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ワイヤーボンディング市場 - レポートの範囲
このレポートは世界のワイヤーボンディング市場を調査したTransparency Market Research (TMR)の調査報告書です。世界のワイヤーボンディング市場の促進要因、動向、課題などの主要な市場力学やその構造に関する詳細な情報を提供しています。TMRの調査は、世界のワイヤーボンディング市場に関する貴重な情報を提供し、予測期間である2021年から2031年の間に市場がどのように拡大すると予想されるかを説明するものである。

バリューチェーン分析や年平均成長率（CAGR）など、市場成長の主要指標はTMRの調査において包括的に解明されています。このデータは、読者が世界のワイヤーボンディング市場の定量的な成長側面を解釈するのに役立ちます。

主要な市場参加者が採用する事業戦略に関する広範な分析も、TMRの世界のワイヤーボンディング市場に関する調査で紹介されています。これは、読者が世界のワイヤーボンディング市場の成長をもたらす主要因を理解するのに役立ちます。本調査では、読者は世界のワイヤーボンディング市場の質的・量的な成長の道筋に関する具体的なデータも得ることができます。このデータは、近い将来、市場関係者が適切な意思決定を行う際のガイドとなるでしょう。

ワイヤーボンディング市場に関するTMRの調査において回答された主要な質問
2021年から2031年にかけてのワイヤーボンディングの世界市場の前年比成長トレンドはどのようになるのか？
タイプ別セグメントのトレンド変化がワイヤーボンディングの世界市場に与える影響とは？
今後数年間、アジア太平洋地域はワイヤーボンディングのプロバイダーにとって最も支配的な地域市場であり続けるでしょうか？
予測期間中にワイヤーボンディングの世界市場を阻害する要因は何でしょうか？
ワイヤーボンディングの世界市場で事業を展開している大手企業はどこか？
調査方法
TMRは、世界のワイヤーボンディング市場に関する包括的な調査を実施し、市場の将来の成長見通しに関する結論を導き出すために、独自の調査手法を採用しています。この調査手法は、一次調査と二次調査を組み合わせたものであり、アナリストが導き出された結論の正確性と信頼性を保証するのに役立ちます。

ワイヤーボンディングの世界市場に関するレポート作成時にアナリストが参照した二次調査ソースには、企業の年次報告書、SEC提出書類、企業のウェブサイト、世界銀行のデータベース、投資家のプレゼンテーション、規制データベース、政府刊行物、市場のホワイトペーパーからの統計が含まれています。また、アナリストは一次調査資料として、TMRの世界のワイヤーボンディング市場に関する調査作成に貢献したシニアマネージャー、製品ポートフォリオマネージャー、CEO、副社長、マーケットインテリジェンスマネージャーにインタビューしています。

これらの一次情報源および二次情報源は、インタビュー時に独占情報を提供し、世界のワイヤーボンディング市場で事業を展開するリーディングプレイヤーからの検証の場となりました。社内の広範なリポジトリおよび社外の独自データベースへのアクセスにより、本レポートは世界のワイヤーボンディング市場に関する特定の詳細や疑問に正確に対処することができました。また、本調査では、トップダウンアプローチで各分野の数値を評価し、ボトムアップアプローチでその数値を逆検証しています。これにより、ワイヤーボンディングの世界市場の将来展望に関するTMRの予測は、より信頼性が高く正確なものとなっています。

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目次

