Summary
この調査レポートは世界の組込みボード、モジュール、システム市場を調査し、市場概説や競争環境、エンドユーザ分析などを行っています。
What questions are addressed?
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Who leads the markets for embedded boards, modules, and integrated computer systems?
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How will form factor fragmentation evolve and impact competition in the future?
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Where are boards and systems providers expanding their developer and application support?
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Why are some market leaders at risk of losing their positioning?
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Which industries face the most competition from captive/OEM in-house engineering solutions?
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What do engineers and developers care most about the embedded hardware they are sourcing?
Vendors Listed In This Report
AAEON Technology, Abaco Systems, ADLINK Technology, Advantech, Artesyn, Avalue Technology, Axiomtek, BAE Systems, congatec, Curtiss-Wright Defense Solutions, Dell Technologies, DFI, Eurotech, EVOC Intelligent Technology, Extreme Engineering Solutions, Fujitsu Technology Solutions, Gemalto, General Dynamics Mission Systems, HPE, Huawei, IBASE Technology, IBM, IEI Integration, Kontron S&T, L3 Technologies, Lenovo, Leonardo DRS, Mercury Computer Systems, MPL, Murata, National Instruments, Octagon Systems, Oracle, Radisys, Rockwell Automation, RTD Embedded, Shenzhen NORCO Intelligent Technology, Sierra Wireless, SIMCom, Supermicro, Skyworks Solutions, Telit, Texas Instruments, Trimble, TYAN, U-blox, VersaLogic, VIA Technologies, WINSystems
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Table of Contents
Contents
Inside This Report 2
Executive Summary 4
Global Market Overview 5
Competitive Landscape 7
Vendor Insights 11
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Abaco Systems
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ADLINK
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Advantech Artesyn
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congatec
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Dell Technologies
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Eurotech
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HPE
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Kontron
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Supermicro
End-User Insights 21
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Each Industry Treats Board-level Component Criteria Differently
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Embedded Systems Selection Guided by Performance Requirements
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Follow the BOM for Differentiation
Appendix: Market Definitions 24
About VDC Research 28
List of Report Exhibits
Exhibit 1: Forecasted Global Shipments of Embedded Boards, Modules, and Systems Segmented by Form Factor, 2018?2023
Exhibit 2: Global Vendor Shares of Desktop Class Motherboards
Exhibit 3: Global Vendor Shares of ITX Class Motherboards
Exhibit 4: Global Vendor Shares of Embedded/Stackable Class Motherboards
Exhibit 5: Global Vendor Shares of Slot SBCs & Blades Exhibit 6: Global Vendor Shares of COMs & Carriers Exhibit 7: Global Vendor Shares of Wireless Modules
Exhibit 8: Global Vendor Shares of Embedded Integrated Computer Systems
Exhibit 9: Most Important Product Selection Criteria (Excluding Cost) When Purchasing/Specifying
CPU Boards, Blades and/or Modules Segmented by Vertical Market
Exhibit 10: Most Important Product Selection Criteria (Excluding Cost) When Purchasing/Specifying
Embedded Computing Systems Segmented by Primary Processor Bit Width
Exhibit 11: Estimated Distribution of Development Costs Segmented by Organization Type
List of Excel Exhibits
Vendor Share Exhibits
