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電子部品におけるプラスチック：テクノロジーと世界市場Plastics in Electronics Components: Technologies and Global Markets レポートのスコープ 本調査では、プラスチックが多量に使用されている電子部品全般を対象としています。射出成形、圧縮成形、封止成形で製造される部品に焦点をあてています。ワイヤーやケーブル、コンデンサ... もっと見る
サマリーレポートのスコープ本調査では、プラスチックが多量に使用されている電子部品全般を対象としています。射出成形、圧縮成形、封止成形で製造される部品に焦点をあてています。ワイヤーやケーブル、コンデンサーや記録媒体に使用されるフィルム、エンクロージャーは対象外です。また、主要な材料サプライヤーと主要な加工業者を特定しています。また、重要な新技術や、電子部品市場に大きな影響を与える可能性のある法律や業界標準・規範の変更について検討し、ポリマー間の競争についても考察しています。 レポートには以下の内容が含まれます： - 61のデータテーブルと23の追加テーブル - 電子部品用プラスチックの世界市場および技術の概要 - 世界市場動向の分析、2022年、2023年のデータと2028年までの年平均成長率（CAGR）の予測 - 電子部品用プラスチックの市場規模の推定と収益予測、タイプ別・エンドユーザー別・地域別の市場シェア分析 - 市場機会のハイライト、プラスチック業界に影響を与える主要な問題やトレンドの紹介 - 最近の業界構造、規制・政策、パイプライン製品、市場参加者のベンダーランドスケープに関する洞察 - BASF、Covestro AG、Henkel AG、Mitsubishi Engineering-Plastics Corp.、SABICなど、業界内の主要プレイヤーの会社概要 目次Table of ContentsChapter 1 Introduction 1.1 Study Goals and Objectives 1.2 Reasons for Doing This Study 1.3 Scope of Report 1.4 What’s New in This Report? 1.5 Information Sources 1.6 Methodology 1.7 Geographic Breakdown 1.8 Analyst’s Credentials 1.9 BCC Custom Research 1.10 Related BCC Research Reports Chapter 2 Summary and Highlights Chapter 3 Market and Technology Background 3.1 Overview 3.2 Snapshot of the Electronic Device Market 3.3 Computers 3.3.1 Overview 3.3.2 Desktops 3.4 Electronic Displays 3.4.1 Background 3.5 Printers 3.5.1 Overview 3.5.2 Inkjet Printers 3.5.3 Monochrome Laser Printers 3.5.4 Color Laser Printers 3.5.5 Manufacturers 3.6 “All-in-One” Machines 3.7 Phones 3.7.1 Corded 3.7.2 Cordless 3.8 Fax Machines 3.9 Scanners 3.10 Mobile Electronics Devices 3.10.1 Phones 3.10.2 Laptops/Notebooks/Netbooks 3.10.3 Tablets 3.10.4 E-Readers 3.10.5 Portable Music Players 3.11 Automotive Market 3.11.1 Overview 3.11.2 Electric Cars 3.11.3 CAFE Issues 3.11.4 Overview of Electronic Components in Automotive Products 3.11.5 Flexible Circuitry in Automotive Applications Chapter 4 Market Breakdown by Technology Type 4.1 Overview 4.2 Types of Polymers 4.3 Thermoplastics 4.3.1 Standard Nylons 4.3.2 Thermoplastic Polymers 4.3.3 Polyphenylene Sulfide 4.3.4 Polyimides 4.3.5 Polycarbonates 4.3.6 Polyphthalamides and Other High-Temperature Nylons 4.3.7 Liquid Crystal Polymers 4.3.8 Sulfone Polymers 4.3.9 Alloys/Blends 4.3.10 Fluoropolymers 4.3.11 Polyaryletherketones 4.3.12 Cyclic Olefin Copolymers 4.3.13 Thermoplastic Market Estimates and Forecasts Summary 4.4 Thermoset Polymers 4.4.1 Overview 4.4.2 General Properties 4.4.3 Epoxy Resins 4.4.4 Polyurethanes 4.4.5 Phenolics 4.4.6 Unsaturated Polyesters 4.4.7 Diallyl Phthalate 4.4.8 BT-Epoxy Resins and Cyanate Esters 4.4.9 Thermoset Market Estimates and Forecasts Summary Chapter 5 Overview of Key Components, PCBs and Encapsulants 5.1 Introduction 5.2 The Focus of This Report 5.3 Resin Consumption 5.3.1 Background 5.3.2 Markets 5.3.3 Growth 5.3.4 Market Drivers 5.4 Printed Circuit Boards 5.4.1 Overview 5.4.2 Property Requirements for Laminates 5.4.3 Physical Composition 5.4.4 Assembly Technologies 5.4.5 PCB Substrates 5.4.6 Specific Polymers Used in Printed Circuit Boards 5.4.7 Other Materials Used in Printed Circuit Boards 5.4.8 Fiber Reinforcements 5.4.9 Production of Circuitry 5.4.10 Environmental Issues 5.4.11 Flexible Printed Circuit Boards 5.4.12 Soldering 5.4.13 Production Statistics 5.4.14 Industry Trends 5.4.15 Electronics Packaging 5.4.16 Market