Summary

The silicon photonics market represents a transformative force in semiconductor and optical communications technology, merging optical data transmission capabilities with traditional silicon semiconductor manufacturing. This integration enables unprecedented performance in data transmission speed, power efficiency, and computational capabilities while maintaining cost-effectiveness through established manufacturing processes. The current market is experiencing robust growth driven by several key factors. Data center expansion and cloud computing continue to demand higher bandwidth solutions, while 5G network deployments push the boundaries of telecommunications infrastructure. The rising global demand for high-speed internet, coupled with the exponential growth in artificial intelligence and machine learning applications, creates an increasingly compelling case for silicon photonics adoption.

The technology has found its strongest foothold in data centers and high-performance computing environments, where it serves as the backbone for high-speed interconnects between servers. These applications benefit from silicon photonics' ability to transmit data at higher speeds while significantly reducing power consumption compared to traditional electronic solutions. The telecommunications sector represents another major market segment, with applications ranging from 5G infrastructure to long-haul communications and metro networks.

Healthcare and biosensing applications are emerging as promising growth areas, with silicon photonics enabling advances in medical diagnostics, biological sensors, point-of-care testing devices, and DNA sequencing applications. This diversification of applications demonstrates the technology's versatility and potential for market expansion. Emerging applications are set to drive future growth, with quantum computing, LiDAR systems for autonomous vehicles, and artificial intelligence accelerators leading the way. The edge computing infrastructure's expansion also creates new opportunities for silicon photonics implementation. However, the industry faces several key challenges. Future market evolution will likely be shaped by several key trends, including increased integration density and miniaturization of components, enhanced functionality per chip, and improved power efficiency. New applications in neuromorphic computing, quantum photonics, and advanced sensing systems continue to emerge, while biomedical devices represent a promising growth sector.

Manufacturing evolution remains crucial to market growth, with advances in automated testing and characterization, improved yield management, and cost reduction through scale. The industry's ability to overcome current technical and commercial challenges while capitalizing on emerging opportunities will determine the ultimate realization of silicon photonics' market potential. As the technology continues to mature and find new applications, its role in shaping the future of computing and communications becomes increasingly central to global technological advancement.

The Global Silicon Photonics Market 2025-2035 provides an in-depth analysis of the rapidly evolving industry, covering market trends, technological developments, and growth opportunities from 2025 to 2035. The report examines the convergence of optical and electronic technologies, highlighting how silicon photonics is revolutionizing data centers, telecommunications, sensing applications, and emerging quantum computing solutions.

Report contents include:

