相互接続部品と受動部品の2030年までの市場予測

Interconnect And Passive Components Market Forecast to 2030

相互接続部品と受動部品の2030年までの市場予測市場概要インターコネクト・パッシブコンポーネントの市場規模は予測期間中に6.1%のCAGRが予測されます。電気部品ビジネスは、機械的な進歩のある宇宙では基本... もっと見る

出版社	出版年月	電子版価格	ページ数	言語
Market Research Future マーケットリサーチフューチャー (MRFR)	2023年5月8日	US$7,250 ライセンス・価格情報・注文方法はこちら	110	英語

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サマリー

相互接続部品と受動部品の2030年までの市場予測
市場概要
インターコネクト・パッシブコンポーネントの市場規模は予測期間中に6.1%のCAGRが予測されます。電気部品ビジネスは、機械的な進歩のある宇宙では基本的なものである。この領域が拡大し、今日の顧客が期待する電子機器の在庫を迅速に入手できるよう、優れた在庫チェーンによって維持されることが重要である。
IoT（Web of Things）とは、ウェブに関連した実際のモノの組織である。これらのモノは、内外の影響とつながることができる革新的な技術を持っています。小売、交通、園芸、住宅、都市、生活様式、在庫ネットワーク、危機、医療サービス、気候、エネルギーなどが、IoTが活用されている領域です。IoTガジェットは、フレームワークをより利用しやすくし、フレームワークの空き時間を制限することで、一般的な生産と機能的な有効性を構築するために製造事務所に力を与え、世界中の現代地域を変化させています。また、Modern 4.0の進展により、さまざまなモダンオフィスでさまざまな接続ガジェットが使用されるようになり、遠隔監視による機能サイクルの円滑化が促進されています。
市場区分
インターコネクトとパッシブコンポーネントの市場は、パッシブコンポーネントとインターコネクトというコンポーネントの種類によって区分されます。携帯電話、コンピューター、家電製品、ゲーム機などの電子機器には、受動部品と相互接続部品が不可欠な構成部品として利用されています。
相互接続部品と受動部品の用途別市場は、コンシューマーエレクトロニクス、IT・通信、自動車、産業、航空宇宙・防衛、ヘルスケア、その他で構成されています。IT・通信分野は、予想される期間中に急成長することが予想されます。
地域別インサイト
アジア太平洋地域は、予測期間中、相互接続および受動部品市場で大きなシェアを占めると思われます。
アジア太平洋（APAC）地域は最も人口の多い地域で、中国、インド、日本、韓国を含む世界の重要な経済圏の一部で構成されています。APAC市場の需要は、例えば、急速に成長している半導体市場などの変数によって強化されています。また、APAC市場は、天然物質コストの上昇や同地域の分断化などの要素により、世界市場で最も注目される所得を有すると考えられています。アジア太平洋地域は、96.5百万米ドルの市場規模を達成し、受動・接続電子部品市場全体の中で最も有力な地域となった。この地域の発展は、主要な電子製品メーカーと輸出業者の存在によって大きく左右されます。サムスン電子、BBKエレクトロニクス（Oppo、Realme、Vivoなどのブランドを含む）、Foxconn Innovation Gathering、Xiaomi Organizationなどの主要なショッパーエレクトロニクスメーカーの存在は、地域の発展にとって良い印象を与えるはずである。
主要なプレーヤー
相互接続および受動部品市場の主要企業は、KYOCERA AVX COMPONENTS CORPORATION.(京セラ株式会社）、Molex LLC、パナソニック株式会社、Ametek Inc.、Amphenol Corporation、Vishay Intertechnology, Inc.、Murata Manufacturing Co.村田製作所、TDK株式会社、サムスン電子、ホシデン株式会社、富士通株式会社、TE Connectivity、Hon Hai Precision Industry Co.(株)村田製作所、(株)サムスン電子、(株)ホシデン、富士通(株)、(株)TEコネクティビティ、Hon Hai Precision Industry Co.Ltd.、Mouser Electronics, Inc.
COVID 19の影響
当社は、COVID-19パンデミックがあらゆる分野の様々な業界や業種に与える影響を継続的に追跡しています。当社の調査レポートでは、COVID-19の産業への影響による減少や上昇を把握することができます。また、関心のある市場の需要と供給のギャップを特定するのに役立ちます。さらに、このレポートは、分析、改正された政府規制、および他の多くの有用な洞察であなたを支援します。