Estimates and Forecasts 5.5 Encapsulants 5.5.1 Definitions and Background 5.5.2 Primary Purposes of Encapsulation 5.5.3 Encapsulant Materials 5.5.4 Epoxy Encapsulation Formulations 5.5.5 Encapsulated Electrical and Electronic Components 5.5.6 Epoxy Encapsulant Systems 5.5.7 Silicone Encapsulants 5.5.8 Thermoplastic Encapsulants 5.5.9 Selected Major Encapsulant Producers and Their Product Lines 5.5.10 Market Estimates and Forecasts Chapter 6 Molded Electronic Products 6.1 Overview 6.1.1 Background 6.1.2 Polymers Used 6.1.3 Market Drivers 6.2 Connectors 6.2.1 Background 6.2.2 Functions and Components of Connectors 6.2.3 Trends 6.2.4 Applications for Electronic Connectors 6.2.5 Material Selection 6.2.6 Flame Retardance 6.2.7 Standards Relating to Connectors 6.2.8 Manufacturers 6.2.9 End-Use Markets 6.2.10 Market Estimates and Forecasts 6.3 Switches 6.3.1 Background 6.3.2 Market Estimates and Forecasts 6.4 Coil Formers 6.4.1 Background 6.4.2 Manufacturers 6.4.3 Market Estimates and Forecasts 6.5 Relays 6.5.1 Background 6.5.2 Market Estimates and Forecasts 6.6 Capacitors 6.6.1 Background 6.6.2 Applications 6.6.3 Capacitor Materials 6.6.4 Consumption by Market Segment 6.6.5 Market Estimates and Forecasts 6.7 Other Types of Molded Electronic Components 6.7.1 Resistors 6.7.2 Market Estimates and Forecasts 6.8 Summary of Market Estimates and Forecasts Chapter 7 New Developments 7.1 Background 7.2 Importance of Miniaturization 7.2.1 High-density Interconnect Technology to Drive Market for PCB 7.3 Thin-Walling Electronic Components 7.3.1 Background 7.3.2 Effects of Thin-Walling on Performance Requirements and Design 7.3.3 Application Requirements 7.3.4 Material and Process Selection 7.3.5 Properties Required 7.3.6 Challenges in Downsizing 7.3.7 Software that Aids Thin-wall Design 7.4 Flexible Electronics 7.4.1 Overview 7.5 Wearable Electronics 7.6 Cloud Computing and Big Data 7.7 The Internet of Everything 7.8 Changes in Electronics Component Manufacturing That Could Influence Resin Choices 7.9 Recent Patents Related to the Industry Chapter 8 Electronic Component Industry Overview and Plastics Producers 8.1 Top Semiconductor Producers and Customers 8.2 Manufacturing and Marketing Aspects 8.2.1 Globalization 8.2.2 What Component Suppliers Are Doing 8.3 Plastics Producers 8.3.1 Overview 8.4 Polymer Producers According to Material Type 8.4.1 Thermosets 8.4.2 Thermoplastics Chapter 9 Environmental Issues 9.1 Overview 9.2 Printed Circuit Board Disposal 9.3 Bromine-Free Printed Circuit Boards 9.4 Halogen-Free Flame Retardants for Thermoplastics 9.5 Recycling 9.6 Electronics Industry Interface 9.6.1 Overview 9.6.2 Reasons for Increased Environmental Regulations for Electronics Equipment 9.6.3 The European Union RoHS Directive 9.6.4 The European Union WEEE Directive 9.6.5 EPEAT Chapter 10 Performance Requirements Related to Electronic Components 10.1 Overview 10.2 Flammability Standards 10.2.1 Definitions 10.3 Flammability Tests 10.3.1 Overview 10.3.2 UL 94 10.3.3 Glow-Wire Flammability Index - IEC 60695 10.3.4 UL 1694 10.3.5 UL 746C 10.4 Other Standards 10.4.1 UL 1446 10.4.2 UL 1950 Chapter 11 Competitive Landscape 11.1 Overview 11.2 Big Brands Engineer the Potential of Thermoplastics 11.3 Key Developments 11.3.1 Important News Pertaining to the Market for Plastics in Electronic Components Chapter 12 Company Profiles ASAHI KASEI CORP. ASHLAND INC. BASF CELANESE COVESTRO AG CYTEC INDUSTRIES INC. DSM DUPONT DE NEMOURS AND CO. EMS GRIVORY EPIC RESINS HENKEL AG HUNTSMAN INTERNATIONAL LLC INTERPLASTIC CORP. KINGFA SCIENCE AND TECHNOLOGY CO. LTD. LANXESS AG MITSUBISHI ENGINEERING-PLASTICS CORP. POLYPLASTICS SABIC INNOVATIVE PLASTICS SOLVAY SPECIALTY POLYMERS SUMITOMO BAKELITE TORAY PLASTICS VICTREX PLC Chapter 13 Appendix: Acronyms
