インターポーザおよびファンアウトウェーハレベルパッケージング市場：パッケージングコンポーネント＆デザイン（シリコン、有機、ガラス、セラミック）、パッケージング（2.5D、3D）、デバイス（ロジックIC、LED、メモリデバイス、MEMS、イメージング＆オプトエレクトロニクス）、産業別 - 2029年までの世界予測

Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029

世界のインターポーザーとFOWLP市場は、2024年に356億米ドルと予測され、2029年には635億米ドルに達すると予測され、2024年から2029年までの年平均成長率は12.3%と予測される。AIと高性能コンピューティングにお... もっと見る

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世界のインターポーザーとFOWLP市場は、2024年に356億米ドルと予測され、2029年には635億米ドルに達すると予測され、2024年から2029年までの年平均成長率は12.3%と予測される。AIと高性能コンピューティングにおける高度なパッケージングに対する需要の増加は、インターポーザとFOWLP市場の重要な推進力となっている。
"パッケージングタイプ別3Dパッケージングセグメントが予測期間中にインターポーザとFOWLP市場でより高いCAGRを占める"
半導体パッケージング業界では、3Dパッケージングが、性能の向上、フォームファクタの縮小、従来の2Dパッケージングに関連する課題への対処を可能にするため、急増している。小型で強力な電子機器への需要が高まる中、積層集積回路やシリコン貫通ビアなどの3Dパッケージング技術は、進化する市場ニーズに対応する効率性で脚光を浴びている。
「2029年、コンシューマーエレクトロニクスがインターポーザとFOWLP市場で最大シェアを占める"
半導体パッケージは、小型化、性能の向上、エネルギー効率の改善を可能にすることで、民生用電子機器において重要な役割を果たしている。スマートフォンやウェアラブル端末など、より小型で高性能、エネルギー効率に優れたデバイスへの需要が、民生用電子機器市場の進化する要件に対応する半導体パッケージング技術の絶え間ない革新を促している。
"インターポーザとFOWLP市場で最も高いCAGRで成長するアジア太平洋地域"
アジア太平洋地域における半導体パッケージングの成長は、同地域のエレクトロニクス製造における強い存在感、熟練労働力の利用可能性、コスト効率の高い生産と主要市場への近接性を求める大手半導体企業による高度なパッケージング施設の設立に起因している。さらに、政府の支援政策や研究開発への投資も、この地域の半導体パッケージングにおける優位性に寄与している。
この調査には、部品サプライヤーからティア1企業、OEMに至るまで、様々な業界専門家の洞察が含まれている。主な内訳は以下の通り：
- 企業タイプ別：ティア1：38%、ティア2：28%、ティア3：34
- 役職別Cレベル幹部：40%、取締役：30%、その他：30
- 地域別北米：35％、欧州：20％、アジア太平洋地域：35％、RoW：10
インターポーザーおよびFOWLP市場で事業を展開している主要企業は、Samsung（韓国）、Taiwan Semiconductor Manufacturing Company, Ltd.(台湾)、SK HYNIX INC.（韓国）などである。
調査範囲
この調査レポートは、インターポーザとFOWLP市場を、パッケージングコンポーネント＆デザイン（インターポーザ、FOWLP）、パッケージングタイプ（2.5D、3D）、デバイスタイプ（ロジックIC、イメージング＆オプトエレクトロニクス、LED、MEMS/センサー、メモリデバイス、その他のデバイスタイプ）、エンドユーザー産業（家電、通信、製造、自動車、医療機器、航空宇宙）、地域（北米、欧州、アジア太平洋地域、RoW）別に調査・分析しています。
本レポートでは、インターポーザーおよびFOWLP市場の成長に影響を与える促進要因、阻害要因、課題、機会などの主要要因に関する詳細情報を網羅しています。主要な業界プレイヤーを詳細に分析し、その事業概要、製品、主要戦略、契約、パートナーシップ、合意に関する洞察を提供しています。インターポーザーとFOWLP市場に関連する新製品とサービスの発表、合併と買収、最近の動向。インターポーザーとFOWLP市場のエコシステムにおける今後の新興企業の競争分析もカバーしています。
レポート購入の主なメリット
 インターポーザおよびFOWLP市場の成長に影響を与える主要な促進要因（小型化およびフォームファクタ要件の増加傾向；AIおよび高性能コンピューティングにおける高度なパッケージングに対する需要の増加；家電およびゲーム機器に対する需要の増加；高度なパッケージングが提供するコスト優位性）、阻害要因（特定の材料および化学物質の使用による環境への懸念；複雑な製造プロセス）、機会（IoTデバイスおよびウェアラブルに対する需要の増加；自動車における高度な電子機器の統合）、および課題（ウェハレベルパッケージングにおける熱問題；サプライチェーンにおける複雑さ）の分析。

