Summary
World Markets, Technologies and Opportunities: 2024-2027
A study of global markets for electrode and termination materials for multilayered stacked ceramic components; covering ores, powders and pastes in Palladium, Nickel, Copper and Silver With Value, Volume and Pricing Forecasts to 2027.
Paumanok Publications, Inc., Saxapahaw, NC USA has published “Electrodes and Terminations: World Markets, Technologies and Opportunities: 2024-2027 ISBN# 1-89-3211-38-X,” which is a detailed deep dive analysis of four metals markets feeding into the global stacked ceramic component markets as electrodes and terminations- considered cornerstone to all electronic circuits worldwide. This detailed analysis is produced with an eye on creating transparency from raw materials costs to produce ceramic chip components. Metals in the form of ores, powders and pastes are consumed by the multilayered ceramic chip component markets with emphasis on two base metals and two precious metals; this market study traces their detailed supply chains to the paste and ink processors, the nano-technology powder producers and the ore miners that support the global high-tech economy.
Paumanok Industrial Market Research employs a vertical research model that has data input resources at each level of the supply chain- mining, materials production, component manufacturing; component distribution, component consumption and materials recycling. This creates a legacy of data, whereby each segment of the supply chain is a set of checks and balances for data coming from the components markets. This methodology also provides the best short-term and long-term forecasting model for Paumanok IMR predictive analytics. This article focuses on four metals that are consumed as electrodes and terminations in passive electronic components and includes two precious metals and two base metals. We use this data to monitor the variable costs structure for producing passive electronic components. Electrodes and terminations and fundamental to the construction of passive electronic components, with emphasis upon stacked ceramic solutions for capacitance, resistance, inductance and sensing in electronic circuits.
In an effort to achieve higher operating functionality, electronic components adopted a stacking method for ceramic dielectric materials almost 70 years ago. This stacking capability has evolved over time to handle increasingly thinner layers; which in turn has fostered in an age of increased volumetric efficiency in portable electronics. The specific product lines that benefited from increased functionality through stacking includes multilayered ceramic chip Multilayered Ceramic components (MLC); multilayered chip varistors; ceramic chip coil inductors; PTC thermistors, NTC thermistors and various types of EMC, EMI and RFI filters. A cornerstone material supply chain for multilayered chip components is the precious and base metals used for electrodes and terminations and matched with the ceramic stacks. This study sheds light on the metals ecosystems that feed into mass produced electronic components.
The Stacking Method for Electronic components creates opportunities for base and precious metals in the form of metal electrodes and metal terminations. These metals represent a significant cost for component manufacturers and also involves ecosystems and expertise outside of the direct control of the component manufacturers.
“Electrodes and Terminations: World Markets, Technologies and Opportunities: 2024-2027 ISBN# 1-89-3211-38-X,” is a study of global markets for electrode and termination materials for multilayered stacked ceramic components; covering ores, powders and pastes in Palladium, Nickel, Copper and Silver With Value, Volume and Pricing Forecasts to 2027.
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Table of Contents
Table of Contents
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Table of Contents. 3
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Table of Figures and Graphs . 12
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INTRODUCTION: . 15
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THE STACKING METHOD FOR MASS PRODUCED ELECTRONIC COMPONENTS: . 16
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TYPES OF ELECTRODES FOR STACKED ELECTRONIC COMPONENTS: . 18
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PRECIOUS METAL ELECTRODES . 18
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Palladium Electrodes: . 18
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Silver Electrodes: . 18
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Exotic Precious Metal Electrodes: . 18
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BASE METAL ELECTRODES. 19
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Nickel Electrodes: . 19
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Copper Electrodes: . 19
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Electrode Matching Systems: . 19
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Ceramic Matching System: . 19
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Termination Matching System: . 19
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TYPES OF TERMINATIONS FOR STACKED CERAMIC ELECTRONIC COMPONENTS . 20
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Precious Metal Terminations: . 20
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Silver Terminations: . 20
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Base Metal Terminations: . 20
