半導体アセンブリおよびパッケージング装置の世界市場の機会と2032年までの戦略Including：1) タイプ別1)タイプ別：めっき装置、検査・ダイシング装置、ワイヤボンディング装置、ダイボンディング装置2)用途別：コンパニオンアニマル、家畜3)エンドユーザー別：OSATS（アウトソーシング・パッケージング装置3)エンドユーザー別: OSATS (Outsourced Semiconductor Assembly And Test); IDMS (Integrated Device Manufacturers)：東京エレクトロン; アプライドマテリアルズ; Kulicke and Soffa Industries, Inc; ASML Holding N.V; BE Semiconductor Industries N.V

Semiconductor Assembly And Packaging Equipment Global Market Opportunities And Strategies To 2032Including: 1) By Type: Plating Equipment; Inspection And Dicing Equipment; Wire Bonding Equipment; Die-Bonding Equipment2) By Application: Companion Animals; Livestock.3) By End User: OSATS (Outsourced Semiconductor Assembly And Test); IDMS (Integrated Device Manufacturers).Covering: Tokyo Electron Ltd; Applied Materials, Inc; Kulicke and Soffa Industries, Inc; ASML Holding N.V; BE Semiconductor Industries N.V

この調査レポートは、半導体アセンブリおよびパッケージング装置の世界市場のビジネスチャンスと2032年までの戦略を掲載し、戦略家、マーケティング担当者、上級管理職がCOVID 19の閉鎖から抜け出し、世界の半導... もっと見る

出版社	出版年月	電子版価格	ページ数	言語
The Business Research Company　(TBRC) ザ・ビジネスリサーチカンパニー	2023年4月25日	US$4,000 シングルユーザライセンスライセンス・価格情報注文方法はこちら	326	英語

サマリー

この調査レポートは、半導体アセンブリおよびパッケージング装置の世界市場のビジネスチャンスと2032年までの戦略を掲載し、戦略家、マーケティング担当者、上級管理職がCOVID 19の閉鎖から抜け出し、世界の半導体アセンブリおよびパッケージング装置市場を評価するために必要な重要情報を提供します。

購入の理由
- 12地域をカバーするこの市場に関する最も包括的なレポートにより、真にグローバルな視点を得ることができます。
- 市場がコロナウイルスからどのような影響を受けているのか、またウイルスの影響が和らぐにつれて市場がどのように立ち上がり、成長していくのかを理解することができます。
- 現地のデータと分析に基づき、地域別および国別の戦略を策定する。
- 投資の対象となる成長セグメントを特定する。
- 予測データと市場を形成するドライバーとトレンドを活用し、競合他社を凌駕する。
- 最新の市場調査結果に基づいて顧客を理解する。
- 主要な競合他社とのパフォーマンスの比較
- 主要データセット間の関係を活用し、優れた戦略を立てる。
- 信頼性の高い高品質なデータと分析により、社内外のプレゼンテーションをサポートします。

説明
半導体アセンブリ・パッケージング装置の最大市場、急成長市場はどこか？経済全体、人口動態、他の類似市場との関連は？今後どのような力が市場を形成していくのか？ビジネスリサーチ社の半導体組立・実装装置世界市場レポートでは、これらすべての疑問やその他多くの疑問にお答えします。
当レポートでは、市場の特徴、規模と成長、セグメンテーション、地域別および国別内訳、競合情勢、市場シェア、市場の動向と戦略を網羅しています。市場の歴史をたどり、地域別の市場成長を予測しています。また、同市場をより広範な半導体アセンブリ・パッケージング装置市場との関連において位置づけ、他市場との比較も行っています。

