Summary

The semiconductor manufacturing equipment market is projected to reach USD 155.09 billion by 2029 from USD 109.24 billion in 2024 at a CAGR of 7.3% during the forecast period. The major factors driving the growth of the market are expansion of semiconductor fabrication facilities, surge in automotive semiconductor market, and increasing demand for advanced and efficient chips. Further, advancements in advanced packaging technologies and increasing government support for domestic semiconductor industry are some new growth avenues for market participants. Large-scale expansions within fab centers, the dependence of rising cloud computing and change to electric, connected vehicle configurations make up the semiconductor manufacturing equipment market. All this is backed by much energy-efficient manufacture, advance regarding advanced semiconductor manufacturing facilities, and more pressure from smaller chips. It inspires innovation and scaling of production, resulting in increased usage of semiconductor manufacturing equipment in other industries as well.
“Lithography to register the largest market share in semiconductor manufacturing front-end equipment segment during the forecast period.”
Advances in EUV technology and increasing investment in high-precision equipment for handling the challenges will be key drivers of the lithography segment in the front-end equipment market of semiconductor manufacturing equipment, accounting for a significant share. Lithography is one of the principal semiconductor fabrication processes of patterning intricate circuit patterns at microscopic resolution on silicon wafers. This step places the IC layout onto the surface of the wafer with light or electron beams imitating extremely minute features. Advances in the technology, most specifically in EUV lithography, provide a pathway to fabricate chips that are smaller and more powerful. Companies such as ASML (Netherlands) use EUV lithography, a process employing shorter wavelengths of light to fabricate features down to 5nm.
“Bonding to account for the highest CAGR in back-end equipment segment during the forecast period.”
The bonding segment of the semiconductor manufacturing equipment market is expected to grow the most due to the increasing requirement for the precise semiconductor devices and for the processes of high yield and efficiency of production. Bonding equipment is needed in the formation of electrical interconnections between semiconductor dies and their packages or substrates so that semiconductor devices can function. Some generally used techniques include wire bonding, ball bonding, and solder bump bonding. The right bonding technology will make all the difference in either performance or cost-effectiveness in the semiconductor manufacturing process. Growth in the development of advanced semiconductor packaging technology and demand for cost-effective, high-reliability automotive and consumer-electronics components are driving demand for bonding equipment.

“Asia Pacific to register the fastest growth during the forecast period.”
The highest CAGR is expected to be registered in the Asia Pacific region, which has the highest presence of leading semiconductor manufacturing equipment providers in key countries such as China, Japan, Taiwan, and South Korea, that ascertain dominance in semiconductor production and innovation in this region. The region has advanced production capabilities and a substantial consumer electronics sector. In addition, the growing government initiatives, the relentless advances in technology, and the substantial investments of local and international players. The increasing semiconductor need across consumer electronics, automotive, and telecommunications contribute to increasing growth. The concentration on innovative culture and infrastructure development is also a driving factor in the region's competitive position in the global market. The high growth is attributed to technological advancements in artificial intelligence (Al), Internet of Things (IoT), and 5G. The region is characterized with the robust manufacturing of consumer electronics and high demand for electronic appliances and electric vehicles, which basically calls for a huge need for a reliable as well as performance semiconductor manufacturing equipment.
The break-up of the profile of primary participants in the semiconductor manufacturing equipment market-
• By Company Type: Tier 1 – 25%, Tier 2 – 35%, Tier 3 – 40%
• By Designation Type: C Level – 40%, Director Level – 30%, Others – 30%
• By Region Type: Asia Pacific – 45%, Americas – 35%, Europe, Middle East & Africa – 20%

The major players in the semiconductor manufacturing equipment market with a significant global presence include Applied Materials, Inc. (US), ASML (Netherlands), Tokyo Electron Limited (Japan), Lam Research Corporation (US), KLA Corporation (US), and others.
Research Coverage
The report segments the semiconductor manufacturing equipment market and forecasts its size by front-end equipment, back-end equipment, product type, dimension, supply chain participant, and region. It also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing market growth. The report covers qualitative aspects in addition to quantitative aspects of the market.