SummaryReport Scope: Table of ContentsTable of ContentsChapter 1 Introduction 1.1 Study Goals and Objectives 1.2 Reasons for Doing This Study 1.3 Scope of Report 1.4 What’s New in This Report? 1.5 Information Sources 1.6 Methodology 1.7 Geographic Breakdown 1.8 Analyst’s Credentials 1.9 BCC Custom Research 1.10 Related BCC Research Reports Chapter 2 Summary and Highlights Chapter 3 Market and Technology Background 3.1 Overview 3.2 Snapshot of the Electronic Device Market 3.3 Computers 3.3.1 Overview 3.3.2 Desktops 3.4 Electronic Displays 3.4.1 Background 3.5 Printers 3.5.1 Overview 3.5.2 Inkjet Printers 3.5.3 Monochrome Laser Printers 3.5.4 Color Laser Printers 3.5.5 Manufacturers 3.6 “All-in-One” Machines 3.7 Phones 3.7.1 Corded 3.7.2 Cordless 3.8 Fax Machines 3.9 Scanners 3.10 Mobile Electronics Devices 3.10.1 Phones 3.10.2 Laptops/Notebooks/Netbooks 3.10.3 Tablets 3.10.4 E-Readers 3.10.5 Portable Music Players 3.11 Automotive Market 3.11.1 Overview 3.11.2 Electric Cars 3.11.3 CAFE Issues 3.11.4 Overview of Electronic Components in Automotive Products 3.11.5 Flexible Circuitry in Automotive Applications Chapter 4 Market Breakdown by Technology Type 4.1 Overview 4.2 Types of Polymers 4.3 Thermoplastics 4.3.1 Standard Nylons 4.3.2 Thermoplastic Polymers 4.3.3 Polyphenylene Sulfide 4.3.4 Polyimides 4.3.5 Polycarbonates 4.3.6 Polyphthalamides and Other High-Temperature Nylons 4.3.7 Liquid Crystal Polymers 4.3.8 Sulfone Polymers 4.3.9 Alloys/Blends 4.3.10 Fluoropolymers 4.3.11 Polyaryletherketones 4.3.12 Cyclic Olefin Copolymers 4.3.13 Thermoplastic Market Estimates and Forecasts Summary 4.4 Thermoset Polymers 4.4.1 Overview 4.4.2 General Properties 4.4.3 Epoxy Resins 4.4.4 Polyurethanes 4.4.5 Phenolics 4.4.6 Unsaturated Polyesters 4.4.7 Diallyl Phthalate 4.4.8 BT-Epoxy Resins and Cyanate Esters 4.4.9 Thermoset Market Estimates and Forecasts Summary Chapter 5 Overview of Key Components, PCBs and Encapsulants 5.1 Introduction 5.2 The Focus of This Report 5.3 Resin Consumption 5.3.1 Background 5.3.2 Markets 5.3.3 Growth 5.3.4 Market Drivers 5.4 Printed Circuit Boards 5.4.1 Overview 5.4.2 Property Requirements for Laminates 5.4.3 Physical Composition 5.4.4 Assembly Technologies 5.4.5 PCB Substrates 5.4.6 Specific Polymers Used in Printed Circuit Boards 5.4.7 Other Materials Used in Printed Circuit Boards 5.4.8 Fiber Reinforcements 5.4.9 Production of Circuitry 5.4.10 Environmental Issues 5.4.11 Flexible Printed Circuit Boards 5.4.12 Soldering 5.4.13 Production Statistics 5.4.14 Industry Trends 5.4.15 Electronics Packaging 5.4.16 Market Estimates and Forecasts 5.5 Encapsulants 5.5.1 Definitions and Background 5.5.2 Primary Purposes of Encapsulation 5.5.3 Encapsulant Materials 5.5.4 Epoxy Encapsulation Formulations 5.5.5 Encapsulated Electrical and Electronic Components 5.5.6 Epoxy Encapsulant Systems 5.5.7 Silicone Encapsulants 5.5.8 Thermoplastic Encapsulants 5.5.9 Selected Major Encapsulant Producers and Their Product Lines 5.5.10 Market Estimates and Forecasts