Exhibit 1 Desktop Class Motherboards, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 2 ITX Class Motherboards, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 3 Embedded Class Motherboards, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 4 PC/104 Family Modules, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 5 COM Modules and Merchant COM Carriers, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 6 Wireless Modules, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 7 Mezzanine Cards & Non-Intelligent Mezzanine Carriers, Vendor Shares, Dollar Volume
Shipments, 2018
Exhibit 8 Slot Single Board Computers & CPU Blades, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 9 Merchant Embedded Integrated Computer Systems, Vendor Shares, Dollar Volume
Shipments, 2018
Exhibit 10 Merchant Embedded Integrated Computer Systems in Aerospace & Defense, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 11 Merchant Embedded Integrated Computer Systems in Communications & Networking, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 12 Merchant Embedded Integrated Computer Systems in Industrial Automation & Control, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 13 Merchant Embedded Integrated Computer Systems in Medical, Vendor Shares, Dollar
Volume Shipments, 2018
Exhibit 14 Merchant Embedded Integrated Computer Systems in Transportation, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 15 Merchant Embedded Integrated Computer Systems in Emerging & Niche Markets, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 16 Embedded Gateway Hardware, Vendor Shares, Dollar Volume Shipments, 2018
List of Excel Exhibits
Vendor Share Exhibits
Exhibit 1 Desktop Class Motherboards, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 2 ITX Class Motherboards, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 3 Embedded Class Motherboards, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 4 PC/104 Family Modules, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 5 COM Modules and Merchant COM Carriers, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 6 Wireless Modules, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 7 Mezzanine Cards & Non-Intelligent Mezzanine Carriers, Vendor Shares, Dollar Volume
Shipments, 2018
Exhibit 8 Slot Single Board Computers & CPU Blades, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 9 Merchant Embedded Integrated Computer Systems, Vendor Shares, Dollar Volume
Shipments, 2018
Exhibit 10 Merchant Embedded Integrated Computer Systems in Aerospace & Defense, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 11 Merchant Embedded Integrated Computer Systems in Communications & Networking,
Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 12 Merchant Embedded Integrated Computer Systems in Industrial Automation & Control,
Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 13 Merchant Embedded Integrated Computer Systems in Medical, Vendor Shares, Dollar
Volume Shipments, 2018
Exhibit 14 Merchant Embedded Integrated Computer Systems in Transportation, Vendor Shares, Dollar Volume Shipments, 2018
Exhibit 15 Merchant Embedded Integrated Computer Systems in Emerging & Niche Markets, Vendor
Shares, Dollar Volume Shipments, 2018
Exhibit 16 Embedded Gateway Hardware, Vendor Shares, Dollar Volume Shipments, 2018
IoT & Embedded Engineering Survey Exhibits
Exhibit 1 Types of Projects in Current Role’s Purview
Exhibit 2 Primary Area of Expertise
Exhibit 3 Primary Classification of Current or Most Recently Completed Project
Exhibit 4 Personal Involvement with Engineering in Project
Exhibit 5 Products Purchased by Respondent’s Organization
Exhibit 6 Organization’s Primary Industry
Exhibit 7 Number of People Working for Respondent’s Organization Worldwide
Exhibit 8 Respondent’s Primary Role Within Organization
Exhibit 9 Respondent’s Country of Residence
Exhibit 10 Respondent’s Region of Residence
Exhibit 11 Industry/Vertical Market
Exhibit 12 Type of Aerospace & Defense Product
