基板対基板コネクタ市場：タイプ（ピンヘッダー、ソケット）、ピンヘッダー（スタックド、シュラウド）ピッチ（1mm未満、1mm～2mm、2mm以上）、用途（民生用電子機器、産業用オートメーション）、地域別 - 2028年までの世界予測

Board-to-Board Connectors Market by Type (Pin Headers, and Sockets), Pin Headers (Stacked & Shrouded) Pitch (Less Than 1 mm, 1 mm to 2 mm, Greater Than 2 mm), Application (Consumer Electronics, Industrial Automation) and Region - Global Forecast to 2028

世界の基板対基板コネクタ市場は、2023年に116億米ドルと評価され、2028年には154億米ドルに達すると予測され、予測期間中のCAGRは5.8％を記録する。ウェアラブル、ポータブル電子機器、スマート家電のような小型... もっと見る

出版社	出版年月	電子版価格	ページ数	図表数	言語
MarketsandMarkets マーケッツアンドマーケッツ	2023年7月17日	US$4,950 シングルユーザライセンスライセンス・価格情報注文方法はこちら	228	238	英語

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サマリー

世界の基板対基板コネクタ市場は、2023年に116億米ドルと評価され、2028年には154億米ドルに達すると予測され、予測期間中のCAGRは5.8％を記録する。ウェアラブル、ポータブル電子機器、スマート家電のような小型電子機器のトレンドの高まりが市場を活性化させている。メーカーは、PCB間の信頼性の高い相互接続を確保しながら、スペース効率の高い設計を提供する基板対基板コネクタを求めている。さらに、発展途上国における自動化の進展が、基板対基板コネクタの需要に拍車をかけている。これらの傾向は、基板対基板コネクタ市場の成長につながっている。
"1mm未満セグメントは予測期間中最高のCAGRで成長する見込み"
基板対基板コネクタ市場では、1mm未満セグメントが最も高いCAGRで成長している。様々な業界において、電子機器の小型化とコンパクト設計の傾向が強まっている。より小さく、より軽く、よりポータブルなデバイスへの需要が高まる中、限られたスペースにコンポーネントを統合できるよう、ピッチサイズの小さい基板対基板コネクタへのニーズが高まっている。ピッチサイズが1mm未満のコネクターは、こうした小型化設計に必要なコンパクト性を提供する。
"民生用電子機器セグメントが基板対基板コネクタ市場を支配すると予測"
基板対基板コネクタ市場では、民生用電子機器分野が最大のシェアを占めている。民生用電子機器市場は、高い消費者需要と短い製品ライフサイクルによって、大規模な生産量で運営されている。民生用電子機器の組み立てに不可欠な部品である基板対基板コネクタは、業界の要件を満たすために大量に製造・供給される。さらに、民生用電子機器メーカーは、機器の小型化、薄型化、美観の向上に絶えず努めています。このような小型化の傾向から、プリント基板に高密度に実装された部品に対応できるコンパクトな基板対基板コネクタの使用が必要とされている。このような傾向は、民生用電子機器における基板対基板コネクタの需要を促進している。

"中国がアジア太平洋地域の基板対基板コネクタ市場を支配すると予測される"
中国は、いくつかの要因により、基板対基板コネクタ市場で最大の市場シェアを占めている。中国は世界的な製造拠点としての地位を確立しており、費用対効果の高い生産能力と大規模な製造インフラで知られている。電子部品メーカーとサプライヤーの広範なネットワークにより、基板対基板コネクターの効率的で安価な生産が可能となっている。中国の製造ノウハウと規模の経済は、競争力のある価格設定と大量生産を可能にし、国内外の顧客を惹きつけている。

基板対基板コネクタ市場で事業を展開するさまざまな主要組織の最高経営責任者（CEO）、取締役、その他の経営幹部との詳細な面談を実施した。

- 企業タイプ別ティア1 - 25%、ティア2 - 35%、ティア3 - 40
- 役職別Cレベル幹部 - 35%、取締役 - 25%、その他 - 40
- 地域別北米20％、欧州30％、アジア太平洋地域40％、RoW10

Amphenol Corporation（米国）、TE Connectivity（スイス）、日本航空電子工業（日本）、ヒロセ電機（日本）、モレックス（米国）、オムロン株式会社（日本）、サムテック（米国）、Harting Technology Group（ドイツ）、FIT Hon Teng Limited（台湾）、京セラ株式会社（日本）、CSCONN Corporation（中国）は、基板対基板コネクタ市場における主要企業の一部である。

この調査には、企業プロフィール、最近の動向、主要市場戦略など、基板対基板コネクタ市場におけるこれら主要企業の詳細な競合分析が含まれています。

調査範囲

この調査レポートは、基板対基板コネクタ市場をタイプ別（ピンヘッダー、ソケット）、ピッチ別（1mm未満、1mm〜2mm、2mm以上）、用途別（民生用電子機器、産業用オートメーション、通信、自動車、ヘルスケア、その他）、地域別（北米、欧州、アジア太平洋地域、RoW）に分類しています。本レポートでは、基板対基板コネクタ市場の成長に影響を与える促進要因、阻害要因、課題、機会などの主要要因に関する詳細情報を網羅しています。主要な業界プレイヤーを詳細に分析し、事業概要、ソリューション、サービス、主要戦略、契約、パートナーシップ、協定、新製品・サービスの発表、M&A、基板対基板コネクタ市場に関連する最近の動向に関する洞察を提供しています。本レポートでは、基板対基板コネクタ市場のエコシステムにおける今後の新興企業の競争分析もカバーしています。

このレポートを購入する理由

本レポートは、基板対基板コネクタ市場全体とサブセグメントの収益数の最も近い近似値に関する情報を提供することで、本市場の市場リーダー/新規参入者に役立ちます。本レポートは、利害関係者が競争状況を理解し、自社のビジネスをより良く位置づけ、適切な市場参入戦略を計画するためのより多くの洞察を得るのに役立ちます。また、本レポートは、関係者が市場の鼓動を理解するのに役立ち、主要な市場促進要因、阻害要因、課題、機会に関する情報を提供します。