- 製品開発／イノベーション：インターポーザーとFOWLP市場における今後の技術、研究開発活動、新製品発表に関する詳細な洞察

- 市場開発：有利な市場に関する包括的な情報 - 当レポートでは、さまざまな地域のインターポーザーとFOWLP市場を分析しています。

- 市場の多様化：新製品/サービス、未開拓の地域、最近の開発、インターポーザーおよびFOWLP市場における投資に関する網羅的な情報

- 競合評価：Samsung（韓国）、Taiwan Semiconductor Manufacturing Company, Ltd.（台湾）、SK HYNHYN（台湾）など主要企業の市場シェア、成長戦略、サービス内容を詳細に評価。(Ltd.（台湾）、SK HYNIX INC.（韓国）、ASE Technology Holding Co.(Ltd.（台湾）、Amkor Technology社（米国）など、インターポーザとFOWLP市場における主要企業の成長戦略やサービス内容などを掲載している。

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1 INTRODUCTION 29
1.1 STUDY OBJECTIVES 29
1.2 MARKET DEFINITION 29
1.3 INCLUSIONS AND EXCLUSIONS 30
1.4 STUDY SCOPE 30
FIGURE 1 INTERPOSER AND FOWLP MARKET SEGMENTATION 30
1.4.1 REGIONAL SCOPE 31
1.4.2 YEARS CONSIDERED 31
1.4.3 CURRENCY CONSIDERED 31
1.4.4 UNITS CONSIDERED 31
1.5 LIMITATIONS 32
1.6 STAKEHOLDERS 32
1.7 SUMMARY OF CHANGES 32
1.8 IMPACT OF RECESSION 33
2 RESEARCH METHODOLOGY 34
2.1 RESEARCH DATA 34
FIGURE 2 INTERPOSER AND FOWLP MARKET: RESEARCH DESIGN 34
2.1.1 SECONDARY AND PRIMARY RESEARCH 36
2.1.2 SECONDARY DATA 36
2.1.2.1 List of major secondary sources 37
2.1.2.2 Key data from secondary sources 37
2.1.3 PRIMARY DATA 37
2.1.3.1 Breakdown of primaries 37
2.1.3.2 Key data from primary sources 38
2.1.3.3 Key industry insights 39
2.1.3.4 List of primary interview participants 39
2.2 MARKET SIZE ESTIMATION METHODOLOGY 40
FIGURE 3 INTERPOSER AND FOWLP MARKET: MARKET SIZE ESTIMATION METHODOLOGY 40
2.2.1 BOTTOM-UP APPROACH 40
2.2.1.1 Approach to arrive at market size using bottom-up analysis (demand side) 41
FIGURE 4 INTERPOSER AND FOWLP MARKET: BOTTOM-UP APPROACH 41
2.2.2 TOP-DOWN APPROACH 41
2.2.2.1 Approach to arrive at market size using top-down analysis (supply side) 42
FIGURE 5 INTERPOSER AND FOWLP MARKET: TOP-DOWN APPROACH 42
FIGURE 6 INTERPOSER AND FOWLP MARKET: SUPPLY-SIDE ANALYSIS 42
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 43
FIGURE 7 INTERPOSER AND FOWLP MARKET: DATA TRIANGULATION 43
2.4 RESEARCH ASSUMPTIONS 43
TABLE 1 INTERPOSER AND FOWLP MARKET: RESEARCH ASSUMPTIONS 43
2.5 RESEARCH LIMITATIONS 44
FIGURE 8 INTERPOSER AND FOWLP MARKET: RESEARCH LIMITATIONS 44
2.6 RISK ASSESSMENT 44
TABLE 2 INTERPOSER AND FOWLP MARKET: RISK ASSESSMENT 44
2.7 PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET 44
TABLE 3 INTERPOSER AND FOWLP MARKET: PARAMETERS CONSIDERED TO ANALYZE RECESSION IMPACT ON INTERPOSER AND FOWLP MARKET 44
3 EXECUTIVE SUMMARY 45
FIGURE 9 CONSUMER ELECTRONICS TO HOLD LARGEST SHARE OF INTERPOSER AND FOWLP MARKET IN 2029 46
FIGURE 10 MEMS/SENSORS TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD 46
FIGURE 11 2.5D PACKAGING TYPE TO ACCOUNT FOR LARGER MARKET SHARE IN 2024 47
FIGURE 12 INTERPOSER AND FOWLP PACKAGING MARKET IN ASIA PACIFIC TO RECORD HIGHEST CAGR FROM 2024 TO 2029 47
4 PREMIUM INSIGHTS 48
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN INTERPOSER AND FOWLP MARKET 48
FIGURE 13 GROWING DEMAND FOR CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH 48
4.2 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN 48
FIGURE 14 INTERPOSERS TO ACCOUNT FOR LARGER MARKET SHARE IN 2029 48
4.3 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY 49
FIGURE 15 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD 49
4.4 INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC, BY END-USER INDUSTRY AND COUNTRY 49
FIGURE 16 CONSUMER ELECTRONICS END-USER INDUSTRY AND CHINA HELD LARGEST SHARES OF INTERPOSER AND FOWLP MARKET IN ASIA PACIFIC IN 2023 49
4.5 INTERPOSER AND FOWLP MARKET, BY COUNTRY 50
FIGURE 17 CHINA TO REGISTER HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD 50
5 MARKET OVERVIEW 51
5.1 INTRODUCTION 51
5.2 MARKET DYNAMICS 51
FIGURE 18 INTERPOSER AND FOWLP MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES 51
5.2.1 DRIVERS 52
5.2.1.1 Surging demand for miniaturized electronic devices 52
5.2.1.2 Growing reliance on AI and high-performance computing technologies 52
5.2.1.3 Rising popularity of esports and game streaming platforms 52
FIGURE 19 NUMBER OF GLOBAL SMARTPHONE AND MOBILE PHONE USERS, 2020–2025 53
5.2.1.4 Increasing focus on developing advanced chip packaging techniques 53
FIGURE 20 IMPACT ANALYSIS: DRIVERS 54
5.2.2 RESTRAINTS 54
5.2.2.1 Environmental concerns associated with use of chemicals in interposer production facilities 54
5.2.2.2 Requirement for advanced and high-cost manufacturing techniques 55