• Detailed market forecasts spanning 2025-2035
• Comprehensive analysis of key application segments
• In-depth evaluation of materials and components
• Assessment of advanced packaging technologies
• Complete supply chain analysis
• Extensive company profiles of 180+ market players. Companies profiled include Accelink Technologies, Aeva Technologies, Aeponyx, Advanced Fiber Resources, AIM Photonics, AIO Core, Alibaba Cloud, Amazon (AWS), ANSYS, Advanced Micro Foundry, Amkor Technology, AMO GmbH, Analog Photonics, Anello Photonics, Aryballe, A*STAR, ASE Holdings, Aurora Innovation, Axalume, AXT, Ayar Labs, Baidu, Bay Photonics, BE Epitaxy Semiconductor, Broadcom, Black Semiconductor, Broadex, ByteDance, Cadence, CEA LETI, Celestial AI, Centera Photonics, Cambridge Industries Group, Ciena, CISCO Systems, CNIT, Coherent Corp., CompoundTek, Cornerstone, Crealights Technology, DustPhotonics, EFFECT Photonics, Eoptolink, Ephos, Epiphany, Fabrinet, Fast Photonics, Fiberhome, Fibertop, ficonTEC, FormFactor, Fujitsu, Genalyte, Gigalight, GlobalFoundries, HGGenuine, Hisense Broadband, HyperLight, HyperPhotonix, Icon Photonics, InnoLight Technology, Innosemi, IntelliEpi, Inphotec, Intel, Imec, IMECAS, iPronics, JABIL, JCET Group, JFS Laboratory, JSR Corporation, Juniper Networks, Ki3 Photonics, LandMark, Leoni AG, Ligentec, Lightelligence, Lightium, Lightmatter, Lightsynq Technologies, Lightwave Logic, Light Trace Photonics, Liobate Technologies, LioniX International, LPKF, Lumentum, Luceda, Luminous Computing, LuminWave Technology, Lumiphase AG, Luxshare Precision Industry, Luxtelligence SA, MACOM, Marvell, Molex, NanoLN, NEC Corporation, NewPhotonics, NGK Insulators, NLM Photonics, Nokia Corporation, Novel Si Integration Technology, NTT Corporation, Nvidia, O-Net, OpenLight Photonics, OriChip Optoelectronics Technology, Partow Technologies, PETRA, Phix, Photonic Inc., POET Technologies, Pointcloud, Polariton Technologies, PsiQuantum, Q.ANT, QC82, Quandela, Quantum Computing Inc., Quantum Source, Quantum Transistors, Quintessent, QuiX Quantum, Qutronix, Rain Tree Photonics, Ranovus, Rapid Photonics, Salience Labs, Samsung, Sanan IC and more....
• Market Segments analysed include:
  • Datacom and High-Performance Computing
  • Telecommunications Infrastructure
  • Sensing and LiDAR Systems
  • AI and Machine Learning
  • Quantum Computing
  • Neuromorphic Computing
  • Biophotonics and Medical Diagnostics
• Critical technology components:
  • Core Components (lasers, modulators, photodetectors)
  • Integration Technologies
  • Advanced Packaging Solutions
  • Materials (Silicon, Germanium, Silicon Nitride, Lithium Niobate)
  • Wafer Processing and Manufacturing
  • Co-Packaged Optics
  • 2.5D and 3D Integration
• Market Drivers and Opportunities
• Comprehensive coverage of the silicon photonics ecosystem including:
  • Foundries and Wafer Suppliers
  • Integrated Device Manufacturers
  • Fabless Companies
  • Packaging and Testing Providers
  • System Integrators
  • End-Users
• Emerging Technologies:
  • Novel Integration Techniques
  • Advanced Modulator Technologies
  • Next-Generation Photodetectors
  • Innovative Waveguide Designs
  • Breakthrough Packaging Solutions
• Manufacturing and Integration
  • CMOS-Compatible Manufacturing
  • Wafer-Scale Integration
  • Hybrid and Heterogeneous Integration
  • Yield Management
  • Cost Optimization Strategies
• Challenges and Solutions:
  • Thermal Management
  • Packaging Complexity
  • Integration Challenges
  • Cost Reduction Strategies
  • Scaling and Miniaturization
  • Testing and Characterization
• Detailed profiles of 180+ companies including:
  • Major Semiconductor Manufacturers
  • Specialized Photonics Companies
  • Research Institutions
  • Start-ups and Innovators
  • System Integrators
  • Technology Providers

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Table of Contents

1 EXECUTIVE SUMMARY 20

1.1 Market Overview 20
1.2 Electronic and Photonic Integration Compared 21
1.3 Silicon Photonic Transceiver Evolution 21
1.4 Market Map 22
1.5 Global Market Trends in Silicon Photonics 25
1.6 Competing and Complementary Photonics Technologies 26
1.6.1 Metaphotonics 29
1.6.2 III-V Photonics 29
1.6.3 Lithium Niobate Photonics 29
1.6.4 Polymer Photonics 30
1.6.5 Plasmonic Photonics 30
1.7 Potential of photonic AI acceleration 30
1.8 Commercial deployment of silicon photonics 31
1.9 Manufacturing challenges 32

2 INTRODUCTION TO SILICON PHOTONICS 34

2.1 What is Silicon Photonics? 35
2.1.1 Definition and Principles of Silicon Photonics 35
2.1.2 Comparison with traditional technologies 35
2.1.3 Silicon and Photonic Integrated Circuits 36
2.1.4 Optical IO, Coupling and Couplers 37
2.1.5 Emission and Photon Sources/Lasers 38
2.1.6 Detection and Photodetectors 38
2.1.7 Compound Semiconductor Lasers and Photodetectors (III-V) 38
2.1.8 Modulation, Modulators, and Mach-Zehnder Interferometers 39
2.1.9 Light Propagation and Waveguides 40
2.1.10 Optical Component Density 41
2.2 Advantages of Silicon Photonics 42
2.3 Applications of Silicon Photonics 43
2.4 Comparison with Other Photonic Integration Technologies 43
2.5 Evolution from Electronic to Photonic Integration 44
2.6 Silicon Photonics vs Traditional Electronics 45
2.7 Modern high-performance AI data centers 45
2.8 Core Technology Components 48
2.8.1 Optical IO, Coupling and Couplers 48
2.8.2 Emission and Photon Sources/Lasers 49
2.8.2.1 III-V Integration Challenges 50
2.8.2.2 Laser Integration Approaches 50
2.8.3 Detection and Photodetectors 50
2.8.4 Modulation Technologies 51
2.8.4.1 Mach-Zehnder Interferometers 51
2.8.4.2 Ring Modulators 52
2.8.5 Light Propagation and Waveguides 52
2.8.6 Optical Component Density 53
2.9 Basic Optical Data Transmission 53
2.10 Silicon Photonic Circuit Architecture 54

