Summary

The thin wafer market is projected to grow from USD 11.4 billion in 2022 and is projected to reach USD 20.6 billion by 2027; it is expected to grow at a CAGR of 12.5% from 2022 to 2027.
Reducing sizes of electronic devices, rising adoption of MEMS technology in portable health monitoring devices, growing smartphone and consumer electronics markets and high amount of material saving is expected to fuel the growth of the thin wafer market.
However, issues related to efficiency maintenance is limiting the growth of the thin wafer market.
“Market for 200 mm wafers to hold a significant share during the forecast period.”
200 mm wafers are expected to witness significant demand majorly on account of their wide adoption in power devices, ICs, LEDs, MEMS, and many other semiconductor and electronic devices. The 200 mm wafers are affordable and can be easily integrated into various devices. As a result, these wafers are adopted on a large-scale basis by small-scale and large-scale electronic manufacturers. Furthermore, for the manufacturing of devices that require small die sizes and have a global shipment size in the thousands, these wafers are increasingly being used. LED, RF device, and power transistors manufacturers use 200 mm silicon wafers.
In May 2022, Soitec (France) has released its first 200mm silicon carbide SmartSiC™ wafer. With the release, Soitec is able to enlarge its SiC product portfolio beyond 150mm, take the development of its SmartSiC™ wafers to the next level and cater to the growing demand of the automotive market.
“Wafer polishing equipment market is expected to grow at the highest CAGR during the forecast period”
The growth of the wafer polishing equipment market can be attributed to the increasing demand for thinner wafers to integrate microelectronics into various consumer electronic devices. The wafer polishing process creates thinner wafers compared to back-grinding alone and evens out any irregular topography and prevents warping that causes the wafers to weaken. Thus, there is an increased demand for wafer polishing equipment. Moreover, the increasing number of semiconductor fabrication plants in countries such as China and Taiwan, owing to growing investments in semiconductor manufacturing, is expected to contribute toward the growth of the wafer thinning equipment market.
“Asia Pacific to hold the largest share of the thin wafer market during the forecast period”
Asia Pacific is expected to hold the largest share of the thin wafer market during the forecast period. The Asia Pacific has witnessed large-scale adoption of smart electronic devices. This has led the consumer electronics manufacturers to launch higher-end devices in this region. The acceptance of the latest technology trends by majority of consumer electronics manufacturers have stimulated the demand for thinner wafers in Asia Pacific. In recent years, there has been a remarkable increase in the number of semiconductor fabrication plants and IC manufacturing firms in countries such as China and Taiwan, due to investments in semiconductor manufacturing this has paved way towards the growth of the thin wafer market in the Asia Pacific region.
In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted with key industry experts in the thin wafer space. The break-up of primary participants for the report has been shown below:
• By Company Type: Tier 1 –40%, Tier 2 – 40%, and Tier 3 – 20%
• By Designation: C-level Executives – 40%, Directors –40%, and Others – 20%
• By Region: Americas –33%, Asia Pacific– 45%, EMEA –22%
The report profiles key players in the thin wafer market with their respective market ranking analysis. Prominent players profiled in this report are include Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), DISCO Corporation (Japan), 3M (US), and Applied Materials (US Apart from these, Mechatronic Systemtechnik (Austria), Synova (Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US) are among a few emerging companies in the thin wafer market.
Research Coverage:
This research report categorizes global thin wafer market based on wafer size, process, technology, application and geography. The report describes the major drivers, restraints, challenges, and opportunities pertaining to the thin wafer market and forecasts the same till 2027 (including analysis of COVID-19 impact on the market). Apart from these, the report also consists of leadership mapping and analysis of all the companies included in the thin wafer ecosystem.
Key Benefits of Buying the Report
The report would help leaders/new entrants in this market in the following ways:
1. This report segments the thin wafer market comprehensively and provides the closest market size projection for all subsegments across different regions.
2. The report helps stakeholders understand the pulse of the market and provides them with information on key drivers, restraints, challenges, and opportunities for market growth.
