Summary

The global IC Package Heat Spreaders market size was US$ 1715 million in 2024 and is forecast to a readjusted size of US$ 2710 million by 2031 with a CAGR of 6.9% during the forecast period 2025-2031.
A heat spreader is high thermal conductive metallic materials for efficient heat dissipation from an IC chip in a semiconductor package.
This report studies the Heat Spreaders for semiconductor IC package, include FC (Flip Chip) heat spreaders and BGA heat spreaders. The Flip Chip heat spreaders include Lid/Ring type, Hat type, Flat Top type and Cavity type heat spreaders, etc. These spreaders are used in CPU packages for personal computers, CPU packages for servers, SoC/FPGA packages for automotive devices, Processor packages for communication equipment, and AI processor packages, etc.

Heat spreaders are one of the fundamental heat dissipation components used in various industries. They are typically made of high thermal conductivity metals such as copper or aluminum. In the electronics industry, heat spreaders or heat sinks are installed on electronic components or chips to transfer or dissipate the heat generated by the components using the thermal conductivity of the heat dissipation material itself. Heat spreaders find wide applications in the electronic information industry, semiconductor industry, and optoelectronic component industry, with downstream applications extending to the 3C industry.

Furthermore, electric vehicles (EVs) and hybrid electric vehicles (HEVs) have become a major trend in automotive development. In the inverters and rectifiers of electric vehicles, high-power chip modules pose thermal dissipation challenges. Currently, the mainstream solution for such designs is to use water-cooled heat spreaders. By utilizing highly thermally conductive metal materials, along with metal processing techniques and surface treatments, the chip temperature can be controlled within an acceptable range using water cooling. The thermal design of water-cooled heat spreaders needs to effectively dissipate the heat generated by the chips, while considering the cost and manufacturability aspects of the design for mass production.

Currently, the global heat spreader market is primarily dominated by manufacturers from Japan, the United States, and China Taiwan, with China Taiwan being the largest production region, accounting for approximately 57% of the global market share in 2024. Japan and the United States are also significant production regions, with market shares of 16.7% and 17.1%, respectively, in 2024. Chinese manufacturers entered this field relatively late, with two main players currently holding a combined global market share of 4.98% in 2024, which is expected to grow to 10.25% by 2031.

In terms of materials, copper heat spreaders currently dominate the market, accounting for 89% of the market share in 2024. Due to the design changes in AI chips, heat spreaders have not only become larger and thicker but also shifted materials. Historically, copper was the primary material used for heat spreaders due to its high thermal conductivity of 401 W/m.K, which is higher than that of gold or aluminum, second only to silver. However, heat spreader materials are now moving toward stainless steel, which has higher hardness and is more difficult to process, thus raising the technological barriers for manufacturers. In the coming years, stainless steel-based heat spreader are expected to see faster growth.

Regarding chip sizes, the proportion of large-sized heat spreader products is gradually increasing. Heat spreaders are closely related to chip packaging. In the past, processors required heat spreaders with an area of around 30mm x 30mm. Now, with chip manufacturers enhancing computational speeds and incorporating more memory, the number of bare die (chips) has significantly increased, expanding the area to 60mm x 60mm or larger. In 2024, heat spreaders with sizes greater than 35mm x 35mm will account for approximately 53%, and it is expected to rise to 61% by 2031.

In terms of market application, PC CPU/GPU heat spreaders currently hold the largest market share, accounting for 52% in 2024. However, the server/data center sector is growing at a faster pace, accounting for 35% in 2024 and projected to reach 50% by 2031.
The main global heat spreader manufacturers include Jentech Precision Industrial, Honeywell, Shinko, Fujikura, I-Chiun, Favor Precision Technology, and Shandong Ruisi Precision Industry. The top five global manufacturers are expected to account for approximately 91% of the market share in 2024. In the coming years, competition in this industry is expected to intensify.

