1. |
EXECUTIVE SUMMARY |
1.1. |
What is the report about and who should read it? |
1.2. |
Status of OLED |
1.3. |
Strategies of QDs in display |
1.4. |
Characteristic comparison of different display technologies |
1.5. |
Horizontal comparison |
1.6. |
Why Micro-LED Displays? |
1.7. |
Micro-LED value propositions compared with LCD, OLED, QD |
1.8. |
Importance of identifying core value propositions |
1.9. |
Core value propositions of µLED displays 1 |
1.10. |
Core value propositions of µLED displays 2 |
1.11. |
Core value propositions of µLED displays 3 |
1.12. |
Core value propositions of µLED displays 4 |
1.13. |
Core value propositions of µLED displays 5 |
1.14. |
Analysis of micro-LED's value propositions |
1.15. |
Influence of resolution for applications |
1.16. |
Micro-LED display types |
1.17. |
Potential applications for micro-LED displays |
1.18. |
Matrix analysis |
1.19. |
Display requirements for XR applications |
1.20. |
Application analysis: Augmented/mixed reality |
1.21. |
Application analysis: Virtual reality |
1.22. |
Application analysis: Large video displays |
1.23. |
Application analysis: Televisions and monitors |
1.24. |
Application analysis: Automotive displays |
1.25. |
Application analysis: Mobile phones |
1.26. |
Application analysis: Smart watches and wearables |
1.27. |
Application analysis: Tablets and laptop |
1.28. |
Emerging displays enabled by micro-LED technology |
1.29. |
Summary: Micro-LED displays for XR |
1.30. |
Application focus for micro-LED displays |
1.31. |
Emerging functional displays based on micro-LEDs |
1.32. |
Trend: Equipment solution provider status |
1.33. |
Micro-LED display development stage |
1.34. |
Micro-LED application roadmap |
1.35. |
Micro-LED display fabrication flowchart 1 |
1.36. |
Micro-LED display fabrication flowchart 2 |
1.37. |
Technologies of micro-LED displays |
1.38. |
Complex micro-LED display design |
1.39. |
Challenge transition for micro-display manufacturing |
1.40. |
Current achievements of micro-LED displays |
1.41. |
Summary of challenges for micro-LED displays |
1.42. |
Issues with RGB micro-LED chips |
1.43. |
Micro-LED performance summary |
1.44. |
Full colour realization |
1.45. |
Quantum dots for µLEDs |
1.46. |
Common color assembly choice comparison |
1.47. |
Trend: Package preference for direct-view large displays |
1.48. |
Regional players: Taiwan |
1.49. |
Regional players: Mainland China |
1.50. |
Regional players: Japan & Korea |
1.51. |
Regional players: Europe |
1.52. |
Regional players: North America |
1.53. |
Supply chain status |
1.54. |
Supply chain reshuffle |
1.55. |
Possible supply chain for micro-LED displays |
1.56. |
Scenarios of supply chain dominance |
1.57. |
Supply chain influenced by trade war and COVID-19 |
2. |
COST ANALYSIS |
2.1. |
Cost basics |
2.2. |
Micro-LED cost vs Die size |
2.3. |
Cost assumption |
2.4. |
Cost analysis |
2.5. |
Economics of micro-LED: Cost reduction paths |
3. |
MARKET ANALYSIS |
3.1. |
Forecast approaches and assumptions |
3.2. |
Market forecast of device unit |
3.3. |
Market forecast of market value |
3.4. |
2029 & 2034 application market value share |
