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フリップチップCSP(FCCSP)パッケージの世界市場インサイト、2029年までの予測


Global Flip Chip CSP (FCCSP) Package Market Insights, Forecast to 2029

FCCSP(Flip Chip Scale Package)は、I/O数が200以下のチップスケール容量に対応したパッケージです。FCCSPは、DCA(Direct Chip Attach)やCOB(Chip On Board)と比較して、チップの保護やはんだ接合部の信頼... もっと見る

 

 

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2023年5月19日 US$4,900
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FCCSP(Flip Chip Scale Package)は、I/O数が200以下のチップスケール容量に対応したパッケージです。FCCSPは、DCA(Direct Chip Attach)やCOB(Chip On Board)と比較して、チップの保護やはんだ接合部の信頼性に優れています。FCCSPは、KGD(Known Good Die)よりも低コストでテストやバーンインが可能であり、KGDと同等の電気的機能を発揮する。また、薄型・小型で軽量なパッケージが特徴です。
フリップチップCSP(FCCSP)パッケージの世界市場は、2023年の100万米ドルから2029年には100万米ドルまで、予測期間中に年平均成長率(CAGR)%で成長すると予測されています。
フリップチップCSP(FCCSP)パッケージの米国・カナダ市場は、2023年の100万米ドルから2029年には100万米ドルに達すると予測され、2023年から2029年の予測期間中にCAGR %で増加する見込みです。
フリップチップCSP(FCCSP)パッケージの中国市場は、2023年の100万ドルから2029年には100万ドルに達すると推定され、2023年から2029年の予測期間中に年平均成長率は%になると予測されます。
フリップチップCSP(FCCSP)パッケージのヨーロッパ市場は、2023年の100万ドルから2029年には100万ドルに達すると推定され、2023年から2029年までの予測期間中に年平均成長率は%になると予測されます。

フリップチップCSP(FCCSP)パッケージの世界の主要メーカーは、Amkor、Taiwan Semiconductor Manufacturing、ASE Group、Intel Corporation、JCET Group Co.Ltd、Samsung Group、SPIL、Powertech Technology、Tongfu Microelectronics Co., Ltdなど。2022年、世界の上位5社の売上高シェアは約 %でした。
生産面では、本レポートでは、2018年から2023年まで、2029年までの予測で、フリップチップCSP(FCCSP)パッケージの生産量、成長率、メーカー別、地域別(地域レベル、国レベル)市場シェアを調査しています。
消費面では、本レポートは、フリップチップCSP(FCCSP)パッケージの地域別(地域レベル、国レベル)、メーカー別、タイプ別、用途別の売上高を2018年から2023年まで、2029年までの予測で調査しています。

レポートには、以下の内容が含まれています:
本レポートでは、Flip Chip CSP (FCCSP) Packageの世界市場の概要、容量、生産量、収益、価格について紹介します。2018年~2022年の過去の市場収益/売上データ、2023年の予測、2029年までのCAGRの予測など、世界市場動向の分析を行っています。
本レポートでは、フリップチップCSP(FCCSP)パッケージの主要生産者を調査し、主要地域と国の消費も提供しています。フリップチップCSP(FCCSP)パッケージの今後の市場可能性のハイライトと、この市場を様々なセグメントとサブセグメントに分けて予測するための主要地域/国別の注目点。米国、カナダ、メキシコ、ブラジル、中国、日本、韓国、東南アジア、インド、ドイツ、英国、イタリア、中東、アフリカ、その他の国々の国別データおよび市場価値分析。