Reasons to buy the report:
The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall semiconductor manufacturing equipment market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges.
The report provides insights on the following pointers:
• Analysis of key drivers (expansion of semiconductor fabrication facilities, surge in automotive semiconductor market, and increased demand for advanced and efficient chips), restraints (high capital investment requirements and complexity of manufacturing processes), opportunities (expansion of advanced packaging technologies and government support for domestic semiconductor industry), and challenges (rapid pace of technological advancements and environmental and regulatory compliance in manufacturing)
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new solution and service launches in the semiconductor manufacturing equipment market.
• Market Development: Comprehensive information about lucrative markets – the report analyses the semiconductor manufacturing equipment market across varied regions.
• Market Diversification: Exhaustive information about new solutions and services, untapped geographies, recent developments, and investments in the semiconductor manufacturing equipment market.
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and solution and service offerings of leading players, including Applied Materials, Inc. (US), ASML (Netherlands), Tokyo Electron Limited (Japan), Lam Research Corporation (US), and KLA Corporation (US).

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Table of Contents

1 INTRODUCTION 28
1.1 STUDY OBJECTIVES 28
1.2 MARKET DEFINITION 29
1.2.1 INCLUSIONS AND EXCLUSIONS 29
1.3 STUDY SCOPE 30
1.3.1 MARKETS COVERED AND REGIONAL SCOPE 30
1.3.2 YEARS CONSIDERED 31
1.4 CURRENCY CONSIDERED 31
1.5 UNIT CONSIDERED 31
1.6 STAKEHOLDERS 31
2 RESEARCH METHODOLOGY 33
2.1 RESEARCH DATA 33
2.1.1 SECONDARY DATA 34
2.1.1.1 Secondary sources 34
2.1.1.2 Key data from secondary sources 35
2.1.2 PRIMARY DATA 35
2.1.2.1 List of primary participants 35
2.1.2.2 Breakdown of primary interviews 36
2.1.2.3 Key data from primary sources 36
2.1.3 SECONDARY AND PRIMARY RESEARCH 37
2.1.3.1 Key industry insights 38
2.2 MARKET SIZE ESTIMATION 38
2.2.1 BOTTOM-UP APPROACH 38
2.2.2 TOP-DOWN APPROACH 39
2.3 FACTOR ANALYSIS 40
2.3.1 DEMAND-SIDE ANALYSIS 40
2.3.2 SUPPLY-SIDE ANALYSIS 41
2.4 DATA TRIANGULATION 41
2.5 RESEARCH ASSUMPTIONS 42
2.6 RESEARCH LIMITATIONS 43
2.7 RISK ASSESSMENT 43
3 EXECUTIVE SUMMARY 44
 
4 PREMIUM INSIGHTS 49
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 49
4.2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT 49
4.3 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT 50
4.4 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE 50
4.5 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION 51
4.6 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY SUPPLY CHAIN PARTICIPANT 51
4.7 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION 52
4.8 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY 52
5 MARKET OVERVIEW 53
5.1 INTRODUCTION 53
5.2 MARKET DYNAMICS 53
5.2.1 DRIVERS 54
5.2.1.1 Expansion of semiconductor fabrication facilities 54
5.2.1.2 Surge in automotive semiconductor market 54
5.2.1.3 Increasing demand for advanced and efficient chips 55
5.2.2 RESTRAINTS 56
5.2.2.1 High capital investment requirements 56
5.2.2.2 Complexity of manufacturing processes 57
5.2.3 OPPORTUNITIES 58
5.2.3.1 Expansion of advanced packaging technologies 58
5.2.3.2 Government support for domestic semiconductor industry 58
5.2.4 CHALLENGES 59
5.2.4.1 Rapid pace of technological advancements 59
5.2.4.2 Environmental and regulatory compliance in manufacturing 60
5.3 VALUE CHAIN ANALYSIS 61
5.4 ECOSYSTEM ANALYSIS 63
5.5 INVESTMENT AND FUNDING SCENARIO 65
5.6 TRENDS AND DISRUPTIONS IMPACTING CUSTOMER BUSINESS 65
5.7 TECHNOLOGY ANALYSIS 66
5.7.1 KEY TECHNOLOGIES 66
5.7.1.1 Wafer Bonding 66
5.7.2 COMPLEMENTARY TECHNOLOGIES 67
5.7.2.1 Flip Chip 67
5.7.3 ADJACENT TECHNOLOGIES 67
5.7.3.1 3D Stacking 67
 