3.5. |
Market forecast analysis |
3.6. |
Wafer value forecast |
4. |
INTRODUCTION TO MICRO-LED DISPLAY |
4.1. |
Expectation of future displays |
4.2. |
From traditional LEDs... |
4.3. |
...to Micro-LEDs |
4.4. |
Comparisons of LEDs for displays |
4.5. |
Mini-LEDs and Micro-LEDs |
4.6. |
Sony: Micro-LEDs |
4.7. |
Correlations between mini-LED, micro-LED and fine pitch LED displays |
4.8. |
From traditional LEDs to micro-LED |
4.9. |
Display types based on micro-LEDs |
4.10. |
Existing large mini-/micro-LED display announcements |
4.11. |
Advantages of AM micro-LED micro-displays |
4.12. |
LED size definitions |
4.13. |
Micro-LED displays: Size is an important feature |
4.14. |
Micro LED displays: Beyond the size |
4.15. |
A better definition? |
4.16. |
Micro-LED display panel structure |
5. |
EPITAXY AND CHIP MANUFACTURING |
5.1. |
Introduction to light-emitting diodes |
5.1.1. |
History of solid-state lighting |
5.1.2. |
What is an LED? |
5.1.3. |
How does an LED work? |
5.1.4. |
Homojunction vs heterojunction |
5.1.5. |
LEDs by package technique 1 |
5.1.6. |
LEDs by package technique 2 |
5.1.7. |
Typical LED and packaged LED sizes |
5.1.8. |
Comparison between SMD and COB |
5.1.9. |
COB for displays |
5.1.10. |
List of global major LED companies with introduction |
5.2. |
Epitaxy |
5.2.1. |
Bandgap vs lattice constant for III-V semiconductors |
5.2.2. |
Materials for commercial LED chips 1 |
5.2.3. |
Materials for commercial LED chips 2 |
5.2.4. |
Green gap |
5.2.5. |
Epitaxy substrate |
5.2.6. |
Wafer patterning 1 |
5.2.7. |
Wafer patterning 2 |
5.2.8. |
Wafer patterning 3 |
5.2.9. |
Epitaxy methods |
5.2.10. |
Metal organic chemical vapor deposition |
5.2.11. |
Pros and cons of MOCVD |
5.2.12. |
Epitaxial growth requirement |
5.2.13. |
Offering from Aixtron and Veeco |
5.2.14. |
Veeco's offering |
5.2.15. |
Engineered substrate |
5.2.16. |
Wafer uniformity 1 |
5.2.17. |
Wavelength uniformity 2 |
5.2.18. |
Solutions for wafer nonuniformity |
5.3. |
Chip manufacturing |
5.3.1. |
LED fabrication flowchart |
5.3.2. |
Typical RGB LED designs |
5.3.3. |
LED chip structures 1 |
5.3.4. |
LED chip structures 2 |
5.3.5. |
LED chip structure illustrations |
5.3.6. |
Future of the LED chip structure |
5.3.7. |
Epi-film transfer |
5.3.8. |
Fabrication of vertical GaN-LEDs |
5.4. |
Micro-LED Performances |
5.4.1. |
Influence of micro-LED performance |
5.4.2. |
EQE of micro-LED versus current density 1 |
5.4.3. |
EQE of micro-LED versus current density 2 |
5.4.4. |
Efficiency droop |
5.4.5. |
Temperature stability |
5.4.6. |
Bowing of wavelength shift |
5.4.7. |
Size dependence of micro-LEDs: Efficiency |
5.4.8. |
Size dependence of micro-LEDs: Current spreading |
5.4.9. |
Size dependence of micro-LEDs: Strain relaxation |
5.4.10. |
Surface recombination |
5.4.11. |
Sidewall effect |
5.4.12. |
Conclusion of micro-LED size dependency |
5.4.13. |
Side wall passivation |
5.4.14. |
Efficiencies and requirement of RGB micro-LEDs |
5.4.15. |
Color-dependent light emission pattern |
5.4.16. |
Efficiency improvement |
5.4.17. |
Mikro Mesa: Current injection |
5.4.18. |
Mikro Mesa's micro-LEDs |