本レポートでは、2018年から2023年のデータで、主要メーカーのフリップチップCSP(FCCSP)パッケージの売上、収益、市場シェア、業界ランキングに焦点を当てています。世界のフリップチップCSP(FCCSP)パッケージ市場における主要なステークホルダーを特定し、その競争環境と市場ポジショニングを最近の動向とセグメント別の収益に基づき分析します。本レポートは、関係者が競争環境を理解し、より多くの洞察を得て、より良い方法で事業と市場戦略を位置づけるのに役立ちます。
本レポートでは、2018年から2029年までの、タイプ別、用途別のセグメントデータ、売上、収益、価格を分析しています。フリップチップCSP(FCCSP)パッケージの販売、予測される成長動向、生産技術、アプリケーション、エンドユーザー産業の評価と市場規模を予測します。
Amkor、Taiwan Semiconductor Manufacturing、ASE Group、Intel Corporation、JCET Group Co.,Ltd、Samsung Group、SPIL、Powertech Technology、Tongfu Microelectronics Co., Ltdなど、世界の主要プレイヤーの説明的企業プロフィール。

会社別
アムコア
台湾セミコンダクター・マニュファクチャリング
ASEグループ
インテル株式会社
JCET Group Co.
サムスングループ
SPIL
パワーテック・テクノロジー
同富微電子有限公司
天水華天科技有限公司
ユナイテッドマイクロエレクトロニクス
SFAセミコン
タイプ別セグメント
ベアダイタイプ
モールド(CUF、MUF)タイプ
SiPタイプ
ハイブリッド(fcSCSP)タイプ
その他
用途別セグメント
自動車・輸送機器
コンシューマーエレクトロニクス
通信機器
その他
地域別生産量
北アメリカ
欧州
中国
日本
韓国
地域別売上高
米国・カナダ
米国
カナダ
中国
アジア(中国を除く)
日本
韓国
中国 台湾
東南アジア
インド
欧州
ドイツ
フランス
英国
イタリア
ロシア
中近東・アフリカ・中南米
ブラジル
メキシコ
トルコ
イスラエル
GCC諸国

各章の概要
第1章:報告書のスコープ、異なる市場セグメント(タイプ別、アプリケーション別など)のエグゼクティブサマリー、各市場セグメントの市場規模、将来の発展可能性などを紹介します。市場の現状と、短中期および長期的にどのような進化を遂げるかについて、高いレベルの見解を示しています。
第2章:フリップチップCSP(FCCSP)パッケージの世界および主要生産者(地域/国)の生産/生産量。各生産者の生産量と今後6年間の開発可能性を定量的に分析しています。
第3章 フリップチップCSP(FCCSP)パッケージの世界、地域レベル、国レベルの販売(消費)、収益。各地域とその主要国の市場規模と発展可能性を定量的に分析し、世界各国の市場発展、今後の発展見通し、市場スペース、生産能力などを紹介しています。
第4章:フリップチップCSP(FCCSP)パッケージメーカーの競争環境、価格、売上、収益、市場シェア、業界ランキング、最新の開発計画、M&A情報などを詳細に分析します。
第5章:各種市場セグメントを種類別に分析し、各市場セグメントの売上高、収益、平均価格、発展可能性を網羅し、読者が異なる市場セグメントでブルーオーシャン市場を見つけるのに役立ちます。
第6章:読者が異なる下流市場でブルーオーシャン市場を見つけるのを助けるために、各市場セグメントの売上高、収益、平均価格、および開発可能性をカバーする、アプリケーション別の様々な市場セグメントの分析を提供します。
第7章:北米(米国・カナダ)タイプ別、用途別、国別、セグメント別の売上高と収益。
第8章:ヨーロッパ:タイプ別、アプリケーション別、国別、セグメント別の売上高と収益。
第9章:中国 種類別、用途別、国別、各セグメント別の売上と収益。
第10章:アジア(中国を除く) タイプ別、アプリケーション別、地域別、各セグメント別の売上と収益。
第11章:中東、アフリカ、中南米 タイプ別、アプリケーション別、国別、各セグメント別の売上と収益。
第12章:主要メーカーのプロファイルを提供し、製品の説明と仕様、フリップチップCSP(FCCSP)パッケージの売上、収益、価格、粗利益率、最近の開発など、市場の主要企業の基本状況を詳細に紹介します。
第13章:産業チェーン、販売チャネル、主要原材料、流通業者、顧客に関する分析。
第14章:市場力学、市場の最新動向、市場の推進要因と制限要因、業界メーカーが直面する課題とリスク、業界の関連政策の分析を紹介する。
第15章:本レポートの要点と結論。