Exhibit 13 Type of Automotive In-Vehicle Product
Exhibit 14 Type of Communications & Networking Product
Exhibit 15 Type of Consumer Electronics Product
Exhibit 16 Type of Digital Security Product
Exhibit 17 Type of Digital Signage Product
Exhibit 18 Type of Energy & Utilities Product
Exhibit 19 Type of Gaming Product
Exhibit 20 Type of Industrial Automation Product
Exhibit 21 Type of Medical Product
Exhibit 22 Type of Mobile Phone Product
Exhibit 23 Type of Office/Business Automation Product
Exhibit 24 Type of Transportation Product
Exhibit 25 Type of Retail Automation Product
Exhibit 26 Type of Non-Manufacturing/Services Product
Exhibit 27 Capabilities or Features Included in Current Project
Exhibit 28 Capabilities or Features Expected for Similar Project in Three Years
Exhibit 29 Project’s Real-Time Deadlines
Exhibit 30 Project’s Shortest Response Deadline
Exhibit 31 Implementation of Software-Defined Networking (SDN) and/or Network Function
Virtualization (NFV) on Current Project
Exhibit 32 Expected use of Software-Defined Networking (SDN) and/or Network Function Virtualization (NFV) on Similar Project in Three Years
Exhibit 33 Estimate of Total Project Length in Calendar Months
Exhibit 34 Current Project’s Schedule
Exhibit 35 Estimate of Total Years for Which Current Product will be Manufactured Once Initial
Development is Complete
Exhibit 36 Estimate of Product’s Average Years of Useful Life Once Deployed in Field by End Customer
Exhibit 37 Reasons for Any Delays in Current Project
Exhibit 38 Engineering Tasks in which the Respondent is Personally Involved for the Current Project
Exhibit 39 Portion of Time Spent on Engineering Tasks in which the Respondent is Personally Involved for the Current Project
Exhibit 40 Tasks where Respondent Personally Planned for/Designed, Identified, or Remediated
Security Issues
Exhibit 41 Percent of Time Spent on Each Task Personally Planning for/Designing, Identifying, or
Remediating Security Issues
Exhibit 42 Estimated Distribution of Full-Time Engineers Working on Project
Exhibit 43 Estimated Number of Full-Time Engineers Employed by Respondent’s Organization
Exhibit 44 Estimated Distribution of Full-Time Engineers Employed by Respondent’s Organization
Exhibit 45 Estimated Total Cost of Development for the Project
Exhibit 46 Estimated Bill of Material (BOM) for the Project
Exhibit 47 Estimated Number of Units to be Shipped for the Project
Exhibit 48 Estimated Distribution of Development Costs on the Project
Exhibit 49 Estimated Distribution of Development Costs on the Project Three Years from Now
Exhibit 50 Estimate of the Fully-Loaded Labor Cost (including salary, benefits, overhead, etc.) for a
Typical Embedded Engineer at Respondent’s Location
Exhibit 51 Estimated Total Number of Defects or Software Patches Reported/Required per Year once
Product is Deployed in Field
Exhibit 52 Estimated Combined IT and Engineering Time (man-hours) Required for each Patch or
Defect Remediation
Exhibit 53 Estimated Percentage of Devices that will become Inoperable and Require Repair or
Replacement each Year
Exhibit 54 Primary Method for Updating Devices once Deployed in Field
Exhibit 55 Types of Computer System Components or Sub-Systems Purchased by Organization
Exhibit 56 Types of Processors Used on Project
Exhibit 57 Types of Processors Expected to be Used on Similar Project in 3 Years
Exhibit 58 Primary/Application Processor Used on Project
Exhibit 59 Primary Processor Family/Architecture Used on Project
Exhibit 60 Processor Families/Architectures Considered for Project
Exhibit 61 Bit-Width of Architecture Used by Primary Processor on Project
Exhibit 62 Most Important Characteristics when Selecting Embedded Processors
Exhibit 63 CPU/MPU suppliers Currently Used on Project
Exhibit 64 MCU Suppliers Currently Used on Project
Exhibit 65 SoC Suppliers Currently Used on Project
Exhibit 66 ASSP Suppliers Currently Used on Project
Exhibit 67 FPGA Suppliers Currently Used on Project