3 MATERIALS AND COMPONENTS 56

3.1 Silicon 56
3.1.1 Silicon as a Photonic Material 56
3.1.1.1 Optical Properties of Silicon 56
3.1.1.2 Fabrication Processes for Silicon Photonics 56
3.1.2 Silicon and Silicon-on-insulator (SOI) 57
3.1.2.1 SOI Manufacturing Process 58
3.1.2.2 SOI Performance Benchmarks 61
3.1.2.3 Key SOI Players 61
3.2 Germanium 62
3.2.1 Germanium Integration in Silicon Photonics 62
3.2.2 Germanium Photodetectors 62
3.2.3 Germanium-on-Silicon Modulators 63
3.3 Silicon Nitride 63
3.3.1 Silicon Nitride (SiN) in Photonics Integrated Circuits 63
3.3.2 Optical Properties and Fabrication of SiN 65
3.3.3 SiN Modulator Technologies 66
3.3.4 SiN Applications in Photonics Integrated Circuits 66
3.3.5 Advances in SiN Modulator Technologies 67
3.3.6 SiN-based Waveguides and Devices 67
3.3.7 SiN Performance Analysis 68
3.3.8 Applications of SiN in Photonics 69
3.3.9 SiN PIC Players 69
3.4 Thin Film Lithium Niobate 70
3.4.1 Lithium Niobate on Insulator (LNOI) 71
3.4.1.1 Overview of LNOI Technology 71
3.4.1.2 Characteristics and Properties of LNOI 72
3.4.1.3 LNOI Fabrication Processes 72
3.4.1.4 LNOI-based Modulator and Switch Technologies 72
3.4.1.5 Trends Toward Higher Speed and Improved Power Efficiency 73
3.4.1.6 High-Speed LNOI Modulators 73
3.4.1.6.1 Energy-Efficient LNOI Devices 74
3.4.1.6.2 Emerging LNOI Device Technologies 74
3.5 Indium Phosphide 74
3.5.1 Indium Phosphide (InP) Integration 74
3.5.1.1 InP as a Direct Bandgap Semiconductor 75
3.5.1.2 InP-based Active Components 75
3.5.1.3 Hybrid Integration of InP with Silicon Photonics 76
3.5.2 InP PIC Players 76
3.6 Barium Titanite and Rare Earth metals 76
3.6.1 Barium Titanate (BTO) Modulators 77
3.7 Organic Polymer on Silicon 78
3.7.1 Polymer-based Modulators 79
3.8 Wafer Processing 79
3.8.1 Wafer Sizes by Platform 79
3.8.2 Processing Challenges 80
3.8.3 Yield Management 80
3.9 Hybrid and Heterogeneous Integration 81
3.9.1 Monolithic Integration 81
3.9.2 Hybrid Integration 81
3.9.3 Heterogeneous Integration 82
3.9.4 III-V-on-Silicon 82
3.9.5 Bonding and Die-Attachment Techniques 82
3.9.6 Monolithic versus Hybrid Integration 83

4 ADVANCED PACKAGING TECHNOLOGIES 84

4.1 Evolution of Packaging Technologies 84
4.1.1 Traditional Packaging Approaches 87
4.1.2 Advanced Packaging Roadmap 87
4.1.3 Key Performance Metrics 89
4.2 2.5D Integration Technologies 90
4.2.1 Silicon Interposer Technology 91
4.2.2 Glass Interposer Solutions 92
4.2.3 Organic Substrate Options 92
4.3 3D Integration Approaches 93
4.3.1 Through-Silicon Via (TSV) 93
4.3.1.1 TSV Manufacturing Process 94
4.3.1.2 TSV Challenges and Solutions 95
4.3.2 Hybrid Bonding Technologies 96
4.3.2.1 Cu-Cu Bonding 98
4.3.2.2 Direct Bonding 98
4.4 Co-Packaged Optics (CPO) 98
4.4.1 CPO Architecture Overview 98
4.4.2 Benefits and Challenges 99
4.4.3 Integration Approaches 100
4.4.3.1 2D Integration 101
4.4.3.2 2.5D Integration 101
4.4.3.3 3D Integration 101
4.4.4 Thermal Management 102
4.4.5 Optical Coupling Solutions 102
4.5 Optical Alignment 103
4.5.1 Active vs Passive Alignment 103
4.5.2 Coupling Efficiency 104
4.6 Manufacturing Challenges 104

