Summary

KEY FINDINGS
The China printed circuit board market is estimated to prosper at a CAGR of 5.32% over the forecast period of 2024-2032. The base year regarded for the studied market is 2023, and the forecasting years are from 2024 to 2032.
MARKET INSIGHTS
The China printed circuit board industry is experiencing robust growth driven by the rising use of electronics across a variety of applications. As electronic devices become increasingly integral to daily life, their applications expand into diverse sectors, including automotive, healthcare, and consumer electronics. This widespread adoption fuels the demand for printed circuit boards (PCBs) that can support the advanced functionalities of modern electronics. Consequently, manufacturers are focusing on developing PCBs that cater to these varied needs, enhancing performance and reliability.
Additionally, the explosive rise in internet usage is a major factor contributing to the growth of the PCB market in China. The proliferation of internet-connected devices, from smartphones and tablets to smart home systems, requires high-performance PCBs to ensure seamless connectivity and data transfer. The surge in internet usage accelerates the need for PCBs that can handle increased data volumes and complex connectivity requirements, driving innovation and production within the industry.
However, the market faces challenges such as volatility in raw material pricing. Fluctuations in the costs of key materials used in PCB manufacturing, such as copper and various polymers, can impact overall production costs and pricing stability. This volatility necessitates that manufacturers adopt strategies to manage and mitigate the effects of price changes on their operations.
Regulations on e-waste also pose a challenge for the PCB market in China. As environmental concerns intensify, stricter regulations are being implemented to manage and reduce electronic waste. These regulations require manufacturers to adopt more sustainable practices and develop eco-friendly PCBs, which can increase production complexity and costs. Compliance with these regulations is essential for maintaining market access and meeting environmental standards.
On the positive side, there is a growing adoption of flexible printed circuit boards in China. Flexible PCBs offer significant advantages, including their ability to bend and conform to various shapes, which is ideal for modern electronic devices that demand compact and adaptable designs. This trend is leading to increased investment in the development and production of flexible PCBs, enhancing their availability and applications across different sectors.
Advancements in IoT and AI integration in PCB design are also shaping the market landscape. The integration of Internet of Things (IoT) and artificial intelligence (AI) technologies into PCB design enhances the capabilities and functionality of electronic devices. By incorporating these advanced technologies, manufacturers can create more intelligent and responsive PCBs that meet the evolving demands of modern electronics, driving further growth and innovation in the sector.
SEGMENTATION ANALYSIS
The China printed circuit board market segmentation incorporates the market by raw material, substrate, and application. The raw material segment is further segregated into epoxy resin, glass fabric, phenolic resin, kraft paper, and other raw materials. Epoxy resins play a crucial role in over-molding integrated circuits, transistors, and hybrid circuits, as well as in the manufacturing of printed circuit boards (PCBs). These resins provide essential insulation and protection for electronic components and PCBs, shielding them from harsh environmental conditions such as vibration, thermal or physical shock, moisture, and general pollution. By encapsulating electronic devices, epoxy resins create a robust barrier against these challenges, enhancing performance and reliability under demanding conditions.
Kraft paper, also known as cellulose paper, is primarily used in the lamination process for printed circuit boards (PCBs). Its roles include heat preservation, pressure relief, heat transfer management, and decompression during circuit board production. Traditionally, Kraft paper has been used in various laminates, including FR-1, FR-2, and FR-3, which are based on this type of paper.
Moreover, kraft paper, made from chemical pulp, is valued for its cost-effectiveness and mechanical strength. In PCB manufacturing, it serves as a thermal lagging sheet positioned outside the multilayer PCB stack to reduce heat transfer from the platens and manage temperature increases during the heating process. Its benefits include controlling the rate of prepreg rise during critical stages, ensuring uniform heating across the platen, and achieving consistent lamination thickness. The growing electronic manufacturing sector drives the demand for Kraft paper, as it plays a crucial role in the lamination of PCBs, with significant growth expected in electronic product manufacturing in the coming years.
COMPETITIVE INSIGHTS
Some of the leading players in the China printed circuit board market include Daeduck Electronics, HannStar Board Corporation, Samsung Electronics Inc, TTM Technologies, etc.