The global IC Package Heat Spreaders market is strategically segmented by company, region (country), by Type, and by Application. This report empowers stakeholders to capitalize on emerging opportunities, optimize product strategies, and outperform competitors through data-driven insights on sales, revenue, and forecasts across regions, by Type, and by Application for 2020-2031.

Market Segmentation
By Company:
Shinko
Fujikura
Honeywell Advanced Materials
Jentech Precision Industrial
I-Chiun
Favor Precision Technology
Niching Industrial Corporation
Fastrong Technologies Corp.
ECE (Excel Cell Electronic)
Shandong Ruisi Precision Industry
HongRiDa Electronics (HRD)
TBT Co., Ltd
By Type: (Dominant Segment vs High-Margin Innovation)
Cu Heat Spreader
Stainless Steel Heat Spreader
By Application: (Core Demand Driver vs Emerging Opportunity)
PC CPU/GPU Package
Server/Data Center/AI Chip Package
Automotive SoC/FPGA Package
Gaming Console
Others
By Region
Macro-Regional Analysis: Market Size & Growth Forecasts
- North America
- Europe
- Asia-Pacific
- South America
- Middle East & Africa
Micro-Local Market Deep Dive: Strategic Insights
- Competitive Landscape: Player dominance vs. disruptors (e.g., Shinko in Europe)
- Emerging Product Trends: Cu Heat Spreader adoption vs. Stainless Steel Heat Spreader premiumization
- Demand-Side Dynamics: PC CPU/GPU Package growth in China vs. Server/Data Center/AI Chip Package potential in {{RegionFour}}
- Localized Consumer Needs: Regulatory hurdles in EU vs. price sensitivity in India
Focus Markets:
Japan
China Taiwan
North America
China

Chapter Outline
Chapter 1: Report scope, executive summary, and market evolution scenarios (short/mid/long term).
Chapter 2: Quantitative analysis of IC Package Heat Spreaders market size and growth potential at global, regional, and country levels.
Chapter 3: Competitive benchmarking of manufacturers (revenue, market share, M&A, R&D focus).
Chapter 4: Type-based segmentation analysis – Uncovering blue ocean markets (e.g., Stainless Steel Heat Spreader in China).
Chapter 5: Application-based segmentation analysis – High-growth downstream opportunities (e.g., Server/Data Center/AI Chip Package in India).
Chapter 6: Regional sales and revenue breakdown by company, type, application and customer.
Chapter 7: Key manufacturer profiles – Financials, product portfolios, and strategic developments.
Chapter 8: Market dynamics – Drivers, restraints, regulatory impacts, and risk mitigation strategies.
Chapter 9: Actionable conclusions and strategic recommendations.
Why This Report?
Unlike generic global market reports, this study combines macro-level industry trends with hyper-local operational intelligence, empowering data-driven decisions across the IC Package Heat Spreaders value chain, addressing:
- Market entry risks/opportunities by region
- Product mix optimization based on local practices
- Competitor tactics in fragmented vs. consolidated markets