FIGURE 21 IMPACT ANALYSIS: RESTRAINTS 55
5.2.3 OPPORTUNITIES 55
5.2.3.1 Growing demand for wearable IoT devices 55
5.2.3.2 Integration of advanced electronics into automobiles 56
FIGURE 22 IMPACT ANALYSIS: OPPORTUNITIES 56
5.2.4 CHALLENGES 57
5.2.4.1 Thermal issues in interposer and wafer-level packaging 57
5.2.4.2 Managing complex semiconductor supply chain 57
FIGURE 23 IMPACT ANALYSIS: CHALLENGES 57
5.3 SUPPLY CHAIN ANALYSIS 58
FIGURE 24 INTERPOSER AND FOWLP MARKET: SUPPLY CHAIN ANALYSIS 58
5.4 ECOSYSTEM/MARKET MAP 59
FIGURE 25 KEY PLAYERS IN INTERPOSER AND FOWLP ECOSYSTEM 59
TABLE 4 COMPANIES AND THEIR ROLES IN INTERPOSER AND FOWLP ECOSYSTEM 60
5.5 PRICING ANALYSIS 61
5.5.1 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS 61
FIGURE 26 AVERAGE SELLING PRICE OF 12-INCH WAFERS OFFERED BY TWO KEY PLAYERS (USD/THOUSAND UNITS) 61
5.5.2 AVERAGE SELLING PRICE OF 12-INCH WAFERS 62
TABLE 5 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019–2023 (USD/THOUSAND UNITS) 62
FIGURE 27 AVERAGE SELLING PRICE OF 12-INCH WAFERS, 2019–2023 62
5.5.3 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION 62
FIGURE 28 AVERAGE SELLING PRICE OF 12-INCH WAFERS, BY REGION, 2019–2023 63
5.6 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES 63
FIGURE 29 INTERPOSER AND FOWLP MARKET: TRENDS/DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES 64
5.7 TECHNOLOGY ANALYSIS 64
5.7.1 3D STACKING 64
5.7.2 FAN-OUT PANEL-LEVEL PACKAGING 65
5.7.3 MONOLITHIC 3D 65
5.7.4 3D IC 65
5.8 PORTER’S FIVE FORCES ANALYSIS 66
FIGURE 30 INTERPOSER AND FOWLP MARKET: PORTER’S FIVE FORCES ANALYSIS 66
TABLE 6 INTERPOSER AND FOWLP MARKET: PORTER’S FIVE FORCES ANALYSIS 67
5.8.1 INTENSITY OF COMPETITIVE RIVALRY 67
5.8.2 BARGAINING POWER OF SUPPLIERS 67
5.8.3 BARGAINING POWER OF BUYERS 67
5.8.4 THREAT OF SUBSTITUTES 68
5.8.5 THREAT OF NEW ENTRANTS 68
5.9 KEY STAKEHOLDERS AND BUYING CRITERIA 68
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS 68
FIGURE 31 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES 68
TABLE 7 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USER INDUSTRIES (%) 68
5.9.2 BUYING CRITERIA 69
FIGURE 32 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES 69
TABLE 8 KEY BUYING CRITERIA FOR TOP 3 END-USER INDUSTRIES 69
5.10 CASE STUDY ANALYSIS 69
5.10.1 SPTS TECHNOLOGIES PARTNERS WITH IMEC TO REDUCE WAFER THINNING COSTS 69
5.10.2 SEMICONDUCTOR FOUNDRY USES SPTS OMEGA RAPIER XE TO ENHANCE PRODUCTIVITY OF WAFER BACKSIDE VIA REVEAL PROCESS 70
5.10.3 CHROMALOX, INC. DEVELOPS KAPTON HEATERS TO GAIN CONTROL OVER TEMPERATURE-SENSITIVE ETCHING CHEMICALS 70
5.11 TRADE ANALYSIS 70
5.11.1 IMPORT SCENARIO 71
FIGURE 33 IMPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018–2022 (USD MILLION) 71
5.11.2 EXPORT SCENARIO 71
FIGURE 34 EXPORT DATA FOR HS CODE 381800-COMPLIANT PRODUCTS, BY KEY COUNTRY, 2018–2022 (USD MILLION) 71
5.12 PATENT ANALYSIS 72
FIGURE 35 INTERPOSER AND FOWLP MARKET: PATENTS APPLIED AND GRANTED, 2013–2023 72
TABLE 9 LIST OF PATENTS IN INTERPOSER AND FOWLP MARKET 73
5.13 KEY CONFERENCES AND EVENTS, 2024–2025 74
TABLE 10 INTERPOSER AND FOWLP MARKET: LIST OF CONFERENCES AND EVENTS, 2024–2025 74
5.14 TARIFF, REGULATORY LANDSCAPE, AND STANDARDS 75
5.14.1 COUNTRY-WISE TARIFF FOR HS CODE 381800-COMPLIANT PRODUCTS 75
TABLE 11 MFN TARIFF FOR PRODUCTS UNDER HS CODE 381800 EXPORTED BY BRAZIL 75
5.14.2 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 76
TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 76
TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 76
TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 77
TABLE 15 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 77
5.14.3 REGULATIONS 77
5.14.3.1 North America 78
5.14.3.2 Europe 78
5.14.3.3 Asia Pacific 79
5.14.3.4 RoW 79
5.14.4 STANDARDS 79
6 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN 80
6.1 INTRODUCTION 81
FIGURE 36 INTERPOSERS TO REGISTER HIGHER CAGR BETWEEN 2024 AND 2029 81
TABLE 16 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD BILLION) 81
TABLE 17 INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD BILLION) 81
6.2 INTERPOSERS 82
TABLE 18 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION) 82
TABLE 19 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION) 82
TABLE 20 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2020–2023 (USD MILLION) 83
