Summary

The volume of electronics will continues to increase and the use of raw materials in the sector is expected to double by 2050. The amount of electronic waste has also almost doubled over the two decades and it is estimated that only 20% of this waste is collected efficiently. With over 55 million tonnes of electronic waste produced every year, the risk of harm to human and animal health as well as the environment is substantial. There is also considerable value squandered in discarded electronics. It is estimated that $60 billion worth of raw materials are lost every year as precious metals and re-useable materials are disposed of in landfill or incinerated. The use of plastics in electronics devices has significant environmental issues owing to poor biodegradability and additional cost for disposal after use. It is therefore essential to find an eco-friendly and biodegradable substrate.

Sustainable electronics and semiconductor manufacturing seeks to develop electronics products through economically-sound processes that minimize negative environmental impacts while conserving energy and natural resources. The goal is to make the lifecycle of electronic products more sustainable through energy efficiency, reducing waste, using recycled and non-toxic materials, and other eco-friendly practices. Key principles of sustainable electronics manufacturing include:

• Energy efficiency:  Reducing energy consumption in production processes through technology, automation, and optimized practices.
• Renewable energy:  Utilization of renewable energy sources like solar, wind, and geothermal to power manufacturing facilities.
• Waste reduction:  Minimizing waste generation through improved materials utilization, recycling, and re-use.
• Emissions reduction:  Lowering air emissions, water discharges, and carbon footprint through abatement technologies and greener chemistries.
• Resource conservation:  Optimizing use of natural resources like water, minerals, and forestry through efficiency, closed-loop systems, and product circularity.
• Eco-design- Designing products that are energy efficient, durable, non-toxic and recyclable.
• Supply chain sustainability:  Managing social and environmental impacts across the entire supply chain lifecycle; procurement and logistics to reduce environmental impact

The Global Market for Sustainable Electronics and Semiconductor Manufacturing 2025-2035 offers an in-depth analysis of the sustainable electronics landscape, providing strategic insights for businesses, investors, and technology leaders seeking to navigate the complex intersection of technological advancement and environmental responsibility. Report contents include:

• Analysis of global PCB and integrated circuit (IC) revenues
• Emerging sustainable technologies and market trends
• Advanced digital manufacturing techniques
• Renewable energy integration
• Innovative materials development
• Circular economy strategies in electronics production
• Sustainability Drivers and Challenges
  • Environmental impact mitigation
  • Regulatory compliance
  • Resource efficiency
  • Waste reduction strategies
• Sustainable Manufacturing Processes
  • Closed-loop manufacturing models
  • Advanced robotics and automation
  • AI and machine learning analytics
  • Internet of Things (IoT) integration
  • Additive manufacturing techniques
• Material Innovation
  • Bio-based materials
  • Recycled and advanced chemical recycling approaches
  • Biodegradable substrates
  • Green and lead-free soldering technologies
  • Sustainable substrate development
• Semiconductor and PCB Transformation
  • Sustainable integrated circuit manufacturing
  • Flexible and printed electronics
  • Eco-friendly patterning and metallization
  • Advanced oxidation methods
  • Water management in semiconductor production
• Market Projections and Revenue Analysis
  • Global PCB manufacturing (2018-2035)
  • Sustainable PCB market segments
  • Sustainable integrated circuit revenues
  • Substrate type market penetration
• Company Profiles. In-depth analyses of 50+ companies providing green materials, equipment, and manufacturing services. Companies profiled include DP Patterning, Elephantech, Infineon Technologies, Jiva Materials, Samsung, Syenta, and Tactotek. Additional information on bio-based battery, conductive ink, green & lead-free solder and halogen-free FR4, data center sustainability companies.
• Data Center Sustainability
• Green Energy Solutions
• Carbon Reduction Strategies
• Recycling Technologies
• End-of-Life Electronics Management
• Regulatory and Certification Landscape
  • Global sustainability regulations
  • Emerging certification standards
  • Compliance strategies for electronics manufacturers

The Global Market for Sustainable Electronics and Semiconductor Manufacturing 2025-2035 provides a strategic roadmap for technological transformation. As the world increasingly demands environmentally responsible technology solutions, this report provides the critical insights needed to lead, innovate, and succeed in the sustainable electronics ecosystem.