3. This report would help stakeholders understand their competitors better and gain more insights to improve their position in the business. The competitive landscape section includes competitor ecosystem, product developments and launches, partnerships, and mergers and acquisitions.
4. The analysis of the top 28 companies, based on the market rank as well as the product footprint will help stakeholders visualize the market positioning of these key players.
5. Patent analysis, trade data, and technological trends that will shape the market in the coming years has also been covered in this report.

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Table of Contents

1 INTRODUCTION 25
1.1 STUDY OBJECTIVES 25
1.2 MARKET DEFINITION 25
1.3 STUDY SCOPE 26
1.3.1 MARKETS COVERED 26
1.3.2 INCLUSIONS AND EXCLUSIONS 26
1.3.3 REGIONAL SCOPE 27
1.3.4 YEARS CONSIDERED 27
1.4 CURRENCY 27
1.5 PACKAGE SIZE 28
1.6 STAKEHOLDERS 28
1.7 SUMMARY OF CHANGES 28
2 RESEARCH METHODOLOGY 29
2.1 RESEARCH DATA 29
FIGURE 1 THIN WAFER MARKET: RESEARCH DESIGN 30
2.1.1 SECONDARY DATA 30
2.1.1.1 Major secondary sources 31
2.1.1.2 Key data from secondary sources 31
2.1.2 PRIMARY DATA 31
2.1.2.1 Primary interviews with experts 32
2.1.2.2 Breakdown of primaries 32
2.1.3 SECONDARY AND PRIMARY RESEARCH 33
2.1.3.1 Key industry insights 33
2.2 MARKET SIZE ESTIMATION 34
FIGURE 2 MARKET SIZE ESTIMATION METHODOLOGY: REVENUE GENERATED BY KEY PLAYERS IN THIN WAFER MARKET 34
2.2.1 BOTTOM-UP APPROACH 35
2.2.1.1 Approach to capture market size by bottom-up analysis
(demand side) 35
FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 35
2.2.2 TOP-DOWN APPROACH 35
2.2.2.1 Approach to capture market size by top-down analysis (supply side) 36
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 36
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 37
FIGURE 5 DATA TRIANGULATION 37
2.4 RESEARCH ASSUMPTIONS 38
FIGURE 6 ASSUMPTIONS FOR RESEARCH STUDY 38
2.5 RISK ASSESSMENT 38
2.6 LIMITATIONS 39
3 EXECUTIVE SUMMARY 40
3.1 GROWTH RATE ASSUMPTIONS/GROWTH FORECAST 40
FIGURE 7 300 MM WAFER TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD 41
FIGURE 8 THIN WAFER MARKET, BY WAFER SIZE,
2022–2027 (MILLION SQUARE INCHES) 42
FIGURE 9 MEMORY APPLICATIONS TO DOMINATE THIN WAFER MARKET BY 2027 42
FIGURE 10 WAFER THINNING EQUIPMENT MARKET FOR LED APPLICATIONS TO GROW AT HIGHEST CAGR BETWEEN 2022 AND 2027 43
FIGURE 11 ASIA PACIFIC ACCOUNTED FOR LARGEST SHARE OF THIN WAFER MARKET IN 2021 44
4 PREMIUM INSIGHTS 45
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN THIN WAFER MARKET 45
FIGURE 12 THIN WAFERS EXPECTED TO WITNESS HIGH ADOPTION RATE DURING FORECAST PERIOD 45
4.2 WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY 45
FIGURE 13 DICING TECHNOLOGY TO HOLD LARGEST MARKET SHARE DURING FORECAST PERIOD 45
4.3 THIN WAFER MARKET, BY APPLICATION 46
FIGURE 14 MARKET FOR LED EXPECTED TO GROW AT HIGHEST CAGR BETWEEN 2022 AND 2027 46
4.4 WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY AND APPLICATION 46