Exhibit 68 Satisfaction with Embedded Processor Suppliers that Respondent has Purchased
Exhibit 69 Most Important Product Selection Criteria (Excluding Cost) when Purchasing/Specifying
CPU Boards, Blades and/or Modules
Exhibit 70 Architectures or Form Factors of Boards/Modules Used on Project
Exhibit 71 Architectures or Form Factors of Boards/Modules Expected to be Used on a Similar Project
in Three Years
Exhibit 72 Embedded Board Vendors Currently Used on Project
Exhibit 73 Most Important Product Selection Criteria (Excluding Cost) when Purchasing/Specifying
Embedded Computing and/or Storage Systems
Exhibit 74 Architectures or Form Factors Used in Embedded Computing Systems that are Purchased
by Respondent’s Organization on Project
Exhibit 75 Architectures or Form Factors in Embedded Computing Systems Expected to be Purchased
by Respondent’s Organization on Similar Project in Three Years
Exhibit 76 Motherboard Form Factors Currently Used in Organization’s Systems
Exhibit 77 Motherboard Form Factors Expected to be Used in Organization’s Systems on Similar
Project in Three Years
Exhibit 78 COM Form Factors Currently Used in Organization’s Systems
Exhibit 79 COM Form Factors Expected to be Used in Organization’s Systems on Similar Project in
Three Years
Exhibit 80 Types of Wired, Optical, and/or Wireless Connections Used in Systems/Services Produced
by Organization
Exhibit 81 Types of Wired, Optical, and/or Wireless Connections Expected to be Used in Systems/
Services Produced by Organization in Three Years
Exhibit 82 Types of Low-Powered Wide-Area-Networks (LPWAN) Used in Systems/Services Produced
by Organization
Exhibit 83 Types of Low-Powered Wide-Area-Networks (LPWAN) Expected to be Used in Embedded
Systems/Services Produced by Organization on Similar Project in Three Years
Exhibit 84 Estimated Amount of Data Generated by Organization’s Products on Average each Day per
Device
Exhibit 85 Estimated Amount of Data Generated by Organization’s Products on Average each Day per
Device on Similar Project in Three years
Exhibit 86 IoT Middleware Frameworks/Platforms Used on Project
Exhibit 87 IoT Protocols Used on Project
Exhibit 88 Approximate Distance Needed for Devices to Communicate Wirelessly
Exhibit 89 Source of Primary Operating System Used on Previous Project
Exhibit 90 Source of Primary Operating System Used on Project
Exhibit 91 Expected Source of Primary Operating System on Similar Project in Three Years
Exhibit 92 Commercially Obtained, NON Open Source OS Used on Project
Exhibit 93 Commercially or Consortia Obtained, Open Source OS Used on Project
Exhibit 94 Freely and/or Publicly Available, Open Source OS Used on Project
Exhibit 95 Chip/Board Vendor-Supplied OS Used on Project
Exhibit 96 Most Important Characteristics when Selecting Primary Operating System
Exhibit 97 Likelihood of Using same Operating System on Similar Project in Three Years
Exhibit 98 Software Stack Components Required on Project
Exhibit 99 Software Stack Components Required on Similar Project Three Years from Now
Exhibit 100 Importance of Security in Project
Exhibit 101 Actions Organization has Taken in Response to Security Requirements
Exhibit 102 How Well Organization has Addressed Security Requirements
Exhibit 103 Primary Reason Security is Not Important for Project
Exhibit 104 Have any Security Vulnerabilities or Failures within Organization’s Products been Exposed
or Identified
Exhibit 105 Were any Vulnerabilities Disclosed to Customers
Exhibit 106 Results of Security Vulnerabilities
Exhibit 107 Implications of Security Vulnerabilities
Exhibit 108 Commercial Security Vendors Used on Project
Exhibit 109 Embedded Security Software Used on Project
Exhibit 110 Embedded Security Hardware Used on Project
Exhibit 111 Inclusion of PKIs in Project
Exhibit 112 Functions of Digital Certificates/Keys
Exhibit 113 Place Where Digital Certificates/Keys are Stored
Exhibit 114 How Digital Certificates are Provisioned
