Summary

The radiation-hardened electronics market is expected to grow from USD 1.7 billion in 2024 to USD 2.1 billion by 2029, at a CAGR of 4.8% during the forecast period. The demand for radiation-hardened electronics is increasing due to space applications, government initiatives, and technological advancements.
“Memory component is expected to grow at higher CAGR from 2024 to 2029”.
Memory in the component segment is expected to grow at the fastest CAGR during the forecast period. A memory device is a hardware component that retains data, enabling communication or functionality. The memory products used for critical applications such as spacecraft and nuclear weapons need to be radiation-hardened to reduce the total ionizing dose (TID) received by the semiconductor components. Compute-intensive applications in the aerospace and space sector are increasingly demanding radiation-hardened memory solutions with high density and performance to handle large quantities of data obtained from various processor nodes and sensors.
“Space application is expected to grow with the largest market share during the forecast period”
Radiation-hardened electronics are specifically designed to weather the storm and ensure reliable operation across diverse space applications. From the beating heart of onboard computers managing satellites to the guidance systems steering rockets, these robust components power a remarkable range of tasks. They handle communication, fuel efficiency, scientific data collection, and even complex robotic maneuvers on distant planetary surfaces.
“Radiation hardened electronics market in North American region to register largest market size from 2024 to 2029.”
North America accounted for the largest share of the radiation-hardened electronics market in 2023. Factors such as continuous technological advancements in this field, the presence of various government-owned space organizations, and a majority of the key market players in the region are driving the growth potential for radiation-hardened electronics in the region. The US government is continuously making working on capabilities in the manufacture of radiation-hardened electronics.


Breakdown of primaries
In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted with key industry experts in the radiation-hardened electronics market space. The break-up of primary participants for the radiation hardened electronics market has been shown below:
• By Company Type: Tier 1 – 40%, Tier 2 – 30%, and Tier 3 – 30%
• By Designation: C-level Executives – 40%, Directors – 40%, and Others – 20%
• By Region: North America –40%, Europe – 30%, Asia Pacific– 20%, and Rest of the World – 10%
Key players in the radiation-hardened electronics market are Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), AMD (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor ( US).
Research Coverage:
The report describes detailed information regarding the key factors such as drivers, restraints, challenges, and opportunities influencing the growth of the radiation-hardened electronics market. It also includes informations like technology trends, trade data, and patent analysis. This research report categorizes the radiation-hardened electronics market based on components, manufacturing techniques, product type, and region. A detailed analysis of the major industry players was carried out to provide insights into their business overviews, products offered, major strategies adopted that include new product launches, deals (acquisitions, partnerships, agreements, and contracts), and others (expansions), and recession impact on the radiation-hardened electronics market.
Reasons to Buy This Report
The report will help the market leaders/new entrants in the market with information on the closest approximations of the revenue for the overall radiation-hardened electronics market and the subsegments. The report will help stakeholders understand the competitive landscape and gain more insight to position their business better and plan suitable go-to-market strategies. The report also helps stakeholders understand the market's pulse and provides information on key drivers, restraints, opportunities, and challenges.
The report will provide insights into the following pointers:
• Analysis of key drivers (Increasing use of radiation-hardened electronics in space applications), restraints (Difficulty in creating real testing environment), opportunities (Favorable government initiatives and increasing space missions), and challenges (Customization required for high-end consumers)
• Product development /Innovation: Detailed insights on growing technologies, research and development activities, and new product and service launches in the radiation-hardened electronics market.
• Market Development: Comprehensive information about adjacent markets; the report analyses the radiation-hardened electronics market across various geographies.
• Market Diversification: Exhaustive information about new products and services, untapped geographies, recent developments, and investments in the radiation-hardened electronics market.
• Competitive Assessment: In-depth assessment of market share, growth strategies, and services, offering of leading players Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), among others in the radiation-hardened electronics market.