6. |
TRANSFER, ASSEMBLY AND INTEGRATION |
6.1.1. |
Transfer, assembly and integration technology types |
6.1.2. |
Introduction |
6.1.3. |
Mass transfer, assembly and integration technologies |
6.1.4. |
Requirements of mass transfer |
6.1.5. |
Chiplet mass transfer types |
6.2. |
Chiplet Mass Transfer |
6.2.1. |
Introduction to chiplet mass assembly |
6.2.2. |
Chiplet mass transfer scenario 1 |
6.2.3. |
Chiplet mass transfer scenario 2 |
6.2.4. |
Comparison of mass transfer technologies |
6.2.5. |
Comparison of transfer technologies of different companies |
6.2.6. |
Transfer yield |
6.3. |
Fine pick and place |
6.3.1. |
Overview of Elastomeric stamp |
6.3.2. |
Transfer process flow |
6.3.3. |
Elastomeric stamp: Pros and cons |
6.3.4. |
Key technologies for micro-LED mass transfer |
6.3.5. |
Substrate treatment |
6.3.6. |
Kinetic control of the elastomeric stamp adhesion |
6.3.7. |
Elastomeric stamp |
6.3.8. |
Pitch size determination |
6.3.9. |
X-Celeprint |
6.3.10. |
µLED fabrication |
6.3.11. |
µLEDs from sapphire substrate |
6.3.12. |
Passive matrix displays made by micro-transfer printing |
6.3.13. |
Passive matrix μLED display fabrication 1 |
6.3.14. |
Passive matrix μLED display fabrication 2 |
6.3.15. |
Active matrix displays made by micro-transfer printing |
6.3.16. |
Active matrix μLED display fabrication |
6.3.17. |
Automated micro-transfer printing machinery |
6.3.18. |
Capillary-assisted transfer printing |
6.3.19. |
Mikro Mesa: Transfer technology |
6.3.20. |
Mikro Mesa: Transfer flowchart 1 |
6.3.21. |
Mikro Mesa: Transfer flowchart 2 |
6.3.22. |
Mikro Mesa: Transfer stamp |
6.3.23. |
Mikro Mesa: Transfer design target |
6.3.24. |
PlayNitride: Mass transfer for micro-LED chips |
6.3.25. |
PlayNitride: Mass transfer flowchart 1 |
6.3.26. |
PlayNitride: Mass transfer flowchart 2 |
6.3.27. |
Visionox 1 |
6.3.28. |
Visionox 2 |
6.3.29. |
ITRI: Chip fabrication |
6.3.30. |
ITRI's mass transfer process |
6.3.31. |
ITRI's transfer module |
6.3.32. |
Overview of electrostatic array |
6.3.33. |
Electrostatic/electromagnetic transfer |
6.3.34. |
Apple/LuxVue 1 |
6.3.35. |
Apple/LuxVue 2 |
6.3.36. |
VerLASE's large area assembly platform |
6.3.37. |
Interposer idea |
6.4. |
Self-assembly |
6.4.1. |
Introduction of fluidic-assembly |
6.4.2. |
eLux: introduction |
6.4.3. |
Fabrication of micro-LED chip array |
6.4.4. |
eLux's fluidic assembly |
6.4.5. |
eLux's display prototypes |
6.4.6. |
eLux's supply chain |
6.4.7. |
eLux's core patent technology 1 |
6.4.8. |
eLux's core patent technology 2 |
6.4.9. |
eLux's core patent technology 3 |
6.4.10. |
eLux's core patent technology 4 |
6.4.11. |
eLux's core patent technology 5 |
6.4.12. |
eLux's core patent technology 6 |
6.4.13. |
Image quality comparison |
6.4.14. |
SWOT analysis of eLux's technology |
6.4.15. |
Other fluidic assembly techniques |
6.4.16. |
Fluidic assembly (physical): overview |
6.4.17. |
Alien |
6.4.18. |
Alien's fluidic self-assembly technology |
6.4.19. |
Self-assembly based on shape/geometry matching |
6.4.20. |
Shape-based self-assembly |
6.4.21. |
Fluidic assembly (electrophoretic): Overview |