1. Preface
1.1. Market Introduction
1.2. Market and Segments Definition
1.3. Market Taxonomy
1.4. Research Methodology
1.5. Assumption and Acronyms
2. Executive Summary
2.1. Global Wire Bonding Market Analysis and Forecast
2.2. Regional Outline
2.3. Global Market Analysis, by End-use Industry
2.4. Global Market – Competition Analysis
2.5. Market Dynamics Snapshot
2.6. Competition Blueprint
3. Market Dynamics
3.1. Macro-economic Factors
3.2. Key Market Indicator
3.3. Drivers
3.3.1. Economic Drivers
3.3.2. Supply Side Drivers
3.3.3. Demand Side Drivers
3.4. Market Restraints and Opportunities
3.5. Market Trends
3.5.1. Demand Side
3.5.2. Supply Side
3.6. Regulatory Framework
4. Associated Industry and Key Indicator Assessment
4.1. Parent Industry Overview
4.2. Supply Chain Analysis
4.3. Technology Roadmap Analysis
4.4. Industry SWOT Analysis
4.5. Porter Five Forces Analysis
4.6. Summary of Alternative Packaging Technology - Comparative Analysis
5. Global Wire Bonding Market Analysis, by Bonding Process Type
5.1. Global Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Bonding Process Type, 2017‒2031
5.1.1. Thermocompression Bonding
5.1.2. Thermosonic Bonding
5.1.3. Ultrasonic Bonding
5.2. Global Wire Bonding Market Attractiveness Analysis, by Bonding Process Type
6. Global Wire Bonding Market Analysis, by Wire Thickness
6.1. Global Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Thickness, 2017‒2031
6.1.1. 0 µm- 75µm
6.1.2. 75µm-150µm
6.1.3. 150µm-300µm
6.1.4. 300µm-500µm
6.2. Global Wire Bonding Market Attractiveness Analysis, by Wire Thickness
7. Global Wire Bonding Market Analysis, by Material
7.1. Global Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Material, 2017‒2031
7.1.1. Gold
7.1.2. Copper
7.1.3. Aluminum
7.1.4. Silver
7.1.5. Palladium-coated copper (PCC)
7.1.6. Others (PdAg and Other Alloys)
7.2. Global Wire Bonding Market Attractiveness Analysis, by Material
8. Global Wire Bonding Market Analysis, by Wire Product Type
8.1. Global Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Product Type, 2017‒2031
8.1.1. Ball Bonders
8.1.2. Wedge Bonders
8.1.3. Stud/Bump Bonders
8.1.4. Peg Bonders
8.2. Global Wire Bonding Market Attractiveness Analysis, by Wire Product Type
9. Global Wire Bonding Market Analysis, by Application
9.1. Global Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Application, 2017‒2031
9.1.1. MEMS (Micro-Electro-Mechanical Systems)
9.1.2. Optoelectronics System
9.1.3. Memory
9.1.4. Sensors
9.1.5. Others (LCD, Microcontrollers, RF chips, etc.)
9.2. Global Wire Bonding Market Attractiveness Analysis, by Application
10. Global Wire Bonding Market Analysis, by End-use Industry
10.1. Global Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by End-use Industry, 2017‒2031
10.1.1. Aerospace and Defense
10.1.2. Consumer Electronics
10.1.3. Automotive
10.1.4. Healthcare
10.1.5. Energy
10.1.6. Telecommunications
10.1.7. Others (Transportation, Agriculture, etc.)
10.2. Global Wire Bonding Market Attractiveness Analysis, by End-use Industry
11. Global Wire Bonding Market Analysis and Forecast, by Region
11.1. Global Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Region, 2017–2031
11.1.1. North America
11.1.2. Europe
11.1.3. Asia Pacific
11.1.4. Middle East & Africa
11.1.5. South America
11.2. Global Wire Bonding Market Attractiveness Analysis, by Region
12. North America Wire Bonding Market Analysis and Forecast
12.1. Market Snapshot
12.2. Drivers and Restraints: Impact Analysis
12.3. North America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Bonding Process Type, 2017‒2031
12.3.1. Thermocompression Bonding
12.3.2. Thermosonic Bonding
12.3.3. Ultrasonic Bonding
12.4. North America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Thickness, 2017‒2031
12.4.1. 0 µm- 75µm
12.4.2. 75µm-150µm
12.4.3. 150µm-300µm
12.4.4. 300µm-500µm
12.5. North America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Material, 2017‒2031
12.5.1. Gold
12.5.2. Copper
