Global Alternative Energy Market Size study & Forecast, by Type (Nuclear Energy, Solar Energy, Geothermal Energy) by End User (Industrial, Commercial, Residential) and Regional Analysis, 2022-2029
Automotive Semiconductor Global Market Opportunities And Strategies To 2031Including: 1) By Component: Processor; Analog IC; Discrete Power; Sensor; Memory2) By Application: Powertrain; Safety; Body Electronics; Chassis; Telematics And Infotainment3) By Vehicle Type: Passenger Vehicle; Light Commercial Vehicle; Medium and Heavy Commercial Vehicle4) By Propulsion Type: Internal Combustion Engine; Electric; HybridCovering: Infineon Technologies AG; STMicroelectronics N.V; Texas Instruments, Inc.; Renesas Electronics Corp; NXP Semiconductors N.V.
Global 3D IC Packaging Market Size study & Forecast, by Packaging Technology (3D wafer-level chip-scale packaging (WLCSP), 3D TSV), by End-User (Consumer Electronics, Aerospace and Defense, Medical Devices, Communications and Telecom, Automotive), and Regional Analysis, 2022-2029
Gallium Nitride Semiconductor Devices Global Market Opportunities And Strategies To 2031Including: 1) By Component: Transistor; Diode; Rectifier; Power IC2) By Device Type: Opto-Semiconductors; Power Semiconductors; RF Semiconductors3) By Application: Automotive; Consumer Electronics; Defense And Aerospace; Healthcare; Industrial And Power; Information And Communication Technology4) By Wafer Size: 2 Inch; 4 Inch; 6 Inch; 8 InchCovering: Texas Instruments Incorporated; Toshiba Corporation; Infineon Technologies AG; Fujitsu Limited; NXP Semiconductors N.V.