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Copper Terminations: . 20
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Termination Matching Systems: . 20
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METALS AS A VARIABLE COST TO PRODUCE STACKED CERAMIC ELECTRONIC COMPONENTS . 20
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PASSIVE COMPONENT RAW MATERIAL INDEX UPDATE . 21
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HOW MATERIALS IMPACT PASSIVE ELECTRONIC COMPONENT COSTS TO PRODUCE: . 23
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PALLADIUM COSTS, TRENDS AND DIRECTIONS . 23
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NICKEL: THE PRIME ALTERNATIVE TO PRECIOUS METALS IN PASSIVE COMPONENTS . 25
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COPPER: A BASE TERMINATION METAL. 27
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SILVER: A PRECIOUS TERMINATION METAL . 29
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PAUMANOK PROVENANCE AND UTILITY IN DIELECTRIC MATERIAL SUPPLY CHAINS AND ECOSYSTEMS: 1988-2024 . 31
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PAUMANOK RESEARCH IN ELECTRONIC MATERIAL SUPPLY CHAINS AND ECOSYSTEMS: 1988-2024. 32
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Paumanok Provenance in the 8532 HTS-Trade and Transactions- Multilayered Ceramic COMPONENTS . 33
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Paumanok IMR Utility in Global Stacked chip component and Dielectrics Trade and Blockchain Engineering Over Time: . 34
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THE PASSIVE COMPONENT SUPPLY CHAIN:. 35
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Mining of Raw Materials:. 36
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Raw Materials Processing: . 36
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Component Manufacturing: . 36
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Component Distribution: . 37
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End-Market Consumption: . 37
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Recycling of Critical Materials: . 39
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THE TECHNICAL ECONOMIC MAXIMS ASSOCIATED WITH PASSIVE ELECTRONIC COMPONENTS:. 40
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The Two Technical Economic Maxims Associated with Passive Electronic Components: . 41
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Ubiquitous Nature of Passive Electronic Components In Electrical and Electronic Circuits: . 41
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Relationship Between Performance and Available Surface Area: . 41
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FINANCIAL CONSIDERATIONS WITH RESPECT TO THIS REPORT: . 42
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Fiscal Year Reporting . 42
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Currency Translation . 42
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PAUMANOK 2024 GLOBAL MARKET UPDATE: . 44
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Fixed Stacked chip components and Their Respective Sub-Categories: FY 2024. 44
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Linear Resistors and Their Respective Sub-Categories: FY 2024. 46
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Discrete Inductors and Their Respective Sub-Categories: FY 2024 . 47
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DIELECTRIC MATERIALS PROCESSING BY TECHNOLOGY PLATFORM . 48
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Multilayered Dielectric Stacking Technology . 48
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FEEDSTOCKS, ENGINEERING STEPS, DIELECTRIC DEVELOPMENT AND END-MARKET PULL . 48
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Ceramic Stacked chip component Metallization: . 50
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Palladium Electrodes: . 50
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Multilayered Ceramic Nickel Electrodes:. 50
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Multilayered Ceramic Copper Electrodes:. 51
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Multilayered Ceramic Termination Materials: . 51
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Multilayered Ceramic Ceramic Dielectric Materials (Where Ceramic Stacked chip components Get Their Name): . 51
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Multilayered Ceramic Ceramic Stacked chip component Performance Classes . 52
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Class I Ceramics (NPO/COG): . 53
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Class II Ceramics (X7R/Z5U/Y5V). 53
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X7R Stacked chip components (BX) . 54
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Z5U (BZ) Stacked chip components. 54
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Y5V Stacked Chip Components . 55
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Summary of Ceramic Stacking Technologies- . 55
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PGM Electrode and Termination: Complete Supply Chain: Ore To Powder To Paste To MLCC and Other Stacked Ceramic Chip Components. 56
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High-Reliability Passive Components: Report of The End-Use Market Segment . 58
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Defense, Space and Civil Aviation:. 58
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Power Infrastructure: . 58