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Table of Contents

1 INTRODUCTION 16

1.1 Sustainable electronics & semiconductor manufacturing 16
1.2 Drivers for sustainable electronics 17
1.3 Environmental Impacts of Electronics Manufacturing 18
1.3.1 E-Waste Generation 18
1.3.2 Carbon Emissions 18
1.3.3 Resource Utilization 19
1.3.4 Waste Minimization 19
1.3.5 Supply Chain Impacts 20
1.4 New opportunities from sustainable electronics 20
1.5 Regulations 21
1.5.1 Certifications 22
1.6 Powering sustainable electronics (Bio-based batteries) 22
1.7 Bioplastics in injection moulded electronics parts 23

2 SUSTAINABLE ELECTRONICS & SEMICONDUCTORS MANUFACTURING 25

2.1 Conventional electronics manufacturing 25
2.2 Benefits of Sustainable Electronics manufacturing 25
2.3 Challenges in adopting Sustainable Electronics manufacturing 26
2.4 Approaches 27
2.4.1 Closed-Loop Manufacturing 27
2.4.2 Digital Manufacturing 27
2.4.2.1 Advanced robotics & automation 27
2.4.2.2 AI & machine learning analytics 28
2.4.2.3 Internet of Things (IoT) 28
2.4.2.4 Additive manufacturing 28
2.4.2.5 Virtual prototyping 28
2.4.2.6 Blockchain-enabled supply chain traceability 28
2.4.3 Renewable Energy Usage 29
2.4.4 Energy Efficiency 30
2.4.5 Materials Efficiency 31
2.4.6 Sustainable Chemistry 31
2.4.7 Recycled Materials 32
2.4.7.1 Advanced chemical recycling 33
2.4.8 Bio-Based Materials 36
2.5 Greening the Supply Chain 38
2.5.1 Key focus areas 39
2.5.2 Sustainability activities from major electronics brands 42
2.5.3 Key challenges 42
2.5.4 Use of digital technologies 42

3 SUSTAINABLE PRINTED CIRCUIT BOARD (PCB) MANUFACTURING 44

3.1 Conventional PCB manufacturing 44
3.2 Trends in PCBs 45
3.2.1 High-Speed PCBs 45
3.2.2 Flexible PCBs 45
3.2.3 3D Printed PCBs 46
3.2.4 Sustainable PCBs 47
3.3 Reconciling sustainability with performance 47
3.4 Sustainable supply chains 48
3.5 Sustainability in PCB manufacturing 49
3.5.1 Sustainable cleaning of PCBs 49
3.6 Design of PCBs for sustainability 50
3.6.1 Rigid 52
3.6.2 Flexible 52
3.6.3 Additive manufacturing 53
3.6.4 In-mold elctronics (IME) 54
3.7 Materials 55
3.7.1 Low-energy epoxy resins 55
3.7.2 Metal cores 55
3.7.3 Recycled laminates 55
3.7.4 Conductive inks 55
3.7.5 Green and lead-free solder 57
3.7.6 Biodegradable substrates 58
3.7.6.1 Bacterial Cellulose 58
3.7.6.2 Mycelium 60
3.7.6.3 Lignin 61
3.7.6.4 Cellulose Nanofibers 63
3.7.6.5 Soy Protein 66
3.7.6.6 Algae 66
3.7.6.7 PHAs 67
3.7.7 Biobased inks 68
3.8 Substrates 68
3.8.1 Halogen-free FR4 68
3.8.1.1 FR4 limitations 68
3.8.1.2 FR4 alternatives 69
3.8.1.3 Bio-Polyimide 70
3.8.2 Glass substrates 71
3.8.3 Ceramic substrates 71
3.8.4 Metal-core PCBs 72
3.8.5 Biobased PCBs 72
3.8.5.1 Polylactic acid 73
3.8.5.2 Lignin-based Polymers 73
3.8.5.3 Cellulose Composites 73
3.8.5.4 Polyhydroxyalkanoates (PHA) 73
3.8.5.5 Starch Blends 74
3.8.5.6 Challenges 74
3.8.5.7 Flexible (bio) polyimide PCBs 74
3.8.5.8 Recent commercial activity 75
3.8.6 Paper-based PCBs 76
3.8.7 PCBs without solder mask 76
3.8.8 Thinner dielectrics 77
3.8.9 Recycled plastic substrates 77
3.8.10 Flexible substrates 77
3.8.11 Polyimide alternatives 77
3.9 Sustainable patterning and metallization in electronics manufacturing 79
3.9.1 Introduction 79
3.9.2 Issues with sustainability 79
3.9.3 Regeneration and reuse of etching chemicals 80
3.9.4 Transition from Wet to Dry phase patterning 81
3.9.5 Print-and-plate 81
3.9.6 Approaches 82
3.9.6.1 Direct Printed Electronics 82
3.9.6.2 Photonic Sintering 83
3.9.6.3 Biometallization 84
3.9.6.4 Plating Resist Alternatives 84
3.9.6.5 Laser-Induced Forward Transfer 85
3.9.6.6 Electrohydrodynamic Printing 87
3.9.6.7 Electrically conductive adhesives (ECAs 87
3.9.6.8 Green electroless plating 88
3.9.6.9 Smart Masking 89
3.9.6.10 Component Integration 89
3.9.6.11 Bio-inspired material deposition 90
3.9.6.12 Multi-material jetting 90
3.9.6.13 Vacuumless deposition 91
3.9.6.14 Upcycling waste streams 91
3.10 Sustainable attachment and integration of components 92
3.10.1 Conventional component attachment materials 92
3.10.2 Materials 93
3.10.2.1 Conductive adhesives 93
3.10.2.2 Biodegradable adhesives 94
3.10.2.3 Magnets 94
3.10.2.4 Bio-based solders 94
3.10.2.5 Bio-derived solders 94
3.10.2.6 Recycled plastics 95
3.10.2.7 Nano adhesives 95
3.10.2.8 Shape memory polymers 95
3.10.2.9 Photo-reversible polymers 96
3.10.2.10 Conductive biopolymers 97
3.10.3 Processes 97
3.10.3.1 Traditional thermal processing methods 98
3.10.3.2 Low temperature solder 98
3.10.3.3 Reflow soldering 101
3.10.3.4 Induction soldering 101
3.10.3.5 UV curing 102
3.10.3.6 Near-infrared (NIR) radiation curing 102
3.10.3.7 Photonic sintering/curing 102
3.10.3.8 Hybrid integration 103

