Summary

Global Wafer Backgrinding Tape Market is valued approximately USD 201.6 million in 2020 and is anticipated to grow with a healthy growth rate of more than 4.5 % over the forecast period 2021-2027. Wafer backgrinding is a semiconductor device fabrication technique that reduces wafer thickness to facilitate integrated circuit stacking and high-density packing. ICs are made on semiconductor wafers, which go through a series of processing stages. It is the process of grinding the backside of the wafer to the proper thickness before assembly. The global wafer backgrinding market is primarily driven by increased demand for wafer manufacture, increased focus on wafer surface protection during the grinding process, and growth in the semiconductor sector. For instance, LINTEC Corporation introduced the Back Grinding Tape Laminator "RAD-3520F/12" in April 2017 to protect the circuit surface of the wafer during back grinding. However, the market is projected to be restrained by the change from non-UV to UV curable backgrinding tapes, which raises the entire cost of wafer fabrication.

The key regions considered for the global Wafer Backgrinding Tape market study includes Asia Pacific, North America, Europe, Latin America and Rest of the World. Asia Pacific is the leading/significant region across the world in terms of market share owing to the wafer fabrication demand is increasing, as is the focus on wafer surface protection during the grinding process, and the semiconductor industry is expanding. Whereas, Asia-Pacific is also anticipated to exhibit highest growth rate / CAGR over the forecast period 2021-2027.

Major market player included in this report are:
AI Technology Inc.
AMC Co. Ltd.
Denka Company Limited
Furukawa Electric Co. Ltd.
Force-One Applied Materials
Lintec of America Inc. (Lintec Corporation)
Mitsui Chemicals Inc.
Nitto Denko Corporation
Pantech Tape Co. Ltd.
Minitron Elektronik GmbH

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Type:
UV Curable
Non-UV
By Wafer Size:
6-Inch
8-Inch
12-Inch
Others
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World

Furthermore, years considered for the study are as follows:

Historical year – 2018, 2019
Base year – 2020
Forecast period – 2021 to 2027

Target Audience of the Global Wafer Backgrinding Tape Market in Market Study:

Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors

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Table of Contents

Chapter 1. Executive Summary
1.1. Market Snapshot
1.2. Global & Segmental Market Estimates & Forecasts, 2019-2027 (USD Million)
1.2.1. Wafer Backgrinding Tape Market, by Region, 2019-2027 (USD Million)
1.2.2. Wafer Backgrinding Tape Market, by Type, 2019-2027 (USD Million)
1.2.3. Wafer Backgrinding Tape Market, by Wafer Size, 2019-2027 (USD Million)
1.3. Key Trends
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global Wafer Backgrinding Tape Market Definition and Scope
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Scope of the Study
2.2.2. Industry Evolution
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global Wafer Backgrinding Tape Market Dynamics
3.1. Wafer Backgrinding Tape Market Impact Analysis (2019-2027)
3.1.1. Market Drivers
3.1.1.1. Increasing demand from wafer fabrication
3.1.1.2. Growing semiconductor industry
3.1.2. Market Challenges
3.1.2.1. High cost of wafer backgrinding tape
3.1.3. Market Opportunities
3.1.3.1. Advancement in wafer backgrinding tapes by market players
Chapter 4. Global Wafer Backgrinding Tape Market Industry Analysis
4.1. Porter’s 5 Force Model
4.1.1. Bargaining Power of Suppliers
4.1.2. Bargaining Power of Buyers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.1.6. Futuristic Approach to Porter’s 5 Force Model (2018-2027)
4.2. PEST Analysis
4.2.1. Political
4.2.2. Economical
4.2.3. Social
4.2.4. Technological
4.3. Investment Adoption Model
4.4. Analyst Recommendation & Conclusion
4.5. Top investment opportunity
4.6. Top winning strategies
Chapter 5. Risk Assessment: COVID-19 Impact
5.1.1. Assessment of the overall impact of COVID-19 on the industry
5.1.2. Pre COVID-19 and post COVID-19 market scenario
Chapter 6. Global Wafer Backgrinding Tape Market, by Type
6.1. Market Snapshot
6.2. Global Wafer Backgrinding Tape Market by Type, Performance - Potential Analysis
6.3. Global Wafer Backgrinding Tape Market Estimates & Forecasts by Type 2018-2027 (USD Million)
6.4. Wafer Backgrinding Tape Market, Sub Segment Analysis
6.4.1. UV Curable
6.4.2. Non-UV
Chapter 7. Global Wafer Backgrinding Tape Market, by Wafer Size
7.1. Market Snapshot
7.2. Global Wafer Backgrinding Tape Market by Wafer Size, Performance - Potential Analysis
7.3. Global Wafer Backgrinding Tape Market Estimates & Forecasts by Wafer Size 2018-2027 (USD Million)
7.4. Wafer Backgrinding Tape Market, Sub Segment Analysis
7.4.1. 6-Inch
7.4.2. 8-Inch
7.4.3. 12-Inch
7.4.4. Others
Chapter 8. Global Wafer Backgrinding Tape Market, Regional Analysis
8.1. Wafer Backgrinding Tape Market, Regional Market Snapshot
8.2. North America Wafer Backgrinding Tape Market
8.2.1. U.S. Wafer Backgrinding Tape Market
8.2.1.1. Type breakdown estimates & forecasts, 2018-2027
8.2.1.2. Wafer Size breakdown estimates & forecasts, 2018-2027
8.2.2. Canada Wafer Backgrinding Tape Market
8.3. Europe Wafer Backgrinding Tape Market Snapshot
8.3.1. U.K. Wafer Backgrinding Tape Market
8.3.2. Germany Wafer Backgrinding Tape Market
8.3.3. France Wafer Backgrinding Tape Market
8.3.4. Spain Wafer Backgrinding Tape Market
8.3.5. Italy Wafer Backgrinding Tape Market
8.3.6. Rest of Europe Wafer Backgrinding Tape Market
8.4. Asia-Pacific Wafer Backgrinding Tape Market Snapshot
8.4.1. China Wafer Backgrinding Tape Market
8.4.2. India Wafer Backgrinding Tape Market
8.4.3. Japan Wafer Backgrinding Tape Market
8.4.4. Australia Wafer Backgrinding Tape Market
8.4.5. South Korea Wafer Backgrinding Tape Market
8.4.6. Rest of Asia Pacific Wafer Backgrinding Tape Market
8.5. Latin America Wafer Backgrinding Tape Market Snapshot
8.5.1. Brazil Wafer Backgrinding Tape Market
8.5.2. Mexico Wafer Backgrinding Tape Market
8.6. Rest of The World Wafer Backgrinding Tape Market

Chapter 9. Competitive Intelligence
9.1. Top Market Strategies
9.2. Company Profiles
9.2.1. AI Technology Inc.
9.2.1.1. Key Information
9.2.1.2. Overview
9.2.1.3. Financial (Subject to Data Availability)
9.2.1.4. Product Summary
9.2.1.5. Recent Developments
9.2.2. AMC Co. Ltd.
9.2.3. Denka Company Limited
9.2.4. Furukawa Electric Co. Ltd.
9.2.5. Force-One Applied Materials
9.2.6. Lintec of America Inc. (Lintec Corporation)
9.2.7. Mitsui Chemicals Inc.
9.2.8. Nitto Denko Corporation
9.2.9. Pantech Tape Co. Ltd.
9.2.10. Minitron Elektronik GmbH
Chapter 10. Research Process
10.1. Research Process
10.1.1. Data Mining
10.1.2. Analysis
10.1.3. Market Estimation
10.1.4. Validation
10.1.5. Publishing
10.2. Research Attributes
10.3. Research Assumption