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Communications Infrastructure: . 58
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MedTech Electronics: . 58
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Oil & Gas Electronics:. 58
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R&D Laboratory Test and Measurement Equipment:. 58
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Semiconductor Manufacturing . 58
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High-Reliability Passive Components: Report of The Technology Set . 58
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High Voltage Passive Components: . 58
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High Temperature Passive Components: . 58
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High Frequency Passive Components: . 59
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BME Electrode and Termination: Complete Supply Chain: Ore To Powder To Paste To MLCC . 59
CERAMIC CHIP COMPONENTS-- RAW MATERIALS AND FEEDSTOCKS: CHANNEL ANALYSIS . 61
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DIELECTRICS, ELECTRODES, TERMINATIONS: THE BUILDING BLOCKS OF MULTILAYERED CERAMIC . 61
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Ceramic Component Materials Supply Chain: Opportunities for Market and Technology Synergy . 61
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MULTILAYERED CERAMIC-COSTS TO PRODUCE . 61
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Breakdown of Cost of Goods Sold For Multilayered Ceramic: 2024. 62
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Raw Material Costs Associated With Stacked Chip Technology: 2024. 62
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VARIABLE PRODUCTION COSTS- RAW MATERIALS ONLY-. 62
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CERAMIC STACKED CHIP: RAW MATERIALS BREAKDOWN: . 63
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Ceramic Dielectric Material Markets: 2024 . 63
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Electrode Materials: . 64
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Termination Materials: . 64
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A SUMMARY OF METALS CONSUMPTION IN STACKED CERAMIC CHIP COMPONENTS: FY 2024. 66
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Electrode Markets 2024- . 66
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Termination Markets 2024 . 66
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The Importance of Ceramic Stacked Chip Component Yield Ratios To Profitability: . 67
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High Cap Ceramics: . 67
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PAUMANOK INSIGHT: Advanced in Nickel Nano-Technology To Grow Stacked Ceramic Component Market Capabilities- . 67
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Low Cap Ceramics:. 67
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Specialty Ceramics: . 67
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Class III Ceramics . 68
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Ceramic Chip Design: . 68
BASE METAL MARKETS . 70
NICKEL. 70
NICKEL SUPPLY CHAIN: 2024 . 70
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PAUMANOK INSIGHT-Nickel for Stacked Chip Component Electrode-. 70
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Nickel (For Electrode Powder & Paste): . 70
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NICKEL: A CHANGING SUPPLY CHAIN FOR STACKED CHIP ELECTRODE . 71
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PAUMANOK INSIGHTS- No D100s in The Paste! . 71
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NICKEL ORE MINING-2024 . 72
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Nickel Ore Mining Output By Country: 2024-. 72
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Russia Nickel Supply- . 74
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Canada Nickel Supply . 74
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Indonesia Nickel Supply. 74
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Australia Nickel Supply- . 74
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Philippines Nickel Supply- . 74
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Columbia Nickel Supply . 74
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Nickel Ore Mining Output By Mining Company: 2024- . 75
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PAUMANOK INSIGHT: Nickel Ore Mining Is Essential to The Future of Stacked Ceramic Components . 75
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Norilsk Nornickel . 76
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Vale SA. 76
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Glencore. 76
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BHP . 76
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Nickel Asia . 76
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South32 . 76
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Eramet. 76
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PAUMANOK INSIGHT: Trends in Responsible Sourcing: Compliance With ESG- . 77
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London Metal Exchange (LME) Responsible Sourcing Requirements. 77
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Stacked Chip: Market Growth Drives Nickel Electrode Consumption: . 77
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Nickel Electrode Technology: Key Enabling Electronic Material: . 78