12.5.3. Aluminum
12.5.4. Silver
12.5.5. Palladium-coated copper (PCC)
12.5.6. Others (PdAg and Other Alloys)
12.6. North America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Product Type, 2017‒2031
12.6.1. Ball Bonders
12.6.2. Wedge Bonders
12.6.3. Stud/Bump Bonders
12.6.4. Peg Bonders
12.7. North America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Application, 2017‒2031
12.7.1. MEMS (Micro-Electro-Mechanical Systems)
12.7.2. Optoelectronics System
12.7.3. Memory
12.7.4. Sensors
12.7.5. Others (LCD, Microcontrollers, RF chips, etc.)
12.8. North America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by End-use Industry, 2017‒2031
12.8.1. Aerospace and Defense
12.8.2. Consumer Electronics
12.8.3. Automotive
12.8.4. Healthcare
12.8.5. Energy
12.8.6. Telecommunications
12.8.7. Others (Transportation, Agriculture, etc.)
12.9. North America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Country & Sub-region, 2017–2031
12.9.1. U.S.
12.9.2. Canada
12.9.3. Rest of North America
12.10. North America Wire Bonding Market Attractiveness Analysis
12.10.1. By Bonding Process Type
12.10.2. By Wire Thickness
12.10.3. By Material
12.10.4. By Wire Product Type
12.10.5. By Application
12.10.6. By End-use Industry
12.10.7. By Country & Sub-region
13. Asia Pacific Wire Bonding Market Analysis and Forecast
13.1. Market Snapshot
13.2. Drivers and Restraints: Impact Analysis
13.3. Asia Pacific Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Bonding Process Type, 2017‒2031
13.3.1. Thermocompression Bonding
13.3.2. Thermosonic Bonding
13.3.3. Ultrasonic Bonding
13.4. Asia Pacific Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Thickness, 2017‒2031
13.4.1. 0 µm- 75µm
13.4.2. 75µm-150µm
13.4.3. 150µm-300µm
13.4.4. 300µm-500µm
13.5. Asia Pacific Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Material, 2017‒2031
13.5.1. Gold
13.5.2. Copper
13.5.3. Aluminum
13.5.4. Silver
13.5.5. Palladium-coated copper (PCC)
13.5.6. Others (PdAg and Other Alloys)
13.6. Asia Pacific Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Product Type, 2017‒2031
13.6.1. Ball Bonders
13.6.2. Wedge Bonders
13.6.3. Stud/Bump Bonders
13.6.4. Peg Bonders
13.7. Asia Pacific Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Application, 2017‒2031
13.7.1. MEMS (Micro-Electro-Mechanical Systems)
13.7.2. Optoelectronics System
13.7.3. Memory
13.7.4. Sensors
13.7.5. Others (LCD, Microcontrollers, RF chips, etc.)
13.8. Asia Pacific Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by End-use Industry, 2017‒2031
13.8.1. Aerospace and Defense
13.8.2. Consumer Electronics
13.8.3. Automotive
13.8.4. Healthcare
13.8.5. Energy
13.8.6. Telecommunications
13.8.7. Others (Transportation, Agriculture, etc.)
13.9. Asia Pacific Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Country & Sub-region, 2017‒2031
13.9.1. China
13.9.2. Taiwan
13.9.3. Japan
13.9.4. South Korea
13.9.5. ASEAN
13.9.6. Rest of Asia Pacific
13.10. Asia Pacific Wire Bonding Market Attractiveness Analysis
13.10.1. By Bonding Process Type
13.10.2. By Wire Thickness
13.10.3. By Material
13.10.4. By Wire Product Type
13.10.5. By Application
13.10.6. By End-use Industry
13.10.7. By Country & Sub-region
14. Europe Wire Bonding Market Analysis and Forecast
14.1. Market Snapshot
14.2. Drivers and Restraints: Impact Analysis
14.3. Europe Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Bonding Process Type, 2017‒2031
14.3.1. Thermocompression Bonding
14.3.2. Thermosonic Bonding
14.3.3. Ultrasonic Bonding
14.4. Europe Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Thickness, 2017‒2031
14.4.1. 0 µm- 75µm
14.4.2. 75µm-150µm
14.4.3. 150µm-300µm
14.4.4. 300µm-500µm
14.5. Europe Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Material, 2017‒2031
14.5.1. Gold
14.5.2. Copper
14.5.3. Aluminum
14.5.4. Silver
14.5.5. Palladium-coated copper (PCC)
14.5.6. Others (PdAg and Other Alloys)
14.6. Europe Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Product Type, 2017‒2031