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TABLE OF CONTENTS
1. EXECUTIVE SUMMARY
1.1. MARKET ATTRACTIVENESS ANALYSIS
1.1.1. GLOBAL INTERCONNECT AND PASSIVE COMPONENTS MARKET, BY COMPONENT TYPE
1.1.2. GLOBAL INTERCONNECT AND PASSIVE COMPONENTS MARKET, BY APPLICATION
1.1.3. GLOBAL INTERCONNECT AND PASSIVE COMPONENTS MARKET, BY REGION
2. MARKET INTRODUCTION
2.1. DEFINITION
2.2. SCOPE OF THE STUDY
2.3. MARKET STRUCTURE
2.4. KEY BUYING CRITERIA
2.5. MACRO FACTOR INDICATOR ANALYSIS
3. RESEARCH METHODOLOGY
3.1. RESEARCH PROCESS
3.2. PRIMARY RESEARCH
3.3. SECONDARY RESEARCH
3.4. MARKET SIZE ESTIMATION
3.5. FORECAST MODEL
3.6. LIST OF ASSUMPTIONS
4. MARKET DYNAMICS
4.1. INTRODUCTION
4.2. DRIVERS
4.2.1. SIGNIFICANT ADOPTION OF IOT DEVICES IN INDUSTRIAL SECTOR
4.2.2. RISING DEMAND FOR PASSIVE AND INTERCONNECTING COMPONENTS IN 3C APPLICATIONS
4.2.3. INCREASING DEMAND FOR MINIATURIZED AND HIGH-PERFORMANCE ELECTRONIC DEVICES
4.2.4. RISING ADOPTION OF ROBOTS ACROSS INDUSTRIES
4.2.5. GROWING ADOPTION OF PASSIVE AND INTERCONNECTS IN AUTOMOTIVE INDUSTRY
4.2.6. DRIVERS IMPACT ANALYSIS
4.3. RESTRAINTS
4.3.1. LIMITATION IN INTERCONNECTS AS DEVICE SHRINK IN SIZE.
4.3.2. RESTRAINTS IMPACT ANALYSIS
4.4. OPPORTUNITIES
4.4.1. ADVANCEMENT IN INDUSTRIAL M2M COMMUNICATIONS AND RISING INDUSTRIAL AUTOMATION.
4.4.2. NEED FOR PASSIVE COMPONENTS IN MISSION CRITICAL MARKETS.
4.4.3. GROWING NEED FOR HIGH RELIABILITY ELECTRONIC COMPONENTS
4.5. IMPACT OF COVID-19
4.5.1. IMPACT ON SEMICONDUCTOR INDUSTRY
4.5.2. GLOBAL ELECTRONIC COMPONENT SHORTAGE
4.5.3. IMPACT ON OVERALL ELECTRONIC INDUSTRY
5. MARKET FACTOR ANALYSIS
5.1. VALUE CHAIN ANALYSIS/SUPPLY CHAIN ANALYSIS
5.2. PORTER’S FIVE FORCES MODEL
5.3. BARGAINING POWER OF SUPPLIERS
5.4. BARGAINING POWER OF BUYERS
5.5. THREAT OF NEW ENTRANTS
5.6. THREAT OF SUBSTITUTES
5.7. INTENSITY OF RIVALRY
6. GLOBAL INTERCONNECT AND PASSIVE COMPONENTS MARKET, BY COMPONENT TYPE
6.1. INTRODUCTION
6.2. PASSIVE
6.2.1. CAPACITORS
6.2.2. RESISTORS
6.2.3. INDUCTORS
6.2.4. TRANSFORMERS
6.2.5. DIODES
6.2.6. OTHERS
6.3. INTERCONNECTS
6.3.1. PCB
6.3.2. CONNECTORS/ SOCKETS
6.3.3. RELAYS
6.3.4. SWITCHES
6.3.5. OTHERS
7. GLOBAL INTERCONNECT AND PASSIVE COMPONENTS MARKET, BY APPLICATION
7.1. INTRODUCTION
7.2. CONSUMER ELECTRONICS
7.3. IT & TELECOMMUNICATIONS
7.4. AUTOMOTIVE
7.5. INDUSTRIAL
7.6. AEROSPACE & DEFENSE
7.7. HEALTHCARE
7.8. OTHERS
8. GLOBAL INTERCONNECT AND PASSIVE COMPONENTS MARKET SIZE ESTIMATION & FORECAST, BY REGION
8.1. INTRODUCTION
8.2. NORTH AMERICA
8.2.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2030
8.2.2. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.2.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.2.4. US
8.2.5. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.2.6. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.2.7. CANADA
8.2.8. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.2.9. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.2.10. MEXICO
8.2.11. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.2.12. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.3. EUROPE
8.3.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2030
8.3.2. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.3.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.3.4. UK
8.3.4.1. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.3.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.3.5. GERMANY
8.3.5.1. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.3.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.3.6. FRANCE
8.3.6.1. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.3.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.3.7. REST OF EUROPE
8.3.7.1. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.3.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.4. ASIA-PACIFIC
8.4.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2030
