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ウェーハグラインダー(ウェーハ薄片化装置)の世界市場成長 2023-2029


Global Wafer Grinder (Wafer Thinning Equipment) Market Growth 2023-2029

LPI(LPインフォメーション)の最新調査によると、世界のウェーハグラインダー(ウェーハ薄片化装置)市場規模は2022年に7億9920万米ドルとなった。下流市場での需要拡大に伴い、ウェーハグラインダ(ウェーハ薄... もっと見る

 

 

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LP Information
LPインフォメーション
2023年10月8日 US$3,660
シングルユーザライセンス
ライセンス・価格情報
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104 英語

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LPI(LPインフォメーション)の最新調査によると、世界のウェーハグラインダー(ウェーハ薄片化装置)市場規模は2022年に7億9920万米ドルとなった。下流市場での需要拡大に伴い、ウェーハグラインダ(ウェーハ薄片化装置)は2029年までに1億2,200万米ドルに再調整され、レビュー期間中のCAGRは6.7%と予測されています。
この調査レポートは、世界のウェーハグラインダ(ウェーハ薄片化装置)市場の成長可能性を明らかにしています。ウェーハグラインダ(ウェーハ薄片化装置)は、今後の市場でも安定した成長が見込まれる。しかし、ウェーハグラインダー(ウェーハ薄片化装置)の普及には、製品の差別化、コスト削減、サプライチェーンの最適化が引き続き重要である。市場プレイヤーは、ウェーハグラインダー(ウェーハ薄片化装置)市場が提供する膨大な機会を活用するために、研究開発に投資し、戦略的パートナーシップを構築し、進化する消費者の嗜好に合わせた製品を提供する必要があります。
中国市場において、ウェーハ薄片化装置の中心的プレイヤーは、Disco、Tokyo Precision、G&Nなどである。業界の上位2社が市場シェアの約80%を占めている。製品は自動化のレベルによって、全自動と半自動に分類される。本製品は様々なサイズのウエハチューブの生産に広く使用されている。
主な特徴
この調査レポートは、ウェーハグラインダー(ウェーハ薄片化装置)市場の様々な側面を反映し、業界に関する貴重な洞察を提供しています。
市場規模と成長:この調査レポートは、ウェーハグラインダー(ウェーハ薄片化装置)市場の現在の規模と成長の概要を提供します。過去のデータ、自動化レベル別(全自動、半自動など)の市場区分、地域別の内訳などが含まれます。
市場促進要因と課題:政府規制、環境問題、技術進歩、消費者嗜好の変化など、ウェーハグラインダー(ウェーハ薄片化装置)市場の成長を促進する要因を特定・分析することができます。また、インフラ制約、射程距離への不安、初期コストの高さなど、業界が直面する課題も浮き彫りにすることができる。
競合情勢:この調査レポートは、ウェーハグラインダー(ウェーハ薄片化装置)市場内の競合状況の分析を提供しています。主要企業のプロフィール、市場シェア、戦略、製品提供などが含まれています。また、新興企業や市場に与える潜在的な影響にもスポットを当てることができます。
技術開発:調査レポートは、ウェーハグラインダー(ウェーハ薄片化装置)産業における最新の技術開発を掘り下げることができます。これには、ウェーハグラインダー(ウェーハ薄片化装置)技術の進歩、ウェーハグラインダー(ウェーハ薄片化装置)の新規参入企業、ウェーハグラインダー(ウェーハ薄片化装置)の新規投資、ウェーハグラインダー(ウェーハ薄片化装置)の将来を形作るその他の技術革新が含まれます。
川下企業の好み:このレポートは、ウェーハグラインダー(ウェーハ薄片化装置)市場における顧客の購買行動と採用動向を明らかにします。顧客の購買決定、ウェーハグラインダ(ウェーハ薄片化装置)製品の嗜好に影響を与える要因も含まれる。
政府の政策とインセンティブこの調査レポートは、政府の政策とインセンティブがウェーハグラインダ(ウェーハ薄片化装置)市場に与える影響を分析しています。これには、ウェーハグラインダ(ウェーハ薄片化装置)市場の促進を目的とした規制枠組み、補助金、税制優遇措置などの評価が含まれます。また、市場成長促進におけるこれらの政策の有効性も評価します。
環境影響と持続可能性調査レポートは、ウェーハグラインダ(ウェーハ薄片化装置)市場の環境影響と持続可能性の側面を評価します。
市場予測と将来展望:調査レポートでは、実施した分析に基づいて、ウェーハグラインダ(ウェーハ薄片化装置)産業の市場予測と展望を提供しています。これには、市場規模、成長率、地域動向、技術進歩や政策展開に関する予測などが含まれます。
提言と機会:本レポートは、業界関係者、政策立案者、投資家への提言で締めくくられています。市場関係者が新たなトレンドを活用し、課題を克服し、ウェーハグラインダー(ウェーハ薄片化装置)市場の成長と発展に貢献するための潜在的な機会を強調しています。
市場の細分化
ウェーハグラインダー(ウェーハ薄片化装置)市場は、自動化レベル別、用途別に分割される。2018-2029年の期間、セグメント間の成長は、自動化レベル別、アプリケーション別の消費額の正確な計算と予測を数量と金額で提供します。
自動化レベル別セグメント
完全自動
半自動
用途別セグメント
200mmウェハー
300mmウェハー
その他
本レポートでは、地域別にも市場を分割しています:
南北アメリカ
アメリカ
カナダ
メキシコ
ブラジル
APAC
中国
日本
韓国
東南アジア
インド
オーストラリア
ヨーロッパ
ドイツ
フランス
英国
イタリア
ロシア
中東・アフリカ
エジプト
南アフリカ
イスラエル
トルコ
GCC諸国
以下の企業は、一次専門家から収集した情報、および企業のカバレッジ、製品ポートフォリオ、市場浸透度の分析に基づいて選択されています。
ディスコ
東京精密
ジーアンドエヌ
岡本半導体機器事業部
CETC
光洋マシナリー
レバサム
和井田製作所
深圳方達
湖南玉井機械工業
スピードファム
郝海青科
本レポートで扱う主な質問
世界のウェーハグラインダー(ウェーハ薄片化装置)市場の10年展望は?
ウェーハグラインダー(ウェーハ薄片化装置)市場の成長を促進する要因は何か?
市場別・地域別で最も急成長する技術は?
ウェーハグラインダー(ウェーハ薄片化装置)市場機会は最終市場規模によってどのように異なるのか?
ウェーハグラインダー(ウェーハ薄片化装置)の自動化レベル、用途別ブレークアウトは?


