Summary

KEY FINDINGS
The Europe printed circuit board market is forecasted to progress with a CAGR of 3.67% during the projection period of 2024 to 2032. The region’s printed circuit board (PCB) market has experienced considerable evolution over the past decade, driven largely by the increasing demand for consumer electronic products.
MARKET INSIGHTS
Technological advancements, including the development of multilayer and hybrid PCBs, have significantly contributed to the market’s growth, as well, with PCB manufacturing in Europe supported by a robust network of key players. Moreover, the surge in the use of smartphones, tablets, personal computers, fixed-line telephones, and laptops has directly influenced the expansion of the Europe PCB market, as these boards are essential components in virtually all electronic devices.
REGIONAL ANALYSIS
The Europe printed circuit board market growth assessment includes the evaluation of the United Kingdom, Germany, France, Italy, Spain, Nordic Countries, and Rest of Europe. Printed circuit boards serve as the foundation for a vast array of electronic products, ranging from consumer electronics such as smartphones, laptops, televisions, and refrigerators to specialized commercial products, including data communication systems and computer servers. Aligning with this, the United Kingdom’s printed circuit board (PCB) market is significantly driven by a diverse landscape of mid-size and small-scale manufacturers. The continuous expansion of the electronics and IT sectors in the nation is further fueling this diversity.
In terms of electronic waste, the United Kingdom generates over 1.6 million tonnes of e-waste annually, with a substantial portion—764,000 tons—stemming from large household appliances and consumer electronics such as smartphones, laptops, and televisions. This waste, which includes hazardous and toxic components, poses significant environmental risks. In response, the United Kingdom has introduced various regulations aimed at minimizing waste from electrical and electronic equipment (WEEE) and promoting reuse and recycling. Furthermore, the Environment Agency of the UK also oversees the regulatory framework for electronic waste management.
On the other hand, similar to sectors such as aerospace, automotive, and medical, the consumer electronics market in France is rapidly evolving due to its extensive applications across different industries. For instance, in the defense sector, printed circuit boards (PCBs) are integral to radar monitoring and armored vehicle control systems, whereas in the medical sector, PCBs are employed in diagnostic equipment, including digital X-rays and dental devices. Additionally, in logistics, PCBs play a crucial role in GPS control. France, a leading manufacturer of advanced military weapons and fighter jets, relies on PCBs for specific tracking and security control systems essential to these applications. These factors, in turn, are positioned to play a pivotal role in augmenting the Europe printed circuit board market growth during the forecast period.
SEGMENTATION ANALYSIS
The Europe printed circuit board market is segmented into raw material, substrate, and application. The application segment includes communications, consumer electronics, industrial electronics, automotive, military, and other applications. Printed circuit boards (PCBs) play a critical role in various automotive applications and are essential for the proper functioning of systems such as ABS, GPS and navigation, and ECU systems.
Additionally, PCBs are used in power relays, remote controls, diagnostic systems, LED brake lights, security systems, engine timing and monitoring systems, among others. These enhance the reliability and performance of vehicles by supporting sensors and interconnecting all electronic components. The automotive PCB market’s notable growth is driven by increasing security features in vehicles and rising demand for additional automotive accessories. The segment’s expansion is further influenced by the rapid integration of electronic systems in vehicles, though the high cost of these components remains a significant growth restraint.
COMPETITIVE INSIGHTS
Key players operating in the Europe printed circuit board market are Daeduck Electronics, Epitome Components Ltd, HannStar Board Corporation, Ibiden Inc, etc.
Ibiden Inc, headquartered in Japan, specializes in the manufacture, design, and sale of electronic products. The company operates through subsidiaries across the United States, Austria, Hungary, France, the Netherlands, Mexico, Korea, Singapore, China, Malaysia, the Philippines, and Taiwan. Its product offerings include FVSS, e-flux, build-up substrates, build-up CSP, and flip-chip packages.
The company has invested significantly in research and development, with a strong focus on advancing technologies such as ultra-fine patterning, high-temperature sintering, and fine bump forming. Over the last two decades, Ibiden has been actively researching substrates, leveraging its expertise in fine bump forming and ultra-fine patterning technologies. The company maintains a strong presence globally, including in Europe and the United States.

