaging market experienced strong growth during 2015-2020. Looking forward, IMARC Group expects the market to grow at a CAGR of around 11% during 2021-2026. The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption. Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.Key Market Segmentation: IMARC Group provides an analysis of the key trends in each sub-segment of the global wafer level packaging market, along with forecasts at the global, regional and country level from 2021-2026. Our report has categorized the market based on region, packaging technology and end use industry. Breakup by Packaging Technology: 3D TSV WLP 2.5D TSV WLP WLCSP Nano WLP Others Breakup by End Use Industry: Aerospace and Defense Consumer Electronics IT & Telecommunication Healthcare Automotive Others Breakup by Region: North America United States Canada Asia-Pacific China Japan India South Korea Australia Indonesia Others Europe Germany France United Kingdom Italy Spain Russia Others Latin America Brazil Mexico Others Middle East and Africa Competitive Landscape: The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation. Key Questions Answered in This Report: How has the global wafer level packaging market performed so far and how will it perform in the coming years? What has been the impact of COVID-19 on the global wafer level packaging market? What are the key regional markets? What is the breakup of the market based on the packaging type? What is the breakup of the market based on the end use industry? What are the various stages in the value chain of the industry? What are the key driving factors and challenges in the industry? What is the structure of the global wafer level packaging market and who are the key players? What is the degree of competition in the industry? Table of Contents1 Preface2 Scope and Methodology 2.1 Objectives of the Study 2.2 Stakeholders 2.3 Data Sources 2.3.1 Primary Sources 2.3.2 Secondary Sources 2.4 Market Estimation 2.4.1 Bottom-Up Approach 2.4.2 Top-Down Approach 2.5 Forecasting Methodology 3 Executive Summary 4 Introduction 4.1 Overview 4.2 Key Industry Trends 5 Global Wafer Level Packaging Market 5.1 Market Overview 5.2 Market Performance 5.3 Impact of COVID-19 5.4 Market Forecast 6 Market Breakup by Packaging Technology 6.1 3D TSV WLP 6.1.1 Market Trends 6.1.2 Market Forecast 6.2 2.5D TSV WLP 6.2.1 Market Trends 6.2.2 Market Forecast 6.3 WLCSP 6.3.1 Market Trends 6.3.2 Market Forecast 6.4 Nano WLP 6.4.1 Market Trends 6.4.2 Market Forecast 6.5 Others 6.5.1 Market Trends 6.5.2 Market Forecast 7 Market Breakup by End Use Industry 7.1 Aerospace and Defense 7.1.1 Market Trends 7.1.2 Market Forecast 7.2 Consumer Electronics 7.2.1 Market Trends 7.2.2 Market Forecast 7.3 IT & Telecommunication 7.3.1 Market Trends 7.3.2 Market Forecast 7.4 Healthcare 7.4.1 Market Trends 7.4.2 Market Forecast 7.5 Automotive 7.5.1 Market Trends 7.5.2 Market Forecast 7.6 Others 7.6.1 Market Trends 7.6.2 Market Forecast 8 Market Breakup by Region 8.1 North America 8.1.1 United States 8.1.1.1 Market Trends 8.1.1.2 Market Forecast 8.1.2 Canada 8.1.2.1 Market Trends 8.1.2.2 Market Forecast 8.2 Asia-Pacific 8.2.1 China 8.2.1.1 Market Trends 8.2.1.2 Market Forecast 8.2.2 Japan 8.2.2.1 Market Trends 8.2.2.2 Market Forecast 8.2.3 India 8.2.3.1 Market Trends 8.2.3.2 Market Forecast 8.2.4 South Korea 8.2.4.1 Market Trends 8.2.4.2 Market Forecast 8.2.5 Australia 8.2.5.1 Market Trends 8.2.5.2 Market Forecast 8.2.6 Indonesia 8.2.6.1 Market Trends 8.2.6.2 Market Forecast 8.2.7 Others 8.2.7.1 Market Trends 8.2.7.2 Market Forecast 8.3 Europe 8.3.1 Germany 8.3.1.1 Market Trends 8.3.1.2 Market Forecast 8.3.2 France 8.3.2.1 Market Trends 8.3.2.2 Market Forecast 8.3.3 United Kingdom 8.3.3.1 Market Trends 8.3.3.2 Market Forecast 8.3.4 Italy 8.3.4.1 Market Trends 8.3.4.2 Market Forecast 8.3.5 Spain 8.3.5.1 Market Trends 8.3.5.2 Market Forecast 8.3.6 Russia 8.3.6.1 Market Trends 8.3.6.2 Market Forecast 8.3.7 Others 8.3.7.1 Market Trends 8.3.7.2 Market Forecast 8.4 Latin America 8.4.1 Brazil 8.4.1.1 Market Trends 8.4.1.2 Market Forecast 8.4.2 Mexico 8.4.2.1 Market Trends 8.4.2.2 Market Forecast 8.4.3 Others 8.4.3.1 Market Trends 8.4.3.2 Market Forecast 8.5 Middle East and Africa 8.5.1 Market Trends 8.5.2 Market Breakup by Country 8.5.3 Market Forecast 9 SWOT Analysis 9.1 Overview 9.2 Strengths 9.3 Weaknesses 9.4 Opportunities 9.5 Threats 10 Value Chain Analysis 11 Porters Five Forces Analysis 11.1 Overview 11.2 Bargaining Power of Buyers 11.3 Bargaining Power of Suppliers 11.4 Degree of Competition 11.5 Threat of New Entrants 11.6 Threat of Substitutes 12 Price Analysis 13 Competitive Landscape 13.1 Market Structure 13.2 Key Players 13.3 Profiles of Key Players 13.3.1 Amkor Technology Inc. 13.3.1.1 Company Overview 13.3.1.2 Product Portfolio 13.3.1.3 Financials 13.3.1.4 SWOT Analysis 13.3.2 China Wafer Level CSP Co. Ltd. 13.3.2.1 Company Overview 13.3.2.2 Product Portfolio 13.3.2.3 SWOT Analysis 13.3.3 Chipbond Technology Corporation 13.3.3.1 Company Overview 13.3.3.2 Product Portfolio 13.3.3.3 SWOT Analysis 13.3.4 Deca Technologies Inc. (Infineon Technologies AG) 13.3.4.1 Company Overview 13.3.4.2 Product Portfolio 13.3.5 Fujitsu Limited 13.3.5.1 Company Overview 13.3.5.2 Product Portfolio 13.3.5.3 Financials 13.3.5.4 SWOT Analysis 13.3.6 IQE PLC 13.3.6.1 Company Overview 13.3.6.2 Product Portfolio 13.3.6.3 SWOT Analysis 13.3.7 JCET Group Co. Ltd. 13.3.7.1 Company Overview 13.3.7.2 Product Portfolio 13.3.7.3 SWOT Analysis 13.3.8 Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.) 13.3.8.1 Company Overview 13.3.8.2 Product Portfolio 13.3.8.3 Financials 13.3.9 Tokyo Electron Ltd. 13.3.9.1 Company Overview 13.3.9.2 Product Portfolio 13.3.9.3 Financials 13.3.9.4 SWOT Analysis 13.3.10 Toshiba Corporation 13.3.10.1 Company Overview 13.3.10.2 Product Portfolio 13.3.10.3 Financials 13.3.10.4 SWOT Analysis
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