Chapter 6 Molded Electronic Products 6.1 Overview 6.1.1 Background 6.1.2 Polymers Used 6.1.3 Market Drivers 6.2 Connectors 6.2.1 Background 6.2.2 Functions and Components of Connectors 6.2.3 Trends 6.2.4 Applications for Electronic Connectors 6.2.5 Material Selection 6.2.6 Flame Retardance 6.2.7 Standards Relating to Connectors 6.2.8 Manufacturers 6.2.9 End-Use Markets 6.2.10 Market Estimates and Forecasts 6.3 Switches 6.3.1 Background 6.3.2 Market Estimates and Forecasts 6.4 Coil Formers 6.4.1 Background 6.4.2 Manufacturers 6.4.3 Market Estimates and Forecasts 6.5 Relays 6.5.1 Background 6.5.2 Market Estimates and Forecasts 6.6 Capacitors 6.6.1 Background 6.6.2 Applications 6.6.3 Capacitor Materials 6.6.4 Consumption by Market Segment 6.6.5 Market Estimates and Forecasts 6.7 Other Types of Molded Electronic Components 6.7.1 Resistors 6.7.2 Market Estimates and Forecasts 6.8 Summary of Market Estimates and Forecasts Chapter 7 New Developments 7.1 Background 7.2 Importance of Miniaturization 7.2.1 High-density Interconnect Technology to Drive Market for PCB 7.3 Thin-Walling Electronic Components 7.3.1 Background 7.3.2 Effects of Thin-Walling on Performance Requirements and Design 7.3.3 Application Requirements 7.3.4 Material and Process Selection 7.3.5 Properties Required 7.3.6 Challenges in Downsizing 7.3.7 Software that Aids Thin-wall Design 7.4 Flexible Electronics 7.4.1 Overview 7.5 Wearable Electronics 7.6 Cloud Computing and Big Data 7.7 The Internet of Everything 7.8 Changes in Electronics Component Manufacturing That Could Influence Resin Choices 7.9 Recent Patents Related to the Industry Chapter 8 Electronic Component Industry Overview and Plastics Producers 8.1 Top Semiconductor Producers and Customers 8.2 Manufacturing and Marketing Aspects 8.2.1 Globalization 8.2.2 What Component Suppliers Are Doing 8.3 Plastics Producers 8.3.1 Overview 8.4 Polymer Producers According to Material Type 8.4.1 Thermosets 8.4.2 Thermoplastics Chapter 9 Environmental Issues 9.1 Overview 9.2 Printed Circuit Board Disposal 9.3 Bromine-Free Printed Circuit Boards 9.4 Halogen-Free Flame Retardants for Thermoplastics 9.5 Recycling 9.6 Electronics Industry Interface 9.6.1 Overview 9.6.2 Reasons for Increased Environmental Regulations for Electronics Equipment 9.6.3 The European Union RoHS Directive 9.6.4 The European Union WEEE Directive 9.6.5 EPEAT Chapter 10 Performance Requirements Related to Electronic Components 10.1 Overview 10.2 Flammability Standards 10.2.1 Definitions 10.3 Flammability Tests 10.3.1 Overview 10.3.2 UL 94 10.3.3 Glow-Wire Flammability Index - IEC 60695 10.3.4 UL 1694 10.3.5 UL 746C 10.4 Other Standards 10.4.1 UL 1446 10.4.2 UL 1950 Chapter 11 Competitive Landscape 11.1 Overview 11.2 Big Brands Engineer the Potential of Thermoplastics 11.3 Key Developments 11.3.1 Important News Pertaining to the Market for Plastics in Electronic Components Chapter 12 Company Profiles ASAHI KASEI CORP. ASHLAND INC. BASF CELANESE COVESTRO AG CYTEC INDUSTRIES INC. DSM DUPONT DE NEMOURS AND CO. EMS GRIVORY EPIC RESINS HENKEL AG HUNTSMAN INTERNATIONAL LLC INTERPLASTIC CORP. KINGFA SCIENCE AND TECHNOLOGY CO. LTD. LANXESS AG MITSUBISHI ENGINEERING-PLASTICS CORP. POLYPLASTICS SABIC INNOVATIVE PLASTICS SOLVAY SPECIALTY POLYMERS SUMITOMO BAKELITE TORAY PLASTICS VICTREX PLC Chapter 13 Appendix: Acronyms
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