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Table of Contents

TABLE OF CONTENTS
1. RESEARCH SCOPE & METHODOLOGY
1.1. STUDY OBJECTIVES
1.2. METHODOLOGY
1.3. ASSUMPTIONS & LIMITATIONS
2. EXECUTIVE SUMMARY
2.1. MARKET SIZE & ESTIMATES
2.2. MARKET OVERVIEW
2.3. SCOPE OF STUDY
2.4. CRISIS SCENARIO ANALYSIS
2.5. MAJOR MARKET FINDINGS
2.5.1. AUGMENTED DEMAND OF ECO-FRIENDLY PRINTED CIRCUIT BOARDS
2.5.2. INCREASING ADOPTION OF INDUSTRIAL AUTOMATION AND CONTROL SYSTEMS
3. MARKET DYNAMICS
3.1. KEY DRIVERS
3.1.1. RISING DEMAND FOR SMART ELECTRONICS
3.1.2. GROWING APPLICATIONS OF SEMICONDUCTORS
3.1.3. RISING USE OF ELECTRONICS IN DIVERSE APPLICATIONS
3.1.4. EXPLOSIVE RISE IN INTERNET USAGE
3.2. KEY RESTRAINTS
3.2.1. HIGH COMPETITION LEADS TO FALLING PRICES
3.2.2. VOLATILITY IN RAW MATERIAL PRICING
3.2.3. REGULATIONS ON E-WASTE
4. KEY ANALYTICS
4.1. KEY MARKET TRENDS
4.1.1. GROWING ADOPTION OF FLEXIBLE PRINTED CIRCUIT BOARDS
4.1.2. ADVANCEMENTS IN IOT AND AI INTEGRATION IN PCB DESIGN
4.1.3. EMERGENCE OF 3D PRINTED PCBS TO REVOLUTIONIZE MANUFACTURING
4.2. PORTER’S FIVE FORCES ANALYSIS
4.2.1. BUYERS POWER
4.2.2. SUPPLIERS POWER
4.2.3. SUBSTITUTIONS
4.2.4. NEW ENTRANTS
4.2.5. INDUSTRY RIVALRY
4.3. GROWTH PROSPECT MAPPING
4.4. MARKET MATURITY ANALYSIS
4.5. MARKET CONCENTRATION ANALYSIS
4.6. VALUE CHAIN ANALYSIS
4.6.1. RESIN & FIBER SUPPLIERS
4.6.2. LAMINATORS & MANUFACTURERS
4.6.3. DISTRIBUTORS AND RETAILERS
4.6.4. END-USERS
4.7. KEY BUYING CRITERIA
4.7.1. APPLICATION
4.7.2. RELIABILITY
4.7.3. COST
5. MARKET BY RAW MATERIAL
5.1. EPOXY RESIN
5.1.1. MARKET FORECAST FIGURE
5.1.2. SEGMENT ANALYSIS
5.2. GLASS FABRIC
5.2.1. MARKET FORECAST FIGURE
5.2.2. SEGMENT ANALYSIS
5.3. PHENOLIC RESIN
5.3.1. MARKET FORECAST FIGURE
5.3.2. SEGMENT ANALYSIS
5.4. KRAFT PAPER
5.4.1. MARKET FORECAST FIGURE
5.4.2. SEGMENT ANALYSIS
5.5. OTHER RAW MATERIALS
5.5.1. MARKET FORECAST FIGURE
5.5.2. SEGMENT ANALYSIS
6. MARKET BY SUBSTRATE
6.1. STANDARD MULTILAYER
6.1.1. MARKET FORECAST FIGURE
6.1.2. SEGMENT ANALYSIS
6.2. FLEXIBLE CIRCUITS
6.2.1. MARKET FORECAST FIGURE
6.2.2. SEGMENT ANALYSIS
6.3. HIGH-DENSITY INTERCONNECT (HDI)
6.3.1. MARKET FORECAST FIGURE
6.3.2. SEGMENT ANALYSIS
6.4. INTEGRATED CIRCUIT (ICS)
6.4.1. MARKET FORECAST FIGURE
6.4.2. SEGMENT ANALYSIS
6.5. RIGID 1-2 SIDED
6.5.1. MARKET FORECAST FIGURE
6.5.2. SEGMENT ANALYSIS
6.6. RIGID FLEX
6.6.1. MARKET FORECAST FIGURE
6.6.2. SEGMENT ANALYSIS
7. MARKET BY APPLICATION
7.1. COMMUNICATIONS
7.1.1. MARKET FORECAST FIGURE
7.1.2. SEGMENT ANALYSIS
7.2. CONSUMER ELECTRONICS
7.2.1. MARKET FORECAST FIGURE
7.2.2. SEGMENT ANALYSIS
7.3. INDUSTRIAL ELECTRONICS
7.3.1. MARKET FORECAST FIGURE
7.3.2. SEGMENT ANALYSIS
7.4. AUTOMOTIVE
7.4.1. MARKET FORECAST FIGURE
7.4.2. SEGMENT ANALYSIS
7.5. MILITARY
7.5.1. MARKET FORECAST FIGURE
7.5.2. SEGMENT ANALYSIS
7.6. OTHER APPLICATIONS
7.6.1. MARKET FORECAST FIGURE
7.6.2. SEGMENT ANALYSIS
8. GEOGRAPHICAL ANALYSIS
8.1. EUROPE
8.1.1. MARKET SIZE & ESTIMATES
8.1.2. EUROPE PRINTED CIRCUIT BOARD MARKET DRIVERS