本レポートは以下の章をカバーしています。
- 序論と市場特性
半導体アセンブリおよびパッケージング装置市場に関する定義や解説、市場の対象となるセグメントを簡単に紹介しています。
- 主要動向
世界の半導体アセンブリ・パッケージング装置市場を形成している主要トレンドをハイライトしています。また、今後の市場動向についても解説します。
- 世界の市場規模と成長
世界の過去（2017年～2022年）、予測（2022年～2027年）、（2027年～2032年）市場価値、過去および予測期間における市場の成長を支え、制御する促進要因と抑制要因について紹介します。
- 地域別分析
地域別の過去（2017-2022年）および予測（2022-2027年）、（2027-2032年）市場価値と成長率、市場シェア比較。
- 市場セグメンテーション
市場におけるタイプ別、用途別、エンドユーザー別の市場価値（2017-2032年）と各セグメントの分析を収録。
- 地域別市場規模と成長
地域別の市場規模（2022年）、過去（2017年～2022年）および予測（2022年～2027年）、（2027年～2032年）の市場価値、地域内各国の成長率と市場シェア比較。本レポートには、アジア太平洋、西欧、東欧、北米、南米、中東、アフリカの全地域と各地域内の主要国に関する情報が含まれています。
- 競争環境
市場の競争状況、推定市場占有率、主要企業の会社プロファイルの詳細を掲載しています。
- 主要なM&A
本レポートでカバーしている市場における最近のM&Aに関する情報を掲載しています。本セクションでは、近年の市場を形成したM&Aに関する主要な財務情報を掲載しています。
- 市場機会と戦略
調査結果に基づく市場機会と戦略を掲載しています。このセクションでは、国やセグメントごとの成長機会や、それらの市場で取るべき戦略に関する情報も提供する。今後5年間に競合他社が大きなビジネスを獲得できる可能性のある市場について理解することができる。
- 結論と提言
本セクションでは、調査結果に基づく結論と提言を掲載する。また、製品提供、地域拡大、価格提供、ターゲットグループなどの観点から、半導体組立・実装装置メーカーへの提言も行っている。
- 付録
このセクションには、本レポートで使用したNAICSコード、略語、通貨コードの詳細が含まれています。

スコープ

対象市場
1) タイプ別タイプ別：めっき装置、検査・ダイシング装置、ワイヤーボンディング装置、ダイボンディング装置、その他
2) 用途別：コンパニオンアニマル；家畜。
3) エンドユーザー別: OSATS (Outsourced Semiconductor Assembly And Test); IDMS (Integrated Device Manufacturers).

言及された企業東京エレクトロン、アプライドマテリアルズ、Kulicke and Soffa Industries, Inc、ASML Holding N.V、BE Semiconductor Industries N.V.

国中国、オーストラリア、インド、インドネシア、日本、韓国、米国、ブラジル、フランス、ドイツ、英国、ロシア

地域アジア太平洋; 西ヨーロッパ; 東ヨーロッパ; 北アメリカ; 南アメリカ; 中東; アフリカ

時系列：過去5年間および過去10年間の予測。

データデータ：市場規模と成長率の関連市場に対する比率、GDP比率、一人当たり支出、半導体組立およびパッケージング装置の指標比較。

データ区分: 国別および地域別の過去データと予測データ、競合他社の市場シェア、市場セグメント。

ソーシングと参照：本レポート中のデータおよび分析は、エンドノートを使用しています。

本レポートでは、半導体組立・パッケージング装置市場について解説し、歴史的期間と称する2017-2022年と予測期間と称する2022-2027年をカバーし、2027-2032年のさらなる予測も掲載しています。各地域および各地域内の主要経済圏の市場を評価しています。

世界の半導体組立・パッケージング装置市場は、2017年以降年平均成長率（CAGR）8.7％で成長し、2022年には約103億9,940万ドルに達した。同市場は、2022年の103億9,940万ドルから2027年には185億8,080万ドルに12.2%の成長率で拡大すると予測される。その後、2027年から年平均成長率（CAGR）12.1%で成長し、2032年には327億920万ドルに達すると予想される。

歴史的期間の成長は、新興市場の力強い経済成長、半導体装置需要の増加、家電需要の増加、可処分所得の増加によるものである。市場は、コロナウイルスの大流行と主要国間の貿易摩擦によって抑制された。

今後は、半導体産業推進に向けた政府の取り組み、電気自動車需要の増加、医療産業からの需要増加、都市化の進展、携帯電子機器需要の増加が市場成長の原動力となるだろう。今後の半導体組立・実装装置市場の成長を阻害する要因としては、原材料価格の変動、一部の国の経済発展の遅れ、半導体装置の輸出規制などが挙げられる。

