Summary

The EUV lithography market is expected to reach USD 22.69 billion by 2029 from USD 12.18 billion in 2024, at a CAGR of 13.2% during the 2024-2029 period.
Continuing advances in consumer electronics increase demand for extreme ultraviolet lithography markets. With an increase in thinner, more powerful, energy-efficient devices, the usage of extreme ultraviolet lithography also increases. Advanced functionality with high performance is achieved using a smaller semiconductor chip in modern smartphones, smartwatch, laptops, and also a whole smart home device. EUVL has the ability to etch extremely intricate patterns down at nanometer scales, making it absolutely necessary to produce next-generation chips.
The increasing deployment of technologies such as 5G, artificial intelligence (AI), and augmented reality/virtual reality rises the demand for high-performance processors, memory chips, and other semiconductor components, which in turn increases the need for EUV systems. Consumer expectations for longer battery life, faster processing speeds, and sleek designs also reinforce the trend towards miniaturization, which EUV lithography facilitates. Also, in the quest for technological superiority among leading consumer electronics brands, investments in advanced semiconductor manufacturing processes fuel the growth of the EUV lithography market. In this interaction between innovation in consumer electronics and semiconductor fabrication, the EUV lithography stands out as a key to future technologies.
“South Korea is projected to grow at the highest CAGR during the forecast period from 2024-2029”
The South Korean region is expected to have the highest compound annual growth rate (CAGR) for the EUV lithography market over the forecast period due to the country's leadership in semiconductor manufacturing and aggressive investments in advanced lithography technologies. South Korea is also the home of some of the world's largest makers of semiconductors, notably Samsung and SK Hynix, key adopters of EUV for producing high-performance chips at such advanced nodes as 5nm and lower.
The government of South Korea considers the development of a robust ecosystem of semiconductors with considerable support in terms of finance and with policy incentives to reduce imports and thus establish a stronger position in markets around the world. Moreover, South Korean manufacturers are under rising pressure from the increasing demands of AI, 5G, IoT, and automotive applications in both home and international markets.
Continuous collaborations with EUV equipment vendors, such as ASML, will provide South Korean fabs with the most advanced lithography tools. The strategic move of South Korea to scale up EUV lithography, in addition to the semiconductor industry's push toward smaller, more energy-efficient, and powerful chips, drives the market to the robust CAGR in the region.
In-depth interviews have been conducted with chief executive officers (CEOs), Directors, and other executives from various key organizations operating in the EUV lithography market.
The break-up of the profile of primary participants in the EUV lithography market-
• By Company Type: Tier 1 – 30%, Tier 2 – 50%, Tier 3 – 20%
• By Designation Type: C Level Executive – 25%, Directors – 35%, Others – 40%
• By Region Type: Americas – 25%, Europe –35 %, Asia Pacific– 40%
The major players in the EUV lithography market are ASML (Netherlands), Carl Zeiss AG (Germany), NTT Advanced Technology Corporation (Japan), KLA Corporation (US), ADVANTEST CORPORATION (Japan), Ushio Inc. (Japan), SUSS MicroTec SE (Germany), AGC Inc. (Japan), Lasertec Corporation (Japan), TOPPAN Inc. (Japan), Energetiq Technology, Inc. (Japan), NuFlare Technology Inc. (US), Photronics, Inc. (Japan), HOYA Corporation (Japan), TRUMPF (Germany), Rigaku Holdings Corporation (Japan), Edmund Optics Inc. (US), Imagine Optic (France), Applied Materials, Inc. (US), Park Systems (South Koria), EUV Tech (US), Mloptic Crop. (China), MKS Instruments (US), Brooks Automation (US), and Pfeiffer Vacuum GmbH (Germany).

Research Coverage
The report segments the EUV lithography market and forecasts its size by region. It also comprehensively reviews drivers, restraints, opportunities, and challenges influencing market growth. The report covers qualitative aspects in addition to quantitative aspects of the market.
This report has categorized the EUV lithography market by component (light sources, optics, masks, others), end user (integrated device manufacturers, foundries), and region (Americas, Europe, and Asia Pacific)
Reasons to buy the report:
The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall EUV lithography market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the objectives of the market and provides information on key market drivers, restraints, opportunities, and challenges.
The report provides insights on the following pointers:
• Analysis of key drivers (adoption of EUV lithography for advanced semiconductor nodes), restraint (significant upfront capital investment in EUV lithography), opportunity (rising investments in advanced EUV lithography and semiconductor devices), and challenges (competition from alternative lithography techniques)
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the EUV lithography market
• Market Development: Comprehensive information about lucrative markets – the report analyses the EUV lithography market across varied regions.
• Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the EUV lithography market
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and product offerings of leading players like KLA Corporation (US), Carl Zeiss AG (Germany), TRUMPF (Germany), TOPPAN Inc. (Japan), and AGC Inc. (Japan).