FIGURE 15 MEMORY AND LOGIC TO BE MOST FAVORABLE APPLICATION AREAS FOR WAFER THINNING EQUIPMENT MARKET IN 2022 46
4.5 GEOGRAPHICAL ANALYSIS OF THIN WAFER MARKET 47
FIGURE 16 CHINA TO EXHIBIT HIGHEST CAGR IN THIN WAFER MARKET BETWEEN 2022 AND 2027 47
5 MARKET OVERVIEW 48
5.1 INTRODUCTION 48
5.2 MARKET DYNAMICS 48
FIGURE 17 THIN WAFER MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES 48
5.2.1 DRIVERS 49
5.2.1.1 Rising adoption of MEMS technology in portable health monitoring devices 49
5.2.1.2 Reducing size of electronic devices 49
5.2.1.3 Growing smartphone and consumer electronics markets 49
5.2.1.4 High amount of material saving 49
FIGURE 18 DRIVERS: IMPACT ANALYSIS 50
5.2.2 RESTRAINTS 50
5.2.2.1 Efficiency maintenance—major issue for thin wafers 50
FIGURE 19 RESTRAINTS: IMPACT ANALYSIS 50
5.2.3 OPPORTUNITIES 51
5.2.3.1 Expanding IC industry in China 51
5.2.3.2 Growing adoption of IoT and AI in automotive sector 51
FIGURE 20 GLOBAL IOT CONNECTIONS FORECAST BY 2025 (BILLION) 52
5.2.3.3 Rising adoption of portable devices 52
FIGURE 21 OPPORTUNITIES: IMPACT ANALYSIS 52
5.2.4 CHALLENGES 53
5.2.4.1 Volatility and susceptibility to damage caused by pressure or stress 53
FIGURE 22 CHALLENGES: IMPACT ANALYSIS 53
5.3 VALUE CHAIN ANALYSIS 53
FIGURE 23 VALUE CHAIN ANALYSIS: INTEGRATED DEVICE MANUFACTURERS ADD MAJOR VALUE 53
5.4 ECOSYSTEM/MARKET MAP 55
TABLE 1 PLAYERS AND THEIR ROLE IN ECOSYSTEM 56
5.5 TECHNOLOGY ANALYSIS 57
5.5.1 SILICON CARBIDE (SIC) TECHNOLOGY 57
TABLE 2 COMPARISON OF BENEFITS OF SIC TECHNOLOGY WITH OTHER TECHNOLOGIES 57
5.6 CASE STUDY ANALYSIS 58
5.6.1 STMICROELECTRONICS SELECTS CREE’S SILICON CARBIDE BARE AND EPITAXIAL WAFERS 58
5.6.2 INFINEON TECHNOLOGIES AND UMC ANNOUNCE MANUFACTURING AGREEMENT 58
5.6.3 GLOBALWAFERS CO., LTD. AND GLOBALFOUNDRIES ANNOUNCE PARTNERSHIP TO EXPAND SEMICONDUCTOR WAFER SUPPLY 59
5.6.4 VTT USES OKMETIC’S E-SOI® WAFERS FOR ITS PHOTONICS TECHNOLOGY 59
5.6.5 SILTERRA MALAYSIA’S NEW MANUFACTURING TECHNOLOGY FOR MEMS AND PHOTONICS DEVICES USES OKMETIC’S C-SOI WAFERS 60
5.7 REGULATORY LANDSCAPE 60
5.8 PRICING ANALYSIS 61
TABLE 3 SELLING PRICE OF THIN WAFER 61
6 THIN WAFER MARKET, BY PROCESS 62
6.1 INTRODUCTION 63
FIGURE 24 TEMPORARY BONDER AND DEBONDER MARKET SIZE 63
6.2 TEMPORARY BONDING & DEBONDING 63
6.2.1 MARKET ADHESIVES 63
6.2.1.1 UV-release adhesives 64
6.2.1.2 Thermal-release adhesives 64
6.2.1.3 Solvent-release adhesives 64
6.3 CARRIER-LESS APPROACH (TAIKO PROCESS) 64
 
7 THIN WAFER MARKET, BY WAFER SIZE 65
7.1 INTRODUCTION 66
FIGURE 25 300 MM WAFER SEGMENT TO DOMINATE MARKET BETWEEN 2022 AND 2027 66
TABLE 4 THIN WAFER MARKET, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES) 66
TABLE 5 THIN WAFER MARKET, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES) 67
TABLE 6 THIN WAFER MARKET, BY WAFER SIZE, 2018–2021 (USD MILLION) 67
TABLE 7 THIN WAFER MARKET, BY WAFER SIZE, 2022–2027 (USD MILLION) 67
7.2 125 MM 68
7.2.1 ADOPTION OF LARGER DIAMETER WAFERS BY SEMICONDUCTOR MANUFACTURERS TO IMPACT SEGMENT 68