6.4.22. |
Electrophoretic positioning of LEDs |
6.4.23. |
PARC's xerographic micro-assembly Printing 1 |
6.4.24. |
PARC's xerographic micro-assembly Printing 2 |
6.4.25. |
Fluidic-assembly (surface energy): Overview |
6.4.26. |
LG's FSA transfer technique |
6.4.27. |
Mechanism of surface-tension-driven fluidic assembly |
6.4.28. |
Surface tension based fluidic assembly 1 |
6.4.29. |
Surface tension based fluidic assembly 2 |
6.4.30. |
Surface tension based fluidic assembly 3 |
6.4.31. |
Surface tension based fluidic assembly 4 |
6.4.32. |
Fluidic-assembly (magnetic): Overview |
6.4.33. |
Magnetically-assisted assembly |
6.4.34. |
Fluidic-assembly (photoelectrochemical): Overview |
6.4.35. |
Photoelectrochemically driven fluidic-assembly |
6.4.36. |
Fluidic-assembly (combination): Overview |
6.4.37. |
Chip mounting apparatus |
6.4.38. |
Summary of fluidic assembly |
6.4.39. |
SelfArray |
6.5. |
Laser enabled transfer |
6.5.1. |
Overview of laser enabled transfer |
6.5.2. |
Laser beam requirement |
6.5.3. |
Coherent UVtransfer 3in1 System |
6.5.4. |
Uniqarta's parallel laser-enabled transfer technology 1 |
6.5.5. |
Uniqarta's parallel laser-enabled transfer technology 2 |
6.5.6. |
Uniqarta's parallel laser-enabled transfer technology 3 |
6.5.7. |
Uniqarta's parallel laser-enabled transfer technology 4 |
6.5.8. |
Uniqarta's parallel laser-enabled transfer technology 5 |
6.5.9. |
QMAT's beam-addressed release technology |
6.5.10. |
Optovate's technology 1 |
6.5.11. |
Optovate's technology 2 |
6.5.12. |
Coherent's approach |
6.5.13. |
Toray's offering |
6.5.14. |
Visionox's achievement |
6.5.15. |
Selective transfer by selective bonding-debonding |
6.6. |
Other chiplet mass transfer techniques |
6.6.1. |
Korean Institute of Machinery and Materials (KIMM) 1 |
6.6.2. |
Korean Institute of Machinery and Materials (KIMM) 2 |
6.6.3. |
Continuous roller transfer-printing of >75,000 die transfer in a single shot |
6.6.4. |
VueReal's cartridge printing technique |
6.6.5. |
VueReal's micro printer |
6.6.6. |
Innovasonic's technology |
6.6.7. |
Rohinni's Technology |
6.6.8. |
Two-step micro-transfer technology 1 |
6.6.9. |
Two-step micro-transfer technology 2 |
6.6.10. |
Two-step micro-transfer technology 3 |
6.6.11. |
Two-step micro-transfer technology 4 |
6.6.12. |
Micro-transfer using a stretchable film |
6.6.13. |
Micro-pick-and-place |
6.6.14. |
Photo-polymer mass transfer |
6.7. |
All-In-One Transfer |
6.7.1. |
All-in-one CMOS driving |
6.7.2. |
Pros and cons of all-in-one CMOS driving technique |
6.8. |
Heterogeneous Wafers |
6.8.1. |
Array integration |
6.8.2. |
Hybridization |
6.8.3. |
Wafer bonding process |
6.8.4. |
Hybridization integration structure |
6.8.5. |
Process flow of Silicon Display of Sharp |
6.8.6. |
Monolithic micro-LED array |
6.8.7. |
JBD's integration technology |
6.8.8. |
Device fabrication 1 |
6.8.9. |
Device fabrication 2 |
6.8.10. |
Device structure and architecture |
6.8.11. |
micro-LEDs for the JBD's micro-displays |
6.8.12. |
Process of fabricating monolithic micro-displays |
6.8.13. |
Novel approach for monolithic display fabrication |
6.8.14. |