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Table of Contents

1 INTRODUCTION 16
1.1 STUDY OBJECTIVES 16
1.2 MARKET DEFINITION 17
1.3 STUDY SCOPE 17
1.3.1 MARKETS COVERED AND REGIONAL SCOPE 17
1.3.2 INCLUSIONS AND EXCLUSIONS 18
1.3.3 YEARS CONSIDERED 18
1.4 CURRENCY CONSIDERED 18
1.5 UNIT CONSIDERED 19
1.6 LIMITATIONS 19
1.7 STAKEHOLDERS 19
1.8 SUMMARY OF CHANGES 19
2 RESEARCH METHODOLOGY 20
2.1 RESEARCH DATA 20
2.1.1 SECONDARY DATA 21
2.1.1.1 Key data from secondary sources 22
2.1.1.2 Key secondary sources 22
2.1.2 PRIMARY DATA 22
2.1.2.1 Key data from primary sources 23
2.1.2.2 Key participants in primary interviews 23
2.1.2.3 Breakdown of primary interviews 24
2.1.2.4 Key industry insights 24
2.1.3 SECONDARY AND PRIMARY RESEARCH 25
2.2 MARKET SIZE ESTIMATION 25
2.2.1 BOTTOM-UP APPROACH 27
2.2.1.1 Approach to arrive at market size using bottom-up analysis
(Demand side) 28
2.2.2 TOP-DOWN APPROACH 28
2.2.2.1 Approach to arrive at market size using top-down analysis
(Supply side) 29
2.3 DATA TRIANGULATION 30
2.4 RISK ASSESSMENT 31
2.5 RESEARCH ASSUMPTIONS AND LIMITATIONS 32
2.5.1 RESEARCH ASSUMPTIONS 32
2.5.2 RESEARCH LIMITATIONS 32
3 EXECUTIVE SUMMARY 33
4 PREMIUM INSIGHTS 36
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN EUV LITHOGRAPHY MARKET 36
4.2 EUV LITHOGRAPHY MARKET, BY END USER 36
4.3 EUV LITHOGRAPHY MARKET, BY COMPONENT 37
4.4 EUV LITHOGRAPHY MARKET, BY REGION 37
5 MARKET OVERVIEW 38
5.1 INTRODUCTION 38
5.2 MARKET DYNAMICS 38
5.2.1 DRIVERS 39
5.2.1.1 Adoption of EUV lithography for advanced semiconductor nodes 39
5.2.1.2 Rising demand for high-performance computing 39
5.2.1.3 Increasing complexity of integrated circuits 40
5.2.1.4 Advancements in consumer electronics 40
5.2.2 RESTRAINTS 41
5.2.2.1 Need for significant upfront capital investment 41
5.2.2.2 Requirement for advanced infrastructure and skilled workforce 41
5.2.3 OPPORTUNITIES 42
5.2.3.1 Increasing investments in advanced EUV lithography and semiconductor devices 42
5.2.3.2 Expanding deployment of EUV lithography in emerging applications 42
5.2.3.3 Advancement in memory module and chip development for
next-generation devices 43
5.2.3.4 Commercialization of advanced displays for enhanced
visual experiences 43
5.2.3.5 Application of advanced patterning technologies in photonics
and optics production 44
5.2.4 CHALLENGES 45
5.2.4.1 Competition from alternative lithography techniques 45
5.2.4.2 Difficulty in sustaining high source power and productivity 46
5.2.4.3 Detecting and addressing mask defects and yield challenges 46
5.3 VALUE CHAIN ANALYSIS 47
5.3.1 R&D ENGINEERS 48
5.3.2 COMPONENT MANUFACTURERS 48
5.3.3 SYSTEM INTEGRATORS 48
5.3.4 MARKETING & SALES SERVICES PROVIDERS 48
5.3.5 END USERS 48
5.4 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS 48
5.5 ECOSYSTEM ANALYSIS 49
5.6 TECHNOLOGY ANALYSIS 51
5.6.1 KEY TECHNOLOGIES 51
5.6.1.1 Light source 51
5.6.1.2 EUV masks 52
5.6.2 COMPLEMENTARY TECHNOLOGIES 52
5.6.2.1 Mask pellicles 52
5.6.2.2 Plasma generation 52
5.6.3 ADJACENT TECHNOLOGIES 53
5.6.3.1 Extreme ultraviolet reflectometry (EUVR) 53
5.6.3.2 Atomic layer deposition (ALD) 53
5.7 INVESTMENT AND FUNDING SCENARIO 54
5.8 PRICING ANALYSIS 54
5.8.1 AVERAGE SELLING PRICE OF EUV LITHOGRAPHY SYSTEM 55
5.8.2 AVERAGE SELLING PRICE TREND, BY REGION, 2020−2023 55
5.9 CASE STUDY ANALYSIS 56
5.9.1 INTEL SECURES EXCLUSIVE HIGH-NA EUV MACHINES 56
5.9.2 LAM COLLABORATED WITH ASML TO DEVELOP DRY RESIST TECHNOLOGY THAT ADVANCES EUV LITHOGRAPHY 56
5.9.3 TSMC ACQUIRED EUV SYSTEMS TO BOOST PRODUCTION CAPACITY 57
5.10 PATENT ANALYSIS 58
5.11 TRADE ANALYSIS 60
5.11.1 IMPORT SCENARIO (HS CODE 8442) 60
5.11.2 EXPORT SCENARIO (HS CODE 8442) 61
5.12 PORTER'S FIVE FORCES ANALYSIS 63
5.12.1 INTENSITY OF COMPETITIVE RIVALRY 64
5.12.2 THREAT OF NEW ENTRANTS 64
5.12.3 THREAT OF SUBSTITUTES 64
5.12.4 BARGAINING POWER OF BUYERS 64
5.12.5 BARGAINING POWER OF SUPPLIERS 64
5.13 KEY STAKEHOLDERS AND BUYING CRITERIA 65
5.13.1 KEY STAKEHOLDERS IN BUYING PROCESS 65
5.13.2 BUYING CRITERIA 66
5.14 TARIFF AND REGULATORY LANDSCAPE 66
5.14.1 TARIFF ANALYSIS 66
5.14.2 REGULATORY BODIES, GOVERNMENT AGENCIES,
AND OTHER ORGANIZATIONS 67
5.14.3 REGULATIONS 68
5.15 KEY CONFERENCES AND EVENTS, 2024–2025 69
5.16 IMPACT OF GEN AI/AI ON EUV LITHOGRAPHY MARKET 69
5.16.1 INTRODUCTION 69
6 EUV LITHOGRAPHY MARKET, BY COMPONENT 71
6.1 INTRODUCTION 72
6.2 LIGHT SOURCES 73
6.2.1 GROWING ADOPTION OF LPP EUV LIGHT SOURCES IN COMMERCIAL SYSTEMS TO PROPEL MARKET 73
 