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Particle Sizes of Nickel Electrode Powders:. 78
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NICKEL ELECTRODE POWDER MARKETS FOR STACKED CHIP: VALUE, VOLUME AND PRICING . 79
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Development of the Nickel Electrode Powder for Stacked Chip Consumption Volume (Tons): 1997-2024 . 79
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Market Growth in Nickel Electrode Powder for Stacked Chip Value ($/MM) 2024-2027 FORECAST IN MILLIONS OF US DOLLARS . 80
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PAUMANOK INSIGHT- Opportunity for Nickel Electrode Powder in Higher Voltage Cells. 82
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Nickel Electrode Powder For Multilayered Ceramic Price Per Kilogram: 1997-2024. 82
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NI PRICE PER KG- NI ELECTRODE POWDER PRICING BY MEAN PARTICLE SIZE IN NANOMETERS . 84
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Pricing Extrapolation- Ni Price Per Kg- Ni Electrode Powder Pricing by Mean Particle Size in Nanometers (USD Per Kg) . 84
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Stacked Ceramic Chip Nickel Electrode Powder Market by Particle Size: 2024. 85
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MULTILAYERED CERAMIC NICKEL ELECTRODE POWDER MARKET BY PARTICLE . 86
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NICKEL ELECTRODE POWDER VENDORS TO THE GLOBAL MULTILAYERED CERAMIC MARKET ESTIMATED SALES AND MARKET SHARES . 87
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Nickel Electrode Powder Vendors to the Global Stacked Chip Market: 2024 Estimated Sales and Market Shares: . 87
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STACKED CHIP COMPONENT: NICKEL ELECTRODE POWDER SALES BY COUNTRY- . 89
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PAUMANOK INSIGHTS: Japan and ROK - Focal Point of Advanced Nickel Technology- . 90
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NICKEL ELECTRODE POWDER SALES BY KEY CUSTOMER IN STACKED CHIP PRODUCTION . 90
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Nickel Electrode Powder Sales By Key Customer in Stacked Chip ? 2024 . 90
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NICKEL ELECTRODE PASTE FOR STACKED CHIP: WORLD MARKETS AND KEY TECHNOLOGIES: 2024 . 92
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Nickel Paste Vendors To Multilayered Ceramic: 2024 Estimated Market Shares:. 93
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NICKEL ELECTRODE POWDER VENDORS TO THE GLOBAL STACKED CHIP MARKET- ESTIMATED SALES AND MARKET SHARES . 94
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PAUMANOK INSIGHTS- Cornerstone Companies In Nano-Tech Metals and Emerging Technologies . 95
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NEW NICKEL PASTE DEVELOPMENTS- TECHNOLOGY ADVANCEMENT IN STACKED CHIP . 95
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New Nickel Paste Development in Japan: . 95
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NI ELECTRODE THICKNESS/MULTILAYERED CERAMIC STACKED CHIP CAPACITANCE. 97
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Ni Electrode Thickness/Multilayered Ceramic Capacitance (Murata and SEMCO Patents Point The Way): . 97
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AREAS OF RESEARCH & DEVELOPMENT - MARKET EXPANSION IN HIGH CAPACITANCE STACKED CHIP MULTILAYERED CERAMIC BY CASE SIZE AND VOLTAGE PER CELL . 99
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PAUMANOK INSIGHTS-Areas of Research & Development - Market Expansion in High Capacitance Multilayered Ceramic by Case Size and Voltage Per Cell . 99
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MAXIMUM VOLTAGE AT MAXIMUM CAPACITANCE BY CASE SIZE IN STACKED CHIP MULTILAYERED CERAMIC . 101
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PAUMANOK INSIGHTS-Maximum Voltage at Maximum Capacitance by Case Size in Stacked Chip . 101
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FORECASTS: NICKEL ELECTRODE POWDER AND PASTE CONSUMPTION FORECASTS FOR MULTILAYERED CERAMIC . 103
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Nickel Electrode Powder Forecasts: FY 2024-2027 . 103
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Stacked Chip Nickel Powder Market Value Forecasts: FY 2024-2027 . 104
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Stacked Chip Nickel Powder ASP Forecasts: FY 2024-2027 . 105
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PAUMANOK INSIGHTS-Choke Point Metals- Nickel . 105
COPPER . 106
COPPER SUPPLY CHAIN: 2024. 106
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Copper Ore, Powders and Pastes for Stacked Chip Termination: World Markets, Technologies & Opportunities: 2024-2027. 106
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GLOBAL COPPER ECOSYSTEM: 2024 . 106
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Copper Ore Market and Trends: 2024-2027 . 107
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Copper Ore Output by Mine Location: 2024 . 107
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Chile-. 107
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Peru- . 107
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China-. 107
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DR Congo- . 107
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USA- . 108
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Indonesia-. 108
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Australia-. 108