4 SUSTAINABLE INTEGRATED CIRCUITS 104

4.1 IC manufacturing 104
4.2 Sustainable IC manufacturing 104
4.3 Wafer production 105
4.3.1 Silicon 106
4.3.2 Gallium nitride ICs 106
4.3.3 Flexible ICs 106
4.3.4 Fully printed organic ICs 107
4.4 Oxidation methods 108
4.4.1 Sustainable oxidation 108
4.4.2 Metal oxides 109
4.4.3 Recycling 110
4.4.4 Thin gate oxide layers 110
4.4.5 Substrate Oxidation 111
4.4.6 Solution-Based Manufacturing 111
4.4.7 MOSFET Transistors 111
4.4.8 Silicon on Insulator (SOI) and Manufacturing 112
4.5 Patterning and doping 113
4.5.1 Processes 113
4.5.1.1 Wet etching 113
4.5.1.2 Dry plasma etching 113
4.5.1.3 Lift-off patterning 114
4.5.1.4 Surface doping 114
4.5.2 Photolithography 115
4.5.3 Green solvents and chemicals 116
4.6 Metallization 117
4.6.1 Evaporation 118
4.6.2 Plating 118
4.6.3 Printing 118
4.6.3.1 Printed metal gates for organic thin film transistors 118
4.6.4 Physical vapour deposition (PVD) 119
4.7 Packaging 119
4.7.1 Sustainable Semiconductor Packaging Technologies 119
4.7.2 Glass interposer technology 120
4.8 Water management 121
4.8.1 Overview 121
4.8.2 Ultra pure water (UPW) 121
4.8.3 Semiconductor manufacturing water consumption 122
4.8.4 Water Reuse 123

5 END OF LIFE 124

5.1 Legislation 124
5.2 Hazardous waste 125
5.3 Emissions 126
5.4 Water Usage 126

6 RECYCLING 128

6.1 Mechanical recycling 129
6.2 Electro-Mechanical Separation 130
6.3 Chemical Recycling 130
6.4 Electrochemical Processes 130
6.5 Thermal Recycling 131
6.6 Green Certification 131
6.7 PCB recycling 132
6.7.1 Overview 132
6.7.2 Metal recovery from PCB manufacturing 132
6.7.3 Recyclable PCBs 133
6.7.4 Excess electronic component inventory management 133
6.7.5 Electronic waste management and reuse 133

