Summary

The global embedded die packaging technology market size reached USD 102.6 Million in 2024. Looking forward, IMARC Group expects the market to reach USD 266.1 Million by 2033, exhibiting a growth rate (CAGR) of 10.62% during 2025-2033. The increasing semiconductor industry, along with the growing sales of portable electronic devices, are propelling the market.

Embedded die packaging technology is used to embed components inside the substrate via a multi-step manufacturing process. It comprises flip-chip chip scale packaging (FC CSP) and wafer-level chip scale packaging (WL CSP) to improve the efficiency of the system. It creates more space for other components by shrinking overall solutions in the printed circuit board (PCB). It also provides surface-mount technology (SMT) integration and a flexible routing solution to reduce printed circuit board (PCB) size. It offers design flexibility that shifts from 2D to 3D while reducing distortion and power loss. As a result, embedded die packaging technology finds extensive application in electronics, information and technology (IT), automotive, healthcare, and telecommunication industries across the globe.

Embedded Die Packaging Technology Market Trends:
At present, there is an increase in the miniaturization of electronic circuits in microelectronic devices around the world. This, along with the burgeoning semiconductor industry, represents one of the key factors driving the market. Moreover, embedded die packaging technology offers several benefits, such as upgraded electrical and thermal performance, heterogeneous integration, and streamlined logistics for original equipment manufacturers (OEMs), which are contributing to the growth of the market. In addition, the increasing adoption of autonomous robots for professional services in various industries is offering lucrative growth opportunities to industry investors. Besides this, the growing utilization of embedded die packaging technology in smartphones and wearable devices to enhance the available space and integrate more components is positively influencing the market. Additionally, there is a rise in the demand for embedded die packaging technology with integrated internet of things (IoT) across the globe. This, coupled with the increasing sales of portable electronic devices, such as laptops, computers, tablets, e-readers, smartphones, MP3 players, drones, and electronic toys, is bolstering the growth of the market.

Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global embedded die packaging technology market report, along with forecasts at the global, regional and country level from 2025-2033. Our report has categorized the market based on platform and industry vertical.

Breakup by Platform:

Embedded Die in IC Package Substrate
Embedded Die in Rigid Board
Embedded Die in Flexible Board

Breakup by Industry Vertical:

Consumer Electronics
IT and Telecommunication
Automotive
Healthcare
Others

Breakup by Region:

North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa

Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG and TDK Electronics AG (TDK Corporation). Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report

1. What was the size of the global embedded die packaging technology market in 2024?
2. What is the expected growth rate of the global embedded die packaging technology market during 2025-2033?
3. What are the key factors driving the global embedded die packaging technology market?
4. What has been the impact of COVID-19 on the global embedded die packaging technology market?
5. What is the breakup of the global embedded die packaging technology market based on the platform?
6. What is the breakup of the global embedded die packaging technology market based on the industry vertical?
7. What are the key regions in the global embedded die packaging technology market?
8. Who are the key players/companies in the global embedded die packaging technology market?

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Table of Contents

1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Embedded Die Packaging Technology Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Platform
6.1 Embedded Die in IC Package Substrate
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 Embedded Die in Rigid Board
6.2.1 Market Trends
6.2.2 Market Forecast
6.3 Embedded Die in Flexible Board
6.3.1 Market Trends
6.3.2 Market Forecast
7 Market Breakup by Industry Vertical
7.1 Consumer Electronics
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 IT and Telecommunication
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 Automotive
7.3.1 Market Trends
7.3.2 Market Forecast
7.4 Healthcare
7.4.1 Market Trends
7.4.2 Market Forecast
7.5 Others
7.5.1 Market Trends
7.5.2 Market Forecast
8 Market Breakup by Region
8.1 North America
8.1.1 United States
8.1.1.1 Market Trends
8.1.1.2 Market Forecast
8.1.2 Canada
8.1.2.1 Market Trends
8.1.2.2 Market Forecast
8.2 Asia-Pacific
8.2.1 China
8.2.1.1 Market Trends
8.2.1.2 Market Forecast
8.2.2 Japan
8.2.2.1 Market Trends
8.2.2.2 Market Forecast
8.2.3 India
8.2.3.1 Market Trends
8.2.3.2 Market Forecast
8.2.4 South Korea
8.2.4.1 Market Trends
8.2.4.2 Market Forecast
8.2.5 Australia
8.2.5.1 Market Trends
8.2.5.2 Market Forecast
8.2.6 Indonesia
8.2.6.1 Market Trends
8.2.6.2 Market Forecast
8.2.7 Others
8.2.7.1 Market Trends
8.2.7.2 Market Forecast
8.3 Europe
8.3.1 Germany
8.3.1.1 Market Trends
8.3.1.2 Market Forecast
8.3.2 France
8.3.2.1 Market Trends
8.3.2.2 Market Forecast
8.3.3 United Kingdom
8.3.3.1 Market Trends
8.3.3.2 Market Forecast
8.3.4 Italy
8.3.4.1 Market Trends
8.3.4.2 Market Forecast
8.3.5 Spain
8.3.5.1 Market Trends
8.3.5.2 Market Forecast
8.3.6 Russia
8.3.6.1 Market Trends
8.3.6.2 Market Forecast
8.3.7 Others
8.3.7.1 Market Trends
8.3.7.2 Market Forecast
8.4 Latin America
8.4.1 Brazil
8.4.1.1 Market Trends
8.4.1.2 Market Forecast
8.4.2 Mexico
8.4.2.1 Market Trends
8.4.2.2 Market Forecast
8.4.3 Others
8.4.3.1 Market Trends
8.4.3.2 Market Forecast
8.5 Middle East and Africa
8.5.1 Market Trends
8.5.2 Market Breakup by Country
8.5.3 Market Forecast
9 SWOT Analysis
9.1 Overview
9.2 Strengths
9.3 Weaknesses
9.4 Opportunities
9.5 Threats
10 Value Chain Analysis
11 Porters Five Forces Analysis
11.1 Overview
11.2 Bargaining Power of Buyers
11.3 Bargaining Power of Suppliers
11.4 Degree of Competition
11.5 Threat of New Entrants
11.6 Threat of Substitutes
12 Price Analysis
13 Competitive Landscape
13.1 Market Structure
13.2 Key Players
13.3 Profiles of Key Players
13.3.1 Amkor Technology Inc.
13.3.1.1 Company Overview
13.3.1.2 Product Portfolio
13.3.1.3 Financials
13.3.1.4 SWOT Analysis
13.3.2 ASE Technology Holding Co. Ltd.
13.3.2.1 Company Overview
13.3.2.2 Product Portfolio
13.3.2.3 Financials
13.3.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.3.3.1 Company Overview
13.3.3.2 Product Portfolio
13.3.3.3 Financials
13.3.4 Fujikura Ltd.
13.3.4.1 Company Overview
13.3.4.2 Product Portfolio
13.3.4.3 Financials
13.3.4.4 SWOT Analysis
13.3.5 Infineon Technologies AG
13.3.5.1 Company Overview
13.3.5.2 Product Portfolio
13.3.5.3 Financials
13.3.5.4 SWOT Analysis
13.3.6 Microsemi Corporation (Microchip Technology Inc.)
13.3.6.1 Company Overview
13.3.6.2 Product Portfolio
13.3.6.3 SWOT Analysis
13.3.7 Schweizer Electronic AG
13.3.7.1 Company Overview
13.3.7.2 Product Portfolio
13.3.7.3 Financials
13.3.8 TDK Electronics AG (TDK Corporation)
13.3.8.1 Company Overview
13.3.8.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report