本レポートでは、以下のポイントに関する洞察を提供しています：
- 主な促進要因（高密度相互接続を備えた小型化・コンパクト化デバイスに対する需要の高まり、エレクトロニクスや電気通信など複数のアプリケーションにおける急速な技術進歩、産業オートメーションやロボット工学に対する需要の高まり）、阻害要因（アプリケーション固有の基板対基板コネクタの開発に伴う技術的複雑さ）の分析、機会（アジア太平洋地域における5G技術と大容量データセンターの展開、IoTとエッジコンピューティングの採用拡大）、および課題（シグナルインテグリティと高速データ伝送に関連する大きな技術的課題、競争の激しい市場によるコスト最適化と価格圧力）が基板対基板コネクタ市場の成長に影響を与えている。
- 製品開発／イノベーション：基板対基板コネクタ市場における今後の技術、研究開発活動、新製品・サービス開始に関する詳細な洞察
- 市場開発：有利な市場に関する包括的情報 - 当レポートでは、様々な地域の基板対基板コネクタ市場を分析しています。
- 市場の多様化：基板対基板コネクタ市場における新製品＆サービス、未開拓地域、最近の開発、投資に関する詳細情報
- 競合評価：基板対基板コネクタ市場におけるアンフェノール社（米国）、TEコネクティビティ社（スイス）、日本航空電子工業社（日本）、ヒロセ電機株式会社（日本）、モレックス社（米国）、オムロン株式会社（日本）、サムテック社（米国）、Harting Technology Group社（ドイツ）、FIT Hon Teng Limited社（台湾）、京セラ株式会社（日本）、CSCONN Corporation社（中国）などの主要企業の市場シェア、成長戦略、サービス内容を詳細に評価します。

