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Semiconductor Photonic Integrated Circuits 2023-2033


半導体光集積回路 2023-2033年

この調査レポートは、2023-2033年の半導体光集積回路について詳細に調査・分析しています。    主な掲載内容（目次より抜粋） 予測 技術概要 ピックアプリ... もっと見る

　

　

出版社 出版年月 価格 ページ数 言語
IDTechEx
アイディーテックエックス 		2022年12月16日 お問い合わせください
ライセンス・価格情報
注文方法はこちら 		230 英語

※価格はデータリソースまでお問い合わせください。


　

Summary

この調査レポートは、2023-2033年の半導体光集積回路について詳細に調査・分析しています。 
 
主な掲載内容（目次より抜粋）
  • 予測
  • 技術概要
  • ピックアプリケーション
  • プレーヤーと製品
 
Report Summary
The report is separated into five chapters. The first is an executive summary, where details pertaining to the main Photonic Integrated Circuit (PIC) applications within each of the six forecasted market segments are given, as well as an account of the key market players within the supply chain, from design to final product.
 
The second covers Forecasts, with each of the PIC applications in the market segments discussed in the Executive Summary reviewed. The first market subsection covers the Communications industry, as this is the main driver behind PIC development. The forecast is disaggregated by platform and geography, and methodology discussed. For each of the other market segments, market players developing PICs are identified, incumbent technologies are discussed, and individual forecasts are given for PIC applications within those market segments. Each of these segments is then rounded off with a total forecast. Cumulative forecasts are given at the beginning of the chapter, where we show that PIC applications globally will grow by 16.85% CAGR over the course of the forecast window, 2023-2033. We predict that communications will continue to be the dominant market for PICs in 2033, with a generated revenue of US$16.0 Billion. Automotive will be ranked second, with a generated revenue of US$2.5 Billion in 2033. This figure is composed almost entirely of PIC LiDAR sales, an enabler for autonomous driving and Smart Cities.
 
The third chapter covers Technology, wherein the technology review begins at a basic physical level with understanding electrical ICs. Photonic ICs are contextualized with respect to electrical ICs, and some of the structures used for chip (and modular) design are discussed. The review then goes into industry-specific processes, such as packaging, wafer production, and design processes. While these processes are not specific to the data communications market, it should be noted that we often keep this market in mind when discussing technology, due to its importance.
 
The fourth chapter covers PIC Applications, where the technology requirements for optical transceivers, photonic processors (to achieve neuromorphic architectures) and quantum computing using photonics, are all reviewed. The key market drivers for PIC development are also outlined, these being: Higher bandwidth through a single channel, low latency, high power efficiency (with PICs operating at the lowest possible power) and scalability that allows for low cost, especially for the end-user.
 
The final chapter covers the Players and Products, primarily within the Communications market. Seven established companies are reviewed, where they have been chosen due to their impact on the data communications market segment. For each company, financial information (such as revenue and geographic market disaggregation) and company news is discussed, followed by an overview of their relevant product lines and specifications for their PIC products. In addition, twelve start-up companies are reviewed, as well as twelve organizations that are working to develop the European ecosystem for semiconductor photonics.
 
Key Aspects
This report provides the following information
 
Technology trends, design and manufacture analysis
  • Technology and business review of major market players
  • Detailed overview of supply chain
  • Analysis of the product offerings of key market players
  • Technology review of Photonic Integrated Circuits
  • Comparisons between material platforms
  • Categorization of key companies by material platforms employed, geography, and type.
  • Analysis of key company revenue.
  • Developments in technology towards achieving best-in-class of key metrics.
  • Overview of the growing European ecosystem.
  • Profiles of start-up companies in each of the market segments.
  • Primary information from key companies.
 
Market Forecasts & Analysis:
  • 10-year granular market forecasts by six markets.
  • Application case studies for both established and emerging markets.