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目次

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Annual Sales 2018-2029
2.1.2 World Current & Future Analysis for Wafer Grinder (Wafer Thinning Equipment) by Geographic Region, 2018, 2022 & 2029
2.1.3 World Current & Future Analysis for Wafer Grinder (Wafer Thinning Equipment) by Country/Region, 2018, 2022 & 2029
2.2 Wafer Grinder (Wafer Thinning Equipment) Segment by Level of Automation
2.2.1 Fully Automatic
2.2.2 Semi-Automatic
2.3 Wafer Grinder (Wafer Thinning Equipment) Sales by Level of Automation
2.3.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Market Share by Level of Automation (2018-2023)
2.3.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue and Market Share by Level of Automation (2018-2023)
2.3.3 Global Wafer Grinder (Wafer Thinning Equipment) Sale Price by Level of Automation (2018-2023)
2.4 Wafer Grinder (Wafer Thinning Equipment) Segment by Application
2.4.1 200mm Wafer
2.4.2 300mm Wafer
2.4.3 Others
2.5 Wafer Grinder (Wafer Thinning Equipment) Sales by Application
2.5.1 Global Wafer Grinder (Wafer Thinning Equipment) Sale Market Share by Application (2018-2023)
2.5.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue and Market Share by Application (2018-2023)
2.5.3 Global Wafer Grinder (Wafer Thinning Equipment) Sale Price by Application (2018-2023)
3 Global Wafer Grinder (Wafer Thinning Equipment) by Company
3.1 Global Wafer Grinder (Wafer Thinning Equipment) Breakdown Data by Company
3.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Annual Sales by Company (2018-2023)
3.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Market Share by Company (2018-2023)
3.2 Global Wafer Grinder (Wafer Thinning Equipment) Annual Revenue by Company (2018-2023)
3.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Company (2018-2023)
3.2.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue Market Share by Company (2018-2023)
3.3 Global Wafer Grinder (Wafer Thinning Equipment) Sale Price by Company
3.4 Key Manufacturers Wafer Grinder (Wafer Thinning Equipment) Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Wafer Grinder (Wafer Thinning Equipment) Product Location Distribution
3.4.2 Players Wafer Grinder (Wafer Thinning Equipment) Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2018-2023)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for Wafer Grinder (Wafer Thinning Equipment) by Geographic Region
4.1 World Historic Wafer Grinder (Wafer Thinning Equipment) Market Size by Geographic Region (2018-2023)
4.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Annual Sales by Geographic Region (2018-2023)
4.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Annual Revenue by Geographic Region (2018-2023)
4.2 World Historic Wafer Grinder (Wafer Thinning Equipment) Market Size by Country/Region (2018-2023)
4.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Annual Sales by Country/Region (2018-2023)
4.2.2 Global Wafer Grinder (Wafer Thinning Equipment) Annual Revenue by Country/Region (2018-2023)
4.3 Americas Wafer Grinder (Wafer Thinning Equipment) Sales Growth
4.4 APAC Wafer Grinder (Wafer Thinning Equipment) Sales Growth
4.5 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Growth
4.6 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales Growth
5 Americas
5.1 Americas Wafer Grinder (Wafer Thinning Equipment) Sales by Country
5.1.1 Americas Wafer Grinder (Wafer Thinning Equipment) Sales by Country (2018-2023)
5.1.2 Americas Wafer Grinder (Wafer Thinning Equipment) Revenue by Country (2018-2023)
5.2 Americas Wafer Grinder (Wafer Thinning Equipment) Sales by Level of Automation
5.3 Americas Wafer Grinder (Wafer Thinning Equipment) Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Wafer Grinder (Wafer Thinning Equipment) Sales by Region
6.1.1 APAC Wafer Grinder (Wafer Thinning Equipment) Sales by Region (2018-2023)
6.1.2 APAC Wafer Grinder (Wafer Thinning Equipment) Revenue by Region (2018-2023)
6.2 APAC Wafer Grinder (Wafer Thinning Equipment) Sales by Level of Automation
6.3 APAC Wafer Grinder (Wafer Thinning Equipment) Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Wafer Grinder (Wafer Thinning Equipment) by Country
7.1.1 Europe Wafer Grinder (Wafer Thinning Equipment) Sales by Country (2018-2023)
7.1.2 Europe Wafer Grinder (Wafer Thinning Equipment) Revenue by Country (2018-2023)
7.2 Europe Wafer Grinder (Wafer Thinning Equipment) Sales by Level of Automation
7.3 Europe Wafer Grinder (Wafer Thinning Equipment) Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) by Country