5 MARKETS AND APPLICATIONS 106

5.1 Datacom Applications 106
5.1.1 Data Center Architecture Evolution 108
5.1.2 Transceivers 109
5.1.2.1 Integration 110
5.1.3 Artificial intelligence (AI) and machine learning (ML) 111
5.1.4 Pluggable optics 111
5.1.5 Linear drive and linear pluggable optics (LPO) 113
5.1.6 Interconnects 115
5.1.6.1 PIC-based on-device interconnects 115
5.1.6.2 Advanced Packaging and Co-Packaged Optics 118
5.1.6.2.1 Glass materials 119
5.1.6.2.2 Co-Packaged Optics 120
5.1.6.3 Photonic Engines and Accelerators 126
5.1.6.3.1 Photonic processing for AI 127
5.1.6.3.2 Convergence with software 127
5.1.6.3.3 Photonic field-programmable gate arrays (FPGAs) 128
5.1.6.4 Photonic Integrated Circuits for Quantum Computing 129
5.1.6.4.1 Photonic qubits 129
5.1.7 Optical Transceivers 132
5.1.7.1 Architecture and Operation 133
5.1.7.2 Market Players 133
5.1.7.3 Technology Roadmap 134
5.1.8 Co-Packaged Optics for Switches 134
5.1.8.1 CPO vs Pluggable Solutions 134
5.1.8.2 Power and Performance Benefits 135
5.1.8.3 Implementation Challenges 135
5.1.9 Data Center Networks 136
5.1.10 High-Performance Computing 136
5.1.10.1 On-Device Interconnects 137
5.1.10.2 Chip-to-Chip Communication 137
5.1.10.3 System Architecture Impact 137
5.1.11 Chip-to-Chip and Board-to-Board Interconnects 138
5.1.12 Ethernet Networking 138
5.2 Telecommunications 139
5.2.1 5G/6G Infrastructure 140
5.2.2 Bandwidth Requirements 140
5.2.3 Long-Haul and Metro Networks 141
5.2.4 5G and Fiber-to-the-X (FTTx) Applications 141
5.2.5 Optical Transceivers and Transponders 142
5.3 Sensing Applications 143
5.3.1 Lidar and Automotive Sensing 143
5.3.1.1 Photonic Integrated Circuit-based LiDAR 144
5.3.2 Chemical and Biological Sensing 147
5.3.3 Optical Coherence Tomography 149
5.4 Artificial Intelligence and Machine Learning 149
5.4.1 AI Data Traffic Requirements 150
5.4.2 Silicon Photonics for AI Accelerators 150
5.4.3 Neural Network Applications 151
5.4.4 Future AI Architecture Requirements 152
5.5 Emerging Applications 152
5.5.1 Quantum Computing and Communication 152
5.5.1.1 Quantum Photonic Requirements 152
5.5.1.2 Integration Challenges 153
5.5.1.3 Market Players and Development 153
5.5.2 Neuromorphic Computing 154
5.5.3 Biophotonics and Medical Diagnostics 154

6 GLOBAL MARKET SIZE 156

6.1 Global Silicon Photonics Market Overview 156
6.1.1 Market Size and Growth Trends 156
6.1.2 Market Segmentation by Application 157
6.2 Datacom Applications 159
6.2.1 Market Forecast 2023-2035 159
6.2.2 Key Drivers and Restraints 160
6.3 Telecom Applications 160
6.3.1 Market Forecast 2023-2035 160
6.3.2 Key Drivers and Restraints 162
6.4 Sensing Applications 162
6.4.1 Market Forecast 2023-2035 162
6.4.2 Key Drivers and Restraints 163