5.8 PRICING ANALYSIS 68
5.8.1 AVERAGE SELLING PRICE OF PRODUCTS OFFERED BY KEY PLAYERS 68
5.8.2 AVERAGE SELLING PRICE, BY REGION 69
5.9 KEY STAKEHOLDERS AND BUYING CRITERIA 69
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS 69
5.9.2 BUYING CRITERIA 70
5.10 PORTER'S FIVE FORCES ANALYSIS 71
5.10.1 THREAT OF NEW ENTRANTS 72
5.10.2 THREAT OF SUBSTITUTES 73
5.10.3 BARGAINING POWER OF SUPPLIERS 73
5.10.4 BARGAINING POWER OF BUYERS 73
5.10.5 INTENSITY OF COMPETITIVE RIVALRY 73
5.11 CASE STUDY ANALYSIS 74
5.11.1 ENHANCING LED MANUFACTURING THROUGH ELMO'S ADVANCED MOTION CONTROL SOLUTIONS 74
5.11.2 SYNOVA SA ADDRESSES CHALLENGES AND SOLUTIONS IN ADVANCED DIE SINGULATION AND WAFER DICING WITH LMJ TECHNOLOGY 74
5.11.3 OPTIMIZING PHOTORESISTS FOR ADVANCED LITHOGRAPHY TECHNIQUES 74
5.12 TRADE ANALYSIS 75
5.12.1 IMPORT SCENARIO (HS CODE 848620) 75
5.12.2 EXPORT SCENARIO (HS CODE 848620) 76
5.13 PATENT ANALYSIS 77
5.14 REGULATORY LANDSCAPE 80
5.14.1 STANDARDS 83
5.14.1.1 47 CFR 15 83
5.14.1.2 NAICS code 334413 83
5.14.1.3 29 CFR 1910 83
5.14.1.4 SEMI E6, E76, F5, F14, S6, S1, S10, S12, S13, S14, S18, and S22 83
5.14.1.5 IEC 60204-33:2009 84
5.15 KEY CONFERENCES AND EVENTS, 2024–2025 84
5.16 IMPACT OF AI/GEN AI ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 85
5.17 CONNECTORS USED IN MANUFACTURING FACILITIES OF SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET PLAYERS 86
5.17.1 METRIC CIRCULAR 86
5.17.2 CPC, RECTANGULAR 87
5.17.3 D-SUB 87
5.17.4 OVERMOLDED ASSEMBLIES 88
5.17.5 CABLE HARNESS 88
5.17.6 OTHER DEVICES 89
 