8.1.1 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales by Country (2018-2023)
8.1.2 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Revenue by Country (2018-2023)
8.2 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales by Level of Automation
8.3 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Wafer Grinder (Wafer Thinning Equipment)
10.3 Manufacturing Process Analysis of Wafer Grinder (Wafer Thinning Equipment)
10.4 Industry Chain Structure of Wafer Grinder (Wafer Thinning Equipment)
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Wafer Grinder (Wafer Thinning Equipment) Distributors
11.3 Wafer Grinder (Wafer Thinning Equipment) Customer
12 World Forecast Review for Wafer Grinder (Wafer Thinning Equipment) by Geographic Region
12.1 Global Wafer Grinder (Wafer Thinning Equipment) Market Size Forecast by Region
12.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Forecast by Region (2024-2029)
12.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Annual Revenue Forecast by Region (2024-2029)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global Wafer Grinder (Wafer Thinning Equipment) Forecast by Level of Automation
12.7 Global Wafer Grinder (Wafer Thinning Equipment) Forecast by Application
13 Key Players Analysis
13.1 Disco
13.1.1 Disco Company Information
13.1.2 Disco Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.1.3 Disco Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.1.4 Disco Main Business Overview
13.1.5 Disco Latest Developments
13.2 TOKYO SEIMITSU
13.2.1 TOKYO SEIMITSU Company Information
13.2.2 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.2.3 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.2.4 TOKYO SEIMITSU Main Business Overview
13.2.5 TOKYO SEIMITSU Latest Developments
13.3 G&N
13.3.1 G&N Company Information
13.3.2 G&N Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.3.3 G&N Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.3.4 G&N Main Business Overview
13.3.5 G&N Latest Developments
13.4 Okamoto Semiconductor Equipment Division
13.4.1 Okamoto Semiconductor Equipment Division Company Information
13.4.2 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.4.3 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.4.4 Okamoto Semiconductor Equipment Division Main Business Overview
13.4.5 Okamoto Semiconductor Equipment Division Latest Developments
13.5 CETC
13.5.1 CETC Company Information
13.5.2 CETC Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.5.3 CETC Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.5.4 CETC Main Business Overview
13.5.5 CETC Latest Developments
13.6 Koyo Machinery
13.6.1 Koyo Machinery Company Information
13.6.2 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.6.3 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.6.4 Koyo Machinery Main Business Overview
13.6.5 Koyo Machinery Latest Developments
13.7 Revasum
13.7.1 Revasum Company Information
13.7.2 Revasum Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.7.3 Revasum Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.7.4 Revasum Main Business Overview
13.7.5 Revasum Latest Developments
13.8 WAIDA MFG
13.8.1 WAIDA MFG Company Information
13.8.2 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.8.3 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.8.4 WAIDA MFG Main Business Overview
13.8.5 WAIDA MFG Latest Developments
13.9 Shenzhen Fangda
13.9.1 Shenzhen Fangda Company Information
13.9.2 Shenzhen Fangda Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.9.3 Shenzhen Fangda Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.9.4 Shenzhen Fangda Main Business Overview
13.9.5 Shenzhen Fangda Latest Developments
13.10 Hunan Yujing Machine Industrial
13.10.1 Hunan Yujing Machine Industrial Company Information
13.10.2 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.10.3 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.10.4 Hunan Yujing Machine Industrial Main Business Overview
13.10.5 Hunan Yujing Machine Industrial Latest Developments
13.11 SpeedFam
13.11.1 SpeedFam Company Information
13.11.2 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.11.3 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.11.4 SpeedFam Main Business Overview
13.11.5 SpeedFam Latest Developments
13.12 Hauhaiqingke
13.12.1 Hauhaiqingke Company Information
13.12.2 Hauhaiqingke Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.12.3 Hauhaiqingke Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.12.4 Hauhaiqingke Main Business Overview
13.12.5 Hauhaiqingke Latest Developments
14 Research Findings and Conclusion