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1 INTRODUCTION 31
1.1 STUDY OBJECTIVES 31
1.2 MARKET DEFINITION 31
1.3 STUDY SCOPE 32
1.3.1 MARKETS COVERED 32
FIGURE 1 BOARD-TO-BOARD CONNECTOR MARKET: SEGMENTATION 32
1.3.2 REGIONAL SCOPE 32
1.3.3 YEARS CONSIDERED 33
1.3.4 CURRENCY CONSIDERED 33
1.4 STAKEHOLDERS 33
1.5 RECESSION IMPACT 34
2 RESEARCH METHODOLOGY 35
2.1 RESEARCH DATA 35
FIGURE 2 BOARD-TO-BOARD CONNECTOR MARKET: RESEARCH DESIGN 36
2.1.1 SECONDARY DATA 36
2.1.1.1 List of key secondary sources 37
2.1.1.2 Breakdown of secondary sources 37
2.1.2 PRIMARY DATA 38
2.1.2.1 Key data from primary sources 38
2.1.2.2 Key industry insights 39
2.1.2.3 Breakdown of primaries 39
2.2 FACTOR ANALYSIS 40
FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH (SUPPLY SIDE)—REVENUE GENERATED BY COMPANIES FROM SALES OF BOARD-TO-BOARD CONNECTORS 40
2.3 MARKET SIZE ESTIMATION 41
2.3.1 BOTTOM-UP APPROACH 41
2.3.1.1 Approach to derive market size using bottom-up analysis 41
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 42
2.3.2 TOP-DOWN APPROACH 42
2.3.2.1 Approach to derive market size using top-down analysis 42
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 43
2.4 DATA TRIANGULATION 43
FIGURE 6 DATA TRIANGULATION 43
2.5 RESEARCH ASSUMPTIONS 44
2.6 APPROACH TO ANALYZE RECESSION IMPACT ON BOARD-TO-BOARD CONNECTOR MARKET 45
3 EXECUTIVE SUMMARY 46
FIGURE 7 SOCKET SEGMENT TO REGISTER HIGHER CAGR IN BOARD-TO-BOARD CONNECTOR MARKET DURING FORECAST PERIOD 47
FIGURE 8 1–2 MM SEGMENT TO HOLD LARGEST MARKET SHARE IN 2028 47
FIGURE 9 AUTOMOTIVE SEGMENT TO EXHIBIT HIGHEST CAGR IN BOARD-TO-BOARD CONNECTOR MARKET FROM 2023 TO 2028 48
FIGURE 10 ASIA PACIFIC TO BE FASTEST-GROWING MARKET FOR BOARD-TO-BOARD CONNECTORS DURING FORECAST PERIOD 48
4 PREMIUM INSIGHTS 50
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN BOARD-TO-BOARD CONNECTOR MARKET 50
FIGURE 11 GROWING ADOPTION OF AUTOMATION, ROBOTICS, AND IOT TECHNOLOGIES 50
4.2 BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE 50
FIGURE 12 PIN HEADER SEGMENT TO HOLD LARGER SHARE OF BOARD-TO-BOARD CONNECTOR MARKET IN 2028 50
4.3 BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH 51
FIGURE 13 LESS THAN 1 MM SEGMENT TO ACCOUNT FOR LARGEST SHARE OF BOARD-TO-BOARD CONNECTOR MARKET IN 2028 51
4.4 BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION AND REGION 51
FIGURE 14 CONSUMER ELECTRONICS SEGMENT AND ASIA PACIFIC TO HOLD LARGEST SHARES OF BOARD-TO-BOARD CONNECTOR MARKET IN 2028 51
4.5 BOARD-TO-BOARD CONNECTOR MARKET, BY COUNTRY 52
FIGURE 15 INDIA TO REGISTER HIGHEST CAGR IN BOARD-TO-BOARD CONNECTOR MARKET BETWEEN 2023 AND 2028 52
5 MARKET OVERVIEW 53
5.1 INTRODUCTION 53
5.2 MARKET DYNAMICS 53
FIGURE 16 BOARD-TO-BOARD CONNECTOR MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES 53
5.2.1 DRIVERS 54
5.2.1.1 Increased demand for miniaturized and compact devices with high-density interconnections 54
5.2.1.2 Rapid technological advancements in various industries 54
5.2.1.3 Increasing demand for industrial automation and robotics 54
FIGURE 17 BOARD-TO-BOARD CONNECTOR MARKET: DRIVERS AND THEIR IMPACT 55
5.2.2 RESTRAINTS 56
5.2.2.1 Technological complexities associated with development of application-specific board-to-board connectors 56
FIGURE 18 BOARD-TO-BOARD CONNECTOR MARKET: RESTRAINTS AND THEIR IMPACT 56
5.2.3 OPPORTUNITIES 56
5.2.3.1 Rising deployment of high-capacity data centers and 5G technology in Asia Pacific 56
5.2.3.2 Growing adoption of Internet of Things (IoT) and edge computing technologies 57
FIGURE 19 BOARD-TO-BOARD CONNECTOR MARKET: OPPORTUNITIES AND THEIR IMPACT 57
5.2.4 CHALLENGES 58
5.2.4.1 Signal integrity and high-speed data transmission 58
5.2.4.2 Cost optimization and pricing pressure 58
FIGURE 20 BOARD-TO-BOARD CONNECTOR MARKET: CHALLENGES AND THEIR IMPACT 58
5.3 VALUE CHAIN ANALYSIS 59
FIGURE 21 BOARD-TO-BOARD CONNECTOR MARKET: VALUE CHAIN ANALYSIS 59
5.4 ECOSYSTEM ANALYSIS 60
FIGURE 22 BOARD-TO-BOARD CONNECTOR MARKET: ECOSYSTEM ANALYSIS 60
TABLE 1 BOARD-TO-BOARD CONNECTOR MARKET: ECOSYSTEM ANALYSIS 61
5.5 PRICING ANALYSIS 62
5.5.1 AVERAGE SELLING PRICE (ASP) OF BOARD-TO-BOARD CONNECTORS OFFERED BY THREE KEY PLAYERS, BY PITCH 62
FIGURE 23 AVERAGE SELLING PRICE (ASP) OF BOARD-TO-BOARD CONNECTORS OFFERED BY THREE KEY PLAYERS, BY PITCH 62
TABLE 2 AVERAGE SELLING PRICE (ASP) OF BOARD-TO-BOARD CONNECTORS, BY PITCH 62
5.5.2 AVERAGE SELLING PRICE (ASP) TREND 62
TABLE 3 AVERAGE SELLING PRICE (ASP) OF BOARD-TO-BOARD CONNECTORS, BY REGION 63
5.6 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES 63
FIGURE 24 REVENUE SHIFT AND NEW REVENUE POCKETS FOR PLAYERS IN BOARD-TO-BOARD CONNECTOR MARKET 63
5.7 TECHNOLOGY ANALYSIS 64
5.7.1 HIGH-SPEED DATA TRANSMISSION TECHNOLOGY 64
5.7.2 POWER DELIVERY AND MANAGEMENT 64
5.7.3 ELECTROMAGNETIC INTERFERENCE (EMI)/RADIO FREQUENCY INTERFERENCE (RFI) SHIELDING AND FILTERING 64
5.7.4 INDUSTRIAL AUTOMATION 64
5.8 PORTER’S FIVE FORCES ANALYSIS 65
FIGURE 25 BOARD-TO-BOARD CONNECTOR MARKET: PORTER’S FIVE FORCES ANALYSIS 65
TABLE 4 BOARD-TO-BOARD CONNECTOR MARKET: PORTER’S FIVE FORCES ANALYSIS 65
5.9 KEY STAKEHOLDERS AND BUYING CRITERIA 67
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS 67
FIGURE 26 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE APPLICATIONS 67
TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE APPLICATIONS (%) 67
5.9.2 BUYING CRITERIA 68
FIGURE 27 KEY BUYING CRITERIA FOR TOP THREE APPLICATIONS 68
TABLE 6 KEY BUYING CRITERIA FOR TOP THREE APPLICATIONS 68
5.10 CASE STUDY ANALYSIS 69
TABLE 7 JAPAN AVIATION ELECTRONICS SUPPLIED BOARD-TO-BOARD CONNECTORS TO AUTOMOBILE MANUFACTURER FOR INTEGRATED ELECTRONIC CONTROL UNIT (ECU) APPLICATIONS 69
TABLE 8 GLOBAL CONNECTOR TECHNOLOGY (GCT) DEVELOPED CUSTOM 54-POSITION PIN HEADER INSULATOR FOR CUSTOMER 69
5.11 TRADE ANALYSIS 70
5.11.1 IMPORT SCENARIO 70
FIGURE 28 IMPORT DATA, BY KEY COUNTRY, 2018–2022 (USD BILLION) 70
5.11.2 EXPORT SCENARIO 71
FIGURE 29 EXPORT DATA, BY KEY COUNTRY, 2018–2022 (USD BILLION) 71
5.12 PATENT ANALYSIS 71
FIGURE 30 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS 71
TABLE 9 TOP 20 PATENT OWNERS IN US IN LAST 10 YEARS 72
FIGURE 31 NUMBER OF PATENTS GRANTED, 2012–2022 72
TABLE 10 LIST OF FEW PATENTS RELATED TO BOARD-TO-BOARD CONNECTORS 73
5.13 KEY CONFERENCES AND EVENTS, 2023–2024 73
TABLE 11 BOARD-TO-BOARD CONNECTOR MARKET: LIST OF CONFERENCES AND EVENTS 73
5.14 REGULATORY LANDSCAPE 74
5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 74
TABLE 12 NORTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 74
TABLE 13 EUROPE: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 75
TABLE 14 ASIA PACIFIC: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 76
TABLE 15 ROW: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 77
5.14.2 STANDARDS 77
TABLE 16 BOARD-TO-BOARD CONNECTOR MARKET: STANDARDS 77
6 BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE 79
6.1 INTRODUCTION 80
FIGURE 32 PIN HEADER SEGMENT ACCOUNTED FOR LARGER SHARE OF BOARD-TO-BOARD CONNECTOR MARKET IN 2022 80