Exhibit 115 CA Primarily Used to Issue Digital Certificate
Exhibit 116 Cost Per Device of Digital Certificate
Exhibit 117 Types of Devices Connected to Organization’s Enterprise/IT Network on Project
Exhibit 118 Types of Devices Connected to Organization’s Enterprise/IT Network on Similar Project in
Three Years
Exhibit 119 Do Organization’s Current IT Security Policies Cover IoT Devices
Exhibit 120 Has Organization Enacted IT Security Policies Specifically to Cover IoT Devices
Exhibit 121 Will Organization Enact Specific Security Policies for IoT Devices in Three Years
Exhibit 122 Expected Coverage of IoT Security Solutions from Organization’s IT Security Vendor
Exhibit 123 Types of Security Threats Organization is Concerned about for IoT Devices
Exhibit 124 Extent of Agreement with Following IoT Security Statements
Exhibit 125 Security Solutions Currently Used to Protect IoT Devices Connected to Organization’s
Network
Exhibit 126 Security Solutions Expected to be Used to Protect IoT Devices Connected to Organization’s Network in Three Years
Exhibit 127 Commercial IT Security Vendors Currently Used by Respondent’s Organization
Exhibit 128 Use of Security Solutions from IoT Specialist Vendors
Exhibit 129 Percentage of Organization’s IT Security Budget Related to Security
Exhibit 130 Percentage of Organization’s IT Security Budget Related to Commercial Security Software/Services
Exhibit 131 Percentage of Organization’s IT Security Budget Related to Security on a Similar Project in Three Years
Exhibit 132 Person Responsible for Selection and Purchase of Enterprise Security Solutions
Exhibit 133 Types of Tools Used on Project
Exhibit 134 Types of Tools Used on Similar Project in Three Years
Exhibit 135 Most Important Characteristics when Selecting Compiler Used on Project
Exhibit 136 Types of Compiler Purchased by Respondent’s Organization
Exhibit 137 Compilation Tools Currently Used on Project
Exhibit 138 Static Analysis or SAST Tools Used on Project
Exhibit 139 Most Important Characteristics when Selecting SAST or Static Analysis Tool Used on Project
Exhibit 140 Who Makes Purchasing Decision for Static Analysis and SAST Tools
Exhibit 141 Dynamic Testing or DAST Tools Being Used on Project
Exhibit 142 Most Important Characteristics when Selecting Dynamic Testing or DAST Tools Used on
Project
Exhibit 143 Who Makes Purchasing Decision for Dynamic Testing or DAST Tools
Exhibit 144 Requirements Management/Definition Tools being Used on Project
Exhibit 145 Most Important Characteristics when Selecting Requirements Management/Definition Tools Used on Project
Exhibit 146 Who Makes Purchasing Decision for Requirements Management/Definition Tools
Exhibit 147 Product Line Engineering (PLE) Tools Used on Project
Exhibit 148 Most Important Characteristics when Selecting PLE Tools Used on Project
Exhibit 149 Who Makes Purchasing Decision for PLE Tools
Exhibit 150 Release Management/Continuous Deployment Tools Used on Project
Exhibit 151 Most Important Characteristics when Selecting Release Management/Continuous
Deployment Tools Used on Project
Exhibit 152 Who Makes Purchasing Decision for Release Management/Continuous Deployment Tools
Exhibit 153 Software Composition Analysis (SCA)/IP Compliance Tools Used on Project
Exhibit 154 Most Important Characteristics when Selecting SCA/IP Compliance Tools Used on Project
Exhibit 155 Who Makes SCA/IP Compliance Tool Purchasing Decisions
Exhibit 156 Organization Linking System Requirements on Project
Exhibit 157 Description of Organization’s Requirements Engineering
Exhibit 158 Implementation/Investigation of ALM, PLM, EDA
Exhibit 159 Advantages/Benefits of Cross-Engineering Domain Integrations
Exhibit 160 Investigation/Implementation of Enhanced Delivery of Continuous Post-Deployment Content and Services Support
Exhibit 161 Approximate Cost Budgeted for all Tools Used on Project
Exhibit 162 Type of Prototyping Solutions Used on Project