TABLE 8 125 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (MILLION SQUARE INCHES) 68
TABLE 9 125 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (MILLION SQUARE INCHES) 68
TABLE 10 125 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (USD MILLION) 69
TABLE 11 125 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (USD MILLION) 69
7.3 200 MM 69
7.3.1 DEMAND FOR 200 MM WAFERS TO WITNESS STEADY GROWTH DURING FORECAST PERIOD 69
TABLE 12 200 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (MILLION SQUARE INCHES) 70
TABLE 13 200 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (MILLION SQUARE INCHES) 70
TABLE 14 200 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (USD MILLION) 71
TABLE 15 200 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (USD MILLION) 71
7.4 300 MM 72
7.4.1 300 MM WAFER SEGMENT EXPECTED TO WITNESS FASTEST GROWTH DURING FORECAST PERIOD 72
TABLE 16 300 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (MILLION SQUARE INCHES) 72
TABLE 17 300 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (MILLION SQUARE INCHES) 73
TABLE 18 300 MM: THIN WAFER MARKET, BY APPLICATION, 2018–2021 (USD MILLION) 73
TABLE 19 300 MM: THIN WAFER MARKET, BY APPLICATION, 2022–2027 (USD MILLION) 74
 
8 THIN WAFER MARKET, BY APPLICATION 75
8.1 INTRODUCTION 76
FIGURE 26 THIN WAFER SHIPMENTS FOR LED APPLICATIONS TO GROW AT HIGHEST RATE BETWEEN 2022 AND 2027 76
TABLE 20 THIN WAFER MARKET, BY APPLICATION, 2018–2021 (MILLION SQUARE INCHES) 76
TABLE 21 THIN WAFER MARKET, BY APPLICATION, 2022–2027 (MILLION SQUARE INCHES) 77
FIGURE 27 MEMORY TO BE LARGEST APPLICATION IN THIN WAFERS MARKET IN 2022 77
TABLE 22 THIN WAFER MARKET, BY APPLICATION, 2018–2021 (USD MILLION) 78
TABLE 23 THIN WAFER MARKET, BY APPLICATION, 2022–2027 (USD MILLION) 78
TABLE 24 WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION) 79
TABLE 25 WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION) 79
8.2 MEMS 80
8.2.1 GROWTH ATTRIBUTED TO HIGH ADOPTION IN PORTABLE ELECTRONIC DEVICES 80
TABLE 26 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES) 80
TABLE 27 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES) 80
TABLE 28 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2018–2021 (USD MILLION) 81
TABLE 29 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2022–2027 (USD MILLION) 81
TABLE 30 WAFER THINNING EQUIPMENT MARKET FOR MEMS APPLICATIONS, BY REGION, 2018–2021 (USD MILLION) 81
TABLE 31 WAFER THINNING EQUIPMENT MARKET FOR MEMS APPLICATIONS, BY REGION, 2022–2027 (USD MILLION) 82
8.3 CIS 82
8.3.1 INCREASING DEMAND FOR CIS FROM AUTOMOTIVE VERTICAL EXPECTED TO DRIVE DEMAND 82
TABLE 32 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES) 82
TABLE 33 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES) 83
TABLE 34 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2018–2021 (USD MILLION) 83
TABLE 35 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2022–2027 (USD MILLION) 83