7 SUPPLY CHAIN ANALYSIS 166

7.1 Foundries and Wafer Suppliers 166
7.1.1 CMOS Foundries 166
7.1.2 Specialty Photonics Foundries 167
7.2 Integrated Device Manufacturers (IDMs) 168
7.2.1 Fabless Companies 168
7.2.2 Fully Integrated Photonics Companies 169
7.3 Foundries and Wafer Suppliers 169
7.4 Packaging and Testing 170
7.4.1 Chip-Scale Packaging 170
7.4.2 Module-Level Packaging 170
7.4.3 Testing and Characterization 171
7.5 System Integrators and End-Users 171

8 TECHNOLOGY TRENDS 173

8.1 Laser Integration Techniques 173
8.1.1 Direct Epitaxial Growth 173
8.1.2 Flip-Chip Bonding 174
8.1.3 Hybrid Integration 174
8.1.4 Advances and Challenges 174
8.2 Modulator Technologies 175
8.2.1 Silicon Modulators 176
8.2.2 Germanium Modulators 176
8.2.3 Lithium Niobate Modulators 176
8.2.4 Polymer Modulators 176
8.3 Photodetector Technologies 177
8.3.1 Silicon Photodetectors 177
8.3.2 Germanium Photodetectors 177
8.3.3 III-V Photodetectors 178
8.4 Waveguide and Coupling Innovations 178
8.4.1 Silicon Waveguides 178
8.4.2 Silicon Nitride Waveguides 178
8.4.3 Coupling Techniques 179
8.5 Packaging and Integration Advancements 179
8.5.1 Chip-Scale Packaging 179
8.5.2 Wafer-Scale Integration 180
8.5.3 3D Integration and Interposer Technologies 180

9 CHALLENGES AND FUTURE TRENDS 182

9.1 CMOS-Foundry-Compatible Devices and Integration 182
9.1.1 Scaling and Miniaturization 183
9.1.2 Process Complexity and Yield Improvement 183
9.2 Power Consumption and Thermal Management 184
9.2.1 Energy-Efficient Photonic Devices 185
9.2.2 Thermal Optimization Techniques 186
9.3 Packaging and Testing 186
9.3.1 Advanced Packaging Solutions 186
9.3.2 Automated Testing and Characterization 187
9.4 Scalability and Cost-Effectiveness 188
9.4.1 Wafer-Scale Integration 188
9.4.2 Outsourced Semiconductor Assembly and Test (OSAT) 189
9.5 Emerging Materials and Hybrid Integration 190
9.5.1 Novel Semiconductor Materials 190
9.5.2 Heterogeneous Integration Approaches 191