TABLE 21 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT, 2024–2029 (USD MILLION) 83
TABLE 22 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 83
TABLE 23 INTERPOSERS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 84
6.2.1 SILICON 84
6.2.1.1 Implementation of silicon interposers to stack multiple semiconductor dies in single package to foster segmental growth 84
6.2.2 ORGANIC 84
6.2.2.1 Adoption of organic interposers to facilitate effective thermal management to accelerate segmental growth 84
6.2.3 GLASS 85
6.2.3.1 Use of glass interposers to ensure high-speed electrical data transfer to fuel segmental growth 85
6.2.4 CERAMIC 85
6.2.4.1 Trend of electronic device miniaturization to augment demand for ceramic interposers 85
6.2.5 OTHER INTERPOSERS 86
6.3 FOWLP 86
6.3.1 VERSATILITY AND FLEXIBLE DESIGN TO BOOST ADOPTION OF FOWLP TECHNOLOGY 86
TABLE 24 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION) 86
TABLE 25 FOWLP: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION) 87
TABLE 26 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 87
TABLE 27 FOWLP: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 87
6.3.2 SINGLE-DIE 88
6.3.3 MULTI-DIE 88
7 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE 91
7.1 INTRODUCTION 92
FIGURE 37 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE 92
FIGURE 38 3D PACKAGING TYPE TO DEPICT HIGHER CAGR FROM 2024 TO 2029 92
TABLE 28 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD BILLION) 93
TABLE 29 INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD BILLION) 93
7.2 2.5D 94
7.2.1 ADOPTION OF 2.5D PACKAGING TECHNOLOGY TO ENHANCE PERFORMANCE OF COMPUTING SOLUTIONS TO DRIVE MARKET 94
TABLE 30 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION) 94
TABLE 31 2.5D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION) 94
7.3 3D 95
7.3.1 USE OF 3D PACKAGING SOLUTIONS IN ADVANCED SEMICONDUCTOR MANUFACTURING FACILITIES TO FUEL SEGMENTAL GROWTH 95
TABLE 32 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION) 95
TABLE 33 3D: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION) 95
8 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE 96
8.1 INTRODUCTION 97
FIGURE 39 MEMORY DEVICES TO DOMINATE INTERPOSER AND FOWLP MARKET DURING FORECAST PERIOD 97
TABLE 34 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD BILLION) 97
TABLE 35 INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD BILLION) 98
8.2 LOGIC ICS 98
8.2.1 GROWING DEMAND FOR SMART HOME APPLIANCES TO CONTRIBUTE TO SEGMENTAL GROWTH 98
TABLE 36 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 99
TABLE 37 LOGIC ICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 99
8.3 IMAGING & OPTOELECTRONICS 99
8.3.1 RISING POPULARITY OF AUTONOMOUS VEHICLES TO ACCELERATE SEGMENTAL GROWTH 99
TABLE 38 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 100
TABLE 39 IMAGING & OPTOELECTRONICS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 100
8.4 MEMORY DEVICES 101
8.4.1 INCREASING DEMAND FOR SPECIALIZED AI AND ML HARDWARE COMPONENTS TO DRIVE MARKET 101
TABLE 40 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 101
TABLE 41 MEMORY DEVICES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 102
8.5 MEMS/SENSORS 102
8.5.1 ESCALATING ADOPTION OF ADVANCED CONSUMER ELECTRONICS TO FOSTER SEGMENTAL GROWTH 102
TABLE 42 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 103
TABLE 43 MEMS/SENSORS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 103
8.6 LEDS 103
8.6.1 INCREASING USE OF LEDS IN TELECOMMUNICATION DEVICES TO PROPEL MARKET 103
TABLE 44 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 104
TABLE 45 LEDS: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 104
8.7 OTHER DEVICE TYPES 104
TABLE 46 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 105
TABLE 47 OTHER DEVICE TYPES: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 105
9 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY 106
9.1 INTRODUCTION 107
FIGURE 40 AUTOMOTIVE END-USER INDUSTRY TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET FROM 2024 TO 2029 107
TABLE 48 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD BILLION) 107
TABLE 49 INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD BILLION) 108
9.2 CONSUMER ELECTRONICS 108
9.2.1 SURGING DEMAND FOR SLEEK AND MULTIFUNCTIONAL ELECTRONIC GADGETS TO DRIVE MARKET 108