半導体組立・実装装置市場は、タイプ別にめっき装置、検査・ダイシング装置、ワイヤーボンディング装置、ダイボンディング装置、その他に区分される。検査・ダイシング装置市場は、タイプ別に区分された半導体組立・実装装置市場の中で最大のセグメントであり、2022年には全体の37.3%を占めた。今後、ダイボンディング装置分野は、2022-2027年のCAGR 12.8%で、タイプ別に区分された半導体組立・実装装置市場の中で最も急成長する分野となる見込みである。

半導体組立・実装装置市場は、用途別に民生用電子機器、ヘルスケア機器、自動車、企業向けストレージ、その他の用途に区分される。民生用電子機器市場は、半導体アセンブリおよびパッケージング装置市場をアプリケーション別にセグメント化した中で最大のセグメントであり、2022年には全体の48.1%を占めた。今後、アプリケーション別にセグメント化された半導体組立・実装装置市場では、その他のアプリケーション分野が2022～2027年のCAGR13.3%で最も急成長すると予測されている。

半導体組立・実装装置市場は、エンドユーザー別にOSATs（半導体組立・テストアウトソーシング）とIDMs（集積デバイスメーカー）に区分される。OSATs市場は、エンドユーザー別にセグメント化された半導体組立・実装装置市場の中で最大のセグメントであり、2022年には全体の75.6%を占めた。今後、OSATsセグメントは、エンドユーザー別にセグメント化された半導体組立およびパッケージング装置市場において、2022-2027年のCAGR 12.3%で最も急成長するセグメントとなる見込みである。

半導体組立・実装装置市場ではアジア太平洋地域が最大で、2022年には全体の55.4%を占めた。次いで北米、西欧、その他の地域と続く。今後、半導体組立・実装装置市場で最も成長する地域はアジア太平洋地域と北米で、年平均成長率はそれぞれ13.6%と11.8%となる。これに西欧と南米が続き、市場のCAGRはそれぞれ10.4％と8.6％と予想される。

世界の半導体組立・実装装置市場は、少数の大手企業が市場を支配しており、統合されている。同市場における上位10社の競争力は、2021年の市場全体の61.01%を占めている。東京エレクトロンが市場シェア14.51%で最も大きく、次いでアプライド・マテリアルズが12.46%、Kulicke and Soffa Industries, Inc.が9.27%、ASML Holding N.Vが7.76%、BE Semiconductor Industries N.Vが5.03%、東京精密が3.31%、Amkor Technologyが3.05%、ASM Pacific Technologyが2.44%、Screen Holdings Co.Ltd.が1.70%、KLA-Tencorが1.47%だった。

タイプ別にセグメント化された半導体組立・パッケージング装置市場で最大のビジネスチャンスは、2027年までに世界の年間売上高29億5630万ドルを獲得する検査・ダイシング装置セグメントに生じる。半導体組立・実装装置市場を用途別にセグメント化すると、民生用電子機器セグメントに最大のビジネスチャンスがあり、2027年までに世界の年間売上高が36億8,040万ドルになると予測される。エンドユーザー別に見た半導体組立・実装装置市場では、2027年までに世界年間売上高61億6,340万ドルに達するOSATs分野に最大のビジネスチャンスが生まれる。半導体組立・実装装置市場規模は、中国で19億1,050万ドルと最も拡大する。

半導体組立・実装装置の市場トレンドに基づく戦略としては、ビッグデータとAI（人工知能）を活用した新しい半導体検査機の投入に注力すること、新しい自動フリップチップボンダーの導入など新製品のイノベーションに注力すること、ウェットプロセス製品ラインを強化するために化合物半導体装置の導入に注力すること、投資を拡大することに注力すること、新製品を開発するためにパートナーシップを結ぶことに注力することなどが挙げられる。

半導体組立・実装装置市場で採用されている戦略は、新製品の投入による事業強化、戦略的パートナーシップによるデータ対応装置の提供強化、提携やパートナーシップによる事業強化などである。

ビジネス・リサーチ・カンパニーは、この機会を活用するために、半導体組立・パッケージング装置企業が、半導体装置におけるビッグデータとAI技術の導入に注力すること、化合物半導体装置に注力すること、製品イノベーションに注力すること、新興市場での拡大を図ること、先進国市場に引き続き注力すること、戦略的パートナーシップに注力すること、競争力のある価格での提供を行うこと、B2Bプロモーションを引き続き利用すること、展示会やイベントに参加すること、急成長するアプリケーションを引き続きターゲットにすることを推奨している。