Pros and cons of heterogeneous wafers |
6.8.15. |
Players on heterogeneous wafers |
6.9. |
Monolithic Integration |
6.9.1. |
Introduction to monolithic integration |
6.9.2. |
Lumiode approach |
6.9.3. |
Lumiode: Introduction |
6.9.4. |
Lumiode approach, process details |
6.9.5. |
Lumiode's micro-LED performance |
6.9.6. |
Lumiode's device performance |
6.9.7. |
Temperature performance for the crystallization |
6.9.8. |
Wafer from Lumiode |
6.9.9. |
Ostendo's approach |
6.9.10. |
Ostendo's QPI structure |
6.9.11. |
Introduction of EpiPix |
6.9.12. |
EpiPix's technique |
6.10. |
GaN on Silicon |
6.10.1. |
GaN-on-Si for various application markets |
6.10.2. |
GaN on silicon epi types |
6.10.3. |
Challenges of GaN-on-Silicon epitaxy |
6.10.4. |
Value propositions of GaN-on-Si 1 |
6.10.5. |
Value propositions of GaN-on-Si 2 |
6.10.6. |
GaN on sapphire vs on silicon |
6.10.7. |
GaN-on-Si approach |
6.10.8. |
Cost comparison: Sapphire vs silicon |
6.10.9. |
Is GaN-on-Si the ultimate option? |
6.10.10. |
Players working on GaN micro-LEDs on silicon |
6.10.11. |
LED manufacturing |
6.10.12. |
Pixel development |
6.10.13. |
RGB GaN on silicon |
6.11. |
Nanowires |
6.11.1. |
Comparison between 2D and 3D micro-LEDs |
6.11.2. |
GaN epitaxy on silicon substrate |
6.11.3. |
Aledia process flow |
6.11.4. |
Aledia's nanowire technology |
6.11.5. |
Front size device technology |
6.11.6. |
Nanowires growth on silicon substrate |
6.11.7. |
Size influence on nanowire's efficiency |
6.11.8. |
Native EL RGB nanowires |
6.11.9. |
3D technology for small-display applications |
6.11.10. |
Micro-display enabled by nanowires and 3D integration |
6.11.11. |
Future of nanowire approach |
6.12. |
Bonding and interconnection |
6.12.1. |
Classification |
6.12.2. |
Summary |
6.12.3. |
Wire bonding and flip chip bonding |
6.12.4. |
ACF bonding |
6.12.5. |
Interconnection by resin reflow |
6.12.6. |
Microtube interconnections |
6.12.7. |
Microtube fabrication |
6.12.8. |
Transfer and interconnection process by microtubes |
6.12.9. |
Interconnection options |
7. |
TESTING |
7.1. |
Challenges in inspection |
7.2. |
Testing techniques |
7.3. |
PL vs EL testing |
7.4. |
EL test by Tesoro Scientific 1 |
7.5. |
EL test by Tesoro Scientific 2 |
7.6. |
Camera-based microscopic imaging system |
7.7. |
Inspection solution by Toray 1 |
7.8. |
Inspection solution by Toray 2 |
7.9. |
Instrument System's solution |
7.10. |
PL+AOI |
7.11. |
TTPCON's solution |
7.12. |
Cathodoluminescence used for testing |
7.13. |
Hamamatsu Photonics' PL testing |
7.14. |
Trends of testing |
7.15. |
Inspection tool suppliers |
8. |
DEFECT MANAGEMENT |
8.1. |
Introduction |
8.2. |
Defect types |
8.3. |
Redundancy |
8.4. |
Repair 1 |
8.5. |
Repair 2 |
8.6. |
Laser micro trimming 1 |
8.7. |
Laser micro trimming 2 |
8.8. |
PlayNitride's SMAR Tech |
8.9. |
Defect compensation by QDs |
9. |
MICRO-LED DISPLAY FULL-COLOUR REALIZATION |
9.1.1. |
Strategies for full colour realization |
9.1.2. |
Direct RGB or color converters? |
9.1.3. |
RGB micro-LEDs vs blue micro-LED + QD 1 |
9.1.4. |
RGB micro-LEDs vs blue micro-LED + QD 2 |
9.1.5. |
UV LED approach |