TABLE 50 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION) 109
TABLE 51 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION) 109
TABLE 52 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION) 109
TABLE 53 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION) 110
TABLE 54 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION) 110
TABLE 55 CONSUMER ELECTRONICS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION) 110
9.3 MANUFACTURING 111
9.3.1 ESCALATING ADOPTION OF SMART MANUFACTURING AND INDUSTRY 4.0 TECHNOLOGIES TO FUEL SEGMENTAL GROWTH 111
TABLE 56 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION) 111
TABLE 57 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION) 111
TABLE 58 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION) 112
TABLE 59 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION) 112
TABLE 60 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION) 112
TABLE 61 MANUFACTURING: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION) 113
9.4 COMMUNICATIONS 113
9.4.1 INCREASING DEVELOPMENT OF DATA CENTERS TO CONTRIBUTE TO SEGMENTAL GROWTH 113
TABLE 62 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION) 113
TABLE 63 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION) 114
TABLE 64 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION) 114
TABLE 65 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION) 114
TABLE 66 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION) 115
TABLE 67 COMMUNICATIONS: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION) 115
9.5 AUTOMOTIVE 115
9.5.1 RISING POPULARITY OF ELECTRIC VEHICLES TO ACCELERATE SEGMENTAL GROWTH 115
TABLE 68 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION) 116
TABLE 69 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION) 116
TABLE 70 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION) 116
TABLE 71 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION) 117
TABLE 72 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION) 117
TABLE 73 AUTOMOTIVE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION) 117
9.6 HEALTHCARE 118
9.6.1 RAPID ADVANCEMENTS IN WEARABLE HEALTHCARE DEVICES TO FOSTER SEGMENTAL GROWTH 118
TABLE 74 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION) 118
TABLE 75 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION) 118
TABLE 76 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION) 119
TABLE 77 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION) 119
TABLE 78 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION) 119
TABLE 79 HEALTHCARE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION) 120
9.7 AEROSPACE 120
9.7.1 INCREASING INTEGRATION OF COMPLEX SYSTEMS AND SENSORS INTO AIRCRAFT TO BOOST SEGMENTAL GROWTH 120
TABLE 80 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2020–2023 (USD MILLION) 120
TABLE 81 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY PACKAGING COMPONENT AND DESIGN, 2024–2029 (USD MILLION) 121
TABLE 82 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2020–2023 (USD MILLION) 121
TABLE 83 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY DEVICE TYPE, 2024–2029 (USD MILLION) 121
TABLE 84 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION) 122
TABLE 85 AEROSPACE: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION) 122
10 INTERPOSER AND FOWLP MARKET, BY REGION 123
10.1 INTRODUCTION 124
FIGURE 41 ASIA PACIFIC TO EXHIBIT HIGHEST CAGR IN INTERPOSER AND FOWLP MARKET BETWEEN 2024 AND 2029 124
TABLE 86 INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD BILLION) 124
TABLE 87 INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD BILLION) 125
10.2 NORTH AMERICA 125
FIGURE 42 NORTH AMERICA: INTERPOSER AND FOWLP MARKET SNAPSHOT 126
TABLE 88 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 126
TABLE 89 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 127
TABLE 90 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 127
TABLE 91 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 127
TABLE 92 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION) 128
TABLE 93 NORTH AMERICA: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION) 128
10.2.1 RECESSION IMPACT ON MARKET IN NORTH AMERICA 128
10.2.2 US 128
10.2.2.1 Rising focus on enhancing performance and functionality of electronic devices to drive market 128
10.2.3 CANADA 129