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1. Executive Summary
2. Table Of Contents
3. List Of Figures
4. List Of Tables
5. Report Structure
6. Introduction and Market Characteristics
6.1. General Market Definition
6.2. Summary
6.3. Semiconductor Assembly And Packaging Equipment Market Definition And Segmentations
6.4. Market Segmentation By Type
6.4.1. Plating Equipment
6.4.2. Inspection And Dicing Equipment
6.4.3. Wire Bonding Equipment
6.4.4. Die-Bonding Equipment
6.4.5. Other Types
6.5. Market Segmentation By Application
6.5.1. Consumer Electronics
6.5.2. Healthcare Devices
6.5.3. Automotive
6.5.4. Enterprise Storage
6.5.5. Other Applications
6.6. Market Segmentation By End-User
6.6.1. OSATs
6.6.2. IDMs
7. Major Market Trends
7.1. Introduction of Big Data and AI Technology In Semiconductor Equipment
7.2. Product Innovation
7.3. Compound Semiconductor Equipment
7.4. Increasing Investments
7.5. Strategic Partnerships
8. Global Market Size and Growth
8.1. Market Size
8.2. Historic Market Growth, 2017 – 2022, Value ($ Million)
8.2.1. Market Drivers 2017 – 2022
8.2.2. Market Restraints 2017 – 2022
8.3. Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
8.3.1. Market Drivers 2022 – 2027
8.3.2. Market Restraints 2022 – 2027
9. Global Semiconductor Assembly And Packaging Equipment Market Segmentation
9.1. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
9.2. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
9.3. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
10. Semiconductor Assembly And Packaging Equipment Market, Regional and Country Analysis
10.1. Global Semiconductor Assembly And Packaging Equipment Market, By Region, Historic and Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
10.2. Global Semiconductor Assembly And Packaging Equipment Market, By Country, Historic and Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11. Asia-Pacific Market
11.1. Summary
11.2. Market Overview
11.2.1. Region Information
11.2.2. Market Information
11.2.3. Background Information
11.2.4. Government Initiatives
11.2.5. Regulations
11.2.6. Regulatory Bodies
11.2.7. Major Associations
11.2.8. Taxes Levied
11.2.9. Corporate Tax Structure
11.2.10. Investments
11.2.11. Major Companies
11.3. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
11.4. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
11.5. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.6. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.7. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.8. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market: Country Analysis
11.9. China Market
11.10. Summary
11.11. Market Overview
11.11.1. Country Information
11.11.2. Market Information
11.11.3. Background Information
11.11.4. Government Initiatives
11.11.5. Regulations
11.11.6. Regulatory Bodies
11.11.7. Major Associations
11.11.8. Taxes levied
11.11.9. Corporate tax structure
11.11.10. Investments
11.11.11. Major Companies
11.12. China Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
11.13. China Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
11.14. China Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.15. China Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.16. China Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.17. India Market
11.18. India Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
11.19. India Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
11.20. India Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.21. India Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.22. India Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.23. Japan Market
11.24. Japan Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
11.25. Japan Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
11.26. Japan Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.27. Japan Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.28. Japan Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.29. Australia Market
11.30. Australia Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
11.31. Australia Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
11.32. Australia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.33. Australia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.34. Australia Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.35. Indonesia Market
11.36. Indonesia Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
11.37. Indonesia Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
11.38. Indonesia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.39. Indonesia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.40. Indonesia Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.41. South Korea Market
11.42. South Korea Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
11.43. South Korea Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
11.44. South Korea Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.45. South Korea Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
11.46. South Korea Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12. Western Europe Market
12.1. Summary
12.2. Market Overview
12.2.1. Region Information
12.2.2. Market Information
12.2.3. Background Information
12.2.4. Government Initiatives
12.2.5. Regulations
12.2.6. Regulatory Bodies
12.2.7. Major Associations
12.2.8. Taxes Levied
12.2.9. Corporate Tax Structure
12.2.10. Investments
12.2.11. Major Companies
12.3. Western Europe Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
12.4. Western Europe Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
12.5. Western Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12.6. Western Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12.7. Western Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12.8. Western Europe Semiconductor Assembly And Packaging Equipment Market: Country Analysis
12.9. UK Market
12.10. UK Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
12.11. UK Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
12.12. UK Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12.13. UK Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12.14. UK Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12.15. Germany Market
12.16. Germany Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
12.17. Germany Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
12.18. Germany Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12.19. Germany Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12.20. Germany Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12.21. France Market
12.22. France Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
12.23. France Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
12.24. France Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12.25. France Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
12.26. France Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
13. Eastern Europe Market
13.1. Summary
13.2. Market Overview
13.2.1. Region Information
13.2.2. Market Information
13.2.3. Background Information
13.2.4. Government Initiatives