8.1.3. EUROPE PRINTED CIRCUIT BOARD MARKET CHALLENGES
8.1.4. KEY PLAYERS IN EUROPE PRINTED CIRCUIT BOARD MARKET
8.1.5. COUNTRY ANALYSIS
8.1.5.1. UNITED KINGDOM
8.1.5.1.1. UNITED KINGDOM PRINTED CIRCUIT BOARD MARKET SIZE & OPPORTUNITIES
8.1.5.2. GERMANY
8.1.5.2.1. GERMANY PRINTED CIRCUIT BOARD MARKET SIZE & OPPORTUNITIES
8.1.5.3. FRANCE
8.1.5.3.1. FRANCE PRINTED CIRCUIT BOARD MARKET SIZE & OPPORTUNITIES
8.1.5.4. ITALY
8.1.5.4.1. ITALY PRINTED CIRCUIT BOARD MARKET SIZE & OPPORTUNITIES
8.1.5.5. SPAIN
8.1.5.5.1. SPAIN PRINTED CIRCUIT BOARD MARKET SIZE & OPPORTUNITIES
8.1.5.6. NORDIC COUNTRIES
8.1.5.6.1. NORDIC COUNTRIES PRINTED CIRCUIT BOARD MARKET SIZE & OPPORTUNITIES
8.1.5.7. REST OF EUROPE
8.1.5.7.1. REST OF EUROPE PRINTED CIRCUIT BOARD MARKET SIZE & OPPORTUNITIES
9. COMPETITIVE LANDSCAPE
9.1. KEY STRATEGIC DEVELOPMENTS
9.1.1. MERGERS & ACQUISITIONS
9.1.2. PARTNERSHIPS & AGREEMENTS
9.1.3. BUSINESS EXPANSIONS & DIVESTITURES
9.2. COMPANY PROFILES
9.2.1. ASCENT CIRCUIT PRIVATE LIMITED
9.2.1.1. COMPANY OVERVIEW
9.2.1.2. PRODUCTS
9.2.1.3. STRENGTHS & CHALLENGES
9.2.2. AT&S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)
9.2.2.1. COMPANY OVERVIEW
9.2.2.2. PRODUCTS
9.2.2.3. STRENGTHS & CHALLENGES
9.2.3. COMPEQ LTD
9.2.3.1. COMPANY OVERVIEW
9.2.3.2. PRODUCTS
9.2.3.3. STRENGTHS & CHALLENGES
9.2.4. DAEDUCK ELECTRONICS
9.2.4.1. COMPANY OVERVIEW
9.2.4.2. PRODUCTS
9.2.4.3. STRENGTHS & CHALLENGES
9.2.5. EPITOME COMPONENTS LTD
9.2.5.1. COMPANY OVERVIEW
9.2.5.2. PRODUCTS
9.2.5.3. STRENGTHS & CHALLENGES
9.2.6. HANNSTAR BOARD CORPORATION
9.2.6.1. COMPANY OVERVIEW
9.2.6.2. KEY COMPANY DETAILS
9.2.6.3. PRODUCTS
9.2.6.4. STRENGTHS & CHALLENGES
9.2.7. IBIDEN INC
9.2.7.1. COMPANY OVERVIEW
9.2.7.2. PRODUCTS
9.2.7.3. STRENGTHS & CHALLENGES
9.2.8. ISU PETASYS
9.2.8.1. COMPANY OVERVIEW
9.2.8.2. PRODUCTS
9.2.8.3. STRENGTHS & CHALLENGES
9.2.9. NAN YA PCB CORPORATION
9.2.9.1. COMPANY OVERVIEW
9.2.9.2. PRODUCTS
9.2.9.3. STRENGTHS & CHALLENGES
9.2.10. NIPPON MEKTRON LTD
9.2.10.1. COMPANY OVERVIEW
9.2.10.2. PRODUCTS
9.2.10.3. STRENGTHS & CHALLENGES
9.2.11. OKI PRINTED CIRCUITS CO LTD
9.2.11.1. COMPANY OVERVIEW
9.2.11.2. PRODUCTS
9.2.11.3. STRENGTHS & CHALLENGES
9.2.12. SAMSUNG ELECTRONICS INC
9.2.12.1. COMPANY OVERVIEW
9.2.12.2. PRODUCTS
9.2.12.3. STRENGTHS & CHALLENGES
9.2.13. SHENNAN CIRCUITS
9.2.13.1. COMPANY OVERVIEW
9.2.13.2. PRODUCTS
9.2.13.3. STRENGTHS & CHALLENGES
9.2.14. TRIPOD TECHNOLOGY CORPORATION
9.2.14.1. COMPANY OVERVIEW
9.2.14.2. PRODUCTS
9.2.14.3. STRENGTHS & CHALLENGES
9.2.15. TTM TECHNOLOGIES
9.2.15.1. COMPANY OVERVIEW
9.2.15.2. PRODUCTS
9.2.15.3. STRENGTHS & CHALLENGES
9.2.16. UNIMICRON TECHNOLOGY CORP
9.2.16.1. COMPANY OVERVIEW
9.2.16.2. PRODUCTS
9.2.16.3. STRENGTHS & CHALLENGES
9.2.17. YOUNG POONG ELECTRONICS CO LTD
9.2.17.1. COMPANY OVERVIEW
9.2.17.2. PRODUCTS
9.2.17.3. STRENGTHS & CHALLENGES
9.2.18. ZHEN DING TECHNOLOGY HOLDING LTD
9.2.18.1. COMPANY OVERVIEW
9.2.18.2. PRODUCTS
9.2.18.3. STRENGTHS & CHALLENGES