7 SUSTAINABILITY IN DATA CENTERS 135

7.1 Overview 135
7.1.1 Data center sustainability 135
7.1.2 Carbon reductions 135
7.1.3 Data center decarbonization 136
7.1.4 Data center company sustainability activities 138
7.2 Green Energy 139
7.2.1 Data centers power consumption 139
7.2.2 Microgrids 141
7.2.3 Energy storage systems 142
7.2.4 Solar 142
7.2.5 Wind power 143
7.2.6 Geothermal 144
7.2.7 Nuclear 145
7.2.7.1 Large-scale nuclear reactors 146
7.2.7.2 Small modular reactors (SMRs) 146
7.2.7.3 Nuclear fusion 147
7.2.8 Fuel cells 147
7.2.8.1 PEMFCs and SOFCs 148
7.2.9 Batteries 149
7.2.9.1 UPS battery technologies 149
7.2.9.2 BESS (Battery Energy Storage Systems) 150
7.3 Improved Energy Efficiency 151
7.3.1 Thermal efficiency 152
7.3.2 IT efficiency 152
7.3.3 Electrical efficiency 155
7.4 Carbon credits and CO2 offsetting 156
7.4.1 CO2 emissions of data centers 156
7.4.2 Carbon dioxide removal technology 157
7.4.3 Low-carbon construction 160
7.4.3.1 Green concrete 160
7.4.3.2 Green Steel 162
7.5 Companies 164