HannStar Board Corp (HSB) is a prominent electronics manufacturer specializing in printed circuit boards (PCBs). The company produces PCBs for a wide range of applications, including computers, peripherals, cellular phones, networking equipment, telecom systems, game consoles, set-top boxes, televisions, and printers. HSB’s products are utilized in various fields, such as mobile phones, PDAs, notebooks, access servers, data storage solutions, and automotive systems. Operating across Taiwan, Hong Kong, the British Virgin Islands, the Cayman Islands, and Samoa, HSB is headquartered in Taoyuan, Taiwan.

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Table of Contents

TABLE OF CONTENTS
1. RESEARCH SCOPE & METHODOLOGY
1.1. STUDY OBJECTIVES
1.2. METHODOLOGY
1.3. ASSUMPTIONS & LIMITATIONS
2. EXECUTIVE SUMMARY
2.1. MARKET SIZE & ESTIMATES
2.2. COUNTRY SNAPSHOT
2.3. COUNTRY ANALYSIS
2.4. SCOPE OF STUDY
2.5. CRISIS SCENARIO ANALYSIS
2.6. MAJOR MARKET FINDINGS
2.6.1. AUGMENTED DEMAND OF ECO-FRIENDLY PRINTED CIRCUIT BOARDS
2.6.2. INCREASING ADOPTION OF INDUSTRIAL AUTOMATION AND CONTROL SYSTEMS
3. MARKET DYNAMICS
3.1. KEY DRIVERS
3.1.1. RISING DEMAND FOR SMART ELECTRONICS
3.1.2. GROWING APPLICATIONS OF SEMICONDUCTORS
3.1.3. RISING USE OF ELECTRONICS IN DIVERSE APPLICATIONS
3.1.4. EXPLOSIVE RISE IN INTERNET USAGE
3.2. KEY RESTRAINTS
3.2.1. HIGH COMPETITION LEADS TO FALLING PRICES
3.2.2. VOLATILITY IN RAW MATERIAL PRICING
3.2.3. REGULATIONS ON E-WASTE
4. KEY ANALYTICS
4.1. KEY MARKET TRENDS
4.1.1. GROWING ADOPTION OF FLEXIBLE PRINTED CIRCUIT BOARDS
4.1.2. ADVANCEMENTS IN IOT AND AI INTEGRATION IN PCB DESIGN
4.1.3. EMERGENCE OF 3D PRINTED PCBS TO REVOLUTIONIZE MANUFACTURING
4.2. PESTLE ANALYSIS
4.2.1. POLITICAL
4.2.2. ECONOMICAL
4.2.3. SOCIAL
4.2.4. TECHNOLOGICAL
4.2.5. LEGAL
4.2.6. ENVIRONMENTAL
4.3. PORTER’S FIVE FORCES ANALYSIS
4.3.1. BUYERS POWER
4.3.2. SUPPLIERS POWER
4.3.3. SUBSTITUTION
4.3.4. NEW ENTRANTS
4.3.5. INDUSTRY RIVALRY
4.4. GROWTH PROSPECT MAPPING
4.5. MARKET MATURITY ANALYSIS
4.6. MARKET CONCENTRATION ANALYSIS
4.7. VALUE CHAIN ANALYSIS
4.7.1. RESIN & FIBER SUPPLIERS
4.7.2. LAMINATORS & MANUFACTURERS
4.7.3. DISTRIBUTORS AND RETAILERS
4.7.4. END-USERS
4.8. KEY BUYING CRITERIA
4.8.1. APPLICATION
4.8.2. RELIABILITY
4.8.3. COST
5. MARKET BY RAW MATERIAL
5.1. EPOXY RESIN