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Table of Contents

1 Market Overview
1.1 IC Package Heat Spreaders Product Scope
1.2 IC Package Heat Spreaders by Type
1.2.1 Global IC Package Heat Spreaders Sales by Type (2020 & 2024 & 2031)
1.2.2 Cu Heat Spreader
1.2.3 Stainless Steel Heat Spreader
1.3 IC Package Heat Spreaders by Application
1.3.1 Global IC Package Heat Spreaders Sales Comparison by Application (2020 & 2024 & 2031)
1.3.2 PC CPU/GPU Package
1.3.3 Server/Data Center/AI Chip Package
1.3.4 Automotive SoC/FPGA Package
1.3.5 Gaming Console
1.3.6 Others
1.4 Global IC Package Heat Spreaders Market Estimates and Forecasts (2020-2031)
1.4.1 Global IC Package Heat Spreaders Market Size in Value Growth Rate (2020-2031)
1.4.2 Global IC Package Heat Spreaders Market Size in Volume Growth Rate (2020-2031)
1.4.3 Global IC Package Heat Spreaders Price Trends (2020-2031)
1.5 Assumptions and Limitations
2 Market Size and Prospective by Region
2.1 Global IC Package Heat Spreaders Market Size by Region: 2020 VS 2024 VS 2031
2.2 Global IC Package Heat Spreaders Retrospective Market Scenario by Region (2020-2025)
2.2.1 Global IC Package Heat Spreaders Sales Market Share by Region (2020-2025)
2.2.2 Global IC Package Heat Spreaders Revenue Market Share by Region (2020-2025)
2.3 Global IC Package Heat Spreaders Market Estimates and Forecasts by Region (2026-2031)
2.3.1 Global IC Package Heat Spreaders Sales Estimates and Forecasts by Region (2026-2031)
2.3.2 Global IC Package Heat Spreaders Revenue Forecast by Region (2026-2031)
2.4 Major Region and Emerging Market Analysis
2.4.1 Japan IC Package Heat Spreaders Market Size and Prospective (2020-2031)
2.4.2 China Taiwan IC Package Heat Spreaders Market Size and Prospective (2020-2031)
2.4.3 North America IC Package Heat Spreaders Market Size and Prospective (2020-2031)
2.4.4 China IC Package Heat Spreaders Market Size and Prospective (2020-2031)
3 Global Market Size by Type
3.1 Global IC Package Heat Spreaders Historic Market Review by Type (2020-2025)
3.1.1 Global IC Package Heat Spreaders Sales by Type (2020-2025)
3.1.2 Global IC Package Heat Spreaders Revenue by Type (2020-2025)
3.1.3 Global IC Package Heat Spreaders Price by Type (2020-2025)
3.2 Global IC Package Heat Spreaders Market Estimates and Forecasts by Type (2026-2031)
3.2.1 Global IC Package Heat Spreaders Sales Forecast by Type (2026-2031)
3.2.2 Global IC Package Heat Spreaders Revenue Forecast by Type (2026-2031)
3.2.3 Global IC Package Heat Spreaders Price Forecast by Type (2026-2031)
3.3 Different Types IC Package Heat Spreaders Representative Players
4 Global Market Size by Application
4.1 Global IC Package Heat Spreaders Historic Market Review by Application (2020-2025)
4.1.1 Global IC Package Heat Spreaders Sales by Application (2020-2025)
4.1.2 Global IC Package Heat Spreaders Revenue by Application (2020-2025)
4.1.3 Global IC Package Heat Spreaders Price by Application (2020-2025)
4.2 Global IC Package Heat Spreaders Market Estimates and Forecasts by Application (2026-2031)
4.2.1 Global IC Package Heat Spreaders Sales Forecast by Application (2026-2031)
4.2.2 Global IC Package Heat Spreaders Revenue Forecast by Application (2026-2031)
4.2.3 Global IC Package Heat Spreaders Price Forecast by Application (2026-2031)
4.3 New Sources of Growth in IC Package Heat Spreaders Application
5 Competition Landscape by Players
5.1 Global IC Package Heat Spreaders Sales by Players (2020-2025)
5.2 Global Top IC Package Heat Spreaders Players by Revenue (2020-2025)
5.3 Global IC Package Heat Spreaders Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in IC Package Heat Spreaders as of 2024)
5.4 Global IC Package Heat Spreaders Average Price by Company (2020-2025)