8 GLOBAL MARKET AND REVENUES 2018-2035 166

8.1 Global PCB manufacturing industry 166
8.1.1 PCB revenues 166
8.2 Sustainable PCBs 167
8.3 Sustainable ICs 170

9 COMPANY PROFILES 172 (55 company profiles)

10 RESEARCH METHODOLOGY 224

10.1 Objectives of This Report 224

11 REFERENCES 225

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List of Tables/Graphs

List of Tables

Table 1. Sustainability Index Benchmarking. 17
Table 2. Key factors driving adoption of green electronics. 17
Table 3. Key circular economy strategies for electronics. 20
Table 4. Regulations pertaining to sustainable electronics. 21
Table 5. Companies developing bio-based batteries for application in sustainable electronics. 23
Table 6. Benefits of Green Electronics Manufacturing 25
Table 7. Challenges in adopting Sustainable Electronics manufacturing. 26
Table 8. Major chipmakers' renewable energy road maps. 30
Table 9. Energy efficiency in sustainable electronics manufacturing. 30
Table 10. Recycling and Reuse Initiatives in Sustainable Electronics. 32
Table 11. Composition of plastic waste streams. 34
Table 12. Comparison of mechanical and advanced chemical recycling. 34
Table 13. Example chemically recycled plastic products. 35
Table 14. Bio-based and non-toxic materials in sustainable electronics. 36
Table 15. Key focus areas for enabling greener and ethically responsible electronics supply chains. 39
Table 16. Sustainability programs and disclosure from major electronics brands. 42
Table 17. PCB manufacturing process. 44
Table 18. Challenges in PCB manufacturing. 44
Table 19. 3D PCB manufacturing. 46
Table 20. Comparison of some sustainable PCB alternatives against conventional options in terms of key performance factors. 47
Table 21. Sustainable PCB supply chain. 48
Table 22. Key areas where the PCB industry can improve sustainability. 49
Table 23. PCB Design Options and Sustainability. 50
Table 24. Improving sustainability of PCB design. 51
Table 25. PCB design options for sustainability. 52
Table 26. Sustainability benefits and challenges associated with 3D printing. 54
Table 27. Conductive ink producers. 56
Table 28. Green and lead-free solder companies. 58
Table 29. Biodegradable substrates for PCBs. 58
Table 30. Overview of mycelium fibers-description, properties, drawbacks and applications. 60
Table 31. Application of lignin in composites. 61
Table 32. Properties of lignins and their applications. 62
Table 33. Properties of flexible electronics‐cellulose nanofiber film (nanopaper). 64
Table 34. Companies developing cellulose nanofibers for electronics. 64
Table 35. Commercially available PHAs. 67
Table 36. Main limitations of the FR4 material system used for manufacturing printed circuit boards (PCBs). 68
Table 37. Halogen-free FR4 companies. 71
Table 38. Bioplastics for PCBs. 72
Table 39. Properties of biobased PCBs. 73
Table 40. Applications of flexible (bio) polyimide PCBs. 75
Table 41. Sustainability in Patterning and Metallization Processes. 79
Table 42. Main patterning and metallization steps in PCB fabrication and sustainable options. 79
Table 43. Sustainability issues with conventional metallization processes. 80
Table 44. Benefits of print-and-plate. 81
Table 45. Sustainable alternative options to standard plating resists used in printed circuit board (PCB) fabrication. 84
Table 46. Applications for laser induced forward transfer 85
Table 47. Copper versus silver inks in laser-induced forward transfer (LIFT) for electronics fabrication. 86
Table 48. Approaches for in-situ oxidation prevention. 86
Table 49. Market readiness and maturity of different lead-free solders and electrically conductive adhesives (ECAs) for electronics manufacturing. 88
Table 50. Advantages of green electroless plating. 88
Table 51. Sustainability for Patterning and Metallization Materials. 92
Table 52. Comparison of component attachment materials. 92
Table 53. Comparison between sustainable and conventional component attachment materials for printed circuit boards 93
Table 54. Comparison between the SMAs and SMPs. 95
Table 55. Comparison of conductive biopolymers versus conventional materials for printed circuit board fabrication. 97
Table 56. Comparison of curing and reflow processes used for attaching components in electronics assembly. 97
Table 57. Low temperature solder alloys. 99
Table 58. Thermally sensitive substrate materials. 99
Table 59. Limitations of existing IC production. 104
Table 60. Strategies for improving sustainability in integrated circuit (IC) manufacturing. 105
Table 61. Comparison of oxidation methods and level of sustainability. 108
Table 62. Sustainability Index for the Oxidation Processes. 109
Table 63. Stage of commercialization for oxides. 110
Table 64. Sustainable Oxidation Process Comparison. 111
Table 65. Wet and Dry Thermal Oxidation Comparison. 112
Table 66. Alternative doping techniques. 115
Table 67. Sustainability Index for Patterning. 117
Table 68. Sustainability Index for Metallization. 119
Table 69. Sustainability Index for Interconnection Techniques. 120
Table 70. Organic Substrates. 120
Table 71. UPW Specifications and Monitoring Methods. 121
Table 72. Water Management Techniques. 122
Table 73. UPW Upgrades and Reuse. 123
Table 74. Water Management Companies. 123
Table 75. Metal content mg / Kg in Printed Circuit Boards (PCBs) from waste desktop computers. 129
Table 76. Chemical recycling methods for handling electronic waste. 130
Table 77. Electrochemical processes for recycling metals from electronic waste 131
Table 78. Thermal recycling processes for electronic waste. 131
Table 79. Critical Semiconductor Materials and Recycling. 132
Table 80. Waste Reduction Techniques. 134
Table 81. Data Center Sustainability Metrics. 135
Table 82. Data Center CO2 Emissions. 135
Table 83. Total Carbon Emissions Breakdown. 136
Table 84. Global Data Center Hyperscalers. 136
Table 85. PUE and CUE metrics. 136
Table 86. Data Center Equipment Sustainability. 137
Table 87. Data center companies sustainability activity. 138
Table 88. Power sources for data centers. 139
Table 89. Benchmarking electricity sources. 140
Table 90. Decarbonization of Power. 140
Table 91 Renewable Energy Activities of Hyperscalers. 141
Table 92. Cost Comparison of Renewable Sources. 141
Table 93. Solar energy in data centers. 143
Table 94. Approaches to Wind-Powered Data Centers. 143
Table 95. Power Efficiency and Wind Turbine Models. 144
Table 96. Enhanced Geothermal Systems. 145
Table 97. Geothermal Power for Data Centers. 145
Table 98. SMR Projects. 146
Table 99. Fuel Cells for Data Centers. 148
Table 100. Battery Applications in Data Centers. 149
Table 101. Companies in Grid-scale Li-ion BESS. 150
Table 102. System Power Consumption and Metrics. 151
Table 103. Cooling Methods Overview. 152
Table 104. Power Demand. 153
Table 105. Power Forecast 2013-2035. 153
Table 106. Carbon Emissions by Type. 153
Table 107. GHG Emissions ? Storage. 154
Table 108. CDR Credit Prices. 159
Table 109. Carbon credits Price range. 159
Table 110. Cement Decarbonization Technologies. 161
Table 111. Decarbonization Technologies for Steel. 162
Table 112. Global Data Center Lifecycle CO2e Forecast. 163
Table 113. Carbon-Free Energy Savings Forecast for Data Centers. 163
Table 114. Carbon Credits Forecast to 2035. 163
Table 115. Companies in sustainability for data centers 164
Table 116. Global PCB revenues 2018-2035 (billions USD), by substrate types. 166
Table 117. Global sustainable PCB revenues 2018-2035, by type (millions USD). 167
Table 118. Global sustainable ICs revenues 2018-2035, by type (millions USD). 170
Table 119. Oji Holdings CNF products. 204