13.2.5. Regulations
13.2.6. Regulatory bodies
13.2.7. Major Associations
13.2.8. Taxes Levied
13.2.9. Corporate Tax Structure
13.2.10. Investments
13.2.11. Major Companies
13.3. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
13.4. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
13.5. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
13.6. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
13.7. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
13.8. Eastern Europe Semiconductor Assembly And Packaging Equipment Market: Country Analysis
13.9. Russia Market
13.10. Russia Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
13.11. Russia Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
13.12. Russia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
13.13. Russia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
13.14. Russia Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
14. North America Market
14.1. Summary
14.2. Market Overview
14.2.1. Region Information
14.2.2. Market Information
14.2.3. Background Information
14.2.4. Government Initiatives
14.2.5. Regulations
14.2.6. Regulatory Bodies
14.2.7. Major Associations
14.2.8. Taxes Levied
14.2.9. Corporate Tax Structure
14.2.10. Investments
14.2.11. Major Companies
14.3. North America Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
14.4. North America Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
14.5. North America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
14.6. North America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
14.7. North America Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
14.8. North America Semiconductor Assembly And Packaging Equipment Market: Country Analysis
14.9. USA Market
14.10. Summary
14.11. Market Overview
14.11.1. Country Information
14.11.2. Market Information
14.11.3. Background Information
14.11.4. Government Initiatives
14.11.5. Regulations
14.11.6. Regulatory bodies
14.11.7. Major Associations
14.11.8. Taxes Levied
14.11.9. Corporate Tax Structure
14.11.10. Investments
14.11.11. Major Companies
14.12. USA Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
14.13. USA Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
14.14. USA Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
14.15. USA Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
14.16. USA Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
15. South America Market
15.1. Summary
15.2. Market Overview
15.2.1. Region Information
15.2.2. Market Information
15.2.3. Background Information
15.2.4. Government Initiatives
15.2.5. Regulations
15.2.6. Regulatory Bodies
15.2.7. Major Associations
15.2.8. Taxes Levied
15.2.9. Corporate Tax Structure
15.2.10. Investments
15.2.11. Major Companies
15.3. South America Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
15.4. South America Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
15.5. South America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
15.6. South America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
15.7. South America Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
15.8. South America Semiconductor Assembly And Packaging Equipment Market: Country Analysis
15.9. Brazil Market
15.10. Brazil Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
15.11. Brazil Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
15.12. Brazil Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
15.13. Brazil Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
15.14. Brazil Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
16. Middle East Market
16.1. Summary
16.2. Market Overview
16.2.1. Region Information
16.2.2. Market Information
16.2.3. Background Information
16.2.4. Government Initiatives
16.2.5. Regulations
16.2.6. Regulatory Bodies
16.2.7. Major Associations
16.2.8. Taxes Levied
16.2.9. Corporate Tax Structure
16.2.10. Investments
16.2.11. Major Companies
16.3. Middle East Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
16.4. Middle East Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
16.5. Middle East Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
16.6. Middle East Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
16.7. Middle East Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
17. Africa Market
17.1. Summary
17.2. Market Overview
17.2.1. Region Information
17.2.2. Market Information
17.2.3. Background Information
17.2.4. Government Initiatives
17.2.5. Regulations
17.2.6. Regulatory Bodies
17.2.7. Major Associations
17.2.8. Taxes Levied
17.2.9. Corporate Tax Structure
17.2.10. Investments
17.2.11. Major Companies
17.3. Africa Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2017 – 2022, Value ($ Million)
17.4. Africa Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2022 – 2027, 2032F Value ($ Million)
17.5. Africa Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
17.6. Africa Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
17.7. Africa Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2017 – 2022, 2027F, 2032F, Value ($ Million)
18. Competitive Landscape And Company Profiles
18.1. Company Profiles
18.2. Tokyo Electron Ltd
18.2.1. Company Overview
18.2.2. Products And Services
18.2.3. Financial Overview
18.3. Applied Materials, Inc.
18.3.1. Company Overview
18.3.2. Products And Services
18.3.3. Business Strategy
18.3.4. Financial Overview
18.4. Kulicke and Soffa Industries, Inc
18.4.1. Company Overview
18.4.2. Products And Services
18.4.3. Business Strategy
18.4.4. Financial Overview
18.5. ASML Holding N.V
18.5.1. Company Overview
18.5.2. Products And Services
18.5.3. Financial Overview
18.6. BE Semiconductor Industries N.V
18.6.1. Company Overview
18.6.2. Products And Services
18.6.3. Business Strategy
18.6.4. Financial Overview
19. Key Mergers and Acquisitions
19.1. Atlas Copco Acquired Ceres Technologies Inc.
19.2. Applied Materials Inc. Acquired Picosun Oy
19.3. Lam Research Acquired Semsysco
19.4. Renesas Electronics Corporation Acquired Dialog Semiconductor Plc
19.5. YES (Yield Engineering Systems) Acquired Kanthal’s Semiconductor
19.6. Advantest Corporation Acquired R&D Altanova
19.7. YES (Yield Engineering Systems, Inc) Acquired SPEC (Semiconductor Process Equipment Corporation)
19.8. Wingtech Technology Acquired Nexperia
20. Opportunities And Strategies
20.1. Global Semiconductor Assembly And Packaging Equipment Market In 2027 – Countries Offering Most New Opportunities
20.2. Global Semiconductor Assembly And Packaging Equipment Market In 2027 – Segments Offering Most New Opportunities
20.3. Global Semiconductor Assembly And Packaging Equipment Market In 2027 – Growth Strategies
20.3.1. Market Trend Based Strategies
20.3.2. Competitor Strategies
21. Semiconductor Assembly And Packaging Equipment Market, Conclusions And Recommendations
21.1. Conclusions
21.2. Recommendations
21.2.1. Product
21.2.2. Place
21.2.3. Price
21.2.4. Promotion
21.2.5. People
22. Appendix
22.1. Market Data Sources
22.2. Research Methodology
22.3. Currencies
22.4. The Business Research Company
22.5. Copyright and Disclaimer