5.1.1. MARKET FORECAST FIGURE
5.1.2. SEGMENT ANALYSIS
5.2. GLASS FABRIC
5.2.1. MARKET FORECAST FIGURE
5.2.2. SEGMENT ANALYSIS
5.3. PHENOLIC RESIN
5.3.1. MARKET FORECAST FIGURE
5.3.2. SEGMENT ANALYSIS
5.4. KRAFT PAPER
5.4.1. MARKET FORECAST FIGURE
5.4.2. SEGMENT ANALYSIS
5.5. OTHER RAW MATERIALS
5.5.1. MARKET FORECAST FIGURE
5.5.2. SEGMENT ANALYSIS
6. MARKET BY SUBSTRATE
6.1. STANDARD MULTILAYER
6.1.1. MARKET FORECAST FIGURE
6.1.2. SEGMENT ANALYSIS
6.2. FLEXIBLE CIRCUITS
6.2.1. MARKET FORECAST FIGURE
6.2.2. SEGMENT ANALYSIS
6.3. HIGH-DENSITY INTERCONNECT (HDI)
6.3.1. MARKET FORECAST FIGURE
6.3.2. SEGMENT ANALYSIS
6.4. INTEGRATED CIRCUITS (ICS)
6.4.1. MARKET FORECAST FIGURE
6.4.2. SEGMENT ANALYSIS
6.5. RIGID 1-2 SIDED
6.5.1. MARKET FORECAST FIGURE
6.5.2. SEGMENT ANALYSIS
6.6. RIGID FLEX
6.6.1. MARKET FORECAST FIGURE
6.6.2. SEGMENT ANALYSIS
7. MARKET BY APPLICATION
7.1. COMMUNICATIONS
7.1.1. MARKET FORECAST FIGURE
7.1.2. SEGMENT ANALYSIS
7.2. CONSUMER ELECTRONICS
7.2.1. MARKET FORECAST FIGURE
7.2.2. SEGMENT ANALYSIS
7.3. INDUSTRIAL ELECTRONICS
7.3.1. MARKET FORECAST FIGURE
7.3.2. SEGMENT ANALYSIS
7.4. AUTOMOTIVE
7.4.1. MARKET FORECAST FIGURE
7.4.2. SEGMENT ANALYSIS
7.5. MILITARY
7.5.1. MARKET FORECAST FIGURE
7.5.2. SEGMENT ANALYSIS
7.6. OTHER APPLICATIONS
7.6.1. MARKET FORECAST FIGURE
7.6.2. SEGMENT ANALYSIS
8. COMPETITIVE LANDSCAPE
8.1. KEY STRATEGIC DEVELOPMENTS
8.1.1. MERGERS & ACQUISITIONS
8.1.2. PARTNERSHIPS & AGREEMENTS
8.1.3. BUSINESS EXPANSIONS & DIVESTITURES
8.2. COMPANY PROFILES
8.2.1. ASCENT CIRCUIT PRIVATE LIMITED
8.2.1.1. COMPANY OVERVIEW
8.2.1.2. PRODUCTS
8.2.1.3. STRENGTHS & CHALLENGES
8.2.2. AT&S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)
8.2.2.1. COMPANY OVERVIEW
8.2.2.2. PRODUCTS
8.2.2.3. STRENGTHS & CHALLENGES
8.2.3. COMPEQ LTD
8.2.3.1. COMPANY OVERVIEW
8.2.3.2. PRODUCTS
8.2.3.3. STRENGTHS & CHALLENGES
8.2.4. DAEDUCK ELECTRONICS
8.2.4.1. COMPANY OVERVIEW
8.2.4.2. PRODUCTS
8.2.4.3. STRENGTHS & CHALLENGES
8.2.5. HANNSTAR BOARD CORPORATION
8.2.5.1. COMPANY OVERVIEW
8.2.5.2. KEY COMPANY DETAILS
8.2.5.3. PRODUCTS
8.2.5.4. STRENGTHS & CHALLENGES
8.2.6. SAMSUNG ELECTRONICS INC
8.2.6.1. COMPANY OVERVIEW
8.2.6.2. PRODUCTS
8.2.6.3. STRENGTHS & CHALLENGES
8.2.7. TTM TECHNOLOGIES
8.2.7.1. COMPANY OVERVIEW
8.2.7.2. PRODUCTS
8.2.7.3. STRENGTHS & CHALLENGES