14.6.1. Ball Bonders
14.6.2. Wedge Bonders
14.6.3. Stud/Bump Bonders
14.6.4. Peg Bonders
14.7. Europe Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Application, 2017‒2031
14.7.1. MEMS (Micro-Electro-Mechanical Systems)
14.7.2. Optoelectronics System
14.7.3. Memory
14.7.4. Sensors
14.7.5. Others (LCD, Microcontrollers, RF chips, etc.)
14.8. Europe Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by End-use Industry, 2017‒2031
14.8.1. Aerospace and Defense
14.8.2. Consumer Electronics
14.8.3. Automotive
14.8.4. Healthcare
14.8.5. Energy
14.8.6. Telecommunications
14.8.7. Others (Transportation, Agriculture, etc.)
14.9. Europe Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Country & Sub-region, 2017‒2031
14.9.1. U.K.
14.9.2. Germany
14.9.3. France
14.9.4. Italy
14.9.5. Russia
14.9.6. Rest of Europe
14.10. Europe Wire Bonding Market Attractiveness Analysis
14.10.1. By Bonding Process Type
14.10.2. By Wire Thickness
14.10.3. By Material
14.10.4. By Wire Product Type
14.10.5. By Application
14.10.6. By End-use Industry
14.10.7. By Country & Sub-region
15. South America Wire Bonding Market Analysis and Forecast
15.1. Market Snapshot
15.2. Drivers and Restraints: Impact Analysis
15.3. South America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Bonding Process Type, 2017‒2031
15.3.1. Thermocompression Bonding
15.3.2. Thermosonic Bonding
15.3.3. Ultrasonic Bonding
15.4. South America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Thickness, 2017‒2031
15.4.1. 0 µm- 75µm
15.4.2. 75µm-150µm
15.4.3. 150µm-300µm
15.4.4. 300µm-500µm
15.5. South America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Material, 2017‒2031
15.5.1. Gold
15.5.2. Copper
15.5.3. Aluminum
15.5.4. Silver
15.5.5. Palladium-coated copper (PCC)
15.5.6. Others (PdAg and Other Alloys)
15.6. South America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Product Type, 2017‒2031
15.6.1. Ball Bonders
15.6.2. Wedge Bonders
15.6.3. Stud/Bump Bonders
15.6.4. Peg Bonders
15.7. South America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Application, 2017‒2031
15.7.1. MEMS (Micro-Electro-Mechanical Systems)
15.7.2. Optoelectronics System
15.7.3. Memory
15.7.4. Sensors
15.7.5. Others (LCD, Microcontrollers, RF chips, etc.)
15.8. South America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by End-use Industry, 2017‒2031
15.8.1. Aerospace and Defense
15.8.2. Consumer Electronics
15.8.3. Automotive
15.8.4. Healthcare
15.8.5. Energy
15.8.6. Telecommunications
15.8.7. Others (Transportation, Agriculture, etc.)
15.9. South America Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Country & Sub-region, 2017‒2031
15.9.1. Brazil
15.9.2. Rest of South America
15.10. South America Wire Bonding Market Attractiveness Analysis
15.10.1. By Bonding Process Type
15.10.2. By Wire Thickness
15.10.3. By Material
15.10.4. By Wire Product Type
15.10.5. By Application
15.10.6. By End-use Industry
15.10.7. By Country & Sub-region
16. Middle East & Africa (MEA) Wire Bonding Market Analysis and Forecast
16.1. Market Snapshot
16.2. Drivers and Restraints: Impact Analysis
16.3. Middle East & Africa Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Bonding Process Type, 2017‒2031
16.3.1. Thermocompression Bonding
16.3.2. Thermosonic Bonding
16.3.3. Ultrasonic Bonding
16.4. Middle East & Africa Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Thickness, 2017‒2031
16.4.1. 0 µm- 75µm
16.4.2. 75µm-150µm
16.4.3. 150µm-300µm
16.4.4. 300µm-500µm
16.5. Middle East & Africa Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Material, 2017‒2031
16.5.1. Gold
16.5.2. Copper
16.5.3. Aluminum
16.5.4. Silver
16.5.5. Palladium-coated copper (PCC)
16.5.6. Others (PdAg and Other Alloys)
16.6. Middle East & Africa Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Wire Product Type, 2017‒2031
16.6.1. Ball Bonders
16.6.2. Wedge Bonders
16.6.3. Stud/Bump Bonders
16.6.4. Peg Bonders