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Russia-. 108
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Copper Ore Output by Mine Location and Mine Owner- 2024 . 110
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Top Mining Companies in Copper: 2024-2024 . 111
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MAJOR COPPER MINING COMPANIES: 2024 . 112
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Freeport-McMoRan . 112
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BHP Copper . 112
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Grupo Mexico . 112
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Glencore . 112
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Antofagasta . 112
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CODELCO. 112
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First Quantum . 112
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MMG Copper . 112
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COPPER MINING OUTLOOK: 2024-2027 . 113
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COPPER PRICING OUTLOOK: 2024-2027 . 113
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PAUMANOK INSIGHT: Competition for Copper With Other Industries: 2024-2027. 113
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COPPER TERMINATIONS FOR STACKED CHIP COMPONENTS- GLOBAL VALUE, VOLUME AND AVERAGE PRICE PER POUND . 114
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COPPER TERMINATIONS FOR MULTILAYERED CERAMIC- INTRODUCTION: . 114
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Current Market Status In Multilayered Ceramic: . 114
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Historical Market Development:. 114
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Multilayered Ceramic Copper Termination Powder Consumption Volume: 2024 Forecast and Historical Market Development . 115
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MULTILAYERED CERAMIC COPPER TERMINATION POWDER MARKET VALUE: 2024-2027 . 116
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Multilayered Ceramic Copper Termination Powder Market Value in High Capacitance Multilayered Ceramic. 116
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AVERAGE PRICE TRENDS FOR MULTILAYERED CERAMIC COPPER TERMINATION POWDERS: . 117
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Multilayered Ceramic Copper Termination Powder Pricing Trend . 117
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TECHNICAL-ECONOMIC TREND-DISPLACEMENT OF PRECIOUS METALS IN MULTILAYERED CERAMIC TERMINATIONS: . 118
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AVERAGE PRICE TRENDS FOR COPPER TERMINATION POWDERS:. 118
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IMPORTANCE OF COPPER FLAKE IN MULTILAYERED CERAMIC TERMINATIONS: . 118
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UNDERSTANDING THE BME MULTILAYERED CERAMIC PROCESS: . 119
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THE COPPER POWDER/PASTE MARKET EQUATION: . 119
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COPPER TERMINATION POWDER MARKET SUMMARY . 119
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MULTILAYERED CERAMIC COPPER TERMINATION PASTE MARKETS: . 120
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MULTILAYERED CERAMIC COPPER TERMINATION POWDER MARKET SHARES: . 120
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Global Sales & Market Shares in Copper Termination Powder & Flake Supply to the Multilayered Ceramic Industry: 2024 . 121
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MULTILAYERED CERAMIC COPPER TERMINATION PASTE SUPPLIERS . 122
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MULTILAYERED CERAMIC COPPER TERMINATION PASTE VENDORS: 2024 MARKET SHARES . 123
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CUSTOMER/SUPPLIER RELATIONSHIPS IN COPPER POWDER & FLAKE SUPPLY . 124
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COPPER ORE, POWDER AND PASTE CONSUMPTION FORECASTS FOR MULTILAYERED CERAMIC: 2024-2027 . 126
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Forecasts: Copper Termination Powder and Paste Consumption Forecasts for Multilayered Ceramic To 2027 . 126
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Multilayered Ceramic Copper Termination Powder Consumption Forecast: 2024-2027 . 126
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Stacked Chip Copper Termination Powder Market Volume Forecast: 2024-2027: . 127
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Stacked Chip Copper Termination Powder Market Value Forecast: 2024-2027: . 128
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Copper Termination Powder Price Forecast: 2024-2027. 130
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Copper Termination Paste Market Volume Forecast: 2024-2027: . 131
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Copper Termination Paste Market Value Forecast: 2024-2027: . 132
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Copper Termination Paste ASP Forecast: 2024-2027: . 133
PRECIOUS METAL MARKETS . 134
PALLADIUM AND SILVER . 134
PGM SUPPLY CHAIN: 2024 . 134
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PALLADIUM (MULTILAYERED CERAMIC ELECTRODE POWDERS & PASTES): . 134
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SILVER (FOR ELECTRODES AND TERMINATIONS): . 135
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Metallization Markets (Palladium + Silver) . 135
