世界各国のリアルタイムなデータ・インテリジェンスで皆様をお手伝い

eFuse市場（タイプ。ラッチ型 eFuse とオートリトライ型 eFuse、パッケージタイプ:Small Outline No Lead [SON], Dual Flat No Leads [DFN], Quad Flat No Lead [QFN], Thin Shrink Small Outline Package [TSSOP], and Others; Application（アプリケーション）:用途: Solid State Drive, Hard Disk Drive, Servers and Data Center Equipment, Automotive Electronics, and Others; and End-use Industry:世界の産業分析、サイズ、シェア、成長、トレンド、予測、2021年～2031年


eFuse Market (Type: Latched Type eFuse and Auto-retry Type eFuse; Package Type: Small Outline No Lead [SON], Dual Flat No Leads [DFN], Quad Flat No-lead [QFN], Thin Shrink Small Outline Package [TSSOP], and Others; Application: Solid State Drives, Hard Disk Drives, Servers and Data Center Equipment, Automotive Electronics, and Others; and End-use Industry: Automotive & Transportation, Aerospace & Defense, Consumer Electronics, Healthcare, IT & Telecommunication, and Others) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2021-2031

eFuseの市場 - レポートの範囲 このレポートは世界のeFuse市場を調査したTransparency Market Research (TMR)の調査報告書です。世界のeFuse市場の促進要因、動向、課題などの主要な市場力学やその構造に関する... もっと見る

　

　

出版社 出版年月 電子版価格 ページ数 言語
Transparency Market Research
トランスペアレンシーマーケットリサーチ 		2021年11月30日 US$5,795
シングルユーザーライセンス
ライセンス・価格情報
注文方法はこちら 		168 英語

　

サマリー

eFuseの市場 - レポートの範囲
このレポートは世界のeFuse市場を調査したTransparency Market Research (TMR)の調査報告書です。世界のeFuse市場の促進要因、動向、課題などの主要な市場力学やその構造に関する詳細な情報を提供しています。TMRの調査は、世界のeFuse市場が2021年から2031年の予測期間中にどのように拡大すると予想されるかを説明するために、世界のeFuse市場に関する貴重な情報を提供します。

バリューチェーン分析や年平均成長率（CAGR）など、市場成長の主要指標はTMRの調査において包括的に解明されています。このデータは、読者が世界のeFuse市場の定量的な成長側面を解釈するのに役立ちます。

主要な市場参加者が採用している事業戦略に関する広範な分析も、TMRのeFuseの世界市場に関する調査において特集されています。これは読者が世界のeFuse市場の成長をもたらす主要因を理解するのに役立ちます。本調査では、世界のeFuse市場の質的・量的な成長の道筋に関する具体的なデータも掲載しています。このデータは、近い将来、市場参加者が適切な意思決定を行うための指針となるでしょう。

TMRのeFuse市場に関する調査において回答された主要な質問
2021年から2031年にかけてのeFuse世界市場の前年比成長トレンドはどうなるか？
タイプ別セグメントのトレンドの変化がeFuseの世界市場に与える影響とは？
今後数年間、アジア太平洋地域は eFuse のプロバイダーにとって最も支配的な地域市場であり続けるでしょうか？
予測期間中に世界の eFuse 市場の妨げとなる要因は何でしょうか？
世界の eFuse 市場で事業を展開している大手企業はどこか？
調査方法
TMRでは、eFuseの世界市場に関する包括的な調査を実施し、市場の今後の成長見通しに関する結論を得るために、独自の調査手法を採用しています。この調査手法は、一次調査と二次調査を組み合わせたものであり、アナリストが導き出された結論の正確性と信頼性を保証するのに役立ちます。

eFuseの世界市場に関するレポート作成時にアナリストが参照した二次調査ソースには、企業の年次報告書、SEC提出書類、企業ウェブサイト、世界銀行データベース、投資家向けプレゼンテーション、規制データベース、政府刊行物、市場ホワイトペーパーからの統計が含まれています。また、アナリストは一次調査資料として、TMRのeFuseの世界市場に関する調査作成に貢献したシニアマネージャー、製品ポートフォリオマネージャー、CEO、副社長、マーケットインテリジェンスマネージャーへのインタビューも行っています。