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Table of Contents

1 INTRODUCTION 32
1.1 STUDY OBJECTIVES 32
1.2 MARKET DEFINITION 32
1.2.1 MARKETS COVERED 33
FIGURE 1 MARKET SEGMENTATION 33
1.3 REGIONAL SCOPE 33
1.3.1 YEARS CONSIDERED 34
1.3.2 INCLUSIONS AND EXCLUSIONS 34
1.4 CURRENCY 34
1.5 STAKEHOLDERS 35
1.6 SUMMARY OF CHANGES 35
1.7 LIMITATIONS 35
1.8 RECESSION IMPACT 35
2 RESEARCH METHODOLOGY 36
2.1 RESEARCH DATA 36
FIGURE 2 PROCESS FLOW: RADIATION-HARDENED ELECTRONICS MARKET ESTIMATION 36
FIGURE 3 RESEARCH DESIGN 37
2.1.1 SECONDARY AND PRIMARY RESEARCH 38
2.1.1.1 Key industry insights 39
2.1.2 SECONDARY DATA 39
2.1.2.1 List of key secondary sources 39
2.1.2.2 Key data from secondary sources 40
2.1.3 PRIMARY DATA 40
2.1.3.1 Breakdown of primaries 40
2.1.3.2 Key data from primary sources 41
2.2 MARKET SIZE ESTIMATION 41
2.2.1 BOTTOM-UP APPROACH 42
2.2.1.1 Approach to obtain market size using bottom-up analysis (demand side) 42
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 42
2.2.2 TOP-DOWN APPROACH 43
2.2.2.1 Approach to capture market size using top-down analysis 43
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 43
2.3 DATA TRIANGULATION 44
FIGURE 6 DATA TRIANGULATION 44
2.4 RESEARCH ASSUMPTIONS 45
2.5 LIMITATIONS 45
2.6 RISK ASSESSMENT 46
2.7 APPROACH TO ANALYZE IMPACT OF RECESSION ON RADIATION-HARDENED ELECTRONICS MARKET 46
3 EXECUTIVE SUMMARY 47
3.1 RADIATION-HARDENED ELECTRONICS MARKET: RECESSION IMPACT 47
FIGURE 7 RECESSION IMPACT ON RADIATION-HARDENED ELECTRONICS MARKET, 2020–2029 (USD MILLION) 47
FIGURE 8 POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE, BY COMPONENT, DURING FORECAST PERIOD 48
FIGURE 9 RADIATION-HARDENED BY DESIGN – FASTEST SEGMENT DURING FORECAST PERIOD 49
FIGURE 10 SPACE APPLICATION TO GROW AT HIGHEST CAGR IN RADIATION-HARDENED ELECTRONICS MARKET FROM 2024 TO 2029 49
FIGURE 11 NORTH AMERICA ACCOUNTED FOR LARGEST MARKET SHARE IN 2023 50
4 PREMIUM INSIGHTS 51
4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN RADIATION-HARDENED ELECTRONICS MARKET 51
FIGURE 12 INCREASING DEMAND FOR RADIATION-HARDENED ELECTRONICS IN COMMERCIAL SATELLITES EXPECTED TO PROPEL MARKET GROWTH 51
4.2 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT 52
FIGURE 13 POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE FROM 2024 TO 2029 52
4.3 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE 52
FIGURE 14 RADIATION-HARDENED BY DESIGN SEGMENT TO DOMINATE MARKET FROM 2024 TO 2029 52
4.4 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE 53
FIGURE 15 COTS SEGMENT TO LEAD MARKET WITH MAJOR SHARE THROUGH 2029 53
4.5 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION 53
FIGURE 16 SPACE SEGMENT TO COMMAND LARGEST SHARE OF RADIATION-HARDENED ELECTRONICS MARKET IN 2024 53
4.6 RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY AND REGION 54
FIGURE 17 RADIATION-HARDENED ELECTRONICS MARKET IN CHINA TO GROW AT HIGHEST CAGR FROM 2024 TO2029 54
5 MARKET OVERVIEW 55
5.1 INTRODUCTION 55
5.2 EVOLUTION: RADIATION-HARDENED ELECTRONICS MARKET 55
FIGURE 18 EVOLUTION OF RADIATION-HARDENED ELECTRONICS TECHNOLOGY 56
5.3 MARKET DYNAMICS 56
FIGURE 19 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES: RADIATION-HARDENED ELECTRONICS MARKET 56
5.3.1 DRIVERS 57
FIGURE 20 DRIVERS FOR RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT 57
5.3.1.1 Rising intelligence, surveillance, and reconnaissance (ISR) activities 57
5.3.1.2 Technology advancements in multicore processors used for military and space applications 58
5.3.1.3 Increasing demand for use in commercial satellites 58
5.3.1.4 Proliferation of electronic systems that can withstand severe nuclear environments 59
5.3.2 RESTRAINTS 59
FIGURE 21 RESTRAINTS IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT 59
5.3.2.1 Difficulties in creating real testing environments 60
5.3.2.2 High costs associated with development of radiation-hardened products 60
5.3.3 OPPORTUNITIES 60
FIGURE 22 OPPORTUNITIES IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT 60
5.3.3.1 Increasing space missions globally 61
5.3.3.2 Demand for reconfigurable radiation-hardened electronics 61
5.3.3.3 Rising demand for commercial-off-the-shelf components in space satellites 62
5.3.4 CHALLENGES 62