 

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Summary

According to our LPI (LP Information) latest study, the global Wafer Grinder (Wafer Thinning Equipment) market size was valued at US$ 799.2 million in 2022. With growing demand in downstream market, the Wafer Grinder (Wafer Thinning Equipment) is forecast to a readjusted size of US$ 1262 million by 2029 with a CAGR of 6.7% during review period.
The research report highlights the growth potential of the global Wafer Grinder (Wafer Thinning Equipment) market. Wafer Grinder (Wafer Thinning Equipment) are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of Wafer Grinder (Wafer Thinning Equipment). Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the Wafer Grinder (Wafer Thinning Equipment) market.
In the China market, Wafer Thinning Equipment core players include Disco, Tokyo Precision, G&N and others. The top two players in the industry account for about 80% of the market share. The product can be classified into fully automatic ones and semi-automatic ones according to the level of automation. The product is widely used in the production of various sizes of wafer tubes.
Key Features:
The report on Wafer Grinder (Wafer Thinning Equipment) market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the Wafer Grinder (Wafer Thinning Equipment) market. It may include historical data, market segmentation by Level of Automation (e.g., Fully Automatic, Semi-Automatic), and regional breakdowns.
Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the Wafer Grinder (Wafer Thinning Equipment) market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the Wafer Grinder (Wafer Thinning Equipment) market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the Wafer Grinder (Wafer Thinning Equipment) industry. This include advancements in Wafer Grinder (Wafer Thinning Equipment) technology, Wafer Grinder (Wafer Thinning Equipment) new entrants, Wafer Grinder (Wafer Thinning Equipment) new investment, and other innovations that are shaping the future of Wafer Grinder (Wafer Thinning Equipment).
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the Wafer Grinder (Wafer Thinning Equipment) market. It includes factors influencing customer ' purchasing decisions, preferences for Wafer Grinder (Wafer Thinning Equipment) product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the Wafer Grinder (Wafer Thinning Equipment) market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting Wafer Grinder (Wafer Thinning Equipment) market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the Wafer Grinder (Wafer Thinning Equipment) market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the Wafer Grinder (Wafer Thinning Equipment) industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the Wafer Grinder (Wafer Thinning Equipment) market.
Market Segmentation:
Wafer Grinder (Wafer Thinning Equipment) market is split by Level of Automation and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Level of Automation, and by Application in terms of volume and value.
Segmentation by level of automation
Fully Automatic
Semi-Automatic
Segmentation by application
200mm Wafer
300mm Wafer
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Grinder (Wafer Thinning Equipment) market?
What factors are driving Wafer Grinder (Wafer Thinning Equipment) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Grinder (Wafer Thinning Equipment) market opportunities vary by end market size?
How does Wafer Grinder (Wafer Thinning Equipment) break out level of automation, application?