6 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY FRONT-END EQUIPMENT 90
6.1 INTRODUCTION 91
6.2 LITHOGRAPHY 93
6.2.1 PHOTOLITHOGRAPHY 94
6.2.1.1 Deep ultraviolet (DUV) lithography 94
6.2.1.2 Extreme ultraviolet (EUV) lithography 94
6.2.2 ELECTRON BEAM LITHOGRAPHY 94
6.2.3 ION BEAM LITHOGRAPHY 94
6.2.4 NANOIMPRINT LITHOGRAPHY 94
6.2.5 OTHERS 95
6.3 WAFER SURFACE CONDITIONING 97
6.3.1 ETCHING 97
6.3.1.1 Advancements in dry etching technologies to drive market growth 97
6.3.2 CHEMICAL MECHANICAL PLANARIZATION (CMP) 98
6.3.2.1 Demand for high-performance devices driving market growth 98
6.4 WAFER CLEANING 98
6.4.1 DEMAND FOR HIGH-PERFORMANCE AND RELIABLE SEMICONDUCTOR DEVICES TO FUEL MARKET GROWTH 98
6.5 DEPOSITION 99
6.5.1 ADVANCEMENTS IN DEPOSITION PROCESSES TO DRIVE MARKET GROWTH 99
6.6 OTHER FRONT-END EQUIPMENT 99
7 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY BACK-END EQUIPMENT 100
7.1 INTRODUCTION 101
7.2 ASSEMBLY & PACKAGING 104
7.2.1 ADVANCEMENTS IN PACKAGING TECHNOLOGIES TO DRIVE MARKET GROWTH 104
7.3 DICING 104
7.3.1 INCREASING NEED FOR HIGH-PRECESSION SEMICONDUCTOR DEVICES TO SPUR MARKET DEMAND 104
7.4 METROLOGY 105
7.4.1 NEED FOR PRECISION MEASUREMENT AND ADVANCED DETECTION TO FUEL MARKET GROWTH 105
7.5 BONDING 105
7.5.1 RISING DEMAND FOR ADVANCED SEMICONDUCTOR PACKAGING TECHNOLOGY TO DRIVE MARKET GROWTH 105
7.6 WAFER TESTING/IC TESTING 105
7.6.1 ADVANCEMENTS IN TESTING TECHNOLOGIES BOOSTING SEMICONDUCTOR RELIABILITY AND MARKET GROWTH 105
8 FAB FACILITY EQUIPMENT USED IN SEMICONDUCTOR MANUFACTURING EQUIPMENT 106
8.1 INTRODUCTION 106
8.2 AUTOMATION 106
8.3 CHEMICAL 107
8.4 GAS CONTROL 107
8.5 OTHER FAB FACILITY EQUIPMENT 107
9 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY PRODUCT TYPE 108
9.1 INTRODUCTION 109
9.2 MEMORY 110
9.2.1 RISING DEMAND FOR HIGH-CAPACITY STORAGE AND ADVANCED PACKAGING TO ACCELERATE MARKET GROWTH 110
9.3 LOGIC 111
9.3.1 DEMAND FOR HIGH-PERFORMANCE COMPUTING TO DRIVE MARKET GROWTH 111
9.4 MPU 113
9.4.1 ADVANCEMENTS IN CLOUD COMPUTING AND EDGE COMPUTING TECHNOLOGIES TO DRIVE MARKET GROWTH 113
9.5 DISCRETE 114
9.5.1 RISING DEMAND FOR DISCRETE DEVICES IN AUTOMOTIVE AND ENERGY SECTORS TO DRIVE MARKET GROWTH 114
9.6 ANALOG 115
9.6.1 RISING ADOPTION OF IOT DEVICES TO FUEL MARKET GROWTH 115
9.7 OTHERS 117
9.7.1 SENSORS 118
9.7.1.1 Increased adoption of interconnected devices to drive market growth 118
9.7.2 OPTOELECTRONIC COMPONENTS 118
9.7.2.1 Adoption of advanced display technologies to fuel market growth 118
10 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION 119
10.1 INTRODUCTION 120
10.2 2D ICS 121
10.2.1 HIGH-DENSITY INTEGRATION IN CONSUMER ELECTRONICS TO FOSTER MARKET GROWTH 121
10.3 2.5D ICS 122
10.3.1 NEED FOR COST-EFFECTIVE, HIGH-PERFORMANCE SOLUTIONS TO SPUR MARKET DEMAND 122
10.4 3D ICS 123
10.4.1 NEED FOR INTEGRATING DIVERSE FUNCTIONALITIES IN COMPACT FORM FACTOR TO FUEL MARKET GROWTH 123
11 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY SUPPLY CHAIN PARTICIPANT 125
11.1 INTRODUCTION 126
11.2 FOUNDRIES 127
11.2.1 RISING DEMAND FOR ADVANCED SEMICONDUCTORS AND COST-EFFECTIVE MANUFACTURING TO DRIVE FOUNDRY GROWTH 127
11.3 IDM FIRMS 128
11.3.1 VERTICAL INTEGRATION AND ADVANCED MANUFACTURING CAPABILITIES TO DRIVE MARKET GROWTH 128
11.4 OSAT COMPANIES 129
11.4.1 ADVANCEMENTS IN PACKAGING TECHNOLOGIES AND OUTSOURCING TO FUEL MARKET GROWTH 129
12 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION 130
12.1 INTRODUCTION 131
12.2 AMERICAS 132
12.2.1 MACROECONOMIC OUTLOOK FOR NORTH AMERICA 132
12.2.2 US 140
12.2.2.1 Government initiatives and adoption of advanced technologies to accelerate market growth 140
12.2.3 CANADA 141
12.2.3.1 Strategic innovation and collaboration to create growth opportunities 141
12.2.4 REST OF AMERICAS 142
12.2.4.1 Technological advancements in emerging economies to boost market growth 142
12.3 EUROPE, MIDDLE EAST & AFRICA (EMEA) 143
12.3.1 MACROECONOMIC OUTLOOK FOR EMEA 143
12.3.2 GERMANY 151
12.3.2.1 Advanced technological infrastructure and Industry 4.0 to support market growth 151
12.3.3 UK 151
12.3.3.1 Strategic innovation and investment to propel market growth 151
12.3.4 IRELAND 152
12.3.4.1 Presence of fabrication facilities to contribute to market growth 152
12.3.5 FRANCE 152
12.3.5.1 Strong R&D focus and government initiatives to contribute to market growth 152
12.3.6 ITALY 152
12.3.6.1 Rising demand in automotive, consumer electronics, and industrial sectors to drive market 152
12.3.7 NETHERLANDS 153
12.3.7.1 Strategic R&D investments to propel market growth 153
12.3.8 REST OF EMEA 153
 