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Table of Contents

1. EXECUTIVE SUMMARY
1.1. What is a photonic integrated circuit?
1.2. Why PICs?
1.3. Addressable markets for photonic integrated circuits
1.4. Agriculture
1.5. Biomedical
1.6. Automotive and aerospace
1.7. Smart factories
1.8. Information and communications
1.9. Smart cities and smart living
1.10. Energy and environment
1.11. Material platforms
1.12. Material attribute comparisons - cost and loss
1.13. Material attribute comparisons - modulation and scalability
1.14. Material comparisons - Si, SiN, InP
1.15. Material comparisons - TFLN, BTO, Polymer, Glass
1.16. Integration schemes
1.17. PIC components
1.18. Production workflow
1.19. Main drivers of PIC manufacture
1.20. Companies in the supply chain
1.21. Supply chain companies by geography
1.22. Supply chain companies by material platform
1.23. Funding achieved by start-ups
1.24. Largest data centers by area
1.25. Scope of report
2. FORECASTS
2.1. Cumulative Forecasts
2.1.1. PIC forecast by market
2.1.2. PIC forecast excluding communications
2.1.3. PIC granular forecast excluding communications
2.1.4. Cumulative forecast explanation
2.2. Communications
2.2.1. PICs for communications industry forecast
2.2.2. PICs for communications industry forecast interpretation
2.2.3. Regional forecast
2.2.4. Regional forecast analyst
2.2.5. Material disaggregation forecast
2.2.6. Adjusted material disaggregation forecast
2.2.7. Unadjusted material disaggregation forecast analysis
2.2.8. Adjusted material disaggregation forecast analysis
2.2.9. Adjusted material disaggregation forecast trend discussion
2.2.10. Other PIC applications
2.2.11. Technology Readiness Level
2.3. Agriculture
2.3.1. Market players developing PICs
2.3.2. Incumbent technologies
2.3.3. PIC gas sensor forecast
2.3.4. PIC LiDAR forecast
2.3.5. PIC product monitoring/analysis forecast
2.3.6. Changing market share due to PICs
2.3.7. Agricultural PIC forecast
2.3.8. Notes on forecast methodology
2.4. Biomedical
2.4.1. Market players developing PICs
2.4.2. Incumbent technologies
2.4.3. PIC wearable sensors
2.4.4. PICs for kinaesthetic haptics
2.4.5. Global POC biosensor forecast by format type
2.4.6. PIC POC IVD forecast
2.4.7. Changing market share due to PICs
2.4.8. Biomedical PIC forecast
2.4.9. Notes on forecast methodology
2.5. Automotive
2.5.1. Market players developing PICs
2.5.2. Incumbent technologies
2.5.3. Global automotive LiDAR market value by technology
2.5.4. PICs for automotive LiDAR
2.6. Energy & Environment
2.6.1. Market players developing PICs
2.6.2. Incumbent technologies
2.6.3. Environmental gas sensor forecast
2.6.4. PIC gas sensor environmental forecast
2.7. Smart Factories, Cities, and Living
2.7.1. Developers and incumbent technologies
2.7.2. Industrial PICs - smart factories and structural monitoring
3. TECHNOLOGY OVERVIEW
3.1. Technology Background
3.1.1. The data drive
3.1.2. Photonic integrated circuits - what and why
3.1.3. Electronic limitations
3.1.4. RC delay
3.1.5. Material considerations
3.1.6. Photonic systems
3.1.7. Optical integration
3.1.8. Optical systems
3.1.9. Chip-to-Chip Interconnects
3.1.10. Interposers and advanced technology
3.1.11. Integration schemes
3.2. 2.5D and 3D packaging
3.2.1. Top-level assembly chain
3.2.2. Semiconductor packaging timeline
3.2.3. From 1D to 3D semiconductor packaging
3.2.4. Semiconductor supply chain players
3.2.5. Traditional supply chain
3.2.6. Changing architectures
3.2.7. 2D packaging - System-on-Chip
3.2.8. 2D packaging - Multi-Chip Modules
3.2.9. 2.5D and 3D packaging - System-in-Package
3.2.10. 3D packaging - System-on-Package
3.2.11. 3D packaging - stacked ICs
3.3. Photonic platforms
3.3.1. Material platforms
3.3.2. Silicon photonics: a disambiguation
3.3.3. Semiconductor photonics
3.3.4. Advantages and challenges of semiconductor photonics
3.3.5. Applications in brief
3.3.6. Ingredients of a PIC - why silicon?
3.3.7. Ingredients of a PIC - emission (1)
3.3.8. Ingredients of a PIC - emission (2)
3.3.9. Ingredients of a PIC - emission (3)
3.3.10. Ingredients of a PIC - modulation
3.3.11. Ingredients of a PIC - detection
　

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