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Table of Contents

1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Annual Sales 2018-2029
2.1.2 World Current & Future Analysis for Wafer Grinder (Wafer Thinning Equipment) by Geographic Region, 2018, 2022 & 2029
2.1.3 World Current & Future Analysis for Wafer Grinder (Wafer Thinning Equipment) by Country/Region, 2018, 2022 & 2029
2.2 Wafer Grinder (Wafer Thinning Equipment) Segment by Level of Automation
2.2.1 Fully Automatic
2.2.2 Semi-Automatic
2.3 Wafer Grinder (Wafer Thinning Equipment) Sales by Level of Automation
2.3.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Market Share by Level of Automation (2018-2023)
2.3.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue and Market Share by Level of Automation (2018-2023)
2.3.3 Global Wafer Grinder (Wafer Thinning Equipment) Sale Price by Level of Automation (2018-2023)
2.4 Wafer Grinder (Wafer Thinning Equipment) Segment by Application
2.4.1 200mm Wafer
2.4.2 300mm Wafer
2.4.3 Others
2.5 Wafer Grinder (Wafer Thinning Equipment) Sales by Application
2.5.1 Global Wafer Grinder (Wafer Thinning Equipment) Sale Market Share by Application (2018-2023)
2.5.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue and Market Share by Application (2018-2023)
2.5.3 Global Wafer Grinder (Wafer Thinning Equipment) Sale Price by Application (2018-2023)
3 Global Wafer Grinder (Wafer Thinning Equipment) by Company
3.1 Global Wafer Grinder (Wafer Thinning Equipment) Breakdown Data by Company
3.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Annual Sales by Company (2018-2023)
3.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Market Share by Company (2018-2023)
3.2 Global Wafer Grinder (Wafer Thinning Equipment) Annual Revenue by Company (2018-2023)
3.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Company (2018-2023)
3.2.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue Market Share by Company (2018-2023)
3.3 Global Wafer Grinder (Wafer Thinning Equipment) Sale Price by Company
3.4 Key Manufacturers Wafer Grinder (Wafer Thinning Equipment) Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Wafer Grinder (Wafer Thinning Equipment) Product Location Distribution
3.4.2 Players Wafer Grinder (Wafer Thinning Equipment) Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2018-2023)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for Wafer Grinder (Wafer Thinning Equipment) by Geographic Region
4.1 World Historic Wafer Grinder (Wafer Thinning Equipment) Market Size by Geographic Region (2018-2023)
4.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Annual Sales by Geographic Region (2018-2023)
4.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Annual Revenue by Geographic Region (2018-2023)
4.2 World Historic Wafer Grinder (Wafer Thinning Equipment) Market Size by Country/Region (2018-2023)
4.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Annual Sales by Country/Region (2018-2023)
4.2.2 Global Wafer Grinder (Wafer Thinning Equipment) Annual Revenue by Country/Region (2018-2023)
4.3 Americas Wafer Grinder (Wafer Thinning Equipment) Sales Growth
4.4 APAC Wafer Grinder (Wafer Thinning Equipment) Sales Growth
4.5 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Growth
4.6 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales Growth
5 Americas
5.1 Americas Wafer Grinder (Wafer Thinning Equipment) Sales by Country
5.1.1 Americas Wafer Grinder (Wafer Thinning Equipment) Sales by Country (2018-2023)
5.1.2 Americas Wafer Grinder (Wafer Thinning Equipment) Revenue by Country (2018-2023)
5.2 Americas Wafer Grinder (Wafer Thinning Equipment) Sales by Level of Automation
5.3 Americas Wafer Grinder (Wafer Thinning Equipment) Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Wafer Grinder (Wafer Thinning Equipment) Sales by Region
6.1.1 APAC Wafer Grinder (Wafer Thinning Equipment) Sales by Region (2018-2023)
6.1.2 APAC Wafer Grinder (Wafer Thinning Equipment) Revenue by Region (2018-2023)
6.2 APAC Wafer Grinder (Wafer Thinning Equipment) Sales by Level of Automation
6.3 APAC Wafer Grinder (Wafer Thinning Equipment) Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Wafer Grinder (Wafer Thinning Equipment) by Country
7.1.1 Europe Wafer Grinder (Wafer Thinning Equipment) Sales by Country (2018-2023)
7.1.2 Europe Wafer Grinder (Wafer Thinning Equipment) Revenue by Country (2018-2023)
7.2 Europe Wafer Grinder (Wafer Thinning Equipment) Sales by Level of Automation
7.3 Europe Wafer Grinder (Wafer Thinning Equipment) Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) by Country