16.7. Middle East & Africa Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Application, 2017‒2031
16.7.1. MEMS (Micro-Electro-Mechanical Systems)
16.7.2. Optoelectronics System
16.7.3. Memory
16.7.4. Sensors
16.7.5. Others (LCD, Microcontrollers, RF chips, etc.)
16.8. Middle East & Africa Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by End-use Industry, 2017‒2031
16.8.1. Aerospace and Defense
16.8.2. Consumer Electronics
16.8.3. Automotive
16.8.4. Healthcare
16.8.5. Energy
16.8.6. Telecommunications
16.8.7. Others (Transportation, Agriculture, etc.)
16.9. Middle East & Africa Wire Bonding Market Value (US$ Bn) Analysis & Forecast, by Country & Sub-region, 2017‒2031
16.9.1. GCC
16.9.2. South Africa
16.9.3. Rest of Middle East & Africa
16.10. Middle East & Africa Wire Bonding Market Attractiveness Analysis
16.10.1. By Bonding Process Type
16.10.2. By Wire Thickness
16.10.3. By Material
16.10.4. By Wire Product Type
16.10.5. By Application
16.10.6. By End-use Industry
16.10.7. By Country & Sub-region
17. Competition Assessment
17.1. Global Wire Bonding Market Competition Matrix - a Dashboard View
17.1.1. Global Wire Bonding Market Company Share Analysis, by Value (2020) and Volume
17.1.2. Technological Differentiator
18. Company Profiles (Manufacturers/Suppliers)
18.1. Cirexx International Inc.
18.1.1. Overview
18.1.2. Product Portfolio
18.1.3. Sales Footprint
18.1.4. Key Subsidiaries or Distributors
18.1.5. Strategy and Recent Developments
18.1.6. Financial Analysis
18.2. Powertech Technology Inc.
18.2.1. Overview
18.2.2. Product Portfolio
18.2.3. Sales Footprint
18.2.4. Key Subsidiaries or Distributors
18.2.5. Strategy and Recent Developments
18.2.6. Financial Analysis
18.3. Alter Technology
18.3.1. Overview
18.3.2. Product Portfolio
18.3.3. Sales Footprint
18.3.4. Key Subsidiaries or Distributors
18.3.5. Strategy and Recent Developments
18.3.6. Financial Analysis
18.4. Würth Elektronik GmbH & Co. KG (1/2)
18.4.1. Overview
18.4.2. Product Portfolio
18.4.3. Sales Footprint
18.4.4. Key Subsidiaries or Distributors
18.4.5. Strategy and Recent Developments
18.4.6. Financial Analysis
18.5. QP Technologies
18.5.1. Overview
18.5.2. Product Portfolio
18.5.3. Sales Footprint
18.5.4. Key Subsidiaries or Distributors
18.5.5. Strategy and Recent Developments
18.5.6. Financial Analysis
18.6. Tektronix, Inc.
18.6.1. Overview
18.6.2. Product Portfolio
18.6.3. Sales Footprint
18.6.4. Key Subsidiaries or Distributors
18.6.5. Strategy and Recent Developments
18.6.6. Financial Analysis
18.7. NEOTech Inc.
18.7.1. Overview
18.7.2. Product Portfolio
18.7.3. Sales Footprint
18.7.4. Key Subsidiaries or Distributors
18.7.5. Strategy and Recent Developments
18.7.6. Financial Analysis
18.8. SMART Microsystems Ltd.
18.8.1. Overview
18.8.2. Product Portfolio
18.8.3. Sales Footprint
18.8.4. Key Subsidiaries or Distributors
18.8.5. Strategy and Recent Developments
18.8.6. Financial Analysis
18.9. JCET Group Co., Ltd.
18.9.1. Overview
18.9.2. Product Portfolio
18.9.3. Sales Footprint
18.9.4. Key Subsidiaries or Distributors
18.9.5. Strategy and Recent Developments
18.9.6. Financial Analysis
18.10. Corintech Ltd.
18.10.1. Overview
18.10.2. Product Portfolio
18.10.3. Sales Footprint
18.10.4. Key Subsidiaries or Distributors
18.10.5. Strategy and Recent Developments
18.10.6. Financial Analysis
18.11. Amkor Technology, Inc.
18.11.1. Overview
18.11.2. Product Portfolio
18.11.3. Sales Footprint
18.11.4. Key Subsidiaries or Distributors
18.11.5. Strategy and Recent Developments
18.11.6. Financial Analysis
18.12. ASE Technology Holding Co., Ltd.
18.12.1. Overview
18.12.2. Product Portfolio
18.12.3. Sales Footprint
18.12.4. Key Subsidiaries or Distributors
18.12.5. Strategy and Recent Developments
18.12.6. Financial Analysis
19. Recommendation
19.1. Opportunity Assessment
19.1.1. By Bonding Process Type
19.1.2. By Wire Thickness
19.1.3. By Material
19.1.4. By Wire Product Type
19.1.5. By Application
19.1.6. By End-use Industry
19.1.7. By Region