これらの一次情報源および二次情報源は、世界のeFuse市場で活動する主要プレイヤーからの検証として、インタビュー時に独占情報を提供しています。社内の広範なリポジトリおよび社外の独自データベースへのアクセスにより、本レポートは世界の eFuse 市場に関する特定の詳細および質問に正確に対応することができました。また、本調査では、トップダウンアプローチで各分野の数値を評価し、ボトムアップアプローチでその数値を反証しています。これにより、世界のeFuse市場の将来展望に関するTMRの予測は、より信頼性が高く正確なものとなっています。

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目次

1. Preface
    1.1. Market Introduction
    1.2. Market and Segments Definition
    1.3. Market Taxonomy
    1.4. Research Methodology
    1.5. Assumption and Acronyms
2. Executive Summary
    2.1. Global eFuse Market Analysis and Forecast
    2.2. Regional Outline
    2.3. Market Dynamics Snapshot
    2.4. Competition Blueprint
3. Market Dynamics
    3.1. Macro-economic Factors
    3.2. Key Market Indicators
    3.3. Drivers
        3.3.1. Economic Drivers
        3.3.2. Supply Side Drivers
        3.3.3. Demand Side Drivers
    3.4. Market Restraints and Opportunities
    3.5. Market Trends
        3.5.1. Demand Side
        3.5.2. Supply Side
    3.6. Regulatory Framework
4. Associated Industry and Key Indicator Assessment
    4.1. Parent Industry Overview – Semiconductor Switches Industry
    4.2. Supply Chain Analysis
    4.3. Technology Roadmap Analysis
    4.4. Industry SWOT Analysis
    4.5. Porter Five Forces Analysis
    4.6. COVID-19 Impact Analysis
5. Global eFuse Market Analysis, by Type
    5.1. Global eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        5.1.1. Latched Type eFuse
        5.1.2. Auto-retry Type eFuse
    5.2. Global eFuse Market Attractiveness Analysis, by Type
6. Global eFuse Market Analysis, by Package Type
    6.1. Global eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        6.1.1. Small Outline No Lead (SON)
        6.1.2. Dual Flat No Leads (DFN)
        6.1.3. Quad Flat No-lead (QFN)
        6.1.4. Thin Shrink Small Outline Package (TSSOP)
        6.1.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    6.2. Global eFuse Market Attractiveness Analysis, by Package Type
7. Global eFuse Market Analysis, by Application
    7.1. Global eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        7.1.1. Solid State Drives
        7.1.2. Hard Disk Drives
        7.1.3. Servers and Data Center Equipment
        7.1.4. Automotive Electronics
        7.1.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    7.2. Global eFuse Market Attractiveness Analysis, by Application
8. Global eFuse Market Analysis, by End-use Industry
    8.1. Global eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        8.1.1. Automotive & Transportation
        8.1.2. Aerospace & Defense
        8.1.3. Consumer Electronics
        8.1.4. Healthcare
        8.1.5. IT & Telecommunication
        8.1.6. Others (Manufacturing, Agriculture, etc.)
    8.2. Global eFuse Market Attractiveness Analysis, by End-use Industry
9. Global eFuse Market Analysis and Forecast, by Region
    9.1. Global eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Region, 2017 – 2031
        9.1.1. North America
        9.1.2. Europe
        9.1.3. Asia Pacific
        9.1.4. Middle East & Africa
        9.1.5. South America
    9.2. Global eFuse Market Attractiveness Analysis, by Region
10. North America eFuse Market Analysis and Forecast
    10.1. Market Snapshot
    10.2. Key Trends Analysis
    10.3. Drivers and Restraints: Impact Analysis
    10.4. Pricing Analysis
    10.5. Key Regulations
    10.6. North America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        10.6.1. Latched Type eFuse
        10.6.2. Auto-retry Type eFuse
    10.7. North America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        10.7.1. Small Outline No Lead (SON)
        10.7.2. Dual Flat No Leads (DFN)
        10.7.3. Quad Flat No-lead (QFN)
        10.7.4. Thin Shrink Small Outline Package (TSSOP)
        10.7.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    10.8. North America eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        10.8.1. Solid State Drives
        10.8.2. Hard Disk Drives
        10.8.3. Servers and Data Center Equipment
        10.8.4. Automotive Electronics
        10.8.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    10.9. North America eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        10.9.1. Automotive & Transportation
        10.9.2. Aerospace & Defense
        10.9.3. Consumer Electronics
        10.9.4. Healthcare
        10.9.5. IT & Telecommunication
        10.9.6. Others (Manufacturing, Agriculture, etc.)
    10.10. North America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Country & Sub-region, 2017 – 2031
        10.10.1. U.S.
        10.10.2. Canada
        10.10.3. Rest of North America
    10.11. North America eFuse Market Attractiveness Analysis
        10.11.1. By Type
        10.11.2. By Package Type
        10.11.3. By Application