Exhibit 163 Source of Prototyping Board Used on Project
Exhibit 164 ASIC Gate Count of Current Prototype
Exhibit 165 Number of FPGAs Used on Current Prototype
Exhibit 166 FPGA Vendors Used for Prototype Hardware on Project
Exhibit 167 Challenges of FPGA-based Prototyping
Exhibit 168 FPGA-based/Physical Prototyping Vendors Used on Project
Exhibit 169 Tasks for which Respondent Uses Virtual Prototyping
Exhibit 170 Virtual Prototyping Vendors Used on Project
Exhibit 171 Most Important Factors when Selecting Current Virtual Prototyping Platform
Exhibit 172 Team Responsible for Virtual Prototype Creation within Organization
Exhibit 173 Languages Used on Previous Project
Exhibit 174 Languages Used on Project
Exhibit 175 Languages Expected to be Used on Similar Project in Three Years
Exhibit 176 Estimated Total Source Lines of Code (SLOC) on Project
Exhibit 177 Percent of Total Software Code in Final Design from Following Sources
Exhibit 178 Expected Change in Source Lines of Code (SLOC) on Next Project: Commercial Third-Party Software
Exhibit 179 Expected Change in Source Lines of Code (SLOC) on Next Project: Open Source Third-
Party Software
Exhibit 180 Expected Change in Source Lines of Code (SLOC) on Next Project: In-house Developed
Code
Exhibit 181 Percent Increase Expected for SLOC: Commercial Third-Party Software
Exhibit 182 Percent Increase Expected for SLOC: Open Source Third-Party Software
Exhibit 183 Percent Increase Expected for SLOC: In-house Developed Code
Exhibit 184 Percent Decrease Expected for SLOC: Commercial Third-Party Software
Exhibit 185 Percent Decrease Expected for SLOC: Open Source Third-Party Software
Exhibit 186 Percent Decrease Expected for SLOC: In-House Developed Code
Exhibit 187 Percent of In-House Developed Software Code for Project from Certain Sources
Exhibit 188 Software Design Methodologies Used on Project
Exhibit 189 Software Design Methodologies Expected to be Used on Similar Project in Three Years
Exhibit 190 Certification/Process Standard(s) Adhered to
Exhibit 191 Adherence to Coding Standards
Exhibit 192 Deployment of IoT Capabilities and/or Applications into Organization’s Products
Exhibit 193 Primary Factor Driving Respondent’s Organization to Utilize/Deploy IoT Capabilities
Exhibit 194 IoT Will Allow Respondent’s Organization to…
Exhibit 195 Largest Overall Challenge for Respondent’s Organization in Developing IoT Solutions
Exhibit 196 Most Important Factors when Selecting Suppliers of IoT Components and Solutions
Exhibit 197 Use of IoT Cloud Services to Build Embedded/IoT Project
Exhibit 198 Use of IoT Cloud Services to Connect, Manage, or Analyze any of IoT Devices on Networks
Exhibit 199 Types of IoT Cloud Services being Used on Project
Exhibit 200 Types of IoT Cloud Services Expected to be Used on Similar Project in Three Years
Exhibit 201 Plans to Resell IoT Services as Value-Added Service
Exhibit 202 Types of Cloud Analytics Used for IoT Data
Exhibit 203 Types of Non-Cloud IoT Services Used to Support Customers on Project
Exhibit 204 IoT Cloud Platforms-as-a-Service (PaaS) Used in Project
Exhibit 205 IoT Cloud Platforms-as-a-Service (PaaS) Used on a Similar Project Three Years from Now
Exhibit 206 IoT Platform Functions Used on Project
Exhibit 207 IoT Platform Functions Expected to be Used on Similar Project in Three Years
Exhibit 208 Purchase/Use and Creation/Integration of IoT Gateways
Exhibit 209 Future Plans to Purchase/Integrate IoT Gateways
Exhibit 210 Expected Sourcing of Gateway Technology
Exhibit 211 Expected Number of Endpoints/Devices that will be Supported by the IoT Gateways
Purchased/Used/Integrated by Respondent’s Company
Exhibit 212 Most Important Requirements when Selecting Embedded Connectivity Products for IoT
Gateways Purchased/Used/Integrated by Respondent’s Company
Exhibit 213 Types of Other Devices/Systems IoT Gateways Designed to Connect to in Project
Exhibit 214 Percent of Overall Computation being Done at each Level of Full System