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SOURCES FOR PALLADIUM (COUNTRY AND MINE) . 136
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SOURCES FOR SILVER (COUNTRY AND MINE) . 137
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GLOBAL PALLADIUM AND SILVER CONSUMPTION VALUE IN CERAMIC CHIP: 5 YEAR CYCLE OF VALUE . 138
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PALLADIUM AND SILVER MARKETS IN NPO AND HIGH-RELIABILITY CERAMIC CHIP COMPONENTS: . 142
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GLOBAL PALLADIUM CONSUMPTION VOLUME IN PGM TYPE CERAMIC CHIP COMPONENTS: . 142
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GLOBAL PALLADIUM CONSUMPTION VALUE IN PGM TYPE MULTILAYERED CERAMIC: . 144
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PAUMANOK INSIGHTS-Palladium Pricing Trend. 144
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GLOBAL PALLADIUM PRICE TREND: . 146
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PAUMANOK INSIGHTS- A good time to stock up on industrial palladium. . 146
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SILVER POWDER MARKETS IN PGM TYPE CERAMIC CHIP COMPONENTS:. 147
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GLOBAL SILVER P O W D E R CONSUMPTION VALUE IN PGM TYPE CERAMIC COMPONENTS: . 149
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GLOBAL SILVER PRICING TREND: . 150
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PALLADIUM + SILVER POWDER MARKET VOLUME . 151
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PALLADIUM + SILVER POWDER MARKET VALUE . 152
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PALLADIUM + SILVER POWDER PRICING AND TREND . 153
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PALLADIUM + SILVER PASTE VOLUME AND MARKET TREND . 154
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PALLADIUM + SILVER PASTE VALUE AND MARKET TREND . 155
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PALLADIUM + SILVER PASTE ASP AND MARKET TREND . 156
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PAUMANOK INSIGHTS- Pricing for Pd/Ag pastes for MLCC are dropping because of the halving of the palladium price-= a good time to stock up on electrodes. . 156
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PRECIOUS METAL POWDER AND PASTE VENDORS: 2024 MARKET SHARES . 157
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FORECASTS FOR PGM METALS IN CERAMIC CHIP COMPONENTS: 2024-2027 . 159
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Palladium and Silver Consumption Value, Volume and Price Forecasts: FY 2024 to 2027 . 159
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Forecasts: 2024-2027- Palladium in Electrodes (Volume in Troy Ounces) . 159
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Forecasts: 2024-2027- Palladium in Electrodes (Ore Pricing Forecasts) . 160
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Forecasts: 2024-2027- Palladium in Electrodes (Ore Value Forecasts) . 161
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Forecasts: 2024-2027- Silver in Electrodes (Volume in Troy Ounces) . 162
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Forecasts: 2024-2027- Silver in Electrodes (Ore Pricing Forecasts) . 163
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Forecasts: 2024-2027- Silver in Electrodes (Ore Value Forecasts) . 164
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Forecasts: 2024-2027 Palladium + Silver Ink/Paste (Combined Volume in Troy Ounces) . 165
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Forecasts: 2024-2027 Palladium + Silver Ink/Paste (Price Per Troy Ounce) . 166
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Forecasts: 2024-2027 Palladium + Silver Ink/Paste (Value Forecasts in Millions of US Dollars) . 167
ELECTRODE AND TERMINATION METAL SUPPLIERS TO THE WORLDWIDE CERAMIC COMPONENT INDUSTRY . 168
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ANGLO-AMERICAN (PALLADIUM ORE, COPPER ORE) . 168
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ANTOFAGASTA (COPPER ORE) . 168
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BHP GROUP (COPPER ORE) . 169
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BHP GROUP (NICKEL ORE) . 169
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BHP GROUP (SILVER ORE). 169
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CERMET (PALLADIUM AND SILVER POWDER) . 170
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CHIEF UP INTERNATIONAL CORPORATION (PALLADIUM AND SILVER POWDER) . 170
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CNPC (NICKEL ORE). 171
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CODELCO (COPPER ORE, SILVER ORE). 171
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DAIKEN INDUSTRIES (PALLADIUM, SILVER AND NICKEL PASTE) . 172
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DOWNTON (PALLADIUM AND SILVER POWDERS AND PASTES) . 172
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DU PONT ELECTRONIC MATERIALS (PALLADIUM AND SILVER POWDERS AND PASTES) . 173
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ENGELHARD (BASF) (PALLADIUM AND SILVER POWDERS AND PASTES) . 173
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ESL ELECTROSCIENCE LABS ? FERRO (PALLADIUM AND SILVER POWDERS AND PASTES). 174
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ERAMET (NICKEL ORE) . 175
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FERRO CORPORATION (COPPER PASTE). 175
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FIRST QUANTUM (COPPER ORE) . 175