TABLE 17 BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2019–2022 (USD MILLION) 80
TABLE 18 BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2023–2028 (USD MILLION) 82
6.2 PIN HEADER 82
6.2.1 HIGHLY USED FOR BOARD-TO-BOARD CONNECTIONS IN DIFFERENT ELECTRONIC DEVICES 82
TABLE 19 PIN HEADER: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 83
TABLE 20 PIN HEADER: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 83
TABLE 21 BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2019–2022 (USD MILLION) 83
TABLE 22 BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2023–2028 (USD MILLION) 84
6.2.1.1 Stacked header 84
TABLE 23 STACKED HEADER: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 84
TABLE 24 STACKED HEADER: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 85
6.2.1.2 Shrouded header 85
TABLE 25 SHROUDED HEADER: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 85
TABLE 26 SHROUDED HEADER: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 86
6.3 SOCKET 86
6.3.1 FINDS APPLICATIONS IN MAINTENANCE AND INSPECTION OPERATIONS 86
TABLE 27 SOCKET: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 86
TABLE 28 SOCKET: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 87
7 BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH 88
7.1 INTRODUCTION 89
FIGURE 33 BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH 89
FIGURE 34 1–2 MM SEGMENT TO ACCOUNT FOR LARGEST SHARE OF BOARD-TO-BOARD CONNECTOR MARKET IN 2028 89
TABLE 29 BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2019–2022 (USD MILLION) 90
TABLE 30 BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2023–2028 (USD MILLION) 90
7.2 LESS THAN 1 MM 91
7.2.1 RISING NEED FOR ADVANCED MATING SYSTEMS 91
TABLE 31 LESS THAN 1 MM: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 91
TABLE 32 LESS THAN 1 MM: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 91
7.3 1–2 MM 92
7.3.1 EASE OF HANDLING AND SECURE AND RELIABLE CONNECTION IN VARIOUS APPLICATIONS 92
TABLE 33 1–2 MM: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 92
TABLE 34 1–2 MM: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 93
7.4 GREATER THAN 2 MM 93
7.4.1 SUITABILITY FOR APPLICATIONS REQUIRING RESISTANCE TO MECHANICAL STRESS, VIBRATION, AND SHOCK 93
TABLE 35 GREATER THAN 2 MM: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 94
TABLE 36 GREATER THAN 2 MM: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 94
8 BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION 95
8.1 INTRODUCTION 96
FIGURE 35 BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION 96
FIGURE 36 CONSUMER ELECTRONICS SEGMENT TO ACCOUNT FOR LARGEST SHARE OF BOARD-TO-BOARD CONNECTOR MARKET IN 2028 96
TABLE 37 BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 97
TABLE 38 BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 97
8.2 CONSUMER ELECTRONICS 98
8.2.1 INCREASING DEMAND FOR CONSUMER ELECTRONICS 98
FIGURE 37 ASIA PACIFIC TO ACCOUNT FOR LARGEST SHARE OF BOARD-TO-BOARD CONNECTOR MARKET FOR CONSUMER ELECTRONICS IN 2028 98
TABLE 39 CONSUMER ELECTRONICS: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2019–2022 (USD MILLION) 99
TABLE 40 CONSUMER ELECTRONICS: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2023–2028 (USD MILLION) 99
FIGURE 38 PIN HEADER SEGMENT TO ACCOUNT FOR LARGER SHARE OF BOARD-TO-BOARD CONNECTOR MARKET FOR CONSUMER ELECTRONICS IN 2028 100
TABLE 41 CONSUMER ELECTRONICS: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2019–2022 (USD MILLION) 100
TABLE 42 CONSUMER ELECTRONICS: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2023–2028 (USD MILLION) 100
TABLE 43 CONSUMER ELECTRONICS: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2019–2022 (USD MILLION) 101
TABLE 44 CONSUMER ELECTRONICS: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2023–2028 (USD MILLION) 101
TABLE 45 CONSUMER ELECTRONICS: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2019–2022 (USD MILLION) 101
TABLE 46 CONSUMER ELECTRONICS: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2023–2028 (USD MILLION) 101
8.3 INDUSTRIAL AUTOMATION 102
8.3.1 RISING INVESTMENTS IN INDUSTRIAL AUTOMATION 102
TABLE 47 INDUSTRIAL AUTOMATION: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2019–2022 (USD MILLION) 102
TABLE 48 INDUSTRIAL AUTOMATION: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2023–2028 (USD MILLION) 103
TABLE 49 INDUSTRIAL AUTOMATION: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2019–2022 (USD MILLION) 103
TABLE 50 INDUSTRIAL AUTOMATION: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2023–2028 (USD MILLION) 103
TABLE 51 INDUSTRIAL AUTOMATION: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2019–2022 (USD MILLION) 103
TABLE 52 INDUSTRIAL AUTOMATION: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2023–2028 (USD MILLION) 104
TABLE 53 INDUSTRIAL AUTOMATION: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2019–2022 (USD MILLION) 104
TABLE 54 INDUSTRIAL AUTOMATION: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2023–2028 (USD MILLION) 104
8.4 TELECOMMUNICATION 105
8.4.1 INCREASING NUMBER OF DATA CENTERS IN DEVELOPING ECONOMIES 105
TABLE 55 TELECOMMUNICATION: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2019–2022 (USD MILLION) 105
TABLE 56 TELECOMMUNICATION: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2023–2028 (USD MILLION) 105
TABLE 57 TELECOMMUNICATION: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2019–2022 (USD MILLION) 106
TABLE 58 TELECOMMUNICATION: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2023–2028 (USD MILLION) 106
TABLE 59 TELECOMMUNICATION: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2019–2022 (USD MILLION) 106
TABLE 60 TELECOMMUNICATION: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2023–2028 (USD MILLION) 106
TABLE 61 TELECOMMUNICATION: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2019–2022 (USD MILLION) 107
TABLE 62 TELECOMMUNICATION: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2023–2028 (USD MILLION) 107
8.5 AUTOMOTIVE 107
8.5.1 INCREASING DEMAND FOR ELECTRIC VEHICLES (EVS) AND DEVELOPMENTS IN AUTONOMOUS DRIVING TECHNOLOGIES 107
TABLE 63 AUTOMOTIVE: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2019–2022 (USD MILLION) 108
TABLE 64 AUTOMOTIVE: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2023–2028 (USD MILLION) 108
TABLE 65 AUTOMOTIVE: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2019–2022 (USD MILLION) 108
TABLE 66 AUTOMOTIVE: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2023–2028 (USD MILLION) 109
TABLE 67 AUTOMOTIVE: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2019–2022 (USD MILLION) 109
TABLE 68 AUTOMOTIVE: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2023–2028 (USD MILLION) 109
TABLE 69 AUTOMOTIVE: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2019–2022 (USD MILLION) 109
TABLE 70 AUTOMOTIVE: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2023–2028 (USD MILLION) 110
8.6 HEALTHCARE 110
8.6.1 ADVANCEMENTS IN MEDICAL TECHNOLOGIES 110