FIGURE 23 CHALLENGES IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT 62
5.3.4.1 Customization requirements from high-end consumers 62
5.4 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS 63
FIGURE 24 REVENUE SHIFT FOR RADIATION-HARDENED ELECTRONICS 63
5.5 PRICING ANALYSIS 64
5.5.1 AVERAGE SELLING PRICE OF POWER MANAGEMENT PRODUCTS 64
FIGURE 25 AVERAGE SELLING PRICE OF POWER MANAGEMENT PRODUCTS 64
5.5.2 POWER MANAGEMENT 64
TABLE 1 AVERAGE SELLING PRICE ANALYSIS OF KEY PLAYERS 65
5.5.3 MIXED SIGNAL ICS 65
TABLE 2 AVERAGE SELLING PRICE OF A/D & D/A CONVERTERS 65
5.5.4 PROCESSORS & CONTROLLERS 65
TABLE 3 AVERAGE SELLING PRICE OF PROCESSORS & CONTROLLERS 66
5.5.5 MEMORY 66
TABLE 4 AVERAGE SELLING PRICE OF MEMORY PRODUCTS 66
5.6 SUPPLY/VALUE CHAIN ANALYSIS 66
FIGURE 26 VALUE CHAIN ANALYSIS: MAJOR VALUE ADDED DURING MANUFACTURING, FABRICATION & PACKAGING AND INTERFACING & SOFTWARE DEVELOPMENT 67
5.7 ECOSYSTEM/MARKET MAP 69
FIGURE 27 RADIATION-HARDENED ELECTRONICS MARKET: ECOSYSTEM 69
TABLE 5 RADIATION-HARDENED ELECTRONICS MARKET: ECOSYSTEM 70
5.8 INVESTMENT AND FUNDING SCENARIO 71
FIGURE 28 FUNDS AUTHORIZED BY COMPANIES IN RADIATION-HARDENED ELECTRONICS MARKET 71
5.9 TECHNOLOGY ANALYSIS 71
5.9.1 DEVELOPMENT OF PLASTIC PACKAGING FOR SPACE-GRADE ELECTRONICS 71
5.9.2 SMART CHIPSETS FOR SATELLITES 71
5.9.3 ADVANCED PACKAGING OF SPACE ELECTRONICS 72
5.10 PORTER’S FIVE FORCES ANALYSIS 72
TABLE 6 RADIATION-HARDENED ELECTRONICS MARKET: PORTER’S FIVE FORCES ANALYSIS 72
5.10.1 INTENSITY OF COMPETITIVE RIVALRY 73
5.10.2 BARGAINING POWER OF SUPPLIERS 73
5.10.3 BARGAINING POWER OF BUYERS 73
5.10.4 THREAT OF SUBSTITUTES 73
5.10.5 THREAT OF NEW ENTRANTS 74
5.11 KEY STAKEHOLDERS & BUYING CRITERIA 74
5.11.1 KEY STAKEHOLDERS IN BUYING PROCESS 74
FIGURE 29 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE INDUSTRIES 74
TABLE 7 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE INDUSTRIES 74
5.11.2 BUYING CRITERIA 75
FIGURE 30 KEY BUYING CRITERIA FOR TOP THREE INDUSTRIES 75
TABLE 8 KEY BUYING CRITERIA FOR TOP THREE INDUSTRIES 75
5.12 CASE STUDY ANALYSIS 75
TABLE 9 ASSESSMENT OF 90 MM PROCESS HARDENING TECHNIQUE 76
TABLE 10 ASSESSMENT OF 4MBIT MRAM DEVICE IN SATELLITES 76
TABLE 11 ASSESSMENT OF RADIATION-HARDENED BY DESIGN MICROELECTRONICS 77
TABLE 12 ASSESSMENT OF ARM MCUS FOR SPACE CONDITIONS 77
TABLE 13 ASSESSMENT OF SSDS FOR LOW EARTH ORBIT SATELLITES 78
5.13 TRADE ANALYSIS 78
5.13.1 IMPORT SCENARIO 78
FIGURE 31 IMPORTS, BY KEY COUNTRY, 2019–2022 (USD THOUSAND) 78
5.13.2 EXPORT SCENARIO 79
FIGURE 32 EXPORTS, BY KEY COUNTRY, 2019–2022 (USD THOUSAND) 79
5.14 PATENT ANALYSIS 80
FIGURE 33 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS 80
TABLE 14 TOP 20 PATENT OWNERS IN LAST 10 YEARS 80
FIGURE 34 NUMBER OF PATENTS GRANTED PER YEAR FROM 2013 TO 2023 81
TABLE 15 LIST OF MAJOR PATENTS 81
5.15 KEY CONFERENCES & EVENTS DURING 2024–2025 83
TABLE 16 RADIATION-HARDENED ELECTRONICS MARKET: CONFERENCES & EVENTS 83
5.16 REGULATORY LANDSCAPE 84
5.16.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 84
TABLE 17 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 85
TABLE 18 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 85
TABLE 19 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 86
TABLE 20 REST OF THE WORLD: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 86
5.16.2 STANDARDS AND REGULATIONS RELATED TO MARKET 86
5.16.2.1 North America 87
5.16.2.1.1 US 87
5.16.2.1.1.1 MIL-STD-750D 87
5.16.2.1.1.2 MIL-STD-750F 87
5.16.2.1.1.3 Radiation Hardness Assurance SSB1_005 87
5.16.2.1.1.4 MIL-STD-975M (NASA) 87
5.16.2.1.2 Canada 87
5.16.2.1.2.1 Radiation Emitting Devices Regulations (C.R.C., c. 1370) 87
5.16.2.2 Europe 88
5.16.2.2.1 ECSS-Q-60-01A 88
5.16.2.2.2 ECSS-Q-ST-60-15C 88
5.16.2.2.3 ECSS-Q-HB-60-02A 88
5.16.2.3 Asia Pacific 88
5.16.2.3.1 India 88
5.16.2.3.1.1 IS:1885 88
5.16.2.3.2 Japan 88
5.16.2.3.2.1 Japan Product Safety Compliance 88
5.16.2.3.2.2 JMR-001 88
6 MATERIAL SELECTION AND PACKAGING TYPES IN RADIATION-HARDENED ELECTRONICS MARKET 89
6.1 INTRODUCTION 89
6.2 MATERIAL SELECTION 89
6.2.1 SILICON 89
6.2.2 SILICON CARBIDE (SIC) 89
6.2.3 GALLIUM NITRIDE (GAN) 90
6.2.4 GALLIUM ARSENIDE (GAAS) 90
6.3 PACKAGING TYPES 91
6.3.1 FLIP-CHIP 91