10.2.3.1 Growing emphasis on enhancing semiconductor design and manufacturing to contribute to market growth 129
10.2.4 MEXICO 130
10.2.4.1 Increasing investment in semiconductor R&D projects to fuel market growth 130
10.3 EUROPE 131
FIGURE 43 EUROPE: INTERPOSER AND FOWLP MARKET SNAPSHOT 131
TABLE 94 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 132
TABLE 95 EUROPE: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 132
TABLE 96 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 132
TABLE 97 EUROPE: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 133
TABLE 98 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION) 133
TABLE 99 EUROPE: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION) 133
10.3.1 RECESSION IMPACT ON MARKET IN EUROPE 133
10.3.2 UK 134
10.3.2.1 Rapid advancement in 5G technology to foster market growth 134
10.3.3 GERMANY 134
10.3.3.1 Increased adoption of connected cars and smart home devices to accelerate market growth 134
10.3.4 FRANCE 135
10.3.4.1 Highly developed transport and communication networks to contribute to market growth 135
10.3.5 REST OF EUROPE 135
10.4 ASIA PACIFIC 135
FIGURE 44 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET SNAPSHOT 136
TABLE 100 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 137
TABLE 101 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 137
TABLE 102 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 137
TABLE 103 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 138
TABLE 104 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION) 138
TABLE 105 ASIA PACIFIC: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION) 138
10.4.1 RECESSION IMPACT ON MARKET IN ASIA PACIFIC 138
10.4.2 CHINA 139
10.4.2.1 Increasing expansion of automobile and semiconductor manufacturing facilities to propel market 139
10.4.3 JAPAN 139
10.4.3.1 Rising production of advanced consumer electronics to boost market growth 139
10.4.4 SOUTH KOREA 140
10.4.4.1 Growing number of semiconductor fabrication plants to augment market growth 140
10.4.5 REST OF ASIA PACIFIC 140
10.5 ROW 140
TABLE 106 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2020–2023 (USD MILLION) 141
TABLE 107 ROW: INTERPOSER AND FOWLP MARKET, BY REGION, 2024–2029 (USD MILLION) 141
TABLE 108 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2020–2023 (USD MILLION) 141
TABLE 109 ROW: INTERPOSER AND FOWLP MARKET, BY END-USER INDUSTRY, 2024–2029 (USD MILLION) 142
TABLE 110 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2020–2023 (USD MILLION) 142
TABLE 111 ROW: INTERPOSER AND FOWLP MARKET, BY PACKAGING TYPE, 2024–2029 (USD MILLION) 142
10.5.1 RECESSION IMPACT ON MARKET IN ROW 142
10.5.2 MIDDLE EAST & AFRICA 143
10.5.2.1 High commitment to technological innovation to contribute to market growth 143
10.5.3 SOUTH AMERICA 143
10.5.3.1 Increased R&D of advanced packaging technologies to propel market 143
11 COMPETITIVE LANDSCAPE 144
11.1 INTRODUCTION 144
11.2 STRATEGIES ADOPTED BY KEY PLAYERS, 2020–2023 144
TABLE 112 INTERPOSER AND FOWLP MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, 2020–2023 144
11.2.1 PRODUCT PORTFOLIO EXPANSION 145
11.2.2 REGIONAL FOOTPRINT EXPANSION 145
11.2.3 ORGANIC/INORGANIC GROWTH 145
11.3 MARKET SHARE ANALYSIS, 2023 146
TABLE 113 INTERPOSER AND FOWLP MARKET: DEGREE OF COMPETITION 146
11.4 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018–2022 147
FIGURE 45 REVENUE ANALYSIS OF KEY PLAYERS IN INTERPOSER AND FOWLP MARKET, 2018–2022 147
11.5 COMPANY EVALUATION MATRIX, 2023 148
11.5.1 STARS 148
11.5.2 EMERGING LEADERS 148
11.5.3 PERVASIVE PLAYERS 148
11.5.4 PARTICIPANTS 148
FIGURE 46 INTERPOSER AND FOWLP MARKET: COMPANY EVALUATION MATRIX, 2023 149
11.5.5 COMPANY FOOTPRINT 149
TABLE 114 COMPANY PACKAGING TYPE FOOTPRINT (10 KEY COMPANIES) 149
TABLE 115 COMPANY PACKAGING COMPONENT AND DESIGN FOOTPRINT (10 KEY COMPANIES) 150
TABLE 116 COMPANY REGION FOOTPRINT (10 KEY COMPANIES) 150
TABLE 117 OVERALL COMPANY FOOTPRINT (10 KEY COMPANIES) 151
11.6 START-UP/SME EVALUATION MATRIX, 2023 151
TABLE 118 INTERPOSER AND FOWLP MARKET: LIST OF KEY START-UPS/SMES 151
11.6.1 PROGRESSIVE COMPANIES 152
11.6.2 RESPONSIVE COMPANIES 152
11.6.3 DYNAMIC COMPANIES 152
11.6.4 STARTING BLOCKS 152
FIGURE 47 INTERPOSER AND FOWLP MARKET: START-UP/SME EVALUATION MATRIX, 2023 152
11.6.5 COMPETITIVE BENCHMARKING 153