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Table of Contents

Summary

Semiconductor Assembly And Packaging Equipment Global Market Opportunities And Strategies To 2032 from The Business Research Company provides the strategists; marketers and senior management with the critical information they need to assess the global semiconductor assembly and packaging equipment market as it emerges from the COVID 19 shut down.

Reasons to Purchase
• Gain a truly global perspective with the most comprehensive report available on this market covering 12 geographies.
• Understand how the market is being affected by the coronavirus and how it is likely to emerge and grow as the impact of the virus abates.
• Create regional and country strategies on the basis of local data and analysis.
• Identify growth segments for investment.
• Outperform competitors using forecast data and the drivers and trends shaping the market.
• Understand customers based on the latest market research findings.
• Benchmark performance against key competitors.
• Utilize the relationships between key data sets for superior strategizing.
• Suitable for supporting your internal and external presentations with reliable high-quality data and analysis

Description:
Where is the largest and fastest-growing market for semiconductor assembly and packaging equipment? How does the market relate to the overall economy; demography and other similar markets? What forces will shape the market going forward? The semiconductor assembly and packaging equipment market global report from the Business Research Company answers all these questions and many more.
The report covers market characteristics; size and growth; segmentation; regional and country breakdowns; competitive landscape; market shares; trends and strategies for this market. It traces the market’s history and forecasts market growth by geography. It places the market within the context of the wider semiconductor assembly and packaging equipment market; and compares it with other markets.

