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Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts

5Gと6G向け低損失材料 2024-2034年：市場、動向、予測

この調査レポートでは、5Gおよび6G市場向け低損失材料の主要材料、プレーヤー、動向に関する広範な情報について詳細に調査・分析しています。主な掲載内容（目次より抜粋） ... もっと見る

出版社	出版年月	電子版価格	納期	ページ数	言語
IDTechEx アイディーテックエックス	2024年1月24日	US$7,500 電子ファイル（1-5ユーザライセンス）ライセンス・価格情報注文方法はこちら	お問合わせください	380	英語

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Table of Contents

Summary

この調査レポートでは、5Gおよび6G市場向け低損失材料の主要材料、プレーヤー、動向に関する広範な情報について詳細に調査・分析しています。

主な掲載内容（目次より抜粋）

プリント基板および部品レベルの低損失材料
パッケージレベルの低損失材料
ウェハーレベルの低損失材料
6G用低損失材料
予測
企業プロファイル

Report Summary

Fifth-generation telecommunication technology, 5G, is more than a faster mobile experience to stream movies. It enables a universal connection between devices from automotive to remote robots. As profitable business models and killer applications start to emerge, 5G is one of the fastest growth markets, which IDTechEx forecasts to hit over US$842bn in 2033 and contribute trillions in annual connectivity boost to global GDP.

The most revolutionary aspect of the 5G network relies on high frequency 5G technologies, i.e. mmWave 5G, which utilize the spectrum from 26 GHz up to 40 GHz. At such high frequencies, many technologies and devices are facing challenges such as significant transmission loss, higher power usage needing more efficient power supply, and excess heat generation. Transmission loss is a pain point for both 5G antennas and radio frequency integrated circuits. For low frequency 5G, i.e. sub-6 GHz 5G, due to the high data transfer speed, reducing signal loss is also desirable.

Figure 1: Overview of challenges, trends and innovations for mmWave 5G, source: IDTechEx

With the future rise of mmWave 5G, low-loss materials will experience rapid growth and play an increasingly important role. In this report, we survey the landscape of the low-loss materials and benchmark their performance by five key factors, i.e. dielectric constant (Dk), dissipation factor (Df), moisture absorption, cost and manufacturability. Low-loss materials will not only be used as a substrate for RF components or for the PCB, but also within advanced packages. One strong packaging trend is antenna in package (AiP); as telecom technology goes higher in frequency towards mmWave 5G, the size of the antenna elements will shrink such that the arrays can be fitted into the package itself. This integration will also help shorten the RF paths and thus minimize the transmission losses. AiP will need low-loss materials for the substrates, redistribution layers, electromagnetic interference (EMI) shielding, mold underfill (MUF) materials, and more.

Figure 2: Scope of the low-loss materials covered in the report, source: IDTechEx

We highlight promising low-loss materials for 5G devices. This includes:

Low-loss thermoset materials: thermoset materials dominate the market for 3G/4G network devices. However, the high Dk and Df restrict their use in mmWave 5G. We focus on the strategies and R&D effort from key materials suppliers to reduce the Dk and Df for these materials
Polytetrafluoroethylene (PTFE): one of the most common materials for high-frequency applications such as automotive radar systems, high speed/high frequency (HS/HF) board and connectors
Liquid crystal polymers (LCP): it has been adapted to make flexible board for smartphone antennas. The market will continue to grow and expand into other applications
Low temperature co-fired ceramic (LTCC): the low Df and wide range of Dk for LTCC will accelerate the use of LTCC based components such as compact high frequency filters
Others: in order to optimise the performance for 5G systems, a variety of materials will be used, such as hydrocarbons, poly (p-phenylene ether) (PPE or PPO), and glass. Those alternative materials will take over a large share of the low-loss 5G materials market

Additionally, though the 6G spectrum is years from being allocated, research institutions and materials suppliers are already exploring the material requirements needed to meet the next generation of telecommunication technologies. This report explores the approaches to achieve even lower Df/Dk and the potential 6G applications, like reconfigurable intelligent surfaces (RIS).

Ten-year granular forecasts focusing on low-loss materials area and revenue for 5G devices are presented in this report, with over five forecast lines. The forecasts are segmented by:

Frequency: sub-6 GHz 5G and mmWave 5G
Market applications: low-loss materials for infrastructure, smartphone and customer premises equipment (CPE).
Materials type: exploring the evolution of low-loss materials for both sub-6GHz 5G and mmWave 5G

Figure 3: Forecast and growth rate of low-loss materials for 5G, source: IDTechEx

Based on materials trends, we forecast the low-loss materials revenue for 5G devices from 2024 to 2034. The total market will hit US$2.1 billion USD by 2034. The report contains a comprehensive analysis of different low-loss materials from different perspectives such as performance, technology trends, potential, and bottlenecks for large scale deployment. Importantly, the report presents an unbiased analysis of primary data gathered via our interviews with players across the supply chain, and it builds on our large database of 5G infrastructure and user equipment data.