TABLE 119 INTERPOSER AND FOWLP MARKET: COMPETITIVE BENCHMARKING OF KEY START-UPS/SMES 153
11.7 COMPETITIVE SITUATION AND TRENDS 153
11.7.1 PRODUCT LAUNCHES 153
TABLE 120 INTERPOSER AND FOWLP MARKET: PRODUCT LAUNCHES, AUGUST 2020–NOVEMBER 2023 153
11.7.2 DEALS 155
TABLE 121 INTERPOSER AND FOWLP MARKET: DEALS, FEBRUARY 2021–JANUARY 2024 155
12 COMPANY PROFILES 157
12.1 INTRODUCTION 157
12.2 KEY PLAYERS 157
(Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats)*
12.2.1 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED 157
TABLE 122 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW 157
FIGURE 48 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT 158
TABLE 123 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 158
TABLE 124 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT LAUNCHES 159
TABLE 125 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: DEALS 159
12.2.2 SAMSUNG 161
TABLE 126 SAMSUNG: COMPANY OVERVIEW 161
FIGURE 49 SAMSUNG: COMPANY SNAPSHOT 162
TABLE 127 SAMSUNG: PRODUCTS/SOLUTIONS/SERVICES OFFERED 162
TABLE 128 SAMSUNG: PRODUCT LAUNCHES 163
TABLE 129 SAMSUNG: DEALS 163
12.2.3 ASE TECHNOLOGY HOLDING CO., LTD. 165
TABLE 130 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW 165
FIGURE 50 ASE TECHNOLOGY HOLDING CO. LTD.: COMPANY SNAPSHOT 166
TABLE 131 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 166
TABLE 132 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCT LAUNCHES 167
TABLE 133 ASE TECHNOLOGY HOLDING CO., LTD.: DEALS 167
12.2.4 AMKOR TECHNOLOGY 169
TABLE 134 AMKOR TECHNOLOGY: COMPANY OVERVIEW 169
FIGURE 51 AMKOR TECHNOLOGY: COMPANY SNAPSHOT 170
TABLE 135 AMKOR TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 170
TABLE 136 AMKOR TECHNOLOGY: DEALS 171
TABLE 137 AMKOR TECHNOLOGY: OTHERS 171
12.2.5 SK HYNIX INC. 173
TABLE 138 SK HYNIX INC.: COMPANY OVERVIEW 173
FIGURE 52 SK HYNIX INC.: COMPANY SNAPSHOT 173
TABLE 139 SK HYNIX INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 174
TABLE 140 SK HYNIX INC.: PRODUCT LAUNCHES 174
12.2.6 GLOBAL FOUNDRIES INC. 175
TABLE 141 GLOBAL FOUNDRIES INC.: COMPANY OVERVIEW 175
FIGURE 53 GLOBAL FOUNDRIES INC.: COMPANY SNAPSHOT 176
TABLE 142 GLOBAL FOUNDRIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 176
TABLE 143 GLOBAL FOUNDRIES INC.: DEALS 177
TABLE 144 GLOBAL FOUNDRIES INC.: OTHERS 177
12.2.7 DECA TECHNOLOGIES 178
TABLE 145 DECA TECHNOLOGIES: COMPANY OVERVIEW 178
TABLE 146 DECA TECHNOLOGIES: PRODUCTS/SOLUTIONS/SERVICES OFFERED 178
TABLE 147 DECA TECHNOLOGIES: DEALS 179
12.2.8 JCET GROUP LTD. 180
TABLE 148 JCET GROUP LTD.: COMPANY OVERVIEW 180
FIGURE 54 JCET GROUP LTD.: COMPANY SNAPSHOT 180
TABLE 149 JCET GROUP LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 181
TABLE 150 JCET GROUP LTD.: PRODUCT LAUNCHES 181
TABLE 151 JCET GROUP LTD.: OTHERS 181
12.2.9 POWERTECH TECHNOLOGY INC. 182
TABLE 152 POWERTECH TECHNOLOGY INC.: COMPANY OVERVIEW 182
FIGURE 55 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT 183
TABLE 153 POWERTECH TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 183
TABLE 154 POWERTECH TECHNOLOGY INC.: DEALS 184
12.2.10 ADVANCED MICRO DEVICES, INC. 185
TABLE 155 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW 185
FIGURE 56 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT 186
TABLE 156 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SOLUTIONS/SERVICES 186
TABLE 157 ADVANCED MICRO DEVICES, INC.: PRODUCT LAUNCHES 187
12.3 OTHER PLAYERS 188
12.3.1 NEXLOGIC TECHNOLOGIES INC. 188
12.3.2 SPTS TECHNOLOGIES LTD. 188
12.3.3 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION 189
12.3.4 SAMTEC 189
12.3.5 TELEDYNE DIGITAL IMAGING INC. 190
12.3.6 OKMETIC 190
12.3.7 AMS-OSRAM AG 191
12.3.8 NEPES 191
12.3.9 NHANCED SEMICONDUCTORS 192
12.3.10 DUPONT 192
12.3.11 ALLVIA INC. 193
12.3.12 UNITED MICROELECTRONICS CORPORATION 193
12.3.13 DAI NIPPON PRINTING CO., LTD. 194
12.3.14 RENA TECHNOLOGIES GMBH 194
12.3.15 MURATA MANUFACTURING CO., LTD 195
*Details on Business overview, Products/Solutions/Services offered, Recent developments, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses and Competitive threats might not be captured in case of unlisted companies.
13 APPENDIX 196
13.1 INSIGHTS FROM INDUSTRY EXPERTS 196
13.2 DISCUSSION GUIDE 197
13.3 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 200
13.4 CUSTOMIZATION OPTIONS 202
13.5 RELATED REPORTS 202
13.6 AUTHOR DETAILS 203