TABLE 71 HEALTHCARE: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2019–2022 (USD MILLION) 110
TABLE 72 HEALTHCARE: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2023–2028 (USD MILLION) 111
TABLE 73 HEALTHCARE: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2019–2022 (USD MILLION) 111
TABLE 74 HEALTHCARE: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2023–2028 (USD MILLION) 111
TABLE 75 HEALTHCARE: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2019–2022 (USD MILLION) 111
TABLE 76 HEALTHCARE: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2023–2028 (USD MILLION) 112
TABLE 77 HEALTHCARE: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2019–2022 (USD MILLION) 112
TABLE 78 HEALTHCARE: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2023–2028 (USD MILLION) 112
8.7 OTHERS 113
TABLE 79 OTHERS: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2019–2022 (USD MILLION) 113
TABLE 80 OTHERS: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2023–2028 (USD MILLION) 113
TABLE 81 OTHERS: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2019–2022 (USD MILLION) 113
TABLE 82 OTHERS: BOARD-TO-BOARD CONNECTOR MARKET, BY TYPE, 2023–2028 (USD MILLION) 114
TABLE 83 OTHERS: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2019–2022 (USD MILLION) 114
TABLE 84 OTHERS: BOARD-TO-BOARD CONNECTOR MARKET, BY PIN HEADER TYPE, 2023–2028 (USD MILLION) 114
TABLE 85 OTHERS: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2019–2022 (USD MILLION) 114
TABLE 86 OTHERS: BOARD-TO-BOARD CONNECTOR MARKET, BY PITCH, 2023–2028 (USD MILLION) 115
9 BOARD-TO-BOARD CONNECTOR MARKET, BY REGION 116
9.1 INTRODUCTION 117
FIGURE 39 ASIA PACIFIC TO HOLD LARGEST SHARE OF BOARD-TO-BOARD CONNECTOR MARKET IN 2028 117
TABLE 87 BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2019–2022 (USD MILLION) 117
TABLE 88 BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2023–2028 (USD MILLION) 118
9.2 NORTH AMERICA 118
FIGURE 40 NORTH AMERICA: SNAPSHOT OF BOARD-TO-BOARD CONNECTOR MARKET 119
9.2.1 NORTH AMERICA: RECESSION IMPACT 120
TABLE 89 NORTH AMERICA: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 120
TABLE 90 NORTH AMERICA: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 120
TABLE 91 NORTH AMERICA: BOARD-TO-BOARD CONNECTOR MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 121
TABLE 92 NORTH AMERICA: BOARD-TO-BOARD CONNECTOR MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 121
9.2.2 US 121
9.2.2.1 High adoption of advanced technologies and expanding data center market 121
9.2.3 CANADA 121
9.2.3.1 Booming consumer electronics and automotive industries 121
9.2.4 MEXICO 122
9.2.4.1 Rising number of manufacturing companies 122
9.3 EUROPE 122
FIGURE 41 EUROPE: SNAPSHOT OF BOARD-TO-BOARD CONNECTOR MARKET 123
TABLE 93 EUROPE: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 124
TABLE 94 EUROPE: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 124
TABLE 95 EUROPE: BOARD-TO-BOARD CONNECTOR MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 124
TABLE 96 EUROPE: BOARD-TO-BOARD CONNECTOR MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 125
9.3.1 EUROPE: RECESSION IMPACT 125
9.3.2 GERMANY 125
9.3.2.1 Expanding automotive industry 125
9.3.3 UK 126
9.3.3.1 Expansion of production capacities by automobile companies 126
9.3.4 FRANCE 126
9.3.4.1 Government-led investments in manufacturing sector 126
9.3.5 REST OF EUROPE 126
9.4 ASIA PACIFIC 127
FIGURE 42 ASIA PACIFIC: SNAPSHOT OF BOARD-TO-BOARD CONNECTOR MARKET 127
TABLE 97 ASIA PACIFIC: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 128
TABLE 98 ASIA PACIFIC: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 128
TABLE 99 ASIA PACIFIC: BOARD-TO-BOARD CONNECTOR MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 128
TABLE 100 ASIA PACIFIC: BOARD-TO-BOARD CONNECTOR MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 129
9.4.1 ASIA PACIFIC: RECESSION IMPACT 129
9.4.2 CHINA 129
9.4.2.1 Rising adoption of technologically advanced devices 129
9.4.3 JAPAN 130
9.4.3.1 Rising industrial automation 130
9.4.4 SOUTH KOREA 130
9.4.4.1 Significant growth of automotive and consumer electronics industries 130
9.4.5 INDIA 130
9.4.5.1 Rising focus on promoting local manufacturing 130
9.4.6 REST OF ASIA PACIFIC 131
9.5 ROW 131
TABLE 101 ROW: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2019–2022 (USD MILLION) 131
TABLE 102 ROW: BOARD-TO-BOARD CONNECTOR MARKET, BY APPLICATION, 2023–2028 (USD MILLION) 132
TABLE 103 ROW: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2019–2022 (USD MILLION) 132
TABLE 104 ROW: BOARD-TO-BOARD CONNECTOR MARKET, BY REGION, 2023–2028 (USD MILLION) 132
9.5.1 ROW: RECESSION IMPACT 133
9.6 MIDDLE EAST & AFRICA 133
9.6.1 SAUDI ARABIA 133
9.6.1.1 Expanding industrial and manufacturing sectors 133
9.6.2 UAE 133
9.6.2.1 Growing smart city projects 133
9.6.3 REST OF MIDDLE EAST & AFRICA 133
TABLE 105 MIDDLE EAST & AFRICA: BOARD-TO-BOARD CONNECTOR MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 134
TABLE 106 MIDDLE EAST & AFRICA: BOARD-TO-BOARD CONNECTOR MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 134
9.7 SOUTH AMERICA 134
9.7.1 BRAZIL 134
9.7.1.1 Rising demand for reliable and efficient connectors in manufacturing sector 134
9.7.2 ARGENTINA 135
9.7.2.1 Increasing demand for electronic devices and equipment 135
9.7.3 REST OF SOUTH AMERICA 135
TABLE 107 SOUTH AMERICA: BOARD-TO-BOARD CONNECTOR MARKET, BY COUNTRY, 2019–2022 (USD MILLION) 135
TABLE 108 SOUTH AMERICA: BOARD-TO-BOARD CONNECTOR MARKET, BY COUNTRY, 2023–2028 (USD MILLION) 135
10 COMPETITIVE LANDSCAPE 136
10.1 OVERVIEW 136
10.2 KEY STRATEGIES ADOPTED BY MAJOR PLAYERS 136
TABLE 109 BOARD-TO-BOARD CONNECTOR MARKET: KEY STRATEGIES ADOPTED BY MAJOR PLAYERS 136
10.3 REVENUE ANALYSIS OF TOP THREE PLAYERS, 2018–2022 137
FIGURE 43 BOARD-TO-BOARD CONNECTOR MARKET: REVENUE ANALYSIS OF TOP THREE PLAYERS, 2018–2022 137
10.4 MARKET SHARE ANALYSIS, 2022 138
TABLE 110 BOARD-TO-BOARD CONNECTOR MARKET: DEGREE OF COMPETITION 138
FIGURE 44 BOARD-TO-BOARD CONNECTOR MARKET SHARE ANALYSIS, 2022 138
10.5 COMPETITIVE EVALUATION MATRIX, 2022 140
10.5.1 STARS 140
10.5.2 EMERGING LEADERS 140
10.5.3 PERVASIVE PLAYERS 140
10.5.4 PARTICIPANTS 140
FIGURE 45 BOARD-TO-BOARD CONNECTOR MARKET (GLOBAL): COMPANY EVALUATION MATRIX, 2022 141
10.6 STARTUPS/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES) EVALUATION MATRIX, 2022 142
10.6.1 PROGRESSIVE COMPANIES 142
10.6.2 RESPONSIVE COMPANIES 142
10.6.3 DYNAMIC COMPANIES 142
10.6.4 STARTING BLOCKS 142
FIGURE 46 BOARD TO BOARD CONNECTORS MARKET: STARTUPS/SMES EVALUATION MATRIX, 2022 143
10.7 COMPETITIVE BENCHMARKING 144
TABLE 111 COMPANY FOOTPRINT 144
TABLE 112 PITCH: COMPANY FOOTPRINT 145
TABLE 113 APPLICATION: COMPANY FOOTPRINT 146
TABLE 114 REGION: COMPANY FOOTPRINT 147
10.8 KEY STARTUPS/SMES 148
TABLE 115 BOARD-TO-BOARD CONNECTOR MARKET: LIST OF KEY STARTUPS/SMES 148
TABLE 116 BOARD-TO-BOARD CONNECTOR MARKET: COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES, BY TYPE 148
TABLE 117 BOARD-TO-BOARD CONNECTOR MARKET: COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES, BY REGION 148