Key questions answered in this report:

Which low-loss materials are the incumbents in each 5G application?
Which low-loss materials are emerging for each 5G application?
What are the advantages and disadvantages for each material type in 5G?
Who are the key suppliers for low-loss materials in 5G?
What is the current status of low-loss materials for 6G?
How much area of low-loss material for 5G will be sold between 2024 and 2034?
How will sales of low-loss materials evolve by frequency and material type?
Which 5G application will drive growth for low-loss materials?

Key aspects

This report provides extensive information and analysis on the major materials, players, and trends for low-loss materials for the 5G and 6G markets.

Material trends for low-loss materials and manufacturer analysis:

Identification of incumbent and emerging low-loss materials
Analysis of materials used in different applications (i.e. printed circuit boards, filters, antennas, packaging, etc.)
Benchmarking of dielectric properties of commercialized low-loss materials in different material categories
Identification of critical material suppliers for different material categories
Discussion of growth drivers and limitations for different material categories in different applications: 5G base stations, 5G smartphone antennas, 5G CPEs
Discussion of emerging technologies for 5G and their low-loss materials: antenna-in-package, advanced semiconductor packaging, ink-based EMI shielding, etc.
Analysis of low-loss materials for 6G and current status

Market Forecasts & Analysis:

10-year granular market forecasts for low-loss materials for 5G, segmented by frequency, application, and material type
10-year market forecasts for low-loss materials for three 5G applications: 5G base stations, CPEs, smartphones
Analysis of 5G deployment and material trends for three 5G applications

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EXECUTIVE SUMMARY

1.1.

5G, next generation cellular communications network

1.2.

Two types of 5G: Sub-6 GHz and mmWave

1.3.

Summary: Global trends and new opportunities in 5G/6G

1.4.

Updates on mmWave 5G deployment by region

1.5.

Updates on mmWave 5G deployment by region

1.6.

New opportunities for low-loss materials in mmWave 5G

1.7.

Low-loss materials for 5G/6G discussed in this report

1.8.

Applications of low-loss materials in semiconductor and electronics packaging

1.9.

Evolution of low-loss materials used in different applications

1.10.

Evolution of organic PCB materials for 5G

1.11.

Benchmark of commercial low-loss organic laminates @ 10 GHz

1.12.

Benchmark of LTCC and glass materials

1.13.

Benchmarking of commercial low-loss materials for 5G PCBs/components

1.14.

Status and outlook of commercial low-loss materials for 5G PCBs/components

1.15.

Key low-loss materials supplier landscape

1.16.

Packaging trends for 5G and 6G connectivity

1.17.

Packaging trends for 5G and 6G connectivity

1.18.

Benchmark of low loss materials for AiP

1.19.

Overview: Redistribution layers in advanced semiconductor packages for 5G smartphones

1.20.

IDTechEx outlook of low-loss materials for 6G

1.21.

Forecast of low-loss materials for 5G: Area and revenue

1.22.

Forecast of low-loss materials for 5G segmented by frequency

1.23.

Forecast of low-loss materials for 5G segmented by material type: Revenue and area

1.24.

Market discussion: Low-loss materials for 5G base stations

1.25.

Market discussion: Low-loss materials for 5G

1.26.

Market discussion: Low-loss materials for 5G smartphone antennas

1.27.

Market discussion: Low-loss materials for 5G CPEs

1.28.

Conclusions

INTRODUCTION

2.1.

Terms and definitions

2.1.1.

IDTechEx definitions of "substrate"

2.1.2.

IDTechEx definitions of "package"

2.1.3.

Glossary of abbreviations

2.2.

Introduction to 5G

2.2.1.

Evolution of mobile communications

2.2.2.

5G commercial/pre-commercial services (2022)

2.2.3.

5G, next generation cellular communications network

2.2.4.

5G standardization roadmap

2.2.5.

Two types of 5G: Sub-6 GHz and mmWave

2.2.6.

5G network deployment strategy

2.2.7.

Low, mid-band 5G is often the operator's first choice to provide 5G national coverage

2.2.8.

Approaches to overcome the challenges of 5G limited coverage

2.2.9.