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目次

1 Study Coverage
1.1 Flip Chip CSP (FCCSP) Package Product Introduction
1.2 Market by Type
1.2.1 Global Flip Chip CSP (FCCSP) Package Market Size by Type, 2018 VS 2022 VS 2029
1.2.2 Bare Die Type
1.2.3 Molded (CUF, MUF) Type
1.2.4 SiP Type
1.2.5 Hybrid (fcSCSP) Type
1.2.6 Others
1.3 Market by Application
1.3.1 Global Flip Chip CSP (FCCSP) Package Market Size by Application, 2018 VS 2022 VS 2029
1.3.2 Auto and Transportation
1.3.3 Consumer Electronics
1.3.4 Communication
1.3.5 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Flip Chip CSP (FCCSP) Package Production
2.1 Global Flip Chip CSP (FCCSP) Package Production Capacity (2018-2029)
2.2 Global Flip Chip CSP (FCCSP) Package Production by Region: 2018 VS 2022 VS 2029
2.3 Global Flip Chip CSP (FCCSP) Package Production by Region
2.3.1 Global Flip Chip CSP (FCCSP) Package Historic Production by Region (2018-2023)
2.3.2 Global Flip Chip CSP (FCCSP) Package Forecasted Production by Region (2024-2029)
2.3.3 Global Flip Chip CSP (FCCSP) Package Production Market Share by Region (2018-2029)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Executive Summary
3.1 Global Flip Chip CSP (FCCSP) Package Revenue Estimates and Forecasts 2018-2029
3.2 Global Flip Chip CSP (FCCSP) Package Revenue by Region
3.2.1 Global Flip Chip CSP (FCCSP) Package Revenue by Region: 2018 VS 2022 VS 2029
3.2.2 Global Flip Chip CSP (FCCSP) Package Revenue by Region (2018-2023)
3.2.3 Global Flip Chip CSP (FCCSP) Package Revenue by Region (2024-2029)
3.2.4 Global Flip Chip CSP (FCCSP) Package Revenue Market Share by Region (2018-2029)
3.3 Global Flip Chip CSP (FCCSP) Package Sales Estimates and Forecasts 2018-2029
3.4 Global Flip Chip CSP (FCCSP) Package Sales by Region
3.4.1 Global Flip Chip CSP (FCCSP) Package Sales by Region: 2018 VS 2022 VS 2029
3.4.2 Global Flip Chip CSP (FCCSP) Package Sales by Region (2018-2023)
3.4.3 Global Flip Chip CSP (FCCSP) Package Sales by Region (2024-2029)
3.4.4 Global Flip Chip CSP (FCCSP) Package Sales Market Share by Region (2018-2029)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global Flip Chip CSP (FCCSP) Package Sales by Manufacturers
4.1.1 Global Flip Chip CSP (FCCSP) Package Sales by Manufacturers (2018-2023)
4.1.2 Global Flip Chip CSP (FCCSP) Package Sales Market Share by Manufacturers (2018-2023)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of Flip Chip CSP (FCCSP) Package in 2022
4.2 Global Flip Chip CSP (FCCSP) Package Revenue by Manufacturers
4.2.1 Global Flip Chip CSP (FCCSP) Package Revenue by Manufacturers (2018-2023)
4.2.2 Global Flip Chip CSP (FCCSP) Package Revenue Market Share by Manufacturers (2018-2023)
4.2.3 Global Top 10 and Top 5 Companies by Flip Chip CSP (FCCSP) Package Revenue in 2022
4.3 Global Flip Chip CSP (FCCSP) Package Sales Price by Manufacturers
4.4 Global Key Players of Flip Chip CSP (FCCSP) Package, Industry Ranking, 2021 VS 2022 VS 2023
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Flip Chip CSP (FCCSP) Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Product Offered and Application
4.8 Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Flip Chip CSP (FCCSP) Package Sales by Type
5.1.1 Global Flip Chip CSP (FCCSP) Package Historical Sales by Type (2018-2023)
5.1.2 Global Flip Chip CSP (FCCSP) Package Forecasted Sales by Type (2024-2029)
5.1.3 Global Flip Chip CSP (FCCSP) Package Sales Market Share by Type (2018-2029)
5.2 Global Flip Chip CSP (FCCSP) Package Revenue by Type
5.2.1 Global Flip Chip CSP (FCCSP) Package Historical Revenue by Type (2018-2023)
5.2.2 Global Flip Chip CSP (FCCSP) Package Forecasted Revenue by Type (2024-2029)
5.2.3 Global Flip Chip CSP (FCCSP) Package Revenue Market Share by Type (2018-2029)
5.3 Global Flip Chip CSP (FCCSP) Package Price by Type
5.3.1 Global Flip Chip CSP (FCCSP) Package Price by Type (2018-2023)
5.3.2 Global Flip Chip CSP (FCCSP) Package Price Forecast by Type (2024-2029)
6 Market Size by Application
6.1 Global Flip Chip CSP (FCCSP) Package Sales by Application
6.1.1 Global Flip Chip CSP (FCCSP) Package Historical Sales by Application (2018-2023)
6.1.2 Global Flip Chip CSP (FCCSP) Package Forecasted Sales by Application (2024-2029)
