Global Solar Ingot Wafer Market Size study & Forecast, by Type (Monocrystalline, Polycrystalline) by Application (Mono Solar Cell, Multi Solar Cell, BIPV, Others), by Manufacturing Process (Czochralski, Float Zone, Bridgman), by Wafer Size (125mm x 125mm, 156mm x 156mm, 210mm x 210mm, Others) by End-User (Residential, Commercial, Industrial, Utilities) and Regional Analysis, 2023-2030
Global Semi-Insulating Silicon Carbide Wafer Market Size Study & Forecast, by Type (4 Inch SiC Wafer, 6 Inch SiC Wafer), by Application (Power Device, Electronics & Optoelectronics, Wireless Infrastructure, Others), and Regional Analysis, 2023-2030
North America Autonomous Mobile Manipulator Robots Market Forecast to 2030 Regional Analysis by Type (Differential and Omni-Directional), Payload (3-5 KG, 5-10 KG, 10-20 KG, and 20 KG & Above), Application (Sorting, Pick & Place, Inventory Management, and Others), and End User Industry (Healthcare, Space, Assembly, and Others)
Porous Ceramic Market Growth & Trends
The global porous ceramic market size is expected to reach USD 16.58 billion by 2030, according to a new report by Grand View Research, Inc. It is expected to expand at a CAGR of 12.0% from 2023 to 2030. The increasi…
次世代メモリ市場の成長と動向
Grand View Research, Inc.の最新レポートによると、次世代メモリの世界市場規模は2023年から2030年にかけて年平均成長率16.6%を記録し、2030年には226億5000万米ドルに達すると予測されている。次世代メモリは、現在開発中のコンピュータメ…
Redistribution Layer Material Market Size and Forecasts (2020 - 2030), Global and Regional Share, Trends, and Growth Opportunity Analysis Report Coverage: By Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and Application {Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging [High Bandwidth Memory (HBM), Multi-Chip Integration, Package on Package (FOPOP), and Others]}
Photolithography Equipment Market Growth & Trends
The global photolithography equipment market size is anticipated to reach USD 18.21 billion by 2030, according to a new report by Grand View Research, Inc. The market is projected to grow at a CAGR of 6.4…
Southeast Asia Redistribution Layer Material Market Size and Forecasts (2020 - 2030), Regional Share, Trends, and Growth Opportunity Analysis Report Coverage: By Type (Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others) and Application (Fan-Out Wafer Level Packaging (FOWLP) and 2 5D/3D IC Packaging [High Bandwidth Memory (HBM), Multi-Chip Integration, Package on Package (FOPOP), and Others])
Global Microelectromechanical Systems Market Size study & Forecast, by Type (Sensors, Actuators) By Application (Consumer Electronics, Automotive, Industrial, Aerospace and Defense, Healthcare, Telecommunication, Others) and Regional Analysis, 2023-2030