8.1.1 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales by Country (2018-2023)
8.1.2 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Revenue by Country (2018-2023)
8.2 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales by Level of Automation
8.3 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Wafer Grinder (Wafer Thinning Equipment)
10.3 Manufacturing Process Analysis of Wafer Grinder (Wafer Thinning Equipment)
10.4 Industry Chain Structure of Wafer Grinder (Wafer Thinning Equipment)
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Wafer Grinder (Wafer Thinning Equipment) Distributors
11.3 Wafer Grinder (Wafer Thinning Equipment) Customer
12 World Forecast Review for Wafer Grinder (Wafer Thinning Equipment) by Geographic Region
12.1 Global Wafer Grinder (Wafer Thinning Equipment) Market Size Forecast by Region
12.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Forecast by Region (2024-2029)
12.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Annual Revenue Forecast by Region (2024-2029)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global Wafer Grinder (Wafer Thinning Equipment) Forecast by Level of Automation
12.7 Global Wafer Grinder (Wafer Thinning Equipment) Forecast by Application
13 Key Players Analysis
13.1 Disco
13.1.1 Disco Company Information
13.1.2 Disco Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.1.3 Disco Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.1.4 Disco Main Business Overview
13.1.5 Disco Latest Developments
13.2 TOKYO SEIMITSU
13.2.1 TOKYO SEIMITSU Company Information
13.2.2 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.2.3 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.2.4 TOKYO SEIMITSU Main Business Overview
13.2.5 TOKYO SEIMITSU Latest Developments
13.3 G&N
13.3.1 G&N Company Information
13.3.2 G&N Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.3.3 G&N Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.3.4 G&N Main Business Overview
13.3.5 G&N Latest Developments
13.4 Okamoto Semiconductor Equipment Division
13.4.1 Okamoto Semiconductor Equipment Division Company Information
13.4.2 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.4.3 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.4.4 Okamoto Semiconductor Equipment Division Main Business Overview
13.4.5 Okamoto Semiconductor Equipment Division Latest Developments
13.5 CETC
13.5.1 CETC Company Information
13.5.2 CETC Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.5.3 CETC Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.5.4 CETC Main Business Overview
13.5.5 CETC Latest Developments
13.6 Koyo Machinery
13.6.1 Koyo Machinery Company Information
13.6.2 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.6.3 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.6.4 Koyo Machinery Main Business Overview
13.6.5 Koyo Machinery Latest Developments
13.7 Revasum
13.7.1 Revasum Company Information
13.7.2 Revasum Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.7.3 Revasum Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.7.4 Revasum Main Business Overview
13.7.5 Revasum Latest Developments
13.8 WAIDA MFG
13.8.1 WAIDA MFG Company Information
13.8.2 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.8.3 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.8.4 WAIDA MFG Main Business Overview
13.8.5 WAIDA MFG Latest Developments
13.9 Shenzhen Fangda
13.9.1 Shenzhen Fangda Company Information
13.9.2 Shenzhen Fangda Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.9.3 Shenzhen Fangda Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.9.4 Shenzhen Fangda Main Business Overview
13.9.5 Shenzhen Fangda Latest Developments
13.10 Hunan Yujing Machine Industrial
13.10.1 Hunan Yujing Machine Industrial Company Information
13.10.2 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.10.3 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.10.4 Hunan Yujing Machine Industrial Main Business Overview
13.10.5 Hunan Yujing Machine Industrial Latest Developments
13.11 SpeedFam
13.11.1 SpeedFam Company Information
13.11.2 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.11.3 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.11.4 SpeedFam Main Business Overview
13.11.5 SpeedFam Latest Developments
13.12 Hauhaiqingke
13.12.1 Hauhaiqingke Company Information
13.12.2 Hauhaiqingke Wafer Grinder (Wafer Thinning Equipment) Product Portfolios and Specifications
13.12.3 Hauhaiqingke Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2018-2023)
13.12.4 Hauhaiqingke Main Business Overview
13.12.5 Hauhaiqingke Latest Developments
14 Research Findings and Conclusion

 

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