6.3.2 CERAMIC PACKAGES 91
7 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT 92
7.1 INTRODUCTION 93
FIGURE 35 POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD 93
TABLE 21 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION) 93
TABLE 22 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION) 93
7.2 MIXED SIGNAL ICS 94
TABLE 23 MIXED SIGNAL DEVICES: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (USD MILLION) 94
TABLE 24 MIXED SIGNAL DEVICES: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (USD MILLION) 94
TABLE 25 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION) 95
TABLE 26 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION) 95
TABLE 27 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION) 95
TABLE 28 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION) 95
7.2.1 RAD-HARD A/D AND D/A CONVERTERS 96
7.2.1.1 Increasing usage in space applications 96
7.2.2 MULTIPLEXERS & RESISTORS 96
7.2.2.1 High demand for multiplexers in data acquisition systems 96
7.3 PROCESSORS & CONTROLLERS 96
TABLE 29 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (USD MILLION) 96
TABLE 30 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (USD MILLION) 97
TABLE 31 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (THOUSAND UNITS) 97
TABLE 32 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (THOUSAND UNITS) 97
TABLE 33 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION) 98
TABLE 34 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION) 98
TABLE 35 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION) 98
TABLE 36 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION) 98
7.3.1 MICROPROCESSOR UNITS (MPUS) 99
7.3.1.1 Developments in multicore processors for space & defense applications 99
7.3.2 MICROCONTROLLER UNITS (MCUS) 99
7.3.2.1 Development of ARM-based microcontrollers for spacecraft subsystems 99
7.3.3 APPLICATION-SPECIFIC INTEGRATED CIRCUITS (ASICS) 100
7.3.3.1 Increasing demand for highly customized design 100
7.3.4 FPGAS 100
7.3.4.1 Help eliminate costs related to re-designing or manual updating 100
7.4 MEMORY 101
TABLE 37 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020–2023 (USD MILLION) 101
TABLE 38 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024–2029 (USD MILLION) 101
TABLE 39 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION) 101
TABLE 40 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION) 102
TABLE 41 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION) 102
TABLE 42 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION) 102
TABLE 43 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION) 102
TABLE 44 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION) 103
7.4.1 VOLATILE MEMORY 103
7.4.1.1 Dynamic Random-Access Memory (DRAM) 103
7.4.1.1.1 Low retention time expected to increase adoption in spacecraft 103
7.4.1.2 Static random-access memory (SRAM) 103
7.4.1.2.1 High adoption in image processing applications 103
7.4.2 NON-VOLATILE MEMORY 104
7.4.2.1 Magnetoresistive random-access memory (MRAM) 104
7.4.2.1.1 Increasing developments in MRAM technologies for space environment 104
7.4.2.2 Flash 104
7.4.2.2.1 Increasing requirement for NOR flash memory in processing applications 104
7.4.2.3 Others (ReRAM, EEPROM, NVRAM) 104
7.5 POWER MANAGEMENT 105
TABLE 45 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION) 105
TABLE 46 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION) 105
TABLE 47 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION) 106
TABLE 48 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION) 106
TABLE 49 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION) 106
TABLE 50 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION) 106
7.5.1 MOSFETS 107
7.5.1.1 Increasing adoption for outer space applications 107
7.5.2 DIODES 107
7.5.2.1 Integration of ceramic packaging technology to improve performance in space applications 107
7.5.3 THYRISTORS 107
7.5.3.1 Increasing adoption in aerospace & defense applications 107
7.5.4 IGBTS 108
7.5.4.1 High current density and low power dissipation drive adoption 108
7.6 OTHERS (QUALITATIVE) 108
8 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE 109
8.1 INTRODUCTION 110