The report covers the following chapters
• Introduction and Market Characteristics
Brief introduction to the segmentations covered in the market, definitions and explanations about the semiconductor assembly and packaging equipment market.
• Key Trends
Highlights the major trends shaping the global semiconductor assembly and packaging equipment market. This section also highlights likely future developments in the market.
• Global Market Size and Growth
Global historic (2017-2022) and forecast (2022-2027), and (2027-2032) market values, and drivers and restraints that support and control the growth of the market in the historic and forecast periods.
• Regional Analysis
Historic (2017-2022) and forecast (2022-2027), and (2027-2032) market values and growth and market share comparison by region.
• Market Segmentation
Contains the market values (2017-2032) and analysis for each segment by type, by application and by end-user in the market.
• Regional Market Size and Growth
Regional market size (2022), historic (2017-2022) and forecast (2022-2027), and (2027-2032) market values, and growth and market share comparison of countries within the region. This report includes information on all the regions Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa and major countries within each region.
• Competitive Landscape
Details on the competitive landscape of the market, estimated market shares and company profiles of the leading players.
• Key Mergers and Acquisitions
Information on recent mergers and acquisitions in the market covered in the report. This section gives key financial details of mergers and acquisitions, which have shaped the market in recent years.
• Market Opportunities And Strategies
This section includes market opportunities and strategies based on findings of the research. This section also gives information on growth opportunities across countries, segments and strategies to be followed in those markets. It gives an understanding of where there is significant business to be gained by competitors in the next five years.
• Conclusions And Recommendations
This section includes conclusions and recommendations based on findings of the research. This section also gives recommendations for semiconductor assembly and packaging equipment companies in terms of product offerings, geographic expansion, price offerings, and target groups.
• Appendix
This section includes details on the NAICS codes covered, abbreviations and currencies codes used in this report.

Scope

Markets Covered:
1) By Type: Plating Equipment; Inspection And Dicing Equipment; Wire Bonding Equipment; Die-Bonding Equipment; And Other Types.
2) By Application: Companion Animals; Livestock.
3) By End User: OSATS (Outsourced Semiconductor Assembly And Test); IDMS (Integrated Device Manufacturers).

Companies Mentioned: Tokyo Electron Ltd; Applied Materials, Inc; Kulicke and Soffa Industries, Inc; ASML Holding N.V; BE Semiconductor Industries N.V.

Countries: China; Australia; India; Indonesia; Japan; South Korea; USA; Brazil; France; Germany; UK; Russia

Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa

Time-series: Five years historic and ten years forecast.

Data: Ratios of market size and growth to related markets; GDP proportions; expenditure per capita; semiconductor assembly and packaging equipment indicators comparison.

Data segmentations: country and regional historic and forecast data; market share of competitors; market segments.

Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.

This report describes and explains the semiconductor assembly and packaging equipment market and covers 2017-2022, termed the historic period, and 2022-2027 termed the forecast period, along with further forecasts for the period 2027-2032. The report evaluates the market across each region and for the major economies within each region.

The global semiconductor assembly and packaging equipment market reached a value of nearly $10,399.4 million in 2022, having grown at a compound annual growth rate (CAGR) of 8.7% since 2017. The market is expected to grow from $10,399.4 million in 2022 to $18,508.8 million in 2027 at a rate of 12.2%. The market is then expected to grow at a CAGR of 12.1% from 2027 and reach $32,709.2 million in 2032.

Growth in the historic period resulted from strong economic growth in emerging markets, an increasing demand for semiconductor equipment, an increasing demand for consumer electronics and a rise in disposable income. The market was restrained by the coronavirus pandemic and trade conflicts between major countries.

Going forward, government initiatives to propel the semiconductor industry, an increasing demand for electric vehicles, an increasing demand from the medical industry, rising urbanization and an increasing demand for portable electronic devices will drive market growth. Factors that could hinder the growth of the semiconductor assembly and packaging equipment market in the future include fluctuating price of raw materials, slow economic progress in some countries and restrictions on export of semiconductors equipment.

The semiconductor assembly and packaging equipment market is segmented by type into plating equipment, inspection and dicing equipment, wire bonding equipment, die-bonding equipment, and other types. The inspection and dicing equipment market was the largest segment of the semiconductor assembly and packaging equipment market segmented by type, accounting for 37.3% of the total in 2022. Going forward, the die-bonding equipment segment is expected to be the fastest growing segment in the semiconductor assembly and packaging equipment market segmented by type, at a CAGR of 12.8% during 2022-2027.