6.1.3 Global Flip Chip CSP (FCCSP) Package Sales Market Share by Application (2018-2029)
6.2 Global Flip Chip CSP (FCCSP) Package Revenue by Application
6.2.1 Global Flip Chip CSP (FCCSP) Package Historical Revenue by Application (2018-2023)
6.2.2 Global Flip Chip CSP (FCCSP) Package Forecasted Revenue by Application (2024-2029)
6.2.3 Global Flip Chip CSP (FCCSP) Package Revenue Market Share by Application (2018-2029)
6.3 Global Flip Chip CSP (FCCSP) Package Price by Application
6.3.1 Global Flip Chip CSP (FCCSP) Package Price by Application (2018-2023)
6.3.2 Global Flip Chip CSP (FCCSP) Package Price Forecast by Application (2024-2029)
7 US & Canada
7.1 US & Canada Flip Chip CSP (FCCSP) Package Market Size by Type
7.1.1 US & Canada Flip Chip CSP (FCCSP) Package Sales by Type (2018-2029)
7.1.2 US & Canada Flip Chip CSP (FCCSP) Package Revenue by Type (2018-2029)
7.2 US & Canada Flip Chip CSP (FCCSP) Package Market Size by Application
7.2.1 US & Canada Flip Chip CSP (FCCSP) Package Sales by Application (2018-2029)
7.2.2 US & Canada Flip Chip CSP (FCCSP) Package Revenue by Application (2018-2029)
7.3 US & Canada Flip Chip CSP (FCCSP) Package Sales by Country
7.3.1 US & Canada Flip Chip CSP (FCCSP) Package Revenue by Country: 2018 VS 2022 VS 2029
7.3.2 US & Canada Flip Chip CSP (FCCSP) Package Sales by Country (2018-2029)
7.3.3 US & Canada Flip Chip CSP (FCCSP) Package Revenue by Country (2018-2029)
7.3.4 United States
7.3.5 Canada
8 Europe
8.1 Europe Flip Chip CSP (FCCSP) Package Market Size by Type
8.1.1 Europe Flip Chip CSP (FCCSP) Package Sales by Type (2018-2029)
8.1.2 Europe Flip Chip CSP (FCCSP) Package Revenue by Type (2018-2029)
8.2 Europe Flip Chip CSP (FCCSP) Package Market Size by Application
8.2.1 Europe Flip Chip CSP (FCCSP) Package Sales by Application (2018-2029)
8.2.2 Europe Flip Chip CSP (FCCSP) Package Revenue by Application (2018-2029)
8.3 Europe Flip Chip CSP (FCCSP) Package Sales by Country
8.3.1 Europe Flip Chip CSP (FCCSP) Package Revenue by Country: 2018 VS 2022 VS 2029
8.3.2 Europe Flip Chip CSP (FCCSP) Package Sales by Country (2018-2029)
8.3.3 Europe Flip Chip CSP (FCCSP) Package Revenue by Country (2018-2029)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China Flip Chip CSP (FCCSP) Package Market Size by Type
9.1.1 China Flip Chip CSP (FCCSP) Package Sales by Type (2018-2029)
9.1.2 China Flip Chip CSP (FCCSP) Package Revenue by Type (2018-2029)
9.2 China Flip Chip CSP (FCCSP) Package Market Size by Application
9.2.1 China Flip Chip CSP (FCCSP) Package Sales by Application (2018-2029)
9.2.2 China Flip Chip CSP (FCCSP) Package Revenue by Application (2018-2029)
10 Asia (excluding China)
10.1 Asia Flip Chip CSP (FCCSP) Package Market Size by Type
10.1.1 Asia Flip Chip CSP (FCCSP) Package Sales by Type (2018-2029)
10.1.2 Asia Flip Chip CSP (FCCSP) Package Revenue by Type (2018-2029)
10.2 Asia Flip Chip CSP (FCCSP) Package Market Size by Application
10.2.1 Asia Flip Chip CSP (FCCSP) Package Sales by Application (2018-2029)
10.2.2 Asia Flip Chip CSP (FCCSP) Package Revenue by Application (2018-2029)
10.3 Asia Flip Chip CSP (FCCSP) Package Sales by Region
10.3.1 Asia Flip Chip CSP (FCCSP) Package Revenue by Region: 2018 VS 2022 VS 2029
10.3.2 Asia Flip Chip CSP (FCCSP) Package Revenue by Region (2018-2029)
10.3.3 Asia Flip Chip CSP (FCCSP) Package Sales by Region (2018-2029)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Market Size by Type
11.1.1 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Sales by Type (2018-2029)
11.1.2 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Revenue by Type (2018-2029)
11.2 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Market Size by Application
11.2.1 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Sales by Application (2018-2029)
11.2.2 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Revenue by Application (2018-2029)
11.3 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Sales by Country
11.3.1 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Revenue by Country: 2018 VS 2022 VS 2029
11.3.2 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Revenue by Country (2018-2029)
11.3.3 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Sales by Country (2018-2029)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 Amkor