FIGURE 36 RHBD SEGMENT TO LEAD RADIATION-HARDENED ELECTRONICS MARKET DURING FORECAST PERIOD 110
TABLE 51 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020–2023 (USD MILLION) 111
TABLE 52 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024–2029 (USD MILLION) 111
8.2 RADIATION-HARDENING BY DESIGN (RHBD) 111
TABLE 53 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION) 112
TABLE 54 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION) 112
TABLE 55 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION) 112
TABLE 56 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION) 112
TABLE 57 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION) 113
TABLE 58 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION) 113
TABLE 59 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION) 113
TABLE 60 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION) 114
TABLE 61 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION) 114
TABLE 62 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION) 114
8.2.1 TOTAL IONIZING DOSE 115
8.2.1.1 Long-term ionizing damage could result in malfunctioning of electronic components 115
8.2.2 SINGLE EVENT EFFECT (SEE) 115
8.2.2.1 RHBD approach favored in space electronics 115
8.3 RADIATION-HARDENING BY PROCESS (RHBP) 115
TABLE 63 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION) 116
TABLE 64 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION) 116
TABLE 65 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION) 116
TABLE 66 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION) 117
TABLE 67 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION) 117
TABLE 68 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION) 117
TABLE 69 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION) 117
TABLE 70 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION) 118
TABLE 71 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION) 118
TABLE 72 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION) 118
8.3.1 SILICON ON INSULATOR (SOI) 119
8.3.1.1 Integration of SOI ICs in insulation layers provides benefits in high-radiation environments 119
8.3.2 SILICON ON SAPPHIRE (SOS) 119
8.3.2.1 High resistance to radiation increases demand in aerospace and military applications 119
8.4 RADIATION HARDENING BY SOFTWARE (RHBS) (QUALITATIVE) 119
9 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE 120
9.1 INTRODUCTION 121
FIGURE 37 COTS SEGMENT TO HOLD LARGER SHARE AND REGISTER HIGHER CAGR DURING FORECAST PERIOD 121
TABLE 73 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020–2023 (USD MILLION) 121
TABLE 74 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024–2029 (USD MILLION) 122
9.2 COMMERCIAL-OFF-THE-SHELF (COTS) 122
9.2.1 INCREASING ADOPTION IN COMMERCIAL AND MILITARY SATELLITES DUE TO LOW-COST BENEFITS 122
TABLE 75 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION) 123
TABLE 76 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION) 123
TABLE 77 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION) 123
TABLE 78 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION) 123
TABLE 79 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION) 124
TABLE 80 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION) 124
TABLE 81 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION) 124
TABLE 82 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION) 124
TABLE 83 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION) 125
TABLE 84 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION) 125
9.3 CUSTOM-MADE 125
9.3.1 HIGH PREFERENCE IN DEFENSE MISSION-CRITICAL APPLICATIONS 125
TABLE 85 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020–2023 (USD MILLION) 126
TABLE 86 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024–2029 (USD MILLION) 126
TABLE 87 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020–2023 (USD MILLION) 126
TABLE 88 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024–2029 (USD MILLION) 126
TABLE 89 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020–2023 (USD MILLION) 127
TABLE 90 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024–2029 (USD MILLION) 127
TABLE 91 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020–2023 (USD MILLION) 127