8.4.2. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.4.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.4.4. CHINA
8.4.4.1. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.4.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.4.5. JAPAN
8.4.5.1. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.4.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.4.6. INDIA
8.4.6.1. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.4.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.4.7. REST OF ASIA-PACIFIC
8.4.7.1. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.4.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.5. MIDDLE EAST & AFRICA
8.5.1. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
8.6. SOUTH AMERICA
8.6.1. MARKET ESTIMATES & FORECAST, BY COMPONENT TYPE, 2018-2030
8.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2030
9. COMPETITIVE LANDSCAPE
9.1. INTRODUCTION
9.2. KEY DEVELOPMENTS & GROWTH STRATEGIES
9.3. COMPETITOR BENCHMARKING
9.4. VENDOR SHARE ANALYSIS, 2021(% SHARE)
10. COMPANY PROFILES
10.1. KYOCERA AVX COMPONENTS CORPORATION. (KYOCERA CORPORATION)
10.1.1. COMPANY OVERVIEW
10.1.2. FINANCIAL OVERVIEW
10.1.3. SOLUTION/SERVICES OFFERED
10.1.4. KEY DEVELOPMENTS
10.1.5. SWOT ANALYSIS
10.1.6. KEY STRATEGIES
10.2. MOLEX LLC
10.2.1. COMPANY OVERVIEW
10.2.2. FINANCIAL OVERVIEW
10.2.3. SOLUTION/SERVICES OFFERED
10.2.4. KEY DEVELOPMENTS
10.2.5. SWOT ANALYSIS
10.2.6. KEY STRATEGIES
10.3. PANASONIC CORPORATION
10.3.1. COMPANY OVERVIEW
10.3.2. FINANCIAL OVERVIEW
10.3.3. SOLUTION/SERVICES OFFERED
10.3.4. KEY DEVELOPMENTS
10.3.5. SWOT ANALYSIS
10.3.6. KEY STRATEGIES
10.4. AMETEK INC.
10.4.1. COMPANY OVERVIEW
10.4.2. FINANCIAL OVERVIEW
10.4.3. SOLUTION/SERVICES OFFERED
10.4.4. KEY DEVELOPMENTS
10.4.5. SWOT ANALYSIS
10.4.6. KEY STRATEGIES
10.5. AMPHENOL CORPORATION
10.5.1. COMPANY OVERVIEW
10.5.2. FINANCIAL OVERVIEW
10.5.3. SOLUTION/SERVICES OFFERED
10.5.4. KEY DEVELOPMENTS
10.5.5. SWOT ANALYSIS
10.5.6. KEY STRATEGIES
10.6. VISHAY INTERTECHNOLOGY, INC.
10.6.1. COMPANY OVERVIEW
10.6.2. FINANCIAL OVERVIEW
10.6.3. SOLUTION/SERVICES OFFERED
10.6.4. KEY DEVELOPMENTS
10.6.5. SWOT ANALYSIS
10.6.6. KEY STRATEGIES
10.7. MURATA MANUFACTURING CO. LTD.
10.7.1. COMPANY OVERVIEW
10.7.2. FINANCIAL OVERVIEW
10.7.3. SOLUTION/SERVICES OFFERED
10.7.4. KEY DEVELOPMENTS
10.7.5. SWOT ANALYSIS
10.7.6. KEY STRATEGIES
10.8. TDK CORPORATION
10.8.1. COMPANY OVERVIEW
10.8.2. FINANCIAL OVERVIEW
10.8.3. SOLUTION/SERVICES OFFERED
10.8.4. KEY DEVELOPMENTS
10.8.5. SWOT ANALYSIS
10.8.6. KEY STRATEGIES
10.9. SAMSUNG ELECTRO-MECHANICS
10.9.1. COMPANY OVERVIEW
10.9.2. FINANCIAL OVERVIEW
10.9.3. SOLUTION/SERVICES OFFERED
10.9.4. KEY DEVELOPMENTS
10.9.5. SWOT ANALYSIS
10.9.6. KEY STRATEGIES
10.10. HOSIDEN CORPORATION
10.10.1. COMPANY OVERVIEW
10.10.2. FINANCIAL OVERVIEW
10.10.3. SOLUTION/SERVICES OFFERED
10.10.4. KEY DEVELOPMENTS
10.10.5. SWOT ANALYSIS
10.10.6. KEY STRATEGIES
10.11. FUJITSU
10.11.1. COMPANY OVERVIEW
10.11.2. FINANCIAL OVERVIEW
10.11.3. SOLUTION/SERVICES OFFERED
10.11.4. KEY DEVELOPMENTS
10.11.5. SWOT ANALYSIS
10.11.6. KEY STRATEGIES
10.12. TE CONNECTIVITY
10.12.1. COMPANY OVERVIEW
10.12.2. FINANCIAL OVERVIEW
10.12.3. SOLUTION/SERVICES OFFERED
10.12.4. KEY DEVELOPMENTS
10.12.5. SWOT ANALYSIS
10.12.6. KEY STRATEGIES
10.13. HON HAI PRECISION INDUSTRY CO. LTD.
10.13.1. COMPANY OVERVIEW
10.13.2. FINANCIAL OVERVIEW
10.13.3. SOLUTION/SERVICES OFFERED
10.13.4. KEY DEVELOPMENTS
10.13.5. SWOT ANALYSIS
10.13.6. KEY STRATEGIES
10.14. HIROSE ELECTRIC CO. LTD.
10.14.1. COMPANY OVERVIEW
10.14.2. FINANCIAL OVERVIEW
10.14.3. SOLUTION/SERVICES OFFERED
10.14.4. KEY DEVELOPMENTS
10.14.5. SWOT ANALYSIS
10.14.6. KEY STRATEGIES
10.15. MOUSER ELECTRONICS, INC.
10.15.1. COMPANY OVERVIEW
10.15.2. FINANCIAL OVERVIEW
10.15.3. SOLUTION/SERVICES OFFERED
10.15.4. KEY DEVELOPMENTS
10.15.5. SWOT ANALYSIS
10.15.6. KEY STRATEGIES