        10.11.4. By End-use Industry
        10.11.5. By Country & Sub-region
11. Europe eFuse Market Analysis and Forecast
    11.1. Market Snapshot
    11.2. Key Trends Analysis
    11.3. Drivers and Restraints: Impact Analysis
    11.4. Pricing Analysis
    11.5. Key Regulations
    11.6. Europe eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        11.6.1. Latched Type eFuse
        11.6.2. Auto-retry Type eFuse
    11.7. Europe eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        11.7.1. Small Outline No Lead (SON)
        11.7.2. Dual Flat No Leads (DFN)
        11.7.3. Quad Flat No-lead (QFN)
        11.7.4. Thin Shrink Small Outline Package (TSSOP)
        11.7.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    11.8. Europe eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        11.8.1. Solid State Drives
        11.8.2. Hard Disk Drives
        11.8.3. Servers and Data Center Equipment
        11.8.4. Automotive Electronics
        11.8.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    11.9. Europe eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        11.9.1. Automotive & Transportation
        11.9.2. Aerospace & Defense
        11.9.3. Consumer Electronics
        11.9.4. Healthcare
        11.9.5. IT & Telecommunication
        11.9.6. Others (Manufacturing, Agriculture, etc.)
    11.10. Europe eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Country and Sub-region, 2017‒2031
        11.10.1. U.K.
        11.10.2. Germany
        11.10.3. France
        11.10.4. Italy
        11.10.5. Russia
        11.10.6. Rest of Europe
    11.11. Europe eFuse Market Attractiveness Analysis
        11.11.1. By Type
        11.11.2. By Package Type
        11.11.3. By Application
        11.11.4. By End-use Industry
        11.11.5. By Country & Sub-region
12. Asia Pacific eFuse Market Analysis and Forecast
    12.1. Market Snapshot
    12.2. Key Trends Analysis
    12.3. Drivers and Restraints: Impact Analysis
    12.4. Pricing Analysis
    12.5. Key Regulations
    12.6. Asia Pacific eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        12.6.1. Latched Type eFuse
        12.6.2. Auto-retry Type eFuse
    12.7. Asia Pacific eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        12.7.1. Small Outline No Lead (SON)
        12.7.2. Dual Flat No Leads (DFN)
        12.7.3. Quad Flat No-lead (QFN)
        12.7.4. Thin Shrink Small Outline Package (TSSOP)
        12.7.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    12.8. Asia Pacific eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        12.8.1. Solid State Drives
        12.8.2. Hard Disk Drives
        12.8.3. Servers and Data Center Equipment
        12.8.4. Automotive Electronics
        12.8.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    12.9. Asia Pacific eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        12.9.1. Automotive & Transportation
        12.9.2. Aerospace & Defense
        12.9.3. Consumer Electronics
        12.9.4. Healthcare
        12.9.5. IT & Telecommunication
        12.9.6. Others (Manufacturing, Agriculture, etc.)
    12.10. Asia Pacific eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Country and Sub-region, 2017 – 2031
        12.10.1. China
        12.10.2. India
        12.10.3. Japan
        12.10.4. South Korea
        12.10.5. ASEAN
        12.10.6. Rest of Asia Pacific
    12.11. Asia Pacific eFuse Market Attractiveness Analysis
        12.11.1. By Type
        12.11.2. By Package Type
        12.11.3. By Application
        12.11.4. By End-use Industry
        12.11.5. By Country & Sub-region
13. Middle East & Africa (MEA) eFuse Market Analysis and Forecast
    13.1. Market Snapshot
    13.2. Key Trends Analysis
    13.3. Drivers and Restraints: Impact Analysis
    13.4. Pricing Analysis
    13.5. Key Regulations
    13.6. MEA eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        13.6.1. Latched Type eFuse
        13.6.2. Auto-retry Type eFuse
    13.7. MEA eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        13.7.1. Small Outline No Lead (SON)
        13.7.2. Dual Flat No Leads (DFN)
        13.7.3. Quad Flat No-lead (QFN)
        13.7.4. Thin Shrink Small Outline Package (TSSOP)
        13.7.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    13.8. MEA eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        13.8.1. Solid State Drives
        13.8.2. Hard Disk Drives
        13.8.3. Servers and Data Center Equipment
        13.8.4. Automotive Electronics
        13.8.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    13.9. MEA eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        13.9.1. Automotive & Transportation
        13.9.2. Aerospace & Defense
        13.9.3. Consumer Electronics
        13.9.4. Healthcare