TABLE 92 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024–2029 (USD MILLION) 127
TABLE 93 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020–2023 (USD MILLION) 128
TABLE 94 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024–2029 (USD MILLION) 128
10 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION 129
10.1 INTRODUCTION 130
FIGURE 38 SPACE APPLICATION SEGMENT TO HOLD LARGEST SHARE AND REGISTER HIGHEST CAGR DURING FORECAST PERIOD 130
TABLE 95 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020–2023 (USD MILLION) 131
TABLE 96 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION) 131
10.2 SPACE 132
10.2.1 PROLIFERATION IN GLOBAL SPACE ECONOMY TO DRIVE GROWTH OPPORTUNITIES 132
TABLE 97 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020–2023 (USD MILLION) 132
TABLE 98 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION) 132
TABLE 99 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION) 133
TABLE 100 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION) 133
10.2.2 COMMERCIAL 134
10.2.2.1 Small satellites 134
10.2.2.2 New Space 135
10.2.2.3 Nanosatellites 135
10.2.3 MILITARY 135
10.3 AEROSPACE & DEFENSE 136
10.3.1 INCREASING FUNDING FOR MILITARY SECTOR IN EMERGING COUNTRIES TO DRIVE MARKET GROWTH 136
TABLE 101 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020–2023 (USD MILLION) 136
TABLE 102 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION) 136
TABLE 103 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION) 137
TABLE 104 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION) 137
10.3.2 WEAPONS AND MISSILES 137
10.3.3 VEHICLES/AVIONICS 138
10.4 NUCLEAR POWER PLANTS 138
10.4.1 RISE IN CONSTRUCTION OF NUCLEAR REACTORS FOR POWER GENERATION TO DRIVE MARKET GROWTH 138
TABLE 105 NUCLEAR POWER PLANTS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION) 138
TABLE 106 NUCLEAR POWER PLANTS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION) 139
10.5 MEDICAL 139
10.5.1 INTEGRATION OF EMI SHIELDING AND FILTERING IN IMPLANTABLE DEVICES TO BOOST GROWTH 139
10.5.2 IMPLANTABLE MEDICAL DEVICES 139
TABLE 107 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION 2020–2023 (USD MILLION) 139
TABLE 108 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024–2029 (USD MILLION) 140
TABLE 109 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION) 140
TABLE 110 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION) 140
10.5.3 RADIOLOGY 141
10.6 OTHERS 141
TABLE 111 OTHER APPLICATIONS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION) 141
TABLE 112 OTHER APPLICATIONS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION) 141
11 REGIONAL ANALYSIS 142
11.1 INTRODUCTION 143
FIGURE 39 REGIONAL SNAPSHOT: CHINA EXPECTED TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 143
FIGURE 40 RADIATION-HARDENED ELECTRONICS MARKET, BY REGION 144
TABLE 113 RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION) 144
TABLE 114 RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION) 144
11.2 NORTH AMERICA 145
FIGURE 41 NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT 145
TABLE 115 NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 146
TABLE 116 NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 146
11.2.1 US 146
11.2.1.1 Increase in space missions from government and private agencies to drive demand 146
11.2.2 CANADA 147
11.2.2.1 Ongoing developments in satellites expected to drive market 147
11.2.3 MEXICO 147
11.2.3.1 Growing economy and increasing urban mobility increase demand for satellites 147
11.2.4 IMPACT OF RECESSION ON MARKET IN NORTH AMERICA 148
11.3 EUROPE 148
FIGURE 42 EUROPE: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT 149
TABLE 117 EUROPE: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 149
TABLE 118 EUROPE: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 150
11.3.1 UK 150
11.3.1.1 Increasing initiatives by government and private entities in space sector to fuel market growth 150
11.3.2 GERMANY 151
11.3.2.1 Proliferation in national space programs to boost demand for radiation-hardened electronics 151
11.3.3 FRANCE 151
11.3.3.1 Increasing partnerships in space industry to increase competitiveness of France in European Union 151
11.3.4 REST OF EUROPE 152
11.3.5 IMPACT OF RECESSION ON MARKET IN EUROPE 152