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FM COMPANY LIMITED {JOINM} (NICKEL PASTE} . 176
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FM COMPANY LIMITED {JOINM} (COPPER PASTE} . 176
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FREEPORT (COPPER ORE). 177
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FRESNILLO PLC MEXICO (SILVER ORE) . 177
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GLENCORE (NICKEL ORE). 177
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GLENCORE (COPPER ORE) . 178
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GLENCORE (SILVER ORE) . 178
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GRIKIN ADVANCED MATERIALS COMPANY LIMITED (PALLADIUM AND SILVER POWDERS) . 178
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GRUPO MEXICO (COPPER ORE) . 179
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THE GWENT GROUP (PALLADIUM AND SILVER POWDERS AND PASTES) . 179
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HEREAUS (PALLADIUM AND SILVER POWDERS AND PASTES) . 180
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HINDUSTAN ZINC INDIA- VEDANTA (SILVER ORE) . 181
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HONGWU INTERNATIONAL GROUP (NICKEL POWDER) . 181
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IMPALA-IMPLATS NORTH AMERICAN PALLADIUM CANADA (PALLADIUM ORE) . 182
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JFE MINERAL (NICKEL POWDER) . 182
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JINCHUAN GROUP INTERNATIONAL (NICKEL POWDER) . 184
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JIANGSU BOQIAN NEW MATERIALS STOCK CO., LTD (NICKEL POWDER) . 184
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JOHNSON MATTHEY (PALLADIUM ORE; PALLADIUM AND SILVER POWDERS AND PASTES) . 184
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KGHM POLAND (SILVER ORE) . 185
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KOARTAN MICROELECTRONIC INTERCONNECT MATERIALS (PALLADIUM AND SILVER PASTE) . 185
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KYMERA INTERNATIONAL (ECKA GRANULES) (COPPER POWDER) . 187
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MITSUI MINING & SMELTING CO. LTD. (COPPER POWDER & PASTE) . 187
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MMG COPPER (COPPER ORE) . 188
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NAMICS CORPORATION (HIMEC- COPPER PASTE) . 188
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NORNICKEL (PALLADIUM ORE, COPPER ORE) . 189
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PJSC “MMC “NORILSK NICKEL” (NICKEL ORE) . 189
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NORTHERN PLATINUM LIMITED (PALLADIUM ORE) . 189
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NEWMONT MINING USA/MEXICO (SILVER ORE, COPPER ORE) . 190
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PRED MATERIALS INTERNATIONAL (NICKEL POWDER) . 190
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QUANTUM SPHERE (NICKEL POWDER) . 190
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SHOEI CHEMICAL (NICKEL PASTE) . 191
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SHOEI CHEMICAL (COPPER PASTE) . 192
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SOUTH32 (NICKEL ORES, SILVER ORES) . 193
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STILLWATER MINING OPERATIONS + SIBAYNE-STILLWATER (PALLADIUM ORES) . 193
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TANAKA PRECIOUS METALS (METALOR) (PALLADIUM AND SILVER POWDERS AND PASTES) . 194
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TECHNIC INC. (PALLADIUM AND SILVER PASTES) . 195
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TOHO TITANIUM (NICKEL POWDER & PASTE) . 195
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SUMITOMO METAL MINING (NICKEL POWDER & PASTE) . 196
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TEKNA PLASMA SYSTEMS (NICKEL POWDERS) . 197
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VALE SA (INCO) (NICKEL ORE) . 197
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List of Tables/Graphs
Figure 1: Paumanok Methodology for Studying Electrode and Termination Materials for Electronic Components: 1988-2024 . 16
Figure 2: Electrode and Termination Metal Ecosystems for Passive Electronic Components . 17
Figure 3: Passive Component Raw Material Pricing Trend: 2012-2024 by Month . 22
Figure 4: Palladium Price Trend by Month: 2012-2024 . 24
Figure 5: Nickel Price Trend by Month: 2012-2024 . 26
Figure 6: Copper Price Trend by Month: 2012-2024 . 28
Figure 7: Silver Price Trend By Month: 2012-2024 . 30
Figure 8: Paumanok Provenance and Utility in Dielectric Material Supply Chains and Ecosystems: 1988-2024 . 32
Figure 9: Paumanok Scope of Coverage in Electronic Components and Supporting Materials . 33
Figure 10: The Passive Electronic Component Supply Chain. 35
Figure 11: The Technical Economic Maxims Associated with Passive Electronic Components . 40
Figure 12: Currency Translations Used In This Report: FY 2013-2024 (Yen, NT$ and Won Currencies To The United States Dollar Quarterly Exchange) . 43
Figure 13: Fixed Stacked chip component Market Breakdown by Sub-Category: FY 2024 . 45
Figure 14: Fixed Linear Resistor Market Breakdown by Sub-Category: FY 2024 . 46
Figure 15: Discrete Inductor Market Breakdown by Sub-Category: FY 2024 . 47
Figure 16: Feedstocks, Engineering Steps, Dielectric Development and End-Market Pull . 49
Figure 17: PGM Electrode and Termination: Complete Supply Chain: Ore To Powder To Paste To MLCC . 57