12.4 ASIA PACIFIC 153
12.4.1 MACROECONOMIC OUTLOOK FOR ASIA PACIFIC 153
12.4.2 CHINA 162
12.4.2.1 Advanced manufacturing capabilities and supportive environment for innovation to accelerate market growth 162
12.4.3 JAPAN 163
12.4.3.1 Demand for advanced semiconductor manufacturing technologies in automotive sector to augment market growth 163
12.4.4 SOUTH KOREA 164
12.4.4.1 Strong manufacturing capabilities of major companies to create opportunities 164
12.4.5 TAIWAN 165
12.4.5.1 Investments in advanced manufacturing technologies to fuel market growth 165
12.4.6 REST OF ASIA PACIFIC 165
13 COMPETITIVE LANDSCAPE 167
13.1 OVERVIEW 167
13.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2020–2024 167
13.3 MARKET SHARE ANALYSIS, 2023 170
13.4 REVENUE ANALYSIS, 2019–2023 172
13.5 COMPANY VALUATION AND FINANCIAL METRICS 172
13.6 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023 173
13.6.1 STARS 173
13.6.2 EMERGING LEADERS 173
13.6.3 PERVASIVE PLAYERS 174
13.6.4 PARTICIPANTS 174
13.6.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023 175
13.6.5.1 Company footprint 175
13.6.5.2 Front-end equipment footprint 176
13.6.5.3 Back-end equipment footprint 177
13.6.5.4 Product type footprint 178
13.6.5.5 Dimension footprint 179
13.6.5.6 Supply chain participant footprint 180
13.6.5.7 Region footprint 181
13.7 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023 182
13.7.1 PROGRESSIVE COMPANIES 182
13.7.2 RESPONSIVE COMPANIES 182
13.7.3 DYNAMIC COMPANIES 182
13.7.4 STARTING BLOCKS 182
13.7.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023 184
13.7.5.1 List of startups/SMEs 184
13.7.5.2 Competitive benchmarking of startups/SMEs 185
13.8 BRAND/PRODUCT COMPARISON 186
13.9 COMPETITIVE SCENARIO AND TRENDS 186
13.9.1 PRODUCT LAUNCHES 186
13.9.2 DEALS 198
13.9.3 EXPANSIONS 204
13.10 FACILITY OVERVIEW OF TOP 5 PAYERS 209
14 COMPANY PROFILES 210
14.1 INTRODUCTION 210
14.2 KEY PLAYERS 210
14.2.1 APPLIED MATERIALS, INC. 210
14.2.1.1 Business overview 210
14.2.1.2 Products/Solutions/Services offered 211
14.2.1.3 Recent developments 216
14.2.1.3.1 Product/Service launches 216
14.2.1.3.2 Deals 218
14.2.1.3.3 Expansions 219
14.2.1.4 MnM view 219
14.2.1.4.1 Key strengths/Right to win 219
14.2.1.4.2 Strategic choices 220
14.2.1.4.3 Weaknesses and competitive threats 220
14.2.2 ASML 221
14.2.2.1 Business overview 221
14.2.2.2 Products/Solutions/Services offered 222
14.2.2.3 Recent developments 223
14.2.2.3.1 Product/Solution/Service launches 223
14.2.2.3.2 Deals 224
14.2.2.3.3 Expansions 224
14.2.2.4 MnM view 225
14.2.2.4.1 Key strengths/Right to win 225
14.2.2.4.2 Strategic choices 225
14.2.2.4.3 Weaknesses and competitive threats 225
14.2.3 TOKYO ELECTRON LIMITED 226
14.2.3.1 Business overview 226
14.2.3.2 Products/Solutions/Services offered 227
14.2.3.3 Recent developments 228
14.2.3.3.1 Product/Solution/Service launches 228
14.2.3.3.2 Deals 230
14.2.3.3.3 Expansions 231
14.2.3.4 MnM view 232
14.2.3.4.1 Key strengths/Right to win 232
14.2.3.4.2 Strategic Choices 232
14.2.3.4.3 Weaknesses and competitive threats 232
14.2.4 LAM RESEARCH CORPORATION 233
14.2.4.1 Business overview 233
14.2.4.2 Products/Solutions/Services offered 234
14.2.4.3 Recent developments 237
14.2.4.3.1 Product/Solution/Service launches 237
14.2.4.3.2 Deals 238
14.2.4.3.3 Expansions 240
14.2.4.4 MnM view 240
14.2.4.4.1 Key strengths/Right to win 240
14.2.4.4.2 Strategic choices 240
14.2.4.4.3 Weaknesses and competitive threats 240
14.2.5 KLA CORPORATION 241
14.2.5.1 Business overview 241
14.2.5.2 Products/Solutions/Services offered 242
14.2.5.3 Recent developments 245
14.2.5.3.1 Product/Service launches 245
14.2.5.3.2 Expansions 247
14.2.5.4 MnM view 248
14.2.5.4.1 Key strengths/Right to win 248
14.2.5.4.2 Strategic choices 248
14.2.5.4.3 Weaknesses and competitive threats 248
14.2.6 SCREEN HOLDINGS CO., LTD. 249
14.2.6.1 Business overview 249
14.2.6.2 Products/Solutions/Services offered 250
14.2.6.3 Recent developments 251
14.2.6.3.1 Product/Service launches 251
14.2.6.3.2 Deals 253
14.2.6.3.3 Expansions 253
14.2.7 TERADYNE, INC. 254
14.2.7.1 Business overview 254
14.2.7.2 Products/Solutions/Services offered 255
14.2.7.3 Recent developments 256
14.2.7.3.1 Product/Service launches 256
14.2.7.3.2 Deals 257
14.2.8 ADVANTEST CORPORATION 258
14.2.8.1 Business overview 258
14.2.8.2 Products/Solutions/Services offered 259
14.2.8.3 Recent developments 261
14.2.8.3.1 Product/Service launches 261
14.2.8.3.2 Deals 263
 