6.3 OPTICS 73
6.3.1 HIGH PRECISION AND ACCURACY OF EUV OPTICS TO DRIVE ADOPTION 73
6.4 MASKS 74
6.4.1 GROWING EMPHASIS ON DEVELOPING NEXT-GENERATION SEMICONDUCTOR DEVICES TO PROPEL MARKET 74
6.5 OTHERS 74
7 EUV LITHOGRAPHY MARKET, BY END USER 76
7.1 INTRODUCTION 77
7.2 INTEGRATED DEVICE MANUFACTURERS 78
7.2.1 EMPHASIS ON DEVELOPING ADVANCED, ENERGY-EFFICIENT MICROCHIPS AND ICS TO DRIVE GROWTH 78
7.3 FOUNDRIES 80
7.3.1 INNOVATIONS IN SEMICONDUCTOR NODES TO ACCELERATE ADOPTION OF EUV LITHOGRAPHY BY FOUNDRIES 80
8 EUV LITHOGRAPHY MARKET, BY REGION 83
8.1 INTRODUCTION 84
8.2 AMERICAS 85
8.2.1 PRESENCE OF STRONG SEMICONDUCTOR ECOSYSTEM TO
PROPEL MARKET GROWTH 85
8.2.2 MACROECONOMIC OUTLOOK FOR AMERICAS 86
8.3 EUROPE 87
8.3.1 STRATEGIC INVESTMENTS IN R&D BY GERMANY, NETHERLANDS,
AND FRANCE TO STRENGTHEN MARKET GROWTH 87
8.3.2 MACROECONOMIC OUTLOOK FOR EUROPE 88
8.4 ASIA PACIFIC 89
8.4.1 MACROECONOMIC OUTLOOK FOR ASIA PACIFIC 89
8.4.2 CHINA 92
8.4.2.1 Advanced semiconductor production capabilities
fueling market growth 92
8.4.3 JAPAN 93
8.4.3.1 Strong semiconductor ecosystem driving market growth 93
8.4.4 SOUTH KOREA 93
8.4.4.1 Advancement in EUV lithography fueling semiconductor innovation 93
8.4.5 TAIWAN 94
8.4.5.1 Significant investments in eco-friendly EUV system components to drive growth 94
8.4.6 REST OF ASIA PACIFIC 95
 
