Global Conductive Plastic Compounds Market to surpass USD 16.2 billion by 2030 from USD 7.6 billion in 2020 at a CAGR of 10.2% in the coming years, i.e., 2021-30.
Product Overview
Conductive plastics are electrically conductive and contain semiconductor …
Pressure Sensor Market with COVID-19 Impact Analysis by Sensor Type (Wired, Wireless), Technology (Piezoresistive, Capacitive, Optical), Product (Absolute, Gauge, Differential), End Use, Vertical, and Geography-Global Forecast to 2026
Thin Wafers Market (Thickness: Below 10 um, 10 um - 29 um, 30 um - 49 um, 50 um- 99 um, 100 um - 200 um, and Above 200 um; Wafer Size: Below 100 mm, 100 mm, 125 mm, 150 mm, 200 mm, and 300 mm; Material: Silicon [Si], Gallium Arsenide (GaAs), Gallium Nitride [GaN], Silicon Carbide [SiC], and Others [Indium, etc.]; Application: MEMS, CMOS, Memory, Image Sensor, Light Emitting Diode, Interposer, and Others (Radio Frequency Devices, Logic, etc.); and End-use Industry: Consumer Electronics, Automotive, Healthcare, IT and Telecom, Aerospace and Defense, and Others) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2021-2031
Silicon on Insulator (SOI) Market with COVID-19 Impact Analysis by Wafer Size (200 mm and less than 200 mm, 300 mm), Wafer Type (RF-SOI, FD-SOI), Technology (Smart Cut), Product, Application (Consumer Electronics, Automotive) - Global Forecast to 2026
This report contains market size and forecasts of Thin Film Piezo MEMS Inkjet Printhead in China, including the following market information:
China Thin Film Piezo MEMS Inkjet Printhead Market Revenue, 2016-2021, 2022-2027, ($ millions)
China Thin Film Pi…
This report contains market size and forecasts of Thick Layer Photoresists in China, including the following market information:
China Thick Layer Photoresists Market Revenue, 2016-2021, 2022-2027, ($ millions)
China Thick Layer Photoresists Market Sales,…
A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS).
Market Analysis an…
We consider MEMS as devices that include moving parts (or fluids) in the µm - mm range, and which use a photolithography process for manufacturing. Only die-level components (first-level packaged device) are considered, not the full system around a MEMS d…