10 COMPANY PROFILES 193 (181 company profiles)

11 APPENDICES 311

11.1 Glossary of Terms 311
11.2 List of Abbreviations 312
11.3 Research Methodology 314

12 REFERENCES 315

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List of Tables/Graphs

List of Tables

Table 1. Silicon Photonics vs. Electronics: Key Metrics Comparison. 21
Table 2. Photonic Technologies Comparative Analysis. 26
Table 3. Comparison between electronic and photonic computing. 30
Table 4. Electronics companies silicon photonics commercial activities. 31
Table 5. Manufacturing Metrics & Challenges. 32
Table 6. Manufacturing Targets vs Current State. 33
Table 7. Comparative cost analysis. 36
Table 8. Silicon Photonics Integration Schemes. 36
Table 9. Benefits of PICs. 37
Table 10. Photodetector Performance. 38
Table 11. III-V Device Performance. 39
Table 12. Optical Modulator Performance Comparison. 40
Table 13. Silicon Photonic Waveguide Characteristics. 41
Table 14. Optical Component Integration Metrics. 41
Table 15. Advantages of Silicon Photonics. 42
Table 16. Applications of Silicon Photonics. 43
Table 17. Comparison with Other Photonic Integration Technologies. 43
Table 18. Silicon Photonics vs Traditional Electronics: Performance Metrics. 45
Table 19. Switch IC Bandwidth and CPO Technology Evolution. 47
Table 20. Challenges in data center architectures. 47
Table 21. Key Trends of Optical Transceivers in High-End Data Centers. 47
Table 22. Core Components Specifications and Requirements 48
Table 23. Types of Emission and Photon Sources/Lasers. 49
Table 24. III-V Integration Challenges. 50
Table 25. Laser Integration Approaches Comparison. 50
Table 26. Modulator Types and Configurations. 51
Table 27. Waveguide Specifications and Requirements. 52
Table 28. Data Transmission Parameters and Specifications. 53
Table 29. Circuit Architecture Building Blocks. 54
Table 30. Integration Approaches. 55
Table 31. Silicon Photonics Component Specifications. 56
Table 32. Optical Properties of Silicon. 56
Table 33. Fabrication Processes for Silicon Photonics. 57
Table 34. Silicon Foundry Technology Comparison. 59
Table 35. Silicon-on-insulator (SOI) Platform Benchmarking. 60
Table 36. SOI Performance Benchmarks. 61
Table 37. Key SOI Players. 61
Table 38. Germanium Integration Methods and Applications. 62
Table 39. SiN Key Foundries. 64
Table 40. SiN Modulator Technologies. 66
Table 41. Silicon (SOI and SiN) Device Heterogeneous Integration. 66
Table 42. SiN Benchmarking. 68
Table 43. Applications of SiN in Photonics. 69
Table 44. SiN PIC Players. 69
Table 45. Benchmarking of TFLN. 71
Table 46. Characteristics and Properties of LNOI. 72
Table 47. LNOI Fabrication Processes. 72
Table 48. LNOI-based Modulator and Switch Technologies. 73
Table 49. Emerging LNOI Device Technologies. 74
Table 50. InP Benchmarking. 75
Table 51. Integration Technologies. 76
Table 52. InP PIC Players. 76
Table 53. BTO Benchmarking. 77
Table 54. Comparative analysis of materials. 77
Table 55. Benchmarking of Polymer on Insulator. 79
Table 56. Wafer Size Comparison by Platform. 79
Table 57. Wafer Processing Challenges. 80
Table 58. Yield Analysis by Process Step. 80
Table 59. Integration Scheme Comparison. 81
Table 60. Bonding and Die-Attachment Techniques. 82
Table 61. Monolithic versus Hybrid Integration. 83
Table 62. Packaging Technology Comparison Matrix. 84
Table 63. Evolution of semiconductor packaging. 84
Table 64. Summary of key advanced semiconductor packaging approaches. 88
Table 65. Key Performance Metrics for Advanced Packaging Technologies. 89
Table 66. Glass Interposer Solutions. 92
Table 67. Organic Substrate Options. 93
Table 68. TSV Specifications by Application. 94
Table 69. TSV Challenges and Solutions. 95
Table 70. Comparative benchmark overview table of key semiconductor interconnection technologies 97
Table 71. CPO Benefits and Challenges. 99
Table 72. Performance Metrics Comparison. 100
Table 73. CPO Integration Approaches Comparison. 100
Table 74. Manufacturing Process Comparison. 102
Table 75. Thermal Management Approaches. 102
Table 76. Optical Coupling Solutions. 103
Table 77. Alignment Tolerance Analysis. 103
Table 78. Active vs Passive Alignment Comparison. 103
Table 79. Coupling Efficiency Analysis. 104
Table 80. Advanced packaging manufacturing challenges. 104
Table 81. Energy Consumption Analysis. 107
Table 82. Key Metrics for Advanced Semiconductor Packaging Performance. 119
Table 83. Pluggable Optics vs. Co-Packaged Optics (CPO). 122
Table 84. Future Challenges in Co-Packaged Optics (CPO). 123
Table 85. Key Technology Building Blocks for Co-Packaged Optics. 124
Table 86. Key Packaging Components for Co-Packaged Optics. 124
Table 87. Key Players in Photonic Quantum Computing. 129
Table 88. Comparison of PICs vs Traditional Optical Systems. 130
Table 89. Future PIC Requirements of the Quantum Industry. 131
Table 90. Optical Transceivers Market Players. 133
Table 91. Power and Performance Benefits. 135
Table 92. Implementation Challenges. 135
Table 93. Silicon Photonics in HPC: Technical Parameters 136
Table 94. Applications of Silicon Photonics in Telecommunications. 139
Table 95. Bandwidth Requirements by Segment. 141
Table 96. 5G and FTTx Applications Technical Parameters. 142
Table 97. Opportunities for PIC Sensors in LiDAR Applications. 144
Table 98. Challenges of PIC-based FMCW LiDARs. 145
Table 99. Companies Developing PIC-based LiDAR. 145
Table 100. Companies Developing PIC Biosensors. 147
Table 101. Companies Developing PIC-based Gas Sensors. 147
Table 102. Companies Developing Spectroscopy PICs. 148
Table 103. AI Data Traffic Requirements. 150
Table 104. Neural Network Applications. 151
Table 105. Future AI Architecture Requirements. 152
Table 106. Quantum Photonic Requirements. 153
Table 107. Integration Challenges in Quantum Computing and Communication. 153
Table 108. Market players and development. 153
Table 109. Biophotonics Applications. 155
Table 110. Global Market for Silicon Photonics 2023-2035 (Billions USD). 156
Table 111. Market Segmentation by Application 2023-2035 (Billions USD). 158
Table 112. Market Forecast for Silicon Photonics in Datacom Applications 2023-2035 (Billions USD). 159
Table 113. Key market drivers and restraints for silicon photonics in Datacom Applications. 160
Table 114. Market Forecast for Silicon Photonics in Telecom Applications 2023-2035 (Billions USD) 160
Table 115. Key market drivers and restraints for silicon photonics in Telecom Applications. 162
Table 116. Market Forecast for Silicon Photonics in Sensing Applications 2023-2035 (Billions USD). 162
Table 117. Key market drivers and restraints for silicon photonics in Sensing Applications. 164
Table 118. CMOS Foundries. 166
Table 119. Specialty Photonics Foundries. 167
Table 120. Fabless Companies. 168
Table 121. Fully Integrated Photonics Companies. 169
Table 122. Foundries and Wafer Suppliers. 170
Table 123. System Integrators and End-Users. 172
Table 124. Laser Integration Methods Comparison. 173
Table 125. Advanced Techniques and Challenges. 174
Table 126. Modulator Technology Benchmarking. 175
Table 127. Photodetector Performance Metrics . 177
Table 128. Novel semiconductor materials for silicon photonics. 190
Table 129. Glossary of terms. 311
Table 130. List of abbreviations. 312