9.1.6. |
Micro Nitride's technology |
9.2. |
Colour filters |
9.2.1. |
Colour filters |
9.2.2. |
Colour filter process flow: Black matrix process |
9.2.3. |
Colour filter process flow: RGB process 1 |
9.2.4. |
Colour filter process flow: RGB process 2 |
9.3. |
Stacked RGB MicroLEDs |
9.3.1. |
Introduction to stacked RGB microLEDs |
9.3.2. |
MIT's solution |
9.3.3. |
Seoul Viosys' contribution |
9.3.4. |
Lumens |
9.3.5. |
Innovision's efforts |
9.3.6. |
Sundiode |
9.3.7. |
Tsinghua University's research |
9.3.8. |
Youngwoo DSP |
9.3.9. |
KAIST |
9.3.10. |
Rayleigh Vision's innovation |
9.4. |
Three panel system |
9.4.1. |
Full colour realized by optical lens synthesis |
9.4.2. |
Full colour realization for projectors |
9.5. |
Do phosphors work for micro-LED displays? |
9.5.1. |
Introduction to phosphors 1 |
9.5.2. |
Introduction to phosphors 2 |
9.5.3. |
Requirements for phosphors in LEDs |
9.5.4. |
Table of phosphor materials |
9.5.5. |
Common and emerging red-emitting phosphors |
9.5.6. |
Search for narrow FWHM red phosphors |
9.5.7. |
Red phosphor options: TriGainTM from GE |
9.5.8. |
Reliability of TriGain |
9.5.9. |
Red phosphor options: Sr[LiAl3N4]:Eu2+ (SLA) red phosphor |
9.5.10. |
Commercial progress of GE's narrowband red phosphor |
9.5.11. |
Small sized PFS phosphor |
9.5.12. |
Value propositions of red KSF |
9.5.13. |
Evolution of KSF phosphors |
9.5.14. |
GE alternative red phosphors in development |
9.5.15. |
Thermal stability of common RGY phosphors |
9.5.16. |
Narrow-band green phosphor |
9.5.17. |
High performance organic phosphors |
9.5.18. |
Toray's organic colour conversion film |
9.5.19. |
Colour coverage of Toray's colour conversion films |
9.5.20. |
Stability of Toray's colour conversion films |
9.5.21. |
Response time feature of Toray's colour conversion films |
9.5.22. |
Suppliers of phosphors |
9.6. |
Quantum dot approach |
9.6.1. |
Introduction to quantum dots |
9.6.2. |
Quantum dot structure |
9.6.3. |
Value propositions of QDs in displays |
9.6.4. |
QD-based display types |
9.6.5. |
Photoluminescence of quantum dots |
9.6.6. |
Replacing phosphors with quantum dots |
9.6.7. |
Phosphors and quantum dots |
9.6.8. |
QDs vs phosphors: Particle size |
9.6.9. |
QDs vs phosphors: Response time |
9.6.10. |
QDs vs phosphors: Colour tunability |
9.6.11. |
QDs vs phosphors: Stability |
9.6.12. |
QDs vs phosphors: Absorption |
9.6.13. |
QDs vs phosphors: FWHM |
9.6.14. |
Summary: QDs vs phosphors |
9.6.15. |
Phosphor and QD in harmony |
9.6.16. |
Quantum dots used for micro-LED displays |
9.6.17. |
Using quantum dots as colour filter |
9.6.18. |
Basic requirements of QDs for micro-LED displays |
9.6.19. |
Disadvantages and challenges of QD color filters |
9.6.20. |
Trade-off between efficiency and leakage |
9.6.21. |
Efficiency drop and red shift |
9.6.22. |
Thickness of the QD layer for absorption |
9.6.23. |
Emission tails overlap |
9.6.24. |
High blue absorptive QD materials |
9.6.25. |
Display structure with QDs |
9.6.26. |
QD display pixel patterning techniques |
9.6.27. |
QD converters for µLED displays |
9.6.28. |
Ink-jet printed QD colour converters |