5.5 Global Key Manufacturers of IC Package Heat Spreaders, Manufacturing Sites & Headquarters
5.6 Global Key Manufacturers of IC Package Heat Spreaders, Product Type & Application
5.7 Global Key Manufacturers of IC Package Heat Spreaders, Date of Enter into This Industry
5.8 Manufacturers Mergers & Acquisitions, Expansion Plans
6 Region Analysis
6.1 Japan Market: Players, Segments, Downstream and Major Customers
6.1.1 Japan IC Package Heat Spreaders Sales by Company
6.1.1.1 Japan IC Package Heat Spreaders Sales by Company (2020-2025)
6.1.1.2 Japan IC Package Heat Spreaders Revenue by Company (2020-2025)
6.1.2 Japan IC Package Heat Spreaders Sales Breakdown by Type (2020-2025)
6.1.3 Japan IC Package Heat Spreaders Sales Breakdown by Application (2020-2025)
6.1.4 Japan IC Package Heat Spreaders Major Customer
6.1.5 Japan Market Trend and Opportunities
6.2 China Taiwan Market: Players, Segments, Downstream and Major Customers
6.2.1 China Taiwan IC Package Heat Spreaders Sales by Company
6.2.1.1 China Taiwan IC Package Heat Spreaders Sales by Company (2020-2025)
6.2.1.2 China Taiwan IC Package Heat Spreaders Revenue by Company (2020-2025)
6.2.2 China Taiwan IC Package Heat Spreaders Sales Breakdown by Type (2020-2025)
6.2.3 China Taiwan IC Package Heat Spreaders Sales Breakdown by Application (2020-2025)
6.2.4 China Taiwan IC Package Heat Spreaders Major Customer
6.2.5 China Taiwan Market Trend and Opportunities
6.3 North America Market: Players, Segments, Downstream and Major Customers
6.3.1 North America IC Package Heat Spreaders Sales by Company
6.3.1.1 North America IC Package Heat Spreaders Sales by Company (2020-2025)
6.3.1.2 North America IC Package Heat Spreaders Revenue by Company (2020-2025)
6.3.2 North America IC Package Heat Spreaders Sales Breakdown by Type (2020-2025)
6.3.3 North America IC Package Heat Spreaders Sales Breakdown by Application (2020-2025)
6.3.4 North America IC Package Heat Spreaders Major Customer
6.3.5 North America Market Trend and Opportunities
6.4 China Market: Players, Segments, Downstream and Major Customers
6.4.1 China IC Package Heat Spreaders Sales by Company
6.4.1.1 China IC Package Heat Spreaders Sales by Company (2020-2025)
6.4.1.2 China IC Package Heat Spreaders Revenue by Company (2020-2025)
6.4.2 China IC Package Heat Spreaders Sales Breakdown by Type (2020-2025)
6.4.3 China IC Package Heat Spreaders Sales Breakdown by Application (2020-2025)
6.4.4 China IC Package Heat Spreaders Major Customer
6.4.5 China Market Trend and Opportunities
7 Company Profiles and Key Figures
7.1 Shinko
7.1.1 Shinko Company Information
7.1.2 Shinko Business Overview
7.1.3 Shinko IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.1.4 Shinko IC Package Heat Spreaders Products Offered
7.1.5 Shinko Recent Development
7.2 Fujikura
7.2.1 Fujikura Company Information
7.2.2 Fujikura Business Overview
7.2.3 Fujikura IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.2.4 Fujikura IC Package Heat Spreaders Products Offered
7.2.5 Fujikura Recent Development
7.3 Honeywell Advanced Materials
7.3.1 Honeywell Advanced Materials Company Information
7.3.2 Honeywell Advanced Materials Business Overview
7.3.3 Honeywell Advanced Materials IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.3.4 Honeywell Advanced Materials IC Package Heat Spreaders Products Offered
7.3.5 Honeywell Advanced Materials Recent Development
7.4 Jentech Precision Industrial
7.4.1 Jentech Precision Industrial Company Information
7.4.2 Jentech Precision Industrial Business Overview
7.4.3 Jentech Precision Industrial IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.4.4 Jentech Precision Industrial IC Package Heat Spreaders Products Offered
7.4.5 Jentech Precision Industrial Recent Development
7.5 I-Chiun