Figure 18: Base Metal Electrode Supply To The Global MLCC Markets: Ore, Powder and Paste for Copper and Nickel. 60
Figure 19: Overall Metal Paste Consumption in Ceramic Stack Electronic Components: FY 2024 . 66
Figure 20: Multilayered Ceramic Diagram of Materials . 69
Figure 21: Nickel: A Changing Supply Chain For Stacked Chip . 71
Figure 22: Nickel Ore Mining Output By Country: 2024 . 73
Figure 23: Nickel Ore Output By Mining Company: 2024 . 75
Figure 24: Global Market Overview For Nickel Electrode Powder for Multilayered Ceramic: 2024 . 79
Figure 25: Development of the Nickel Electrode Powder for Multilayered Ceramic Consumption Volume (Tons): 1997-2024; 2024-2027 FORECAST . 80
Figure 26: Development of the Nickel Electrode Powder for Multilayered Ceramic Consumption Value (Millions of USD): 1997-2024; 2024-2027 . 81
Figure 27: Nickel Electrode Powder for Multilayered Ceramic (Price per Kilogram): 1997-2024; 2024-2027 FORECAST . 83
Figure 29: Multilayered Ceramic Nickel Electrode Powder Market by Particle Size: 2024. 86
Figure 30: Nickel Electrode Powder Vendors to the Global Multilayered Ceramic Market: 2024 Estimated Sales and Market Shares . 88
Figure 31: Nickel Electrode Powder Sales by Key Customer in Key Countries. 91
Figure 32: Nickel Paste Vendors To Multilayered Ceramic: 2024 Estimated Market Shares . 94
Figure 33: New Nickel Paste Development: 2024 Breakthrough in Japan . 96
Figure 34: Ni Electrode Thickness/Multilayered Ceramic Capacitance- . 98
Figure 35: Multilayered Ceramic Manufacturers: 2024 Competition by Multilayered Ceramic Capacitance Value . 100
Figure 36: Maximum Voltage at Maximum Capacitance by Case Size in Stacked Chip . 102
Figure 37: Multilayered Ceramic Nickel Powder Forecasts: FY 2024-2027 (In Tons) . 103
Figure 38: Multilayered Ceramic Nickel Powder Market Value Forecasts (Worldwide): FY 2024-2027 (In Millions of US Dollars) . 104
Figure 39: Multilayered Ceramic Nickel Powder Market Value Forecasts (Worldwide): FY 2024-2027 (In Millions of US Dollars) . 105
Figure 40: Copper Ore Mining Operations by Country: 2024 . 109
Figure 41: Copper Ore Output By Mine Location: 2024 . 110
Figure 42: Top Mining Companies in Copper Based On Dollar Sales: 2024 . 111
Figure 43: Multilayered Ceramic Copper Termination Powder Volume Markets in High Capacitance Multilayered Ceramic . 115
Figure 44: Multilayered Ceramic Copper Termination Powder Market Value in High Capacitance Multilayered Ceramic . 116
Figure 45: Multilayered Ceramic Copper Termination Powder Pricing Trend . 117
Figure 46: Global Sales & Market Shares in Copper Termination Powder & Flake Supply to the Multilayered Ceramic Industry: 2024 . 121
Figure 47: Multilayered Ceramic Copper Termination Paste Vendors: 2024 Market Shares . 123
Figure 48: Supplier/Customer Relationships in Copper Termination Powder and Paste in the Global Multilayered Ceramic Industry . 125
Figure 49: Stacked Chip Copper Termination Powder Consumption Forecasts: 2024-2027 . 126
Figure 50: Copper Termination Powder Market Volume Forecast: 2024-2027. 128
Figure 51: Copper Termination Powder Market Value Forecast: 2024-2027 . 129
Figure 52: Copper Termination Powder ASP Forecast: 2024-2027 . 130
Figure 53: Copper Termination Paste Market Volume Forecast: 2024-2027 . 131
Figure 54: Copper Termination Paste Market Value Forecast: 2024-2027 . 132
Figure 55: Multilayered Ceramic Copper Termination Paste ASP Forecast: 2024-2027 . 133
Figure 56: Sources for Palladium Ore- Key Producing Mining Operations by Country: FY 2024 . 136
Figure 57: Sources for Silver Ore- Key Producing Mining Operations by Country: FY 2024 . 137
Figure 58: Global Market Value of Consumption for PGM Inks/Pastes Consumed in Ceramic Chip Components: 2019-2024 . 139
Figure 59: Palladium Consumption Volume in Stacked Ceramic Electrodes: 2024 . 143
Figure 60: Palladium Consumption Value in Ceramic Chip Electrodes: 2024 . 145
Figure 61: Global Palladium Price Trend: 2019-2024 . 146
Figure 62: Silver Powder Consumption Volume in Ceramic Chip Components (Annualized): 2019-2024 . 148
Figure 63: Silver (AG) Powder Consumption Value in Ceramic Chip Components (Value). 149
Figure 64: Silver Price (Annualized) . 150
Figure 65: Palladium + Silver Electrode Powder: Global Volume of Consumption: 2019-2024 . 151
Figure 66: Palladium + Silver Electrode Powder: Global Value of Consumption: 2019-2024 . 152
Figure 67: Palladium + Silver Electrode Powder: Pricing and Trend: 2019-2024 . 153
Figure 68: Palladium + Silver Electrode Paste: Volume and Trend: 2019-2024 . 154
Figure 69: Palladium + Silver Electrode Paste: Value and Trend: 2019-2024. 155
Figure 70: Palladium + Silver Electrode Paste: ASP and Trend: 2019-2024 . 156
Figure 71: Palladium and Silver Powder and Paste Vendors to The Ceramic Chip Component Markets: FY 2024. 158
Figure 72: Forecasts- Palladium in Electrodes (Volume In Troy Ounces) . 159
Figure 73: Forecasts- Palladium Price Forecast (US Dollars per Troy Ounces) . 160
Figure 74: Forecasts- Palladium in Electrodes (Value in USD) . 161
Figure 75: Forecasts- Silver in Electrodes (Volume In Troy Ounces) . 162
Figure 76: Forecasts- Silver in Electrodes (US Dollars [per Troy Ounces) . 163
Figure 77: Forecasts- Silver in Electrodes (Value in USD) . 164
Figure 78: Forecasts- Palladium + Silver Ink/Paste (Volume in Troy Ounces) . 165
Figure 79: Forecasts- Palladium + Silver Ink/Paste (Price per Troy Ounce in USD) . 166
Figure 80: Forecasts- Palladium + Silver Ink/Paste (Value Forecasts in Millions of US Dollars) . 167