Summary
Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. This report examines the market for flip chip ICs by device application, and the lithography and wet etch tools used in their manufacture.
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Table of Contents
Chapter 1 Introduction 1-1
Chapter 2 Executive Summary 2-1
Chapter 3 Flip Chip/WLP Issues and Trends 3-1
3.1 Introduction 3-1
3.2 Wafer Bumping 3-6
3.2.1 Solder Bumps 3-7
3.2.1.1 Metallurgy 3-7
3.2.1.2 Deposition Of UBM 3-11
3.2.1.3 Sputter Etching 3-12
3.2.1.4 Photolithography 3-13
3.2.1.5 Solder Deposition 3-14
3.2.1.6 Resist Strip 3-15
3.2.1.7 UBM Wet Etch 3-16
3.2.1.8 Reflow 3-16
3.2.1.9 Flux Issues 3-18
3.2.2 Gold Bumps 3-19
3.2.2.1 Bump Processing 3-19
3.2.2.2 Bonding 3-21
3.2.2.3 Coplanarity 3-25
3.2.2.4 Conductivity 3-26
3.2.2.5 Thermal Properties 3-26
3.2.2.6 Size 3-27
3.2.2.7 Reliability 3-27
3.2.2.8 Cost Issues 3-28
3.2.3 Copper Pillar Bumps 3-31
3.2.4 Copper Stud Bumping 3-35
3.2.5 C4NP 3-40
3.3 Wafer Level Packaging 3-46
3.4 Pad Redistribution 3-57
3.5 Wafer Bumping Costs 3-61
3.5.1 Wafer Redistribution And Wafer Bumping Costs 3-62
3.5.2 WLCSP Hidden Costs 3-63
3.5.3 WLCSP Cost Per Good Die 3-64
3.5.4 Wafer-Level Underfill Costs 3-65
3.6 Panel Level Packaging 3-70
Chapter 4 Lithography Issues And Trends 4-1
4.1 Issues 4-1
4.1.1 Technical Performance 4-2
4.1.2 Capital Investment 4-2
4.1.3 Cost Of Consumables 4-2
4.1.4 Throughput 4-2
4.1.5 Ease Of Use 4-3
4.1.6 Flexibility 4-3
4.1.7 Equipment Support 4-3
4.1.8 Resolution 4-3
4.1.9 Solder Bumping Capabilities 4-4
4.1.10 Gold Bumping Capabilities 4-5
4.2 Exposure Systems 4-6
4.2.1 Introduction 4-6
4.2.1.1 Reduction Steppers 4.6
4.2.1.2 Full-Field Projection 4-8
4.2.1.3 Mask Aligners 4-13
4.2.1.4 1X Steppers 4-13
4.2.1.5 2X Steppers 4-14
4.3 Competitive Technologies 4-16
4.3.1 Inkjet Printing 4-16
4.3.2 Stencil/Screen Printing 4-18
4.3.3 Electroless Metal Deposition 4-22
Chapter 5 UBM Etch Issues And Trends 5-1
5.1 Introduction 5-1
5.2 Technology Issues And Trends 5-2
5.2.1 Process Flow 5-2
5.2.2 Etch Process 5-4
5.2.3 Etch Chemistry 5-8
5.3 Batch Versus Single-Wafer Etching 5-16
Chapter 6 Metallization Issues and Trends 6-1
6.1 Introduction 6-1
6.2 Sputtering Metallization 6-3
6.2.1 Gold Bump 6-3
6.2.2 Solder Bumping 6-4
6.2.2.1 T I / Cu and TiW / Cu 6-5
6.2.2.2 Al / NiV / Cu 6-5
6.2.2.3 T i / N i (V) and TiW / Ni ( V ) 6-6
6.2.2.4 Cr / Cr-Cu / Cu 6-6
6.2.3 Copper Bumping 6-7
6.3 Electrodeposition 6-9
Chapter 7 Market Analysis 7-1
7.1 Market Drivers For Flip Chip And WLP 7-1
7.2 Market Opportunities 7-2
7.3 Challenges 7-6
7.4 Flip Chip Market 7-7
7.4.1 Market Dynamics 7-7
7.4.2 Market Forecast 7-15
7.5 Lithography Market 7-24
7.5.1 Aligners Vs. Steppers 7-24
7.5.2 Market Analysis 7-25
7.6 Deposition Market 7-33
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List of Tables/Graphs
List of Tables
3.1 Common UBM Stacks For Solder And Gold Bumping 3-8
3.2 Solder Bumping Guidelines 3-10
3.3 Gold Bumping Guidelines 3-24
3.4 Copper Bumping Guidelines 3-34
3.5 Comparison Of Solder Bumping Processes 3-43
3.6 ITRS Pin Counts For Different Applications 3-47
3.7 Pillar-WLP CSP Guidelines 3-52
3.8 Pad Redistribution Guidelines 3-59
4.1 Key Challenges For WLP Lithography 4-12
4.2 Lithography Tools By Vendor 4-15
5.1 UBM Film Etchants 5-10
5.2 Advantages Of Spin Processing 5-19
6.1 Common UBM Stacks For Gold And Solder Bumping 6-2
7.1 WLP Demand by Device (Units) 7-20
7.2 WLP Demand by Device (Wafers) 7-21
7.3 Worldwide Lithography Forecast 7-24
7.4 Cost Of Ownership Of 1x Versus 2x Steppers 7-32
7.5 Worldwide Forecast For Deposition Tools 7-34
List of Figures
3.1 C4 Chip Connections 3-3
3.2 Wafer Bump Technology Roadmap 3-4
3.3 Comparison Of Copper Pillar, Flip Chip, And WLP 3-5
3.4 Solder Bumping Process 3-9
3.5 Three Process Flows For Solder Bumping 3-17
3.6 Gold Bumping Process 3-23
3.7 Cost Per Gold Bumped Wafer 3-29
3.8 Copper Stud Bump 3-36
3.9 Breakdown Of Stud Bumping Costs 3-39
3.10 C4NP Process Description 3-41
3.11 Pillar-WLPCSP Process 3-51
3.12 Pad Redistribution Process 3-58
4.1 Laser-Projection Imaging 4-10
4.2 Solder Jet Technology 4-17
4.3 Principle Of Screen Printing 4-20
4.4 Principle Of Inkjet Printing 4-21
4.5 Electroless Under Bump Metallization 4-23
5.1 Electroplated Solder Bumping Process 5-3
7.1 WLP Applications 7-3
7.2 Wire Bond versus Flip Chip 7-11
7.3 Flip Chip and Wire Bond Equipment Forecast 7-13
7.4 Growth in Copper Wire Bonding 7-14
7.5 Flip Chip Market By Number of Devices 7-16
7.6 Flip Chip Market By Number of Wafers 7-17
7.7 WLP Market by Device - 2014 7-18
7.8 WLP Market by Device - 2020 7-19
7.9 Device Shipment Forecast WLP Vs Flip Chip 7-23
7.10 Device Shipment Forecast FIWLP Vs FOWLP 7-24
7.11 Historic Lithography Market Shares 7-27
7.12 Lithography Market Share Growth 7-29
7.13 ECD Market Shares 7-35
7-14 Sputtering Market Shares 7-36