        13.9.5. IT & Telecommunication
        13.9.6. Others (Manufacturing, Agriculture, etc.)
    13.10. MEA eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Country and Sub-region, 2017‒2031
        13.10.1. GCC
        13.10.2. South Africa
        13.10.3. North Africa
        13.10.4. Rest of Middle East & Africa
    13.11. MEA eFuse Market Attractiveness Analysis
        13.11.1. By Type
        13.11.2. By Package Type
        13.11.3. By Application
        13.11.4. By End-use Industry
        13.11.5. By Country & Sub-region
14. South America eFuse Market Analysis and Forecast
    14.1. Market Snapshot
    14.2. Key Trends Analysis
    14.3. Drivers and Restraints: Impact Analysis
    14.4. Pricing Analysis
    14.5. Key Regulations
    14.6. South America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        14.6.1. Latched Type eFuse
        14.6.2. Auto-retry Type eFuse
    14.7. South America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        14.7.1. Small Outline No Lead (SON)
        14.7.2. Dual Flat No Leads (DFN)
        14.7.3. Quad Flat No-lead (QFN)
        14.7.4. Thin Shrink Small Outline Package (TSSOP)
        14.7.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    14.8. South America eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        14.8.1. Solid State Drives
        14.8.2. Hard Disk Drives
        14.8.3. Servers and Data Center Equipment
        14.8.4. Automotive Electronics
        14.8.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    14.9. South America eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        14.9.1. Automotive & Transportation
        14.9.2. Aerospace & Defense
        14.9.3. Consumer Electronics
        14.9.4. Healthcare
        14.9.5. IT & Telecommunication
        14.9.6. Others (Manufacturing, Agriculture, etc.)
    14.10. South America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Country and Sub-region, 2017‒2031
        14.10.1. Brazil
        14.10.2. Argentina
        14.10.3. Rest of South America
    14.11. South America eFuse Market Attractiveness Analysis
        14.11.1. By Type
        14.11.2. By Package Type
        14.11.3. By Application
        14.11.4. By End-use Industry
        14.11.5. By Country & Sub-region
15. Competition Assessment
    15.1. Global eFuse Market Competition Matrix - a Dashboard View
        15.1.1. Global eFuse Market Company Share Analysis, by Value (2020)
        15.1.2. Technological Differentiator
16. Company Profiles (Manufacturers/Suppliers)
    16.1. Analog Devices Inc.
        16.1.1. Overview
        16.1.2. Product Portfolio
        16.1.3. Sales Footprint
        16.1.4. Key Subsidiaries or Distributors
        16.1.5. Strategy and Recent Developments
        16.1.6. Financial Analysis
    16.2. Diodes Incorporated
        16.2.1. Overview
        16.2.2. Product Portfolio
        16.2.3. Sales Footprint
        16.2.4. Key Subsidiaries or Distributors
        16.2.5. Strategy and Recent Developments
        16.2.6. Financial Analysis
    16.3. Microsemi Corporation
        16.3.1. Overview
        16.3.2. Product Portfolio
        16.3.3. Sales Footprint
        16.3.4. Key Subsidiaries or Distributors
        16.3.5. Strategy and Recent Developments
        16.3.6. Financial Analysis
    16.4. On Semiconductor Corporation
        16.4.1. Overview
        16.4.2. Product Portfolio
        16.4.3. Sales Footprint
        16.4.4. Key Subsidiaries or Distributors
        16.4.5. Strategy and Recent Developments
        16.4.6. Financial Analysis
    16.5. Qorvo, Inc.
        16.5.1. Overview
        16.5.2. Product Portfolio
        16.5.3. Sales Footprint
        16.5.4. Key Subsidiaries or Distributors
        16.5.5. Strategy and Recent Developments
        16.5.6. Financial Analysis
    16.6. STMicroelectronics N.V.
        16.6.1. Overview
        16.6.2. Product Portfolio
        16.6.3. Sales Footprint
        16.6.4. Key Subsidiaries or Distributors
        16.6.5. Strategy and Recent Developments
        16.6.6. Financial Analysis
    16.7. Texas Instruments Incorporated
        16.7.1. Overview
        16.7.2. Product Portfolio
        16.7.3. Sales Footprint
        16.7.4. Key Subsidiaries or Distributors
        16.7.5. Strategy and Recent Developments
        16.7.6. Financial Analysis
    16.8. Toshiba Electronic Devices & Storage Corporation
        16.8.1. Overview
        16.8.2. Product Portfolio
        16.8.3. Sales Footprint
        16.8.4. Key Subsidiaries or Distributors
        16.8.5. Strategy and Recent Developments
        16.8.6. Financial Analysis
17. Recommendation
    17.1. Opportunity Assessment
        17.1.1. By Type
        17.1.2. By Package Type
        17.1.3. By Application
        17.1.4. By End-use Industry
        17.1.5. By Region