The semiconductor assembly and packaging equipment market is segmented by application into consumer electronics, healthcare devices, automotive, enterprise storage, and other applications. The consumer electronics market was the largest segment of the semiconductor assembly and packaging equipment market segmented by application, accounting for 48.1% of the total in 2022. Going forward, the other applications segment is expected to be the fastest growing segment in the semiconductor assembly and packaging equipment market segmented by application, at a CAGR of 13.3% during 2022-2027.

The semiconductor assembly and packaging equipment market is segmented by end-user into OSATs (outsourced semiconductor assembly and test) and IDMs (integrated device manufacturers). The OSATs market was the largest segment of the semiconductor assembly and packaging equipment market segmented by end-user, accounting for 75.6% of the total in 2022. Going forward, the OSATs segment is expected to be the fastest growing segment in the semiconductor assembly and packaging equipment market segmented by end-user, at a CAGR of 12.3% during 2022-2027.

Asia Pacific was the largest region in the semiconductor assembly and packaging equipment market, accounting for 55.4% of the total in 2022. It was followed by North America, Western Europe and then the other regions. Going forward, the fastest-growing regions in the semiconductor assembly and packaging equipment market will be Asia Pacific and North America, where growth will be at CAGRs of 13.6% and 11.8% respectively. These will be followed by Western Europe and South America, where the markets are expected to grow at CAGRs of 10.4% and 8.6% respectively.

The global semiconductor assembly and packaging equipment market is consolidated with small number of large players dominating the market. The top ten competitors in the market made up to 61.01% of the total market in 2021. Tokyo Electron Ltd was the largest competitor with 14.51% share of the market, followed by Applied Materials, Inc. with 12.46%, Kulicke and Soffa Industries, Inc. with 9.27%, ASML Holding N.V with 7.76%, BE Semiconductor Industries N.V with 5.03%, Tokyo Seimitsu with 3.31%, Amkor Technology with 3.05%, ASM Pacific Technology with 2.44%, Screen Holdings Co. Ltd with 1.70% and KLA-Tencor with 1.47%.

The top opportunities in the semiconductor assembly and packaging equipment market segmented by type will arise in the inspection and dicing equipment segment, which will gain $2,956.3 million of global annual sales by 2027. The top opportunities in the semiconductor assembly and packaging equipment market segmented by application will arise in the consumer electronics segment, which will gain $3,680.4 million of global annual sales by 2027. The top opportunities in the semiconductor assembly and packaging equipment market segmented by end-user will arise in the OSATs segment, which will gain $6,163.4 million of global annual sales by 2027. The semiconductor assembly and packaging equipment market size will gain the most in China at $1,910.5 million.

Market-trend-based strategies for the semiconductor assembly and packaging equipment include focus on the launch of new semiconductor inspection machines using big data and AI (artificial intelligence), focus on innovating new products such as the introduction of a new automatic flip-chip bonder, focus on introducing compound semiconductor equipment to strengthen the wet process product line, focus on increasing investment and focus on undergoing partnerships to develop new products.

Player-adopted strategies in the semiconductor assembly and packaging equipment market include strengthening business operations through the launch of new products, enhancing data-enabled equipment offerings through strategic partnerships and enhancing business operations through collaborations and partnerships.

To take advantage of the opportunities, The Business Research Company recommends the semiconductor assembly and packaging equipment companies to focus on introduction of big data and AI technology in semiconductor equipment, focus on compound semiconductor equipment, focus on product innovations, expand in emerging markets, continue to focus on developed markets, focus on strategic partnerships, provide competitively priced offerings, continue to use B2B promotions, participate in trade shows and events, continue to target fast-growing applications.

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サマリー

目次

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Table of Contents

ご注文は、お電話またはWEBから承ります。お見積もりの作成もお気軽にご相談ください。

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調査レポートの納品までの日数はどの程度ですか?

注文の手続きはどのようになっていますか?

お支払方法の方法はどのようになっていますか?

データリソース社はどのような会社ですか?

The Business Research Company　(TBRC)社の産業機器分野での最新刊レポート

The Business Research Company　(TBRC)社はどのような調査会社ですか?