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図表リスト

LIST OF FIGURES

FIGURE 1 MARKET ATTRACTIVENESS ANALYSIS: GLOBAL INTERCONNECT AND PASSIVE COMPONENTS MARKET 19

FIGURE 2 GLOBAL INTERCONNECT AND PASSIVE COMPONENTS MARKET: MARKET STRUCTURE 21

FIGURE 3 BOTTOM-UP AND TOP-DOWN APPROACHES 26

FIGURE 4 MARKET DYNAMIC ANALYSIS OF THE GLOBAL INTERCONNECTS AND PASSIVE COMPONENTS MARKET 29

FIGURE 5 DRIVER IMPACT ANALYSIS 33

FIGURE 6 RESTRAINTS IMPACT ANALYSIS 34

FIGURE 7 GLOBAL INTERCONNECTS AND PASSIVE COMPONENTS MARKET: VALUE CHAIN ANALYSIS 40

FIGURE 8 PORTER'S FIVE FORCES ANALYSIS OF THE GLOBAL INTERCONNECTS AND PASSIVE COMPONENTS MARKET 41

FIGURE 9 GLOBAL INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COMPONENT TYPE, 2021 (%) 43

FIGURE 10 GLOBAL INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COMPONENT TYPE, 2021 VS 2030 (USD MILLION) 43

FIGURE 11 GLOBAL INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY APPLICATION, 2021 (%) 48

FIGURE 12 GLOBAL INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY APPLICATION, 2021 VS 2030 (USD MILLION) 48

FIGURE 13 GLOBAL INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY REGION, 2021 (%) 52