9.6.29. |
Pros and cons of ink-jet printing |
9.6.30. |
Photoresist approach |
9.6.31. |
Pros and cons of photolithography |
9.6.32. |
Full-colour emission of quantum-dot-based micro-LED display by aerosol jet technology |
9.6.33. |
Samsung's QNED |
9.6.34. |
Full colour realization by Sharp |
9.6.35. |
NPQD technology from Saphlux 1 |
9.6.36. |
NPQD technology from Saphlux 2 |
9.7. |
Quantum well approach |
9.7.1. |
Quantum wells |
9.7.2. |
Conclusions |
10. |
LIGHT MANAGEMENT |
10.1. |
Light management approach summary |
10.2. |
Layers to optimize current distribution for better light extraction |
10.3. |
InfiniLED's approach to increase light extraction efficiency 1 |
10.4. |
InfiniLED's approach to increase light extraction efficiency 2 |
10.5. |
Apple's approach |
10.6. |
Methods to capture light output |
10.7. |
Micro-catadioptric optical array for better directionality |
10.8. |
AM micro-LED with directional emission |
11. |
BACKPLANES AND DRIVING |
11.1. |
Backplane and driving options for Micro-LED displays |
11.2. |
Introduction to metal oxide semiconductor field-effect transistors |
11.3. |
Introduction to thin film transistors |
11.4. |
Introduction to complementary metal oxide semiconductor |
11.5. |
Introduction to backplane |
11.6. |
TFT materials |
11.7. |
Pixel driving for OLED |
11.8. |
LCD pixel structure |
11.9. |
TFT backplane |
11.10. |
Passive matrix addressing |
11.11. |
Passive driving structure |
11.12. |
Active matrix addressing |
11.13. |
Comparison between PM and AM addressing |
11.14. |
Transistor-micro-LED connection design |
11.15. |
Driving for micro-LEDs |
11.16. |
Pulse width modulation |
11.17. |
PAM vs PWM |
11.18. |
Driving voltage |
11.19. |
Driving vs. EQE |
11.20. |
RGB driver |
11.21. |
Active matrix micro-LEDs with LTPS TFT backplane |
11.22. |
Sony: Active matrix driving with micro IC |
11.23. |
Conclusion |
12. |
IMAGE QUALITY IMPROVEMENT, POWER CONSUMPTION REDUCTION AND OTHER DESIGNS |
12.1. |
Image Quality Improvement |
12.1.1. |
TFT-based image uniformity issues |
12.1.2. |
LED binning |
12.1.3. |
Drive design |
12.1.4. |
Optical compensation |
12.1.5. |
Drive compensation |
12.1.6. |
AUO's LTPS TFT driven micro-LED display 1 |
12.1.7. |
AUO's LTPS TFT driven micro-LED display 2 |
12.2. |
Power Consumption Reduction |
12.2.1. |
LED and TFT |
12.2.2. |
Drive mode optimization |
12.2.3. |
Backplane optimization |
13. |
MINI-LED DISPLAYS |
13.1. |
Mini-LED display configurations |
13.2. |
What kind of role is mini-LED playing? |
13.3. |
MiniLEDs, real hope for 2024 onward? |
13.4. |
Trends of Mini-LED displays |
14. |
PARTNERSHIPS, MERGES, ACQUISITIONS AND JOINT VENTURE |
14.1. |
Display cycle |
14.2. |
Benefits |
14.3. |
Meta & InfiniLED & Plessey |
14.4. |
Google & Raxium & Jasper Display |
14.5. |
Epistar & Leyard |
14.6. |
PlayNitride & RIT Display |
14.7. |
Konka & Chongqing Liangshan Industrial Investment, Konka & LianTronics |
14.8. |
BOE & Rohinni |
14.9. |
Lextar & X Display |
14.10. |
JDI & glō, Kyocera & glō |
14.11. |
Seoul Semiconductors & Viosys |
14.12. |
Kulicke & Soffa and Uniqarta |
14.13. |
Snap & Compound Photonics |