TABLE 36 WAFER THINNING EQUIPMENT MARKET FOR CIS APPLICATIONS, BY REGION, 2018–2021 (USD MILLION) 84
TABLE 37 WAFER THINNING EQUIPMENT MARKET FOR CIS APPLICATIONS, BY REGION, 2022–2027 (USD MILLION) 84
8.4 MEMORY 84
8.4.1 GROWING ADOPTION OF NAND FLASH MEMORY IN MOBILE ELECTRONICS TO DRIVE DEMAND 84
TABLE 38 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES) 85
TABLE 39 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES) 85
TABLE 40 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2018–2021 (USD MILLION) 85
TABLE 41 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2022–2027 (USD MILLION) 86
TABLE 42 WAFER THINNING EQUIPMENT MARKET FOR MEMORY APPLICATIONS, BY REGION, 2018–2021 (USD MILLION) 86
TABLE 43 WAFER THINNING EQUIPMENT MARKET FOR MEMORY APPLICATIONS, BY REGION, 2022–2027 (USD MILLION) 86
8.5 RF DEVICES 87
8.5.1 GROWING ADOPTION OF RF DEVICES IN SMARTPHONES TO PROPEL MARKET GROWTH 87
TABLE 44 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES) 87
TABLE 45 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES) 87
TABLE 46 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2018–2021 (USD MILLION) 88
TABLE 47 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2022–2027 (USD MILLION) 88
TABLE 48 WAFER THINNING EQUIPMENT MARKET FOR RF DEVICES, BY REGION, 2018–2021 (USD MILLION) 88
TABLE 49 WAFER THINNING EQUIPMENT MARKET FOR RF DEVICES, BY REGION, 2022–2027 (USD MILLION) 88
8.6 LED 89
8.6.1 INCREASING DEMAND FOR LED COMPONENTS IN HOMES AND INFRASTRUCTURE TO DRIVE SEGMENT 89
TABLE 50 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES) 89
TABLE 51 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES) 90
TABLE 52 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2018–2021 (USD MILLION) 90
TABLE 53 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2022–2027 (USD MILLION) 90
TABLE 54 WAFER THINNING EQUIPMENT MARKET FOR LED DEVICES, BY REGION, 2018–2021 (USD MILLION) 91
TABLE 55 WAFER THINNING EQUIPMENT MARKET FOR LED DEVICES, BY REGION, 2022–2027 (USD MILLION) 91
8.7 INTERPOSERS 91
8.7.1 NEED FOR ADVANCED ARCHITECTURE IN MINIATURE ELECTRONIC DEVICES TO DRIVE DEMAND 91
TABLE 56 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES) 92
TABLE 57 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES) 92
TABLE 58 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2018–2021 (USD MILLION) 92
TABLE 59 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2022–2027 (USD MILLION) 93
TABLE 60 WAFER THINNING EQUIPMENT MARKET FOR INTERPOSERS, BY REGION, 2018–2021 (USD MILLION) 93
TABLE 61 WAFER THINNING EQUIPMENT MARKET FOR INTERPOSERS, BY REGION, 2022–2027 (USD MILLION) 93
8.8 LOGIC 94
8.8.1 HIGH PENETRATION OF AFFORDABLE CLOUD COMPUTING SOLUTIONS TO DRIVE DEMAND 94
TABLE 62 THIN WAFER MARKET FOR LOGIC DEVICES, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES) 94
TABLE 63 THIN WAFER MARKET FOR LOGIC DEVICES, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES) 94
TABLE 64 THIN WAFER MARKET FOR LOGIC DEVICES, BY WAFER SIZE, 2018–2021 (USD MILLION) 95