11.4 ASIA PACIFIC 152
FIGURE 43 ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT 153
TABLE 119 ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 153
TABLE 120 ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 154
11.4.1 CHINA 154
11.4.1.1 Advancements in space missions expected to drive market 154
11.4.2 INDIA 155
11.4.2.1 Increasing developments by ISRO to drive market 155
11.4.3 JAPAN 155
11.4.3.1 Involvement of private space companies in government space programs to boost market 155
11.4.4 SOUTH KOREA 155
11.4.4.1 Private-public investments in infrastructure, industrial, commercial, military, space, and defense projects – key driver 155
11.4.5 REST OF ASIA PACIFIC 156
11.4.6 IMPACT OF RECESSION ON MARKET IN ASIA PACIFIC 156
11.5 REST OF THE WORLD (ROW) 156
TABLE 121 ROW: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020–2023 (USD MILLION) 156
TABLE 122 ROW: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024–2029 (USD MILLION) 157
11.5.1 GULF COOPERATION COUNCIL (GCC) 157
11.5.1.1 Proliferation of satellite operations to drive market 157
11.5.2 SOUTH AMERICA 157
11.5.2.1 Tie-ups with foreign agencies for space missions to propel market growth 157
11.5.3 REST OF MIDDLE EAST AND AFRICA 158
11.5.3.1 Increasing investments by governments to boost market growth 158
11.5.4 RECESSION IMPACT ON MARKET IN REST OF MIDDLE EAST AND AFRICA 158
12 COMPETITIVE LANDSCAPE 159
12.1 INTRODUCTION 159
12.2 KEY PLAYER STRATEGIES 159
TABLE 123 KEY PLAYER STRATEGIES 159
12.3 MARKET REVENUE ANALYSIS 161
FIGURE 44 RADIATION-HARDENED ELECTRONICS MARKET: REVENUE ANALYSIS OF TOP FIVE PLAYERS, 2020–2022 161
12.4 MARKET SHARE ANALYSIS 162
FIGURE 45 MARKET SHARE ANALYSIS, 2023 162
TABLE 124 DEGREE OF COMPETITION, RADIATION-HARDENED ELECTRONICS MARKET (2023) 162
TABLE 125 MARKET RANKING ANALYSIS 163
12.5 VALUATION AND FINANCIAL METRICS IN RADIATION-HARDENED ELECTRONICS MARKET 165
FIGURE 46 EV/EBITDA OF KEY VENDORS 165
12.6 BRAND/PRODUCT COMPARATIVE ANALYSIS 166
FIGURE 47 RADIATION-HARDENED ELECTRONICS MARKET: TOP TRENDING BRAND/PRODUCTS 166
12.7 COMPANY EVALUATION MATRIX 167
12.7.1 STARS 167
12.7.2 EMERGING LEADERS 167
12.7.3 PERVASIVE PLAYERS 167
12.7.4 PARTICIPANTS 167
FIGURE 48 RADIATION-HARDENED ELECTRONICS MARKET: TOP COMPANY EVALUATION QUADRANT, 2023 168
12.8 RADIATION-HARDENED ELECTRONICS MARKET: COMPANY FOOTPRINT (15 COMPANIES) 169
TABLE 126 COMPANY FOOTPRINT 169
TABLE 127 COMPANY COMPONENT FOOTPRINT (15 COMPANIES) 170
TABLE 128 COMPANY APPLICATION FOOTPRINT (15 COMPANIES) 171
TABLE 129 COMPANY REGION FOOTPRINT (15 COMPANIES) 172
TABLE 130 COMPANY PRODUCT TYPE FOOTPRINT (15 COMPANIES) 173
TABLE 131 COMPANY MANUFACTURING TECHNIQUE FOOTPRINT (15 COMPANIES) 173
12.9 STARTUP/SME EVALUATION QUADRANT, 2023 174
12.9.1 PROGRESSIVE COMPANIES 174
12.9.2 RESPONSIVE COMPANIES 174
12.9.3 DYNAMIC COMPANIES 174
12.9.4 STARTING BLOCKS 174
FIGURE 49 RADIATION-HARDENED ELECTRONICS MARKET, STARTUP/SME EVALUATION QUADRANT, 2023 175
12.10 COMPETITIVE BENCHMARKING 176
TABLE 132 RADIATION-HARDENED ELECTRONICS MARKET: KEY STARTUPS/SMES 176
TABLE 133 RADIATION-HARDENED ELECTRONICS MARKET: COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES 177
12.11 COMPETITIVE SCENARIOS AND TRENDS 178
12.11.1 PRODUCT LAUNCHES/DEVELOPMENTS 178
TABLE 134 RADIATION-HARDENED ELECTRONICS MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2021–2024 178
12.11.2 DEALS 179
TABLE 135 RADIATION-HARDENED ELECTRONICS MARKET: DEALS, 2021–2024 179
12.11.3 OTHERS 181
TABLE 136 RADIATION-HARDENED ELECTRONICS MARKET: OTHER DEALS, 2021–2024 181
13 COMPANY PROFILES 182
13.1 KEY PLAYERS 182
(Business Overview, Products/Solutions/Services Offered, Recent Developments, MnM view (Key strengths/Right to win, Strategic choices made, Weakness/competitive threats)*
13.1.1 MICROCHIP TECHNOLOGY INC. 182
TABLE 137 MICROCHIP TECHNOLOGY INC.: BUSINESS OVERVIEW 182
FIGURE 50 MICROCHIP TECHNOLOGY INC.: COMPANY SNAPSHOT 183
TABLE 138 MICROCHIP TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 183
TABLE 139 MICROCHIP TECHNOLOGY INC.: PRODUCT LAUNCHES 185
TABLE 140 MICROCHIP TECHNOLOGY INC.: DEALS 187
TABLE 141 MICROCHIP TECHNOLOGY INC.: OTHERS 188
13.1.2 BAE SYSTEMS 190
TABLE 142 BAE SYSTEMS: BUSINESS OVERVIEW 190