List of Figures

Figure 1. Closed-loop manufacturing. 27
Figure 2. Sustainable supply chain for electronics. 39
Figure 3. Flexible PCB. 46
Figure 4. Vapor degreasing. 50
Figure 5. Multi-layered PCB. 51
Figure 6. 3D printed PCB. 53
Figure 7. In-mold electronics prototype devices and products. 54
Figure 8. Silver nanocomposite ink after sintering and resin bonding of discrete electronic components. 56
Figure 9. Typical structure of mycelium-based foam. 61
Figure 10. Flexible electronic substrate made from CNF. 64
Figure 11. CNF composite. 65
Figure 12. Oji CNF transparent sheets. 65
Figure 13. Electronic components using cellulose nanofibers as insulating materials. 66
Figure 14. BLOOM masterbatch from Algix. 66
Figure 15. Dell's Concept Luna laptop. 76
Figure 16. Direct-write, precision dispensing, and 3D printing platform for 3D printed electronics. 82
Figure 17. 3D printed circuit boards from Nano Dimension. 83
Figure 18. Photonic sintering. 83
Figure 19. Laser-induced forward transfer (LIFT). 85
Figure 20. Material jetting 3d printing. 90
Figure 21. Material jetting 3d printing product. 91
Figure 22. The molecular mechanism of the shape memory effect under different stimuli. 96
Figure 23. Supercooled Soldering? Technology. 100
Figure 24. Reflow soldering schematic. 101
Figure 25. Schematic diagram of induction heating reflow. 102
Figure 26. Fully-printed organic thin-film transistors and circuitry on one-micron-thick polymer films. 108
Figure 27. Types of PCBs after dismantling waste computers and monitors. 128
Figure 28. Global PCB revenues 2018-2035 (billions USD), by substrate types. 167
Figure 29. Global sustainable PCB revenues 2018-2035, by type (millions USD). 169
Figure 30. Global sustainable ICs revenues 2018-2035, by type (millions USD). 171
Figure 31. PiezotechR FC. 177
Figure 32. PowerCoatR paper. 178
Figure 33. BeFCR biofuel cell and digital platform. 180
Figure 34. DPP-360 machine. 183
Figure 35. P-FlexR Flexible Circuit. 185
Figure 36. Fairphone 4. 187
Figure 37. In2tec’s fully recyclable flexible circuit board assembly. 193
Figure 38. C.L.A.D. system. 195
Figure 39. Soluboard immersed in water. 197
Figure 40. Infineon PCB before and after immersion. 197
Figure 41. Nano OPS Nanoscale wafer printing system. 200
Figure 42. PulpaTronics' paper RFID tag. 207
Figure 43. Stora Enso lignin battery materials. 213
Figure 44. 3D printed electronics. 215
Figure 45. Tactotek IME device. 216
Figure 46. TactoTekR IMSER SiP - System In Package. 217
Figure 47. Eco-friendly NFC tag label (left) and paper-based antenna substrate (right). 218
Figure 48. Illustration of the layer structures of an NFC tag label using PET film as the antenna substrate (left) and Toppan’s new eco-friendly NFC tag label using a paper-based substrate (right). 219
Figure 49. Verde Bio-based resins. 222