12.1.1 Amkor Company Information
12.1.2 Amkor Overview
12.1.3 Amkor Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.1.4 Amkor Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Amkor Recent Developments
12.2 Taiwan Semiconductor Manufacturing
12.2.1 Taiwan Semiconductor Manufacturing Company Information
12.2.2 Taiwan Semiconductor Manufacturing Overview
12.2.3 Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.2.4 Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Taiwan Semiconductor Manufacturing Recent Developments
12.3 ASE Group
12.3.1 ASE Group Company Information
12.3.2 ASE Group Overview
12.3.3 ASE Group Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.3.4 ASE Group Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 ASE Group Recent Developments
12.4 Intel Corporation
12.4.1 Intel Corporation Company Information
12.4.2 Intel Corporation Overview
12.4.3 Intel Corporation Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.4.4 Intel Corporation Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Intel Corporation Recent Developments
12.5 JCET Group Co.,Ltd
12.5.1 JCET Group Co.,Ltd Company Information
12.5.2 JCET Group Co.,Ltd Overview
12.5.3 JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.5.4 JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 JCET Group Co.,Ltd Recent Developments
12.6 Samsung Group
12.6.1 Samsung Group Company Information
12.6.2 Samsung Group Overview
12.6.3 Samsung Group Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.6.4 Samsung Group Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Samsung Group Recent Developments
12.7 SPIL
12.7.1 SPIL Company Information
12.7.2 SPIL Overview
12.7.3 SPIL Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.7.4 SPIL Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 SPIL Recent Developments
12.8 Powertech Technology
12.8.1 Powertech Technology Company Information
12.8.2 Powertech Technology Overview
12.8.3 Powertech Technology Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.8.4 Powertech Technology Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Powertech Technology Recent Developments
12.9 Tongfu Microelectronics Co., Ltd
12.9.1 Tongfu Microelectronics Co., Ltd Company Information
12.9.2 Tongfu Microelectronics Co., Ltd Overview
12.9.3 Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.9.4 Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Tongfu Microelectronics Co., Ltd Recent Developments
12.10 Tianshui Huatian Technology Co., Ltd
12.10.1 Tianshui Huatian Technology Co., Ltd Company Information
12.10.2 Tianshui Huatian Technology Co., Ltd Overview
12.10.3 Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.10.4 Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Tianshui Huatian Technology Co., Ltd Recent Developments
12.11 United Microelectronics
12.11.1 United Microelectronics Company Information
12.11.2 United Microelectronics Overview
12.11.3 United Microelectronics Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.11.4 United Microelectronics Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 United Microelectronics Recent Developments
12.12 SFA Semicon
12.12.1 SFA Semicon Company Information
12.12.2 SFA Semicon Overview
12.12.3 SFA Semicon Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.12.4 SFA Semicon Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 SFA Semicon Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Flip Chip CSP (FCCSP) Package Industry Chain Analysis
13.2 Flip Chip CSP (FCCSP) Package Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Flip Chip CSP (FCCSP) Package Production Mode & Process
13.4 Flip Chip CSP (FCCSP) Package Sales and Marketing
13.4.1 Flip Chip CSP (FCCSP) Package Sales Channels
13.4.2 Flip Chip CSP (FCCSP) Package Distributors
13.5 Flip Chip CSP (FCCSP) Package Customers
14 Flip Chip CSP (FCCSP) Package Market Dynamics
14.1 Flip Chip CSP (FCCSP) Package Industry Trends
14.2 Flip Chip CSP (FCCSP) Package Market Drivers
14.3 Flip Chip CSP (FCCSP) Package Market Challenges
14.4 Flip Chip CSP (FCCSP) Package Market Restraints
15 Key Finding in The Global Flip Chip CSP (FCCSP) Package Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer

 

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Summary

FCCSP (Flip Chip Chip Scale Package) offers chip scale capacity for I/Os around 200 or less. FCCSP provides better protection for chip and better solder joint reliability compared with direct chip attach (DCA) or chip on board (COB). FCCSP is more superior to known good die (KGD) in low-cost test and burn-in, and performs comparable electrical function with KGD. FCCSP features thin and small profile, and lightweight packages.
The global Flip Chip CSP (FCCSP) Package market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The US & Canada market for Flip Chip CSP (FCCSP) Package is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The China market for Flip Chip CSP (FCCSP) Package is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The Europe market for Flip Chip CSP (FCCSP) Package is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.

The global key manufacturers of Flip Chip CSP (FCCSP) Package include Amkor, Taiwan Semiconductor Manufacturing, ASE Group, Intel Corporation, JCET Group Co.,Ltd, Samsung Group, SPIL, Powertech Technology and Tongfu Microelectronics Co., Ltd, etc. In 2022, the global top five players had a share approximately % in terms of revenue.
In terms of production side, this report researches the Flip Chip CSP (FCCSP) Package production, growth rate, market share by manufacturers and by region (region level and country level), from 2018 to 2023, and forecast to 2029.
In terms of consumption side, this report focuses on the sales of Flip Chip CSP (FCCSP) Package by region (region level and country level), by company, by Type and by Application. from 2018 to 2023 and forecast to 2029.

Report Includes:
This report presents an overview of global market for Flip Chip CSP (FCCSP) Package, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2018 - 2022, estimates for 2023, and projections of CAGR through 2029.
This report researches the key producers of Flip Chip CSP (FCCSP) Package, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Flip Chip CSP (FCCSP) Package, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.