10.9 COMPETITIVE SCENARIOS AND TRENDS 149
10.9.1 PRODUCT LAUNCHES 149
TABLE 118 BOARD-TO-BOARD CONNECTOR MARKET: PRODUCT LAUNCHES, 2020−2023 149
10.9.2 DEALS 153
TABLE 119 BOARD-TO-BOARD CONNECTOR MARKET: DEALS, 2020–2023 153
10.9.3 OTHERS 153
TABLE 120 BOARD-TO-BOARD CONNECTOR MARKET: OTHERS, 2020–2023 153
11 COMPANY PROFILES 156
(Business Overview, Products Offered, Recent Developments, MnM View Right to win, Strategic choices made, Weaknesses and competitive threats) *
11.1 KEY PLAYERS 156
11.1.1 TE CONNECTIVITY 156
TABLE 121 TE CONNECTIVITY: COMPANY OVERVIEW 156
FIGURE 47 TE CONNECTIVITY: COMPANY SNAPSHOT 157
TABLE 122 TE CONNECTIVITY: PRODUCTS OFFERED 157
TABLE 123 TE CONNECTIVITY: PRODUCT LAUNCHES 158
TABLE 124 TE CONNECTIVITY: OTHERS 158
11.1.2 AMPHENOL CORPORATION 160
TABLE 125 AMPHENOL CORPORATION: COMPANY OVERVIEW 160
FIGURE 48 AMPHENOL CORPORATION: COMPANY SNAPSHOT 161
TABLE 126 AMPHENOL CORPORATION: PRODUCTS OFFERED 161
TABLE 127 AMPHENOL CORPORATION: PRODUCT LAUNCHES 162
11.1.3 HIROSE ELECTRIC CO., LTD. 164
TABLE 128 HIROSE ELECTRIC CO., LTD.: COMPANY OVERVIEW 164
FIGURE 49 HIROSE ELECTRIC CO., LTD.: COMPANY SNAPSHOT 164
TABLE 129 HIROSE ELECTRIC CO., LTD.: PRODUCTS OFFERED 165
TABLE 130 HIROSE ELECTRIC CO., LTD.: PRODUCT LAUNCHES 166
11.1.4 MOLEX, LLC 168
TABLE 131 MOLEX, LLC: COMPANY OVERVIEW 168
TABLE 132 MOLEX, LLC: PRODUCTS OFFERED 168
TABLE 133 MOLEX, LLC: PRODUCT LAUNCHES 170
TABLE 134 MOLEX, LLC: DEALS 171
TABLE 135 MOLEX, LLC: OTHERS 171
11.1.5 JAPAN AVIATION ELECTRONICS INDUSTRY, LTD. 173
TABLE 136 JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.: COMPANY OVERVIEW 173
FIGURE 50 JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.: COMPANY SNAPSHOT 174
TABLE 137 JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.: PRODUCTS OFFERED 174
TABLE 138 JAPAN AVIATION ELECTRONICS INDUSTRY LTD: PRODUCT LAUNCHES 175
11.1.6 OMRON CORPORATION 177
TABLE 139 OMRON CORPORATION: COMPANY OVERVIEW 177
FIGURE 51 OMRON CORPORATION: COMPANY SNAPSHOT 178
TABLE 140 OMRON CORPORATION: PRODUCTS OFFERED 179
11.1.7 SAMTEC 180
TABLE 141 SAMTEC: COMPANY OVERVIEW 180
TABLE 142 SAMTEC: PRODUCTS OFFERED 180
11.1.8 CSCONN CORPORATION 181
TABLE 143 CSCONN CORPORATION: COMPANY OVERVIEW 181
TABLE 144 CSCONN CORPORATION: PRODUCTS OFFERED 181
11.1.9 FIT HON TENG LIMITED 183
TABLE 145 FIT HON TENG LIMITED: COMPANY OVERVIEW 183
FIGURE 52 FIT HON TENG LIMITED: COMPANY SNAPSHOT 184
TABLE 146 FIT HON TENG LIMITED: PRODUCTS OFFERED 184
TABLE 147 FIT HON TENG LIMITED: OTHERS 185
11.1.10 KYOCERA CORPORATION 186
TABLE 148 KYOCERA CORPORATION: COMPANY OVERVIEW 186
FIGURE 53 KYOCERA CORPORATION: COMPANY SNAPSHOT 187
TABLE 149 KYOCERA CORPORATION: PRODUCTS OFFERED 187
TABLE 150 KYOCERA CORPORATION: PRODUCT LAUNCHES 188
11.1.11 HARTING TECHNOLOGY GROUP 189
TABLE 151 HARTING TECHNOLOGY GROUP: COMPANY OVERVIEW 189
TABLE 152 HARTING TECHNOLOGY GROUP: PRODUCTS OFFERED 189
TABLE 153 HARTING TECHNOLOGY GROUP: DEALS 190
TABLE 154 HARTING TECHNOLOGY GROUP: OTHERS 190
11.2 OTHER PLAYERS 191
11.2.1 3M 191
11.2.2 ERNI DEUTSCHLAND GMBH 192
11.2.3 HARWIN 193
11.2.4 EPT GMBH 194
11.2.5 KEL CORPORATION 195
11.2.6 METZ CONNECT GMBH 196
11.2.7 SMK CORPORATION 197
11.2.8 ACES ELECTRONICS CO., LTD. 198
11.2.9 AIRBORN, INC. 199
11.2.10 AUK 200
11.2.11 ROSENBERGER 201
11.2.12 JST SALES AMERICA, INC. 201
11.2.13 IRISO ELECTRONICS CO., LTD. 203
11.2.14 YAMAICHI ELECTRONICS CO. 204
11.2.15 PHOENIX CONTACT 205
*Details on Business Overview, Products Offered, Recent Developments, MnM View, Right to win, Strategic choices made, Weaknesses and competitive threats might not be captured in case of unlisted companies.
12 KEY PLAYERS IN INDUSTRIAL AUTOMATION 206
12.1 KEY PLAYERS 206
12.1.1 ROCKWELL AUTOMATION 206
12.1.1.1 Business overview 206
TABLE 155 ROCKWELL AUTOMATION: COMPANY OVERVIEW 206
FIGURE 54 ROCKWELL AUTOMATION: COMPANY SNAPSHOT 207
12.1.1.2 Products offered 207
TABLE 156 ROCKWELL AUTOMATION: PRODUCTS OFFERED 207
12.1.1.3 Recent developments 208
12.1.1.3.1 Product launches 208
TABLE 157 ROCKWELL AUTOMATION: PRODUCT LAUNCHES 208
12.1.1.3.2 Deals 208
TABLE 158 ROCKWELL AUTOMATION: DEALS 208
12.1.2 PARKER HANNIFIN CORP 209
12.1.2.1 Business overview 209
TABLE 159 PARKER HANNIFIN CORP: COMPANY OVERVIEW 209
FIGURE 55 PARKER HANNIFIN CORP: COMPANY SNAPSHOT 210
12.1.2.2 Products offered 211
TABLE 160 PARKER HANNIFIN CORP: PRODUCTS OFFERED 211
12.1.2.3 Recent developments 211
12.1.2.3.1 Deals 211
TABLE 161 PARKER HANNIFIN CORP: DEALS 211
12.1.3 SIEMENS 212
12.1.3.1 Business overview 212
TABLE 162 SIEMENS: COMPANY OVERVIEW 212
FIGURE 56 SIEMENS: COMPANY SNAPSHOT 213
12.1.3.2 Products offered 214
TABLE 163 SIEMENS: PRODUCTS OFFERED 214
12.1.3.3 Recent developments 214
12.1.3.3.1 Deals 214
TABLE 164 SIEMENS: DEALS 214
12.1.3.3.2 Others 215
TABLE 165 SIEMENS: OTHERS 215
12.1.4 EATON 216
12.1.4.1 Business overview 216
TABLE 166 EATON: COMPANY OVERVIEW 216
FIGURE 57 EATON: COMPANY SNAPSHOT 217
12.1.4.2 Products offered 218
TABLE 167 EATON: PRODUCTS OFFERED 218
12.1.4.3 Recent developments 218
12.1.4.3.1 Product launches 218
TABLE 168 EATON: PRODUCT LAUNCHES 218
12.1.4.3.2 Deals 218
TABLE 169 EATON: DEALS 218
12.1.5 ABB 219
12.1.5.1 Business overview 219
TABLE 170 ABB: COMPANY OVERVIEW 219
FIGURE 58 ABB: COMPANY SNAPSHOT 220
12.1.5.2 Products offered 221
TABLE 171 ABB: PRODUCTS OFFERED 221
12.1.5.3 Recent developments 221
12.1.5.3.1 Deals 221
TABLE 172 ABB: DEALS 221
12.1.5.3.2 Others 222
TABLE 173 ABB: OTHERS 222
12.1.6 EMERSON ELECTRIC CO. 223
12.1.6.1 Business overview 223
TABLE 174 EMERSON ELECTRIC CO.: COMPANY OVERVIEW 223
FIGURE 59 EMERSON ELECTRIC CO.: COMPANY SNAPSHOT 224
12.1.6.2 Products offered 224
TABLE 175 EMERSON ELECTRIC CO.: PRODUCTS OFFERED 224
12.1.6.3 Recent developments 225
12.1.6.3.1 Product launches 225
TABLE 176 EMERSON ELECTRIC CO.: PRODUCT LAUNCHES 225
12.1.6.3.2 Deals 225
TABLE 177 EMERSON ELECTRIC CO.: DEALS 225
13 ADJACENT AND RELATED MARKETS 226
13.1 INTRODUCTION 226
13.2 RFID MARKET, BY PRODUCT CATEGORY 226
TABLE 178 ELECTRONIC DESIGN AUTOMATION MARKET, BY PRODUCT CATEGORY, 2019–2022 (USD MILLION) 226
TABLE 179 ELECTRONIC DESIGN AUTOMATION MARKET, BY PRODUCT CATEGORY, 2023–2028 (USD MILLION) 227
13.3 COMPUTER-AIDED ENGINEERING (CAE) 227
13.3.1 RISING ADOPTION OF COMPUTER-AIDED ENGINEERING IN VARIOUS INDUSTRIES TO BOOST MARKET 227
13.4 INTEGRATED CIRCUIT (IC) PHYSICAL DESIGN & VERIFICATION 228
13.4.1 SHRINKING PROCESS GEOMETRIES TO INCREASE DEMAND 228
13.5 PRINTED CIRCUIT BOARD (PCB) & MULTI-CHIP MODULE (MCM) 228
13.5.1 GROWING USE OF PCBS AND MCMS IN DEFENSE, INDUSTRIAL, AND COMMERCIAL SECTORS TO DRIVE MARKET 228
13.6 SEMICONDUCTOR INTERNET PROTOCOL (IP) 228
13.6.1 EASY REUSABILITY AND LICENSING TO DRIVE MARKET 228
13.7 SERVICES 229
13.7.1 GROWING COMPLEXITY OF CHIP DESIGN TO DRIVE MARKET 229
14 APPENDIX 230
14.1 DISCUSSION GUIDE 230
14.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 232
14.3 CUSTOMIZATION OPTIONS 234
14.4 RELATED REPORTS 234
14.5 AUTHOR DETAILS 235