14.2.9 HITACHI HIGH-TECH CORPORATION 265
14.2.9.1 Business overview 265
14.2.9.2 Products/Solutions/Services offered 266
14.2.9.3 Recent developments 267
14.2.9.3.1 Product/Service launches 267
14.2.9.3.2 Deals 268
14.2.9.3.3 Expansions 269
14.2.10 PLASMA-THERM 270
14.2.10.1 Business overview 270
14.2.10.2 Products/Solutions/Services offered 270
14.2.10.3 Recent developments 271
14.2.10.3.1 Product/Service launches 271
14.2.10.3.2 Deals 271
14.2.10.3.3 Expansions 272
14.3 OTHER PLAYERS 273
14.3.1 ASM INTERNATIONAL N.V. 273
14.3.2 EV GROUP (EVG) 274
14.3.3 ONTO INNOVATION 276
14.3.4 NORDSON CORPORATION 277
14.3.5 ADT 278
14.3.6 BENEQ 279
14.3.7 CVD EQUIPMENT CORPORATION 280
14.3.8 EUGENE TECHNOLOGY CO. LTD. 281
14.3.9 NIKON CORPORATION 282
14.3.10 SEMICONDUCTOR EQUIPMENT CORP. 284
14.3.11 SENTECH INSTRUMENTS GMBH 286
14.3.12 CANON INC. 288
14.3.13 KOKUSAI ELECTRIC CORPORATION 290
14.3.14 SEMES 292
14.3.15 FORMFACTOR 294
15 APPENDIX 296
15.1 INSIGHTS FROM INDUSTRY EXPERTS 296
15.2 DISCUSSION GUIDE 296
15.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 300
15.4 CUSTOMIZATION OPTIONS 302
15.5 RELATED REPORTS 302
15.6 AUTHOR DETAILS 303