This report focuses on the Flip Chip CSP (FCCSP) Package sales, revenue, market share and industry ranking of main manufacturers, data from 2018 to 2023. Identification of the major stakeholders in the global Flip Chip CSP (FCCSP) Package market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2018 to 2029. Evaluation and forecast the market size for Flip Chip CSP (FCCSP) Package sales, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including Amkor, Taiwan Semiconductor Manufacturing, ASE Group, Intel Corporation, JCET Group Co.,Ltd, Samsung Group, SPIL, Powertech Technology and Tongfu Microelectronics Co., Ltd, etc.

By Company
Amkor
Taiwan Semiconductor Manufacturing
ASE Group
Intel Corporation
JCET Group Co.,Ltd
Samsung Group
SPIL
Powertech Technology
Tongfu Microelectronics Co., Ltd
Tianshui Huatian Technology Co., Ltd
United Microelectronics
SFA Semicon
Segment by Type
Bare Die Type
Molded (CUF, MUF) Type
SiP Type
Hybrid (fcSCSP) Type
Others
Segment by Application
Auto and Transportation
Consumer Electronics
Communication
Others
Production by Region
North America
Europe
China
Japan
South Korea
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Middle East, Africa, Latin America
Brazil
Mexico
Turkey
Israel
GCC Countries

Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc.), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Flip Chip CSP (FCCSP) Package production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Flip Chip CSP (FCCSP) Package in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 4: Detailed analysis of Flip Chip CSP (FCCSP) Package manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by type, by application and by country, sales and revenue for each segment.
Chapter 8: Europe by type, by application and by country, sales and revenue for each segment.
Chapter 9: China by type and by application sales and revenue for each segment.
Chapter 10: Asia (excluding China) by type, by application and by region, sales and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by type, by application and by country, sales and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Flip Chip CSP (FCCSP) Package sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.