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Table of Contents

Summary

The global board-to-board connectors market was valued at USD 11.6 billion in 2023 and is estimated to reach USD 15.4 billion by 2028, registering a CAGR of 5.8% during the forecast period. The rising trend of smaller electronic devices like wearables, portable electronics, and smart appliances fuels the market. Manufacturers require board-to-board connectors that offer space-efficient designs while ensuring reliable interconnections between PCBs. Moreover, increasing automation in developing economies is fueling the demand for board-to-board connectors. These trends is leading to the growth of the board-to-board connectors market.
“Less than 1 mm segment is expected to grow at the highest CAGR during the forecast period.”
The Less than 1 mm segment is growing at the highest CAGR in the board-to-board connectors market. There is a growing trend towards miniaturization and compact designs in electronic devices across various industries. With the increasing demand for smaller, lighter, and more portable devices, there is a need for board-to-board connectors with smaller pitch sizes to enable the integration of components within limited spaces. Connectors with a pitch size of less than 1 mm offer the compactness required for these miniaturized designs.
“Consumer Electronics segment is projected to dominate the board-to-board connectors market.”
Consumer Electronics segment has the largest market share in the board-to-board connectors market. The consumer electronics market operates on large-scale production volumes, driven by high consumer demand and shorter product lifecycles. Board-to-board connectors, a vital component in consumer electronics assembly, are manufactured and supplied in large quantities to meet the industry's requirements. Additionally, consumer electronics manufacturers continuously strive to make their devices smaller, slimmer, and more aesthetically appealing. This miniaturization trend necessitates the use of compact board-to-board connectors that can accommodate the densely packed components on PCBs. These trends are fueling the demand for board-to-board connectors in consumer electronics.