　

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Summary

eFuse Market – Scope of Report
A new study on the global eFuse market has been published by Transparency Market Research (TMR). It presents detailed information on key market dynamics, including drivers, trends, and challenges for the global eFuse market as well as its structure. TMR’s study offers valuable information on the global eFuse market in order to illustrate how the market is expected to expand during the forecast period of 2021 to 2031.

Key indicators of market growth, which include value chain analysis and compound annual growth rate (CAGR), are elucidated in TMR’s study in a comprehensive manner. This data can help readers interpret the quantitative growth aspects of the global eFuse market.

An extensive analysis of business strategies adopted by leading market players is also featured in TMR’s study on the global eFuse market. This can help readers understand key factors responsible for growth of the global eFuse market. In this study, readers can also find specific data on avenues for qualitative and quantitative growth of the global eFuse market. This data would guide market players in making apt decisions in the near future.

Key Questions Answered in TMR’s Study on eFuse Market
What would be the Y-o-Y growth trend of the global eFuse market between 2021 and 2031?
What is the influence of changing trends in the type segment on the global eFuse market?
Would Asia Pacific continue to be the most dominant regional market for providers of eFuse over the next few years?
Which factors would hinder the global eFuse market during the forecast period?
Which are the leading companies operating in the global eFuse market?
Research Methodology
A unique research methodology has been adopted by TMR to conduct comprehensive research on the global eFuse market and arrive at conclusions on future growth prospects for the market. This research methodology is a combination of primary and secondary research, which helps analysts warrant the accuracy and reliability of the conclusions drawn.

Secondary research sources referred to by analysts during production of the report on the global eFuse market include statistics from company annual reports, SEC filings, company websites, World Bank database, investor presentations, regulatory databases, government publications, and market white papers. Analysts have also interviewed senior managers, product portfolio managers, CEOs, VPs, and market intelligence managers, who have contributed to production of TMR’s study on the global eFuse market as a primary research source.

These primary and secondary sources provided exclusive information during interviews, which served as a validation from leading players operating in the global eFuse market. Access to an extensive internal repository as well as external proprietary databases allowed this report to address specific details and questions about the global eFuse market with accuracy. The study also uses a top-down approach to assess the numbers for each segment and a bottom-up approach to counter-validate them. This has helped in making TMR’s estimates on future prospects for the global eFuse market more reliable and accurate.