List of Figures

Figure 1: Global: Embedded Die Packaging Technology Market: Major Drivers and Challenges
Figure 2: Global: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019-2024
Figure 3: Global: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 4: Global: Embedded Die Packaging Technology Market: Breakup by Platform (in %), 2024
Figure 5: Global: Embedded Die Packaging Technology Market: Breakup by Industry Vertical (in %), 2024
Figure 6: Global: Embedded Die Packaging Technology Market: Breakup by Region (in %), 2024
Figure 7: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market: Sales Value (in Million USD), 2019 & 2024
Figure 8: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 9: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market: Sales Value (in Million USD), 2019 & 2024
Figure 10: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 11: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market: Sales Value (in Million USD), 2019 & 2024
Figure 12: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 13: Global: Embedded Die Packaging Technology (Consumer Electronics) Market: Sales Value (in Million USD), 2019 & 2024
Figure 14: Global: Embedded Die Packaging Technology (Consumer Electronics) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 15: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market: Sales Value (in Million USD), 2019 & 2024
Figure 16: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 17: Global: Embedded Die Packaging Technology (Automotive) Market: Sales Value (in Million USD), 2019 & 2024
Figure 18: Global: Embedded Die Packaging Technology (Automotive) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 19: Global: Embedded Die Packaging Technology (Healthcare) Market: Sales Value (in Million USD), 2019 & 2024
Figure 20: Global: Embedded Die Packaging Technology (Healthcare) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 21: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market: Sales Value (in Million USD), 2019 & 2024
Figure 22: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 23: North America: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 24: North America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 25: United States: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 26: United States: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 27: Canada: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 28: Canada: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 29: Asia-Pacific: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 30: Asia-Pacific: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 31: China: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 32: China: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 33: Japan: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 34: Japan: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 35: India: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 36: India: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 37: South Korea: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 38: South Korea: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 39: Australia: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 40: Australia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 41: Indonesia: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 42: Indonesia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 43: Others: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 44: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 45: Europe: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 46: Europe: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 47: Germany: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 48: Germany: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 49: France: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 50: France: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 51: United Kingdom: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 52: United Kingdom: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 53: Italy: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 54: Italy: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 55: Spain: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 56: Spain: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 57: Russia: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 58: Russia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 59: Others: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 60: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 61: Latin America: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 62: Latin America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 63: Brazil: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 64: Brazil: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 65: Mexico: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 66: Mexico: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 67: Others: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 68: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 69: Middle East and Africa: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 70: Middle East and Africa: Embedded Die Packaging Technology Market: Breakup by Country (in %), 2024
Figure 71: Middle East and Africa: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 72: Global: Embedded Die Packaging Technology Industry: SWOT Analysis
Figure 73: Global: Embedded Die Packaging Technology Industry: Value Chain Analysis
Figure 74: Global: Embedded Die Packaging Technology Industry: Porter's Five Forces Analysis

List of Tables

Table 1: Global: Embedded Die Packaging Technology Market: Key Industry Highlights, 2024 and 2033
Table 2: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Platform (in Million USD), 2025-2033
Table 3: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Industry Vertical (in Million USD), 2025-2033
Table 4: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Region (in Million USD), 2025-2033
Table 5: Global: Embedded Die Packaging Technology Market: Competitive Structure
Table 6: Global: Embedded Die Packaging Technology Market: Key Players