TABLE 65 THIN WAFER MARKET FOR LOGIC DEVICES, BY WAFER SIZE, 2022–2027 (USD MILLION) 95
TABLE 66 WAFER THINNING EQUIPMENT MARKET LOGIC APPLICATIONS, BY REGION, 2018–2021 (USD MILLION) 95
TABLE 67 WAFER THINNING EQUIPMENT MARKET FOR LOGIC APPLICATIONS, BY REGION, 2022–2027 (USD MILLION) 96
8.9 OTHERS 96
TABLE 68 THIN WAFER MARKET FOR OTHER APPLICATIONS, BY WAFER SIZE, 2018–2021 (MILLION SQUARE INCHES) 97
TABLE 69 THIN WAFER MARKET FOR OTHER APPLICATIONS, BY WAFER SIZE, 2022–2027 (MILLION SQUARE INCHES) 97
TABLE 70 THIN WAFER MARKET FOR OTHER APPLICATIONS, BY WAFER SIZE, 2018–2021 (USD MILLION) 97
TABLE 71 THIN WAFER MARKET FOR OTHER APPLICATIONS, BY WAFER SIZE, 2022–2027 (USD MILLION) 98
TABLE 72 WAFER THINNING EQUIPMENT MARKET FOR OTHER APPLICATIONS, BY REGION, 2018–2021 (USD MILLION) 98
TABLE 73 WAFER THINNING EQUIPMENT MARKET FOR OTHER APPLICATIONS, BY REGION, 2022–2027 (USD MILLION) 98
9 THIN WAFER MARKET, BY TECHNOLOGY 99
9.1 INTRODUCTION 100
FIGURE 28 WAFER POLISHING EQUIPMENT MARKET TO GROW AT HIGHEST CAGR BETWEEN 2022 AND 2027 100
TABLE 74 WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY, 2018–2021 (USD MILLION) 100
TABLE 75 WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY, 2022–2027 (USD MILLION) 100
9.2 WAFER GRINDING 101
9.2.1 ATTRACTIVE FOR USE IN MINIATURIZATION OF SEMICONDUCTOR DEVICES 101
TABLE 76 WAFER GRINDING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION) 102
TABLE 77 WAFER GRINDING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION) 102
TABLE 78 WAFER GRINDING EQUIPMENT MARKET, BY REGION, 2018–2021 (USD MILLION) 102
TABLE 79 WAFER GRINDING EQUIPMENT MARKET, BY REGION, 2022–2027 (USD MILLION) 103
9.3 WAFER POLISHING 103
9.3.1 DEMAND FOR THIN WAFERS WITH SMOOTH SURFACE FOR SEAMLESS INTEGRATION TO DRIVE SEGMENT 103
TABLE 80 WAFER POLISHING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION) 104
TABLE 81 WAFER POLISHING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION) 104
TABLE 82 WAFER POLISHING EQUIPMENT MARKET, BY REGION, 2018–2021 (USD MILLION) 104
TABLE 83 WAFER POLISHING EQUIPMENT MARKET, BY REGION, 2022–2027 (USD MILLION) 105
9.4 WAFER DICING 105
9.4.1 WAFER DICING EQUIPMENT TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD 105
TABLE 84 WAFER DICING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION) 106
TABLE 85 WAFER DICING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION) 106
TABLE 86 WAFER DICING EQUIPMENT MARKET, BY REGION, 2018–2021 (USD MILLION) 107
TABLE 87 WAFER DICING EQUIPMENT MARKET, BY REGION, 2022–2027 (USD MILLION) 107
10 THIN WAFER MARKET, BY GEOGRAPHY 108
10.1 INTRODUCTION 109
FIGURE 29 THIN WAFER MARKET: GEOGRAPHIC SNAPSHOT, 2022–2027 109
TABLE 88 THIN WAFER MARKET, BY REGION, 2018–2021 (USD MILLION) 109
TABLE 89 THIN WAFER MARKET, BY REGION, 2022–2027 (USD MILLION) 110
TABLE 90 WAFER THINNING EQUIPMENT MARKET, BY REGION, 2018–2021 (USD MILLION) 110
TABLE 91 WAFER THINNING EQUIPMENT MARKET, BY REGION, 2022–2027 (USD MILLION) 110
10.2 AMERICAS 111