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Table of Contents

1. Preface
    1.1. Market Introduction
    1.2. Market and Segments Definition
    1.3. Market Taxonomy
    1.4. Research Methodology
    1.5. Assumption and Acronyms
2. Executive Summary
    2.1. Global eFuse Market Analysis and Forecast
    2.2. Regional Outline
    2.3. Market Dynamics Snapshot
    2.4. Competition Blueprint
3. Market Dynamics
    3.1. Macro-economic Factors
    3.2. Key Market Indicators
    3.3. Drivers
        3.3.1. Economic Drivers
        3.3.2. Supply Side Drivers
        3.3.3. Demand Side Drivers
    3.4. Market Restraints and Opportunities
    3.5. Market Trends
        3.5.1. Demand Side
        3.5.2. Supply Side
    3.6. Regulatory Framework
4. Associated Industry and Key Indicator Assessment
    4.1. Parent Industry Overview – Semiconductor Switches Industry
    4.2. Supply Chain Analysis
    4.3. Technology Roadmap Analysis
    4.4. Industry SWOT Analysis
    4.5. Porter Five Forces Analysis
    4.6. COVID-19 Impact Analysis
5. Global eFuse Market Analysis, by Type
    5.1. Global eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        5.1.1. Latched Type eFuse
        5.1.2. Auto-retry Type eFuse
    5.2. Global eFuse Market Attractiveness Analysis, by Type
6. Global eFuse Market Analysis, by Package Type
    6.1. Global eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        6.1.1. Small Outline No Lead (SON)
        6.1.2. Dual Flat No Leads (DFN)
        6.1.3. Quad Flat No-lead (QFN)
        6.1.4. Thin Shrink Small Outline Package (TSSOP)
        6.1.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    6.2. Global eFuse Market Attractiveness Analysis, by Package Type
7. Global eFuse Market Analysis, by Application
    7.1. Global eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        7.1.1. Solid State Drives
        7.1.2. Hard Disk Drives
        7.1.3. Servers and Data Center Equipment
        7.1.4. Automotive Electronics
        7.1.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    7.2. Global eFuse Market Attractiveness Analysis, by Application
8. Global eFuse Market Analysis, by End-use Industry
    8.1. Global eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        8.1.1. Automotive & Transportation
        8.1.2. Aerospace & Defense
        8.1.3. Consumer Electronics
        8.1.4. Healthcare
        8.1.5. IT & Telecommunication
        8.1.6. Others (Manufacturing, Agriculture, etc.)
    8.2. Global eFuse Market Attractiveness Analysis, by End-use Industry
9. Global eFuse Market Analysis and Forecast, by Region
    9.1. Global eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Region, 2017 – 2031
        9.1.1. North America
        9.1.2. Europe
        9.1.3. Asia Pacific
        9.1.4. Middle East & Africa
        9.1.5. South America
    9.2. Global eFuse Market Attractiveness Analysis, by Region
10. North America eFuse Market Analysis and Forecast
    10.1. Market Snapshot
    10.2. Key Trends Analysis
    10.3. Drivers and Restraints: Impact Analysis
    10.4. Pricing Analysis
    10.5. Key Regulations
    10.6. North America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        10.6.1. Latched Type eFuse
        10.6.2. Auto-retry Type eFuse
    10.7. North America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        10.7.1. Small Outline No Lead (SON)
        10.7.2. Dual Flat No Leads (DFN)
        10.7.3. Quad Flat No-lead (QFN)
        10.7.4. Thin Shrink Small Outline Package (TSSOP)
        10.7.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    10.8. North America eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        10.8.1. Solid State Drives
        10.8.2. Hard Disk Drives
        10.8.3. Servers and Data Center Equipment
        10.8.4. Automotive Electronics
        10.8.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    10.9. North America eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        10.9.1. Automotive & Transportation
        10.9.2. Aerospace & Defense
        10.9.3. Consumer Electronics
        10.9.4. Healthcare
        10.9.5. IT & Telecommunication
        10.9.6. Others (Manufacturing, Agriculture, etc.)
    10.10. North America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Country & Sub-region, 2017 – 2031
        10.10.1. U.S.
        10.10.2. Canada
        10.10.3. Rest of North America
    10.11. North America eFuse Market Attractiveness Analysis
        10.11.1. By Type
        10.11.2. By Package Type
        10.11.3. By Application
        10.11.4. By End-use Industry
        10.11.5. By Country & Sub-region
11. Europe eFuse Market Analysis and Forecast
    11.1. Market Snapshot
    11.2. Key Trends Analysis
    11.3. Drivers and Restraints: Impact Analysis