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Table of Contents

1 Study Coverage
1.1 Flip Chip CSP (FCCSP) Package Product Introduction
1.2 Market by Type
1.2.1 Global Flip Chip CSP (FCCSP) Package Market Size by Type, 2018 VS 2022 VS 2029
1.2.2 Bare Die Type
1.2.3 Molded (CUF, MUF) Type
1.2.4 SiP Type
1.2.5 Hybrid (fcSCSP) Type
1.2.6 Others
1.3 Market by Application
1.3.1 Global Flip Chip CSP (FCCSP) Package Market Size by Application, 2018 VS 2022 VS 2029
1.3.2 Auto and Transportation
1.3.3 Consumer Electronics
1.3.4 Communication
1.3.5 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Flip Chip CSP (FCCSP) Package Production
2.1 Global Flip Chip CSP (FCCSP) Package Production Capacity (2018-2029)
2.2 Global Flip Chip CSP (FCCSP) Package Production by Region: 2018 VS 2022 VS 2029
2.3 Global Flip Chip CSP (FCCSP) Package Production by Region
2.3.1 Global Flip Chip CSP (FCCSP) Package Historic Production by Region (2018-2023)
2.3.2 Global Flip Chip CSP (FCCSP) Package Forecasted Production by Region (2024-2029)
2.3.3 Global Flip Chip CSP (FCCSP) Package Production Market Share by Region (2018-2029)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Executive Summary
3.1 Global Flip Chip CSP (FCCSP) Package Revenue Estimates and Forecasts 2018-2029
3.2 Global Flip Chip CSP (FCCSP) Package Revenue by Region
3.2.1 Global Flip Chip CSP (FCCSP) Package Revenue by Region: 2018 VS 2022 VS 2029
3.2.2 Global Flip Chip CSP (FCCSP) Package Revenue by Region (2018-2023)
3.2.3 Global Flip Chip CSP (FCCSP) Package Revenue by Region (2024-2029)
3.2.4 Global Flip Chip CSP (FCCSP) Package Revenue Market Share by Region (2018-2029)
3.3 Global Flip Chip CSP (FCCSP) Package Sales Estimates and Forecasts 2018-2029
3.4 Global Flip Chip CSP (FCCSP) Package Sales by Region
3.4.1 Global Flip Chip CSP (FCCSP) Package Sales by Region: 2018 VS 2022 VS 2029
3.4.2 Global Flip Chip CSP (FCCSP) Package Sales by Region (2018-2023)
3.4.3 Global Flip Chip CSP (FCCSP) Package Sales by Region (2024-2029)
3.4.4 Global Flip Chip CSP (FCCSP) Package Sales Market Share by Region (2018-2029)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global Flip Chip CSP (FCCSP) Package Sales by Manufacturers
4.1.1 Global Flip Chip CSP (FCCSP) Package Sales by Manufacturers (2018-2023)
4.1.2 Global Flip Chip CSP (FCCSP) Package Sales Market Share by Manufacturers (2018-2023)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of Flip Chip CSP (FCCSP) Package in 2022
4.2 Global Flip Chip CSP (FCCSP) Package Revenue by Manufacturers
4.2.1 Global Flip Chip CSP (FCCSP) Package Revenue by Manufacturers (2018-2023)
4.2.2 Global Flip Chip CSP (FCCSP) Package Revenue Market Share by Manufacturers (2018-2023)
4.2.3 Global Top 10 and Top 5 Companies by Flip Chip CSP (FCCSP) Package Revenue in 2022
4.3 Global Flip Chip CSP (FCCSP) Package Sales Price by Manufacturers
4.4 Global Key Players of Flip Chip CSP (FCCSP) Package, Industry Ranking, 2021 VS 2022 VS 2023
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Flip Chip CSP (FCCSP) Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Product Offered and Application
4.8 Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Flip Chip CSP (FCCSP) Package Sales by Type
5.1.1 Global Flip Chip CSP (FCCSP) Package Historical Sales by Type (2018-2023)
5.1.2 Global Flip Chip CSP (FCCSP) Package Forecasted Sales by Type (2024-2029)
5.1.3 Global Flip Chip CSP (FCCSP) Package Sales Market Share by Type (2018-2029)
5.2 Global Flip Chip CSP (FCCSP) Package Revenue by Type
5.2.1 Global Flip Chip CSP (FCCSP) Package Historical Revenue by Type (2018-2023)
5.2.2 Global Flip Chip CSP (FCCSP) Package Forecasted Revenue by Type (2024-2029)
5.2.3 Global Flip Chip CSP (FCCSP) Package Revenue Market Share by Type (2018-2029)
5.3 Global Flip Chip CSP (FCCSP) Package Price by Type
5.3.1 Global Flip Chip CSP (FCCSP) Package Price by Type (2018-2023)
5.3.2 Global Flip Chip CSP (FCCSP) Package Price Forecast by Type (2024-2029)
6 Market Size by Application
6.1 Global Flip Chip CSP (FCCSP) Package Sales by Application
6.1.1 Global Flip Chip CSP (FCCSP) Package Historical Sales by Application (2018-2023)
6.1.2 Global Flip Chip CSP (FCCSP) Package Forecasted Sales by Application (2024-2029)
6.1.3 Global Flip Chip CSP (FCCSP) Package Sales Market Share by Application (2018-2029)
6.2 Global Flip Chip CSP (FCCSP) Package Revenue by Application
6.2.1 Global Flip Chip CSP (FCCSP) Package Historical Revenue by Application (2018-2023)
6.2.2 Global Flip Chip CSP (FCCSP) Package Forecasted Revenue by Application (2024-2029)
6.2.3 Global Flip Chip CSP (FCCSP) Package Revenue Market Share by Application (2018-2029)
6.3 Global Flip Chip CSP (FCCSP) Package Price by Application
6.3.1 Global Flip Chip CSP (FCCSP) Package Price by Application (2018-2023)
6.3.2 Global Flip Chip CSP (FCCSP) Package Price Forecast by Application (2024-2029)
7 US & Canada
7.1 US & Canada Flip Chip CSP (FCCSP) Package Market Size by Type
7.1.1 US & Canada Flip Chip CSP (FCCSP) Package Sales by Type (2018-2029)
7.1.2 US & Canada Flip Chip CSP (FCCSP) Package Revenue by Type (2018-2029)
7.2 US & Canada