FIGURE 30 AMERICAS: GEOGRAPHIC SNAPSHOT 111
TABLE 92 AMERICAS: THIN WAFER MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 112
TABLE 93 AMERICAS: THIN WAFER MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 112
TABLE 94 AMERICAS: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION) 112
TABLE 95 AMERICAS: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION) 113
10.2.1 US 113
10.2.1.1 US to lead thin wafer market in Americas during forecast period 113
10.2.2 CANADA 114
10.2.2.1 Government support to promote use of electric vehicles to drive market 114
10.2.3 REST OF AMERICAS 114
10.2.3.1 Growing demand for semiconductor devices from consumer electronics and automotive industries to fuel market growth 114
10.3 EMEA 115
FIGURE 31 EMEA: GEOGRAPHIC SNAPSHOT 115
TABLE 96 EMEA: THIN WAFER MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 116
TABLE 97 EMEA: THIN WAFER MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 116
TABLE 98 EMEA: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION) 116
TABLE 99 EMEA: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION) 117
10.3.1 UK 117
10.3.1.1 Increase in demand for portable medical devices to drive market 117
10.3.2 GERMANY 117
10.3.2.1 Growing adoption of MEMS sensors in automotive industry to drive market 117
10.3.3 FRANCE 118
10.3.3.1 Increased EV manufacturing to bolster market growth in France 118
10.3.4 REST OF EMEA 118
10.3.4.1 Dearth of thin wafer manufacturers ― opportunity for new investments in Rest of EMEA 118
10.4 ASIA PACIFIC 119
FIGURE 32 ASIA PACIFIC: GEOGRAPHIC SNAPSHOT 119
TABLE 100 ASIA PACIFIC: THIN WAFER MARKET, BY COUNTRY, 2018–2021 (USD MILLION) 120
TABLE 101 ASIA PACIFIC: THIN WAFER MARKET, BY COUNTRY, 2022–2027 (USD MILLION) 120
TABLE 102 ASIA PACIFIC: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2018–2021 (USD MILLION) 120
TABLE 103 ASIA PACIFIC: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2022–2027 (USD MILLION) 121
10.4.1 TAIWAN 121
10.4.1.1 Presence of several fabrication facilities and IC manufacturing firms to drive market 121
10.4.2 CHINA 122
10.4.2.1 China’s focus on achieving 70% IC self-sufficiency by 2025 to drive market 122
10.4.3 JAPAN 123
10.4.3.1 Presence of major market players and end-use industries to drive market 123
10.4.4 SOUTH KOREA 123
10.4.4.1 South Korea expected to account for largest share of Asia Pacific market during forecast period 123
10.4.5 REST OF ASIA PACIFIC 124
10.4.5.1 Growing demand for connected devices to drive market in Rest of Asia Pacific 124
11 COMPETITIVE LANDSCAPE 125
11.1 COMPETITIVE LANDSCAPE 125
TABLE 104 THIN WAFER MARKET: KEY GROWTH STRATEGIES ADOPTED BY COMPANIES FROM 2019 TO 2022 125
11.2 REVENUE ANALYSIS OF TOP FIVE COMPANIES 126
FIGURE 33 THREE-YEAR REVENUE ANALYSIS OF TOP FIVE PLAYERS IN THIN WAFER MARKET 126
11.3 MARKET SHARE ANALYSIS (2021) 127
TABLE 105 THIN WAFER MARKET: DEGREE OF COMPETITION 127
11.4 COMPANY EVALUATION MATRIX 128
11.4.1 STARS 128
11.4.2 EMERGING LEADERS 128
11.4.3 PERVASIVE PLAYERS 129