FIGURE 51 BAE SYSTEMS: COMPANY SNAPSHOT 191
TABLE 143 BAE SYSTEMS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 191
TABLE 144 BAE SYSTEMS: PRODUCT LAUNCHES 193
TABLE 145 BAE SYSTEMS: DEALS 193
TABLE 146 BAE SYSTEMS: OTHERS 194
13.1.3 RENESAS ELECTRONICS CORPORATION 196
TABLE 147 RENESAS ELECTRONICS CORPORATION: BUSINESS OVERVIEW 196
FIGURE 52 RENESAS ELECTRONICS CORPORATION: COMPANY SNAPSHOT 197
TABLE 148 RENESAS ELECTRONICS CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 197
TABLE 149 RENESAS ELECTRONICS CORPORATION: PRODUCT LAUNCHES 199
TABLE 150 RENESAS ELECTRONICS CORPORATION: DEALS 200
TABLE 151 RENESAS ELECTRONICS CORPORATION: OTHERS 201
13.1.4 INFINEON TECHNOLOGIES AG 203
TABLE 152 INFINEON TECHNOLOGIES AG: BUSINESS OVERVIEW 203
FIGURE 53 INFINEON TECHNOLOGIES AG: COMPANY SNAPSHOT 204
TABLE 153 INFINEON TECHNOLOGIES AG: PRODUCTS/SOLUTIONS/SERVICES OFFERED 204
TABLE 154 INFINEON TECHNOLOGIES AG: PRODUCT LAUNCHES 206
TABLE 155 INFINEON TECHNOLOGIES AG: DEALS 207
TABLE 156 INFINEON TECHNOLOGIES AG: OTHERS 208
13.1.5 STMICROELECTRONICS 210
TABLE 157 STMICROELECTRONICS: BUSINESS OVERVIEW 210
FIGURE 54 STMICROELECTRONICS: COMPANY SNAPSHOT 211
TABLE 158 STMICROELECTRONICS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 211
TABLE 159 STMICROELECTRONICS: PRODUCT LAUNCHES 213
TABLE 160 STMICROELECTRONICS: DEALS 214
13.1.6 ADVANCED MICRO DEVICES, INC (AMD) 216
TABLE 161 ADVANCED MICRO DEVICES, INC: BUSINESS OVERVIEW 216
FIGURE 55 ADVANCED MICRO DEVICES, INC: COMPANY SNAPSHOT 217
TABLE 162 ADVANCED MICRO DEVICES, INC: PRODUCTS/SOLUTIONS/SERVICES OFFERED 217
TABLE 163 ADVANCED MICRO DEVICES, INC: PRODUCT LAUNCHES 218
TABLE 164 ADVANCED MICRO DEVICES, INC: DEALS 218
13.1.7 TEXAS INSTRUMENTS INCORPORATED 219
TABLE 165 TEXAS INSTRUMENTS INCORPORATED: BUSINESS OVERVIEW 219
FIGURE 56 TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT 220
TABLE 166 TEXAS INSTRUMENTS INCORPORATED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 220
TABLE 167 TEXAS INSTRUMENTS INCORPORATED: PRODUCT LAUNCHES 221
TABLE 168 TEXAS INSTRUMENTS INCORPORATED: DEALS 222
TABLE 169 TEXAS INSTRUMENTS INCORPORATED: DEALS 223
13.1.8 HONEYWELL INTERNATIONAL INC. 224
TABLE 170 HONEYWELL INTERNATIONAL INC.: BUSINESS OVERVIEW 224
FIGURE 57 HONEYWELL INTERNATIONAL INC.: COMPANY SNAPSHOT 225
TABLE 171 HONEYWELL INTERNATIONAL INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 225
TABLE 172 HONEYWELL INTERNATIONAL INC.: PRODUCT LAUNCHES 227
TABLE 173 HONEYWELL INTERNATIONAL INC.: DEALS 227
TABLE 174 HONEYWELL INTERNATIONAL INC.: OTHERS 228
13.1.9 TELEDYNE TECHNOLOGIES INC. 229
TABLE 175 TELEDYNE TECHNOLOGIES INC.: BUSINESS OVERVIEW 229
FIGURE 58 TELEDYNE TECHNOLOGIES INC.: COMPANY SNAPSHOT 230
TABLE 176 TELEDYNE TECHNOLOGIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 230
TABLE 177 TELEDYNE TECHNOLOGIES INC.: PRODUCT LAUNCHES 231
TABLE 178 TELEDYNE TECHNOLOGIES INC.: DEALS 232
TABLE 179 TELEDYNE TECHNOLOGIES INC.: OTHERS 232
13.1.10 TTM TECHNOLOGIES, INC. 233
TABLE 180 TTM TECHNOLOGIES, INC.: BUSINESS OVERVIEW 233
FIGURE 59 TTM TECHNOLOGIES, INC.: COMPANY SNAPSHOT 234
TABLE 181 TTM TECHNOLOGIES, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 234
TABLE 182 TTM TECHNOLOGIES, INC.: OTHERS 235
13.2 OTHER PLAYERS 236
13.2.1 COBHAM LIMITED 236
13.2.2 ANALOG DEVICES, INC 238
13.2.3 DATA DEVICE CORPORATION 239
13.2.4 3D PLUS 241
13.2.5 MERCURY SYSTEMS, INC. 242
13.2.6 PCB PIEZOTRONICS, INC. 243
13.2.7 VORAGO TECHNOLOGIES 244
13.2.8 MICROPAC INDUSTRIES, INC. 245
13.2.9 GSI TECHNOLOGY, INC. 246
13.2.10 EVERSPIN TECHNOLOGIES INC 247
13.2.11 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (ON SEMICONDUCTOR) 248
13.2.12 AITECH 249
13.2.13 MICROELECTRONICS RESEARCH DEVELOPMENT CORPORATION 250
13.2.14 SPACE MICRO INC 251
13.2.15 TRIAD SEMICONDUCTOR 252
*Details on Business Overview, Products/Solutions/Services Offered, Recent Developments, MnM view (Key strengths/Right to win, Strategic choices made, Weakness/competitive threats)* might not be captured in case of unlisted companies.
14 APPENDIX 253
14.1 DISCUSSION GUIDE 253
14.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 257
14.3 CUSTOMIZATION OPTIONS 259
14.4 RELATED REPORTS 259
14.5 AUTHOR DETAILS 260