    11.4. Pricing Analysis
    11.5. Key Regulations
    11.6. Europe eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        11.6.1. Latched Type eFuse
        11.6.2. Auto-retry Type eFuse
    11.7. Europe eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        11.7.1. Small Outline No Lead (SON)
        11.7.2. Dual Flat No Leads (DFN)
        11.7.3. Quad Flat No-lead (QFN)
        11.7.4. Thin Shrink Small Outline Package (TSSOP)
        11.7.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    11.8. Europe eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        11.8.1. Solid State Drives
        11.8.2. Hard Disk Drives
        11.8.3. Servers and Data Center Equipment
        11.8.4. Automotive Electronics
        11.8.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    11.9. Europe eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        11.9.1. Automotive & Transportation
        11.9.2. Aerospace & Defense
        11.9.3. Consumer Electronics
        11.9.4. Healthcare
        11.9.5. IT & Telecommunication
        11.9.6. Others (Manufacturing, Agriculture, etc.)
    11.10. Europe eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Country and Sub-region, 2017‒2031
        11.10.1. U.K.
        11.10.2. Germany
        11.10.3. France
        11.10.4. Italy
        11.10.5. Russia
        11.10.6. Rest of Europe
    11.11. Europe eFuse Market Attractiveness Analysis
        11.11.1. By Type
        11.11.2. By Package Type
        11.11.3. By Application
        11.11.4. By End-use Industry
        11.11.5. By Country & Sub-region
12. Asia Pacific eFuse Market Analysis and Forecast
    12.1. Market Snapshot
    12.2. Key Trends Analysis
    12.3. Drivers and Restraints: Impact Analysis
    12.4. Pricing Analysis
    12.5. Key Regulations
    12.6. Asia Pacific eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        12.6.1. Latched Type eFuse
        12.6.2. Auto-retry Type eFuse
    12.7. Asia Pacific eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        12.7.1. Small Outline No Lead (SON)
        12.7.2. Dual Flat No Leads (DFN)
        12.7.3. Quad Flat No-lead (QFN)
        12.7.4. Thin Shrink Small Outline Package (TSSOP)
        12.7.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    12.8. Asia Pacific eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        12.8.1. Solid State Drives
        12.8.2. Hard Disk Drives
        12.8.3. Servers and Data Center Equipment
        12.8.4. Automotive Electronics
        12.8.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    12.9. Asia Pacific eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        12.9.1. Automotive & Transportation
        12.9.2. Aerospace & Defense
        12.9.3. Consumer Electronics
        12.9.4. Healthcare
        12.9.5. IT & Telecommunication
        12.9.6. Others (Manufacturing, Agriculture, etc.)
    12.10. Asia Pacific eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Country and Sub-region, 2017 – 2031
        12.10.1. China
        12.10.2. India
        12.10.3. Japan
        12.10.4. South Korea
        12.10.5. ASEAN
        12.10.6. Rest of Asia Pacific
    12.11. Asia Pacific eFuse Market Attractiveness Analysis
        12.11.1. By Type
        12.11.2. By Package Type
        12.11.3. By Application
        12.11.4. By End-use Industry
        12.11.5. By Country & Sub-region
13. Middle East & Africa (MEA) eFuse Market Analysis and Forecast
    13.1. Market Snapshot
    13.2. Key Trends Analysis
    13.3. Drivers and Restraints: Impact Analysis
    13.4. Pricing Analysis
    13.5. Key Regulations
    13.6. MEA eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        13.6.1. Latched Type eFuse
        13.6.2. Auto-retry Type eFuse
    13.7. MEA eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        13.7.1. Small Outline No Lead (SON)
        13.7.2. Dual Flat No Leads (DFN)
        13.7.3. Quad Flat No-lead (QFN)
        13.7.4. Thin Shrink Small Outline Package (TSSOP)
        13.7.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    13.8. MEA eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        13.8.1. Solid State Drives
        13.8.2. Hard Disk Drives
        13.8.3. Servers and Data Center Equipment
        13.8.4. Automotive Electronics
        13.8.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    13.9. MEA eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        13.9.1. Automotive & Transportation
        13.9.2. Aerospace & Defense
        13.9.3. Consumer Electronics
        13.9.4. Healthcare
        13.9.5. IT & Telecommunication
        13.9.6. Others (Manufacturing, Agriculture, etc.)
    13.10. MEA eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Country and Sub-region, 2017‒2031
        13.10.1. GCC