“China is projected to dominate in Asia Pacific region for board-to-board connectors market”
China is having the largest market share in the board-to-board connectors market due to several factors. China has established itself as a global manufacturing hub, known for its cost-effective production capabilities and large-scale manufacturing infrastructure. The country's extensive network of electronic component manufacturers and suppliers allows for efficient and affordable production of board-to-board connectors. China's manufacturing expertise and economies of scale enable competitive pricing and high-volume production, attracting domestic and international customers.

In-depth interviews have been conducted with chief executive officers (CEOs), Directors, and other executives from various key organizations operating in the board-to-board connectors marketplace.

• By Company Type: Tier 1 – 25%, Tier 2 – 35%, and Tier 3 – 40%
• By Designation: C-level Executives – 35%, Directors – 25%, and Others – 40%
• By Region: North America– 20%, Europe – 30%, Asia Pacific– 40% and RoW- 10%

Amphenol Corporation (US), TE Connectivity (Switzerland), Japan Aviation Electronics (Japan), Hirose Electric Co Ltd (Japan), Molex (US), Omron Corporation (Japan), Samtec (US), Harting Technology Group (Germany), FIT Hon Teng Limited (Taiwan), Kyocera Corporation (Japan), and CSCONN Corporation (China) are some of the key players in the board-to-board connectors market.

The study includes an in-depth competitive analysis of these key players in the board-to-board connectors market, with their company profiles, recent developments, and key market strategies.

Research Coverage

This research report categorizes the board-to-board connectors market by type (Pin Headers, and Sockets), by pitch (Less than 1 mm, 1 mm to 2 mm, Greater than 2 mm), by application (Consumer Electronics, Industrial Automation, Telecommunication, Automotive, Healthcare, and Others), and by region (North America, Europe, Asia Pacific, and RoW). The scope of the report covers detailed information regarding the major factors, such as drivers, restraints, challenges, and opportunities, influencing the growth of the board-to-board connectors market. A detailed analysis of the key industry players has been done to provide insights into their business overview, solutions, and services; key strategies; Contracts, partnerships, agreements. new product & service launches, mergers and acquisitions, and recent developments associated with the board-to-board connectors market. Competitive analysis of upcoming startups in the board-to-board connectors market ecosystem is covered in this report.

Reasons to buy this report

The report will help the market leaders/new entrants in this market with information on the closest approximations of the revenue numbers for the overall board-to-board connectors market and the subsegments. This report will help stakeholders understand the competitive landscape and gain more insights to position their businesses better and to plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.

The report provides insights on the following pointers:
• Analysis of key drivers (Escalated demand for miniaturized and compact devices with high density interconnections, Rapid technological advancements in several applications such as electronics and telecommunications, Increasing demand for industrial automation and robotics), restraints (Technological complexities involved while developing application specific board-to-board connectors), opportunities (Deployment of 5G technology and high-capacity data centers in Asia Pacific Region, Growing Adoption of IoT and Edge computing), and challenges (Large technical challenges related to signal integrity and high-speed data transmission, and Cost optimization and pricing pressure due to intensely competitive market) influencing the growth of the board-to-board connectors market
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product & service launches in the board-to-board connectors market
• Market Development: Comprehensive information about lucrative markets – the report analyses the board-to-board connectors market across varied regions.
• Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the board-to-board connectors market
• Competitive Assessment: In-depth assessment of market shares, growth strategies and service offerings of leading players like Amphenol Corporation (US), TE Connectivity (Switzerland), Japan Aviation Electronics (Japan), Hirose Electric Co Ltd (Japan), Molex (US), Omron Corporation (Japan), Samtec (US), Harting Technology Group (Germany), FIT Hon Teng Limited (Taiwan), Kyocera Corporation (Japan), and CSCONN Corporation (China) among others in the board-to-board connectors market.

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調査レポートの納品までの日数はどの程度ですか?

在庫のあるものは速納となりますが、平均的には 3-４日と見て下さい。
但し、一部の調査レポートでは、発注を受けた段階で内容更新をして納品をする場合もあります。
発注をする前のお問合せをお願いします。

注文の手続きはどのようになっていますか?

1)お客様からの御問い合わせをいただきます。
2)見積書やサンプルの提示をいたします。
3)お客様指定、もしくは弊社の発注書をメール添付にて発送してください。
4)データリソース社からレポート発行元の調査会社へ納品手配します。
5) 調査会社からお客様へ納品されます。最近は、pdfにてのメール納品が大半です。

お支払方法の方法はどのようになっていますか?

納品と同時にデータリソース社よりお客様へ請求書（必要に応じて納品書も）を発送いたします。
お客様よりデータリソース社へ（通常は円払い）の御振り込みをお願いします。
請求書は、納品日の日付で発行しますので、翌月最終営業日までの当社指定口座への振込みをお願いします。振込み手数料は御社負担にてお願いします。
お客様の御支払い条件が60日以上の場合は御相談ください。
尚、初めてのお取引先や個人の場合、前払いをお願いすることもあります。ご了承のほど、お願いします。

データリソース社はどのような会社ですか?

当社は、世界各国の主要調査会社・レポート出版社と提携し、世界各国の市場調査レポートや技術動向レポートなどを日本国内の企業・公官庁及び教育研究機関に提供しております。
世界各国の「市場・技術・法規制などの」実情を調査・収集される時には、データリソース社にご相談ください。
お客様の御要望にあったデータや情報を抽出する為のレポート紹介や調査のアドバイスも致します。

サマリー

目次

Summary

Table of Contents

ご注文は、お電話またはWEBから承ります。お見積もりの作成もお気軽にご相談ください。

本レポートと同分野（電子部品／半導体）の最新刊レポート

MarketsandMarkets社のSemiconductor and Electronics分野での最新刊レポート

本レポートと同じKEY WORD（industrial automation）の最新刊レポート

よくあるご質問

MarketsandMarkets社はどのような調査会社ですか?

調査レポートの納品までの日数はどの程度ですか?

注文の手続きはどのようになっていますか?

お支払方法の方法はどのようになっていますか?

データリソース社はどのような会社ですか?