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Table of Contents

Summary

The global interposer and FOWLP market is expected to be valued at USD 35.6 billion in 2024 and is projected to reach USD 63.5 billion by 2029; it is expected to grow at a CAGR of 12.3% from 2024 to 2029. Increasing demand for advanced packaging in AI and high-performance computing serves as a significant driver for the Interposer and FOWLP market.
“3D packaging by packaging type segment to account higher CAGR in Interposer and FOWLP market during the forecast period”
The semiconductor packaging industry is witnessing a surge in 3D packaging due to its ability to enhance performance, reduce form factor, and address challenges associated with traditional 2D packaging. As demand for compact and powerful electronic devices increases, 3D packaging technologies, such as stacked integrated circuits and through-silicon vias, are gaining prominence for their efficiency in meeting these evolving market needs.
“Consumer Electronics to hold the largest share in Interposer and FOWLP market in 2029”
Semiconductor packaging plays a crucial role in consumer electronics by enabling miniaturization, improved performance, and energy efficiency. The demand for smaller, more powerful, and energy-efficient devices, such as smartphones and wearables, is driving continuous innovation in semiconductor packaging technologies to meet the evolving requirements of the consumer electronics market.
“Asia Pacific region growing at highest CAGR in Interposer and FOWLP market”
The growth of semiconductor packaging in Asia Pacific can be attributed to the region's strong presence in electronics manufacturing, the availability of skilled labor, and the establishment of advanced packaging facilities by major semiconductor companies seeking cost-effective production and proximity to key markets. Additionally, supportive government policies and investment in research and development contribute to the region's prominence in semiconductor packaging.
The study contains insights from various industry experts, ranging from component suppliers to Tier 1 companies and OEMs. The break-up of the primaries is as follows:
• By Company Type: Tier 1 – 38%, Tier 2 – 28%, and Tier 3 – 34%
• By Designation: C-level Executives – 40%, Directors – 30%, and Others – 30%
• By Region: North America – 35%, Europe – 20%, Asia Pacific – 35%, and RoW – 10%
The key players operating in the Interposer and FOWLP market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), among others.
Research Coverage:
The research reports the Interposer and FOWLP Market, by Packaging Component & Design (Interposer, FOWLP); Packaging Type (2.5D,3D); Device Type (Logic ICs, Imaging & Optoelectronics, LEDs, MEMS/Sensors, Memory Devices and Other Device Types), End-user Industry (Consumer Electronics, Communications, Manufacturing, Automotive, Medical Devices, Aerospace); Region (North America, Europe, Asia Pacific, RoW)
The scope of the report covers detailed information regarding the major factors, such as drivers, restraints, challenges, and opportunities, influencing the growth of the interposer and FOWLP market. A detailed analysis of the key industry players has been done to provide insights into their business overviews, products, key strategies, contracts, partnerships, and agreements. New product & service launches, mergers and acquisitions, and recent developments associated with the Interposer and FOWLP market. Competitive analysis of upcoming startups in the Interposer and FOWLP market ecosystem is covered in this report.
Key Benefits of Buying the Report
 Analysis of key drivers (Rising trend of miniaturization and form factor requirements; Increasing demand for advanced packaging in AI and high-performance computing; Growing demand for consumer electronics and gaming devices; Cost advantages offered by advanced packaging), restraints (Environmental concerns due to the usage of certain materials and chemicals; Complex manufacturing process), opportunities (Growing demand for IoT devices and wearables; Integration of advanced electronics in automobiles), and challenges (Thermal issues in wafer level packaging; Complexities in supply chain) influencing the growth of the Interposer and FOWLP market.

• Product Development/Innovation: Detailed insights on upcoming technologies, research and development activities, and new product launches in the Interposer and FOWLP market

• Market Development: Comprehensive information about lucrative markets – the report analyses the Interposer and FOWLP market across varied regions.

• Market Diversification: Exhaustive information about new products/services, untapped geographies, recent developments, and investments in the Interposer and FOWLP market

• Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players like Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), among others in the interposers and FOWLP market.

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Table of Contents

ご注文は、お電話またはWEBから承ります。お見積もりの作成もお気軽にご相談ください。

本レポートと同分野（電子部品／半導体）の最新刊レポート

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