FIGURE 14 INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY REGION, 2021 VS 2030 (USD MILLION) 53

FIGURE 15 ASIA-PACIFIC: INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COUNTRY, 2021 (%) 55

FIGURE 16 ASIA-PACIFIC: INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COUNTRY, 2021 VS 2030 (USD MILLION) 55

FIGURE 17 ASIA-PACIFIC INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COMPONENT TYPE, 2018–2030

(USD MILLION) 56

FIGURE 18 ASIA-PACIFIC INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY APPLICATION, 2018 TO 2030 (USD MILLION) 58

FIGURE 19 NORTH AMERICA: INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COUNTRY, 2021 (%) 66

FIGURE 20 NORTH AMERICA: INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COUNTRY, 2021 VS 2030

(USD MILLION) 67

FIGURE 21 NORTH AMERICA INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COMPONENT TYPE, 2018–2030

(USD MILLION) 68

FIGURE 22 NORTH AMERICA INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY APPLICATION, 2018 TO 2030

(USD MILLION) 69

FIGURE 23 EUROPE: INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COUNTRY, 2021 (%) 73

FIGURE 24 EUROPE: INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COUNTRY, 2021 VS 2030 (USD MILLION) 74

FIGURE 25 EUROPE INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COMPONENT TYPE, 2018–2030 (USD MILLION) 74

FIGURE 26 EUROPE INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY APPLICATION, 2018 TO 2030 (USD MILLION) 76

FIGURE 27 MIDDLE EAST AND AFRICA INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COMPONENT TYPE,

2018–2030 (USD MILLION) 84

FIGURE 28 MIDDLE EAST AND AFRICA INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY APPLICATION, 2018 TO 2030

(USD MILLION) 86

FIGURE 29 SOUTH AMERICA INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY COMPONENT TYPE, 2018–2030