        13.10.2. South Africa
        13.10.3. North Africa
        13.10.4. Rest of Middle East & Africa
    13.11. MEA eFuse Market Attractiveness Analysis
        13.11.1. By Type
        13.11.2. By Package Type
        13.11.3. By Application
        13.11.4. By End-use Industry
        13.11.5. By Country & Sub-region
14. South America eFuse Market Analysis and Forecast
    14.1. Market Snapshot
    14.2. Key Trends Analysis
    14.3. Drivers and Restraints: Impact Analysis
    14.4. Pricing Analysis
    14.5. Key Regulations
    14.6. South America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Type, 2017‒2031
        14.6.1. Latched Type eFuse
        14.6.2. Auto-retry Type eFuse
    14.7. South America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Package Type, 2017‒2031
        14.7.1. Small Outline No Lead (SON)
        14.7.2. Dual Flat No Leads (DFN)
        14.7.3. Quad Flat No-lead (QFN)
        14.7.4. Thin Shrink Small Outline Package (TSSOP)
        14.7.5. Others (Chip Scale Package (CSP), Ceramic Flat-pack (CFP), etc.)
    14.8. South America eFuse Market Size (US$ Mn) Analysis and Forecast, by Application, 2017‒2031
        14.8.1. Solid State Drives
        14.8.2. Hard Disk Drives
        14.8.3. Servers and Data Center Equipment
        14.8.4. Automotive Electronics
        14.8.5. Others (Power Tools, Surveillance Equipment, Networking etc.)
    14.9. South America eFuse Market Size (US$ Mn) Analysis and Forecast, by End-use Industry, 2017‒2031
        14.9.1. Automotive & Transportation
        14.9.2. Aerospace & Defense
        14.9.3. Consumer Electronics
        14.9.4. Healthcare
        14.9.5. IT & Telecommunication
        14.9.6. Others (Manufacturing, Agriculture, etc.)
    14.10. South America eFuse Market Size (US$ Mn) and Volume (Million Units) Analysis and Forecast, by Country and Sub-region, 2017‒2031
        14.10.1. Brazil
        14.10.2. Argentina
        14.10.3. Rest of South America
    14.11. South America eFuse Market Attractiveness Analysis
        14.11.1. By Type
        14.11.2. By Package Type
        14.11.3. By Application
        14.11.4. By End-use Industry
        14.11.5. By Country & Sub-region
15. Competition Assessment
    15.1. Global eFuse Market Competition Matrix - a Dashboard View
        15.1.1. Global eFuse Market Company Share Analysis, by Value (2020)
        15.1.2. Technological Differentiator
16. Company Profiles (Manufacturers/Suppliers)
    16.1. Analog Devices Inc.
        16.1.1. Overview
        16.1.2. Product Portfolio
        16.1.3. Sales Footprint
        16.1.4. Key Subsidiaries or Distributors
        16.1.5. Strategy and Recent Developments
        16.1.6. Financial Analysis
    16.2. Diodes Incorporated
        16.2.1. Overview
        16.2.2. Product Portfolio
        16.2.3. Sales Footprint
        16.2.4. Key Subsidiaries or Distributors
        16.2.5. Strategy and Recent Developments
        16.2.6. Financial Analysis
    16.3. Microsemi Corporation
        16.3.1. Overview
        16.3.2. Product Portfolio
        16.3.3. Sales Footprint
        16.3.4. Key Subsidiaries or Distributors
        16.3.5. Strategy and Recent Developments
        16.3.6. Financial Analysis
    16.4. On Semiconductor Corporation
        16.4.1. Overview
        16.4.2. Product Portfolio
        16.4.3. Sales Footprint
        16.4.4. Key Subsidiaries or Distributors
        16.4.5. Strategy and Recent Developments
        16.4.6. Financial Analysis
    16.5. Qorvo, Inc.
        16.5.1. Overview
        16.5.2. Product Portfolio
        16.5.3. Sales Footprint
        16.5.4. Key Subsidiaries or Distributors
        16.5.5. Strategy and Recent Developments
        16.5.6. Financial Analysis
    16.6. STMicroelectronics N.V.
        16.6.1. Overview
        16.6.2. Product Portfolio
        16.6.3. Sales Footprint
        16.6.4. Key Subsidiaries or Distributors
        16.6.5. Strategy and Recent Developments
        16.6.6. Financial Analysis
    16.7. Texas Instruments Incorporated
        16.7.1. Overview
        16.7.2. Product Portfolio
        16.7.3. Sales Footprint
        16.7.4. Key Subsidiaries or Distributors
        16.7.5. Strategy and Recent Developments
        16.7.6. Financial Analysis
    16.8. Toshiba Electronic Devices & Storage Corporation
        16.8.1. Overview
        16.8.2. Product Portfolio
        16.8.3. Sales Footprint
        16.8.4. Key Subsidiaries or Distributors
        16.8.5. Strategy and Recent Developments
        16.8.6. Financial Analysis
17. Recommendation
    17.1. Opportunity Assessment
        17.1.1. By Type
        17.1.2. By Package Type
        17.1.3. By Application
        17.1.4. By End-use Industry
        17.1.5. By Region

　

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