List of Figures

Figure 1. Silicon Photonic Transceiver Evolution Timeline. 22
Figure 2. Silicon Photonics Player Market Map. 25
Figure 3. Basic Silicon Photonic Circuit Architecture. 35
Figure 4. High Performance AI data center. 46
Figure 5. Optical IO Coupling Mechanisms Diagram. 49
Figure 6. Optical Component Density Evolution. 53
Figure 7. Basic Optical Data Transmission Diagram. 54
Figure 8. SOI Wafer Structure. 58
Figure 9. Manufacturing Process Flow. 59
Figure 10. Germanium Photodetector. 63
Figure 11. Silicon Nitride Layer Stack. 64
Figure 12. AEPONYX SiN PICs. 65
Figure 13. SiN Waveguide Cross-sections. 68
Figure 14. LNOI Device Structures . 71
Figure 15. Timeline of different packaging technologies. 86
Figure 16. Advanced Packaging Roadmap. 88
Figure 17. 2D chip packaging. 90
Figure 18. Typical structure of 2.5D IC package utilizing interposer. 92
Figure 19. TSV Structure and Implementation. 95
Figure 20. Hybrid Bonding Process Flow. 98
Figure 21. Co-Packaged Optics Architecture. 99
Figure 22. Optical module with pluggable fibre interconnect. 112
Figure 23. Roadmap for PIC-Based Transceivers. 114
Figure 24. Evolution Roadmap for Semiconductor Packaging. 118
Figure 25. Roadmap for photonic quantum hardware. 132
Figure 26. Optical Transceivers Technology Roadmap. 134
Figure 27. 5G/6G Implementation Roadmap. 140
Figure 28. LiDAR System Design. 144
Figure 29. Global Market for Silicon Photonics 2023-2035 (Billions USD). 157
Figure 30. Market Segmentation by Application 2023-2035 (Billions USD). 158
Figure 31. Market Forecast for Silicon Photonics in Datacom Applications 2023-2035 (Billions USD). 159
Figure 32. Market Forecast for Silicon Photonics in Telecom Applications 2023-2035 (Billions USD). 161
Figure 33. Market Forecast for Silicon Photonics in Sensing Applications 2023-2035 (Billions USD). 163
Figure 34. Silicon Photonics Supply Chain and Ecosystem. 166
Figure 35. Concept for advanced packaging for integrated photonics. 180
Figure 36. Aeries II LiDAR system. 194
Figure 37. PsiQuantum’s modularized quantum computing system networks. 267
Figure 38. Q.ANT Native Processing Unit (NPU). 269
Figure 39. QuiX low-loss photonic quantum processors. 274