(USD MILLION) 87

FIGURE 30 SOUTH AMERICA INTERCONNECTS AND PASSIVE COMPONENT TYPES MARKET, BY APPLICATION, 2018 TO 2030

(USD MILLION) 88

FIGURE 31 GLOBAL INTERCONNECTS AND PASSIVE COMPONENTS MARKET: COMPETITIVE BENCHMARKING 92

FIGURE 32 VENDOR SHARE ANALYSIS (2021, %) 93

FIGURE 33 KYOCERA AVX COMPONENTS CORPORATION. (KYOCERA CORPORATION): FINANCIAL OVERVIEW SNAPSHOT 100

FIGURE 34 KYOCERA AVX COMPONENTS CORPORATION. (KYOCERA CORPORATION): SWOT ANALYSIS 103

FIGURE 35 PANASONIC CORPORATION: FINANCIAL OVERVIEW SNAPSHOT 112

FIGURE 36 PANASONIC CORPORATION: SWOT ANALYSIS 115

FIGURE 37 AMETEK INC.: FINANCIAL OVERVIEW SNAPSHOT 117

FIGURE 38 AMETEK INC.: SWOT ANALYSIS 119

FIGURE 39 AMPHENOL CORPORATION: FINANCIAL OVERVIEW SNAPSHOT 121

FIGURE 40 AMPHENOL CORPORATION: SWOT ANALYSIS 124

FIGURE 41 VISHAY INTERTECHNOLOGY, INC.: FINANCIAL OVERVIEW SNAPSHOT 126

FIGURE 42 VISHAY INTERTECHNOLOGY, INC.: SWOT ANALYSIS 128

FIGURE 43 TDK CORPORATION: FINANCIAL OVERVIEW SNAPSHOT 131

FIGURE 44 TDK CORPORATION: SWOT ANALYSIS 132

FIGURE 45 SAMSUNG ELECTRO-MECHANICS: FINANCIAL OVERVIEW SNAPSHOT 135

FIGURE 46 SAMSUNG ELECTRO-MECHANICS: SWOT ANALYSIS 137

FIGURE 47 HOSIDEN CORPORATION: FINANCIAL OVERVIEW SNAPSHOT 138

FIGURE 48 HOSIDEN CORPORATION: SWOT ANALYSIS 140

FIGURE 49 FUJITSU LTD: FINANCIAL OVERVIEW SNAPSHOT 142

FIGURE 50 FUJITSU LTD: SWOT ANALYSIS 144

FIGURE 51 TE CONNECTIVITY: FINANCIAL OVERVIEW SNAPSHOT 146

FIGURE 52 TE CONNECTIVITY: SWOT ANALYSIS 149

FIGURE 53 HON HAI PRECISION INDUSTRY CO. LTD.: FINANCIAL OVERVIEW SNAPSHOT 151

FIGURE 54 HON HAI PRECISION INDUSTRY CO. LTD.: SWOT ANALYSIS 152

FIGURE 55 MURATA MANUFACTURING CO. LTD.: FINANCIAL OVERVIEW SNAPSHOT 155

FIGURE 56 MURATA MANUFACTURING CO. LTD.: SWOT ANALYSIS 158

FIGURE 57 HIROSE ELECTRIC CO. LTD.: FINANCIAL OVERVIEW SNAPSHOT 162

FIGURE 58 HIROSE ELECTRIC CO LTD: SWOT ANALYSIS 164

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Table of Contents
List of Tables/Graphs

Summary

Interconnect And Passive Components Market Forecast to 2030
Market Overview
Interconnect And Passive Components Market Size is projected to CAGR of 6.1% during the forecast period. The electrical components business is basic in a universe of mechanical progression. It is important that the area proceeds to extend and be upheld by great stockpile chains to make the promptly available inventory of electronic gadgets that clients today anticipate.
The Web of Things (IoT) is an organization of actual things that are associated with the Web. These actual things highlight innovation that permits them to connect with both inside and outside impacts. Retail, transportation, horticulture, shrewd home, savvy city, ways of life, inventory network, crisis, medical services, climate, and energy are regions where IoT is utilized. IoT gadgets are changing the modern area all around the world by empowering fabricating offices to build their general production and functional effectiveness by making their frameworks more available and limiting complete framework free time. The improvement of Modern 4.0 has likewise prompted the sending of different connected gadgets in different modern offices, which will assist with smoothing out functional cycles through remote observation.
Market Segmentation
The market for interconnects and passive components has been divided into segments based on component type: passive and interconnects. Electronic devices including cellphones, computers, electrical home appliances, and game consoles utilise passive and linked electronic components as essential parts of their construction.
Consumer Electronics, IT & Telecommunications, Automotive, Industrial, Aerospace & Defence, Healthcare, and Others make up the market for interconnects and passive components by application segment. The IT & telecommunications segment is anticipated to grow quickly during the anticipated timeframe.
Regional Insights
Asia Pacific is supposed to have a huge share of the Interconnect and Passive Components Market during the projected period.
Asia Pacific (APAC) region is the most populated region, the region comprises of a portion of the significant economies of the world including China, India, Japan, and South Korea. APAC's market request is being reinforced by variables, for example, the quickly creating semiconductor market. Also, the APAC market is supposed to have the most noteworthy income assortments in the worldwide market, attributable to elements like rising natural substance costs and the divided person of the area. Asia Pacific accomplished a market size of USD 96.5 million arising as the prevailing region in the whole market for passive and interconnecting electronic components. The development is significantly determined by the presence of major electronic product makers and exporters in the region. The presence of key shopper electronics makers like Samsung Electronics Co., Ltd., BBK Electronics (Counting brands like Oppo, Realme, and Vivo), Foxconn Innovation Gathering, and Xiaomi Organization is supposed to look good for the regional development.
Major Players
Key Companies in the Interconnect and Passive Components market are KYOCERA AVX COMPONENTS CORPORATION. (KYOCERA CORPORATION), Molex LLC, Panasonic Corporation, Ametek Inc., Amphenol Corporation, Vishay Intertechnology, Inc., Murata Manufacturing Co. Ltd., TDK Corporation, Samsung Electro-Mechanics, Hosiden Corporation, Fujitsu, TE Connectivity, Hon Hai Precision Industry Co. Ltd., HIROSE Electric Co. Ltd., and Mouser Electronics, Inc.
COVID 19 Impacts
We are continuously tracking the impact of the COVID-19 pandemic on various industries and verticals within all domains. Our research reports include the same and help you understand the drop and rise, owing to the impact of COVID-19 on industries. Also, we help you to identify the gap between the demand and supply of your interested market. Moreover, the report helps you with the analysis, amended government regulations, and many other useful insights.

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相互接続部品と受動部品の2030年までの市場予測

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