11.4.4 PARTICIPANTS 129
FIGURE 34 THIN WAFER MARKET, COMPANY EVALUATION MATRIX, 2021 129
11.5 START-UP/SME EVALUATION MATRIX 130
11.5.1 PROGRESSIVE COMPANIES 131
11.5.2 RESPONSIVE COMPANIES 131
11.5.3 DYNAMIC COMPANIES 131
11.5.4 STARTING BLOCKS 131
FIGURE 35 THIN WAFER MARKET, START-UP/SME EVALUATION QUADRANT, 2021 132
11.6 THIN WAFER MARKET: COMPANY FOOTPRINT 133
TABLE 106 COMPANY FOOTPRINT 133
TABLE 107 COMPANY WAFER SIZE FOOTPRINT 134
TABLE 108 COMPANY APPLICATION FOOTPRINT 135
TABLE 109 COMPANY REGIONAL FOOTPRINT 136
11.7 COMPETITIVE SITUATIONS AND TRENDS 137
11.7.1 PRODUCT LAUNCHES 137
TABLE 110 PRODUCT LAUNCHES, 2019–2022 137
11.7.2 DEALS 137
TABLE 111 DEALS, 2019–2022 137
11.7.3 OTHERS 139
TABLE 112 EXPANSION, 2019–2022 139
 
12 COMPANY PROFILES 141
(Business Overview, Products Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats))*
12.1 INTRODUCTION 141
12.2 KEY PLAYERS 141
12.2.1 SK SILTRON 141
TABLE 113 SK SILTRON: BUSINESS OVERVIEW 141
FIGURE 36 SK SILTRON: COMPANY SNAPSHOT 142
12.2.2 SHIN-ETSU CHEMICAL CO., LTD. 144
TABLE 114 SHIN-ETSU CHEMICAL CO., LTD.: BUSINESS OVERVIEW 144
FIGURE 37 SHIN-ETSU CHEMICAL CO., LTD.: COMPANY SNAPSHOT 145
12.2.3 SILTRONIC 148
TABLE 115 SILTRONIC: BUSINESS OVERVIEW 148
FIGURE 38 SILTRONIC: COMPANY SNAPSHOT 149
12.2.4 SUMCO CORPORATION 152
TABLE 116 SUMCO CORPORATION: BUSINESS OVERVIEW 152
FIGURE 39 SUMCO CORPORATION: COMPANY SNAPSHOT 152
12.2.5 GLOBALWAFERS CO., LTD. 155
TABLE 117 GLOBALWAFERS CO., LTD.: BUSINESS OVERVIEW 155
FIGURE 40 GLOBALWAFERS CO., LTD.: COMPANY SNAPSHOT 156
12.2.6 SOITEC 160
TABLE 118 SOITEC: BUSINESS OVERVIEW 160
FIGURE 41 SOITEC: COMPANY SNAPSHOT 161
12.2.7 SUSS MICROTEC 164
TABLE 119 SUSS MICROTEC: BUSINESS OVERVIEW 164
FIGURE 42 SUSS MICROTEC: COMPANY SNAPSHOT 165
12.2.8 DISCO CORPORATION 169
TABLE 120 DISCO CORPORATION: BUSINESS OVERVIEW 169
FIGURE 43 DISCO CORPORATION: COMPANY SNAPSHOT 169
12.2.9 OKMETIC 172
TABLE 121 OKMETIC: BUSINESS OVERVIEW 172
12.2.10 3M 174
TABLE 122 3M: BUSINESS OVERVIEW 174
FIGURE 44 3M: COMPANY SNAPSHOT 174
12.2.11 APPLIED MATERIALS 176
TABLE 123 APPLIED MATERIALS: BUSINESS OVERVIEW 176
FIGURE 45 APPLIED MATERIALS: COMPANY SNAPSHOT 177
12.3 OTHER COMPANIES 179
12.3.1 MECHATRONIC SYSTEMTECHNIK 179
12.3.2 SYNOVA 180
12.3.3 EV GROUP 181
12.3.4 BREWER SCIENCE 182
12.3.5 WAFER WORKS CORPORATION 183
12.3.6 ATECOM TECHNOLOGY CO., LTD. 184
12.3.7 SIL’TRONIX SILICON TECHNOLOGIES 185
12.3.8 LDK SOLAR 185
12.3.9 PV CRYSTALOX SOLAR PLC 186
12.3.10 UNIVERSITYWAFER, INC 186
12.3.11 SHANGHAI SIMGUI TECHNOLOGY CO., LTD 187
12.3.12 VIRGINIA SEMICONDUCTOR INC 188
12.3.13 SILICON VALLEY MICROELECTRONICS 189
12.3.14 WAFER WORLD INC. 190
*Details on Business Overview, Products Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats) might not be captured in case of unlisted companies.
13 APPENDIX 191
13.1 DISCUSSION GUIDE 191
13.2 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 194
13.3 CUSTOMIZATION OPTIONS 196
13.4 RELATED REPORTS 196
13.5 AUTHOR DETAILS 197