5G Commercial/Pre-commercial Services by Frequency

2.2.10.

5G mmWave commercial/pre-commercial services (Sep. 2022)

2.2.11.

Mobile private networks landscape - By frequency

2.2.12.

Updates on mmWave 5G deployment by region

2.2.13.

Updates on mmWave 5G deployment by region

2.2.14.

The main technique innovations in 5G

2.2.15.

5G for mobile consumers market overview

2.2.16.

5G for industries overview

2.2.17.

5G supply chain overview

2.2.18.

5G user equipment player landscape

2.2.19.

5G for home: Fixed wireless access (FWA)

2.2.20.

5G Customer Premise Equipment (CPE)

2.2.21.

Summary: Global trends and new opportunities in 5G

2.3.

Introduction to low-loss materials for 5G

2.3.1.

Overview of challenges, trends, and innovations for high frequency 5G devices

2.3.2.

New opportunities for low-loss materials in mmWave 5G

2.3.3.

Applications of low-loss materials in semiconductor and electronics packaging

2.3.4.

Anatomy of a copper clad laminate

2.3.5.

Applications of low-loss materials: Beamforming system in 5G base station

2.3.6.

Applications of low-loss materials: PCBs in 5G CPEs

2.3.7.

Applications for low-loss materials: mmWave 5G antenna module for smartphones

2.3.8.

Applications for low-loss materials: Semiconductor packages

2.3.9.

Roadmap of Df/Dk development across all packaging materials for mmWave 5G

LOW-LOSS MATERIALS AT THE PRINTED CIRCUIT BOARD (PCB) AND COMPONENT LEVEL

3.1.

Introduction

3.1.1.

Overview of low-loss materials for PCBs and semiconductor packages

3.1.2.

Five important metrics impacting low-loss materials selection

3.2.

Low-loss organic laminate overview

3.2.1.

Electric properties of common polymers

3.2.2.

Thermoplastics vs thermosets

3.2.3.

Thermoplastics vs thermosets for 5G

3.2.4.

Evolution of organic PCB materials for 5G

3.2.5.

Innovation trends for organic high frequency laminate materials

3.2.6.

Hybrid system: Cost reduction for high frequency circuit boards

3.2.7.

Key suppliers for high frequency and high-speed copper clad laminate

3.2.8.

Benchmark of commercialised low-loss organic laminates

3.2.9.

Benchmark of commercial low-loss organic laminates @ 10 GHz

3.2.10.

Other examples of low-loss laminates

3.3.

Low-loss thermosets

3.3.1.

Strategies to achieve lower dielectric loss and trade-offs

3.3.2.

Factors affecting dielectric loss: Polarizability and molar volume

3.3.3.

Factors affecting dielectric loss: curing temperature

3.3.4.

Strategies to reduce Dk and Df: Low polarity functional groups or atomic bonds

3.3.5.

Strategies to reduce Dk and Df: Additives

3.3.6.

Strategies to reduce Dk: Bulky structures

3.3.7.

Strategies to reduce Dk: Porous structures

3.3.8.

Strategies to reduce Df: Rigid structures

3.3.9.

Where is the limit of Dk for modified thermosets?

3.3.10.

The influence of Dk and substrate choice on PCB feature size

3.3.11.

The challenge of thinning the PCB-substrate for high frequency applications

3.3.12.

Low-loss thermoset suppliers: Ajinomoto Group's Ajinomoto Build Up Film (ABF)

3.3.13.

Low-loss thermoset suppliers: Taiyo Ink's epoxy-based build-up materials

3.3.14.

Low-loss thermoset suppliers: Taiyo Ink's epoxy-based build-up materials

3.3.15.

Low-loss thermoset suppliers: DuPont's Pyralux laminates

3.3.16.

Low-loss thermoset suppliers: Laird's ECCOSTOCK

3.3.17.

Low-loss thermoset suppliers: Panasonic's R5410

3.3.18.

Low-loss thermoset suppliers: JSR Corp's aromatic polyether (HC polymer)

3.3.19.

Low-loss thermoset suppliers: Showa Denko's polycyclic thermoset

3.3.20.

Low-loss thermoset laminate suppliers: Mitsubishi Gas Chemical's BT laminate

3.3.21.

Low-loss thermoset laminate suppliers: Isola

3.3.22.

Low-loss thermoset laminate suppliers: Isola

3.4.

Low-loss thermoplastics: Liquid crystal polymers

3.4.1.

Liquid crystal polymers (LCP)

3.4.2.

LCP classification

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