9 COMPETITIVE LANDSCAPE 96
9.1 OVERVIEW 96
9.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2023–2024 96
9.3 REVENUE ANALYSIS, 2021–2023 98
9.4 MARKET SHARE ANALYSIS, 2023 98
9.5 COMPANY VALUATION AND FINANCIAL METRICS 101
9.6 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023 102
9.6.1 STARS 103
9.6.2 EMERGING LEADERS 103
9.6.3 PERVASIVE PLAYERS 103
9.6.4 PARTICIPANTS 103
9.6.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023 105
9.6.5.1 Company footprint 105
9.6.5.2 Region footprint 106
9.6.5.3 Component footprint 107
9.6.5.4 End user footprint 108
9.7 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023 109
9.7.1 PROGRESSIVE COMPANIES 109
9.7.2 RESPONSIVE COMPANIES 109
9.7.3 DYNAMIC COMPANIES 109
9.7.4 STARTING BLOCKS 109
9.7.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023 111
9.7.5.1 Detailed list of startups/SMEs 111
9.7.5.2 Competitive benchmarking of startups/SMEs 111
9.8 COMPETITIVE SCENARIO 112
9.8.1 PRODUCT LAUNCHES 112
9.8.2 DEALS 112
10 COMPANY PROFILES 113
10.1 INTRODUCTION 113
10.2 KEY PLAYERS 113
10.2.1 ASML 113
10.2.1.1 Business overview 113
10.2.1.2 Products/Solutions/Services offered 115
10.2.1.3 Recent developments 116
10.2.1.3.1 Deals 116
10.2.1.4 MnM view 116
10.2.1.4.1 Key strengths 116
10.2.1.4.2 Strategic choices 116
10.2.1.4.3 Weaknesses and competitive threats 116
 
10.3 KEY COMPONENT MANUFACTURERS 117
10.3.1 CARL ZEISS AG 117
10.3.1.1 Carl Zeiss AG: Business overview 117
10.3.1.2 Products/Solutions/Services offered 119
10.3.1.3 Recent developments 119
10.3.1.3.1 Product launches 119
10.3.1.4 MnM view 120
10.3.1.4.1 Key strengths 120
10.3.1.4.2 Strategic choices 120
10.3.1.4.3 Weaknesses and competitive threats 120
10.3.2 NTT ADVANCED TECHNOLOGY CORPORATION 121
10.3.2.1 Business overview 121
10.3.2.2 Products/Solutions/Services offered 122
10.3.2.3 MnM view 122
10.3.2.3.1 Key strengths 122
10.3.2.3.2 Strategic choices 122
10.3.2.3.3 Weaknesses and competitive threats 123
10.3.3 KLA CORPORATION 124
10.3.3.1 Business overview 124
10.3.3.2 Products/Solutions/Services offered 126
10.3.3.3 MnM view 126
10.3.3.3.1 Key strengths 126
10.3.3.3.2 Strategic choices 126
10.3.3.3.3 Weaknesses and competitive threats 126
10.3.4 ADVANTEST CORPORATION 127
10.3.4.1 Business overview 127
10.3.4.2 Products/Solutions/Services offered 129
10.3.4.3 MnM view 130
10.3.4.3.1 Key strengths 130
10.3.4.3.2 Strategic choices 130
10.3.4.3.3 Weaknesses and competitive threats 130
10.3.5 USHIO INC. 131
10.3.5.1 Business overview 131
10.3.5.2 Products/Solutions/Services offered 132
10.3.6 SUSS MICROTEC SE 133
10.3.6.1 Business overview 133
10.3.6.2 Products/Solutions/Services offered 134
10.3.7 AGC INC. 135
10.3.7.1 Business overview 135
10.3.7.2 Products/Solutions/Services offered 136
 
10.3.8 LASERTEC CORPORATION 137
10.3.8.1 Business overview 137
10.3.8.2 Products/Solutions/Services offered 138
10.3.9 TOPPAN INC. 139
10.3.9.1 Business overview 139
10.3.9.2 Products/Solutions/Services offered 141
10.4 OTHER PLAYERS 142
10.4.1 ENERGETIQ TECHNOLOGY, INC. 142
10.4.2 NUFLARE TECHNOLOGY INC. 143
10.4.3 PHOTRONICS, INC. 144
10.4.4 HOYA CORPORATION 145
10.4.5 TRUMPF 146
10.4.6 RIGAKU HOLDINGS CORPORATION 147
10.4.7 EDMUND OPTICS INC. 148
10.4.8 IMAGINE OPTIC 149
10.4.9 APPLIED MATERIALS, INC. 150
10.4.10 PARK SYSTEMS 151
10.4.11 EUV TECH 152
10.4.12 MLOPTIC CROP. 153
10.4.13 MKS INSTRUMENTS 154
10.4.14 BROOKS AUTOMATION 155
10.4.15 PFEIFFER VACUUM GMBH 156
11 APPENDIX 157
11.1 INSIGHTS FROM INDUSTRY EXPERTS 157
11.2 DISCUSSION GUIDE 158
11.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 160
11.4 CUSTOMIZATION OPTIONS 162
11.5 RELATED REPORTS 162
11.6 AUTHOR DETAILS 163