7.5.1 I-Chiun Company Information
7.5.2 I-Chiun Business Overview
7.5.3 I-Chiun IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.5.4 I-Chiun IC Package Heat Spreaders Products Offered
7.5.5 I-Chiun Recent Development
7.6 Favor Precision Technology
7.6.1 Favor Precision Technology Company Information
7.6.2 Favor Precision Technology Business Overview
7.6.3 Favor Precision Technology IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.6.4 Favor Precision Technology IC Package Heat Spreaders Products Offered
7.6.5 Favor Precision Technology Recent Development
7.7 Niching Industrial Corporation
7.7.1 Niching Industrial Corporation Company Information
7.7.2 Niching Industrial Corporation Business Overview
7.7.3 Niching Industrial Corporation IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.7.4 Niching Industrial Corporation IC Package Heat Spreaders Products Offered
7.7.5 Niching Industrial Corporation Recent Development
7.8 Fastrong Technologies Corp.
7.8.1 Fastrong Technologies Corp. Company Information
7.8.2 Fastrong Technologies Corp. Business Overview
7.8.3 Fastrong Technologies Corp. IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.8.4 Fastrong Technologies Corp. IC Package Heat Spreaders Products Offered
7.8.5 Fastrong Technologies Corp. Recent Development
7.9 ECE (Excel Cell Electronic)
7.9.1 ECE (Excel Cell Electronic) Company Information
7.9.2 ECE (Excel Cell Electronic) Business Overview
7.9.3 ECE (Excel Cell Electronic) IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.9.4 ECE (Excel Cell Electronic) IC Package Heat Spreaders Products Offered
7.9.5 ECE (Excel Cell Electronic) Recent Development
7.10 Shandong Ruisi Precision Industry
7.10.1 Shandong Ruisi Precision Industry Company Information
7.10.2 Shandong Ruisi Precision Industry Business Overview
7.10.3 Shandong Ruisi Precision Industry IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.10.4 Shandong Ruisi Precision Industry IC Package Heat Spreaders Products Offered
7.10.5 Shandong Ruisi Precision Industry Recent Development
7.11 HongRiDa Electronics (HRD)
7.11.1 HongRiDa Electronics (HRD) Company Information
7.11.2 HongRiDa Electronics (HRD) Business Overview
7.11.3 HongRiDa Electronics (HRD) IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.11.4 HongRiDa Electronics (HRD) IC Package Heat Spreaders Products Offered
7.11.5 HongRiDa Electronics (HRD) Recent Development
7.12 TBT Co., Ltd
7.12.1 TBT Co., Ltd Company Information
7.12.2 TBT Co., Ltd Business Overview
7.12.3 TBT Co., Ltd IC Package Heat Spreaders Sales, Revenue and Gross Margin (2020-2025)
7.12.4 TBT Co., Ltd IC Package Heat Spreaders Products Offered
7.12.5 TBT Co., Ltd Recent Development
8 IC Package Heat Spreaders Manufacturing Cost Analysis
8.1 IC Package Heat Spreaders Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Key Suppliers of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.3 Manufacturing Process Analysis of IC Package Heat Spreaders
8.4 IC Package Heat Spreaders Industrial Chain Analysis
9 Marketing Channel, Distributors and Customers
9.1 Marketing Channel
9.2 IC Package Heat Spreaders Distributors List
9.3 IC Package Heat Spreaders Customers
10 IC Package Heat Spreaders Market Dynamics
10.1 IC Package Heat Spreaders Industry Trends
10.2 IC Package Heat Spreaders Market Drivers
10.3 IC Package Heat Spreaders Market Challenges
10.4 IC Package Heat Spreaders Market Restraints
11 Research Findings and Conclusion
12 Appendix
12.1 Research Methodology
12.1.1 Methodology/Research Approach
12.1.1.1 Research Programs/Design
12.1.1.2 Market Size Estimation
12.1.1.3 Market Breakdown and Data Triangulation
12.1.2 Data Source
12.1.2.1 Secondary Sources
12.1.2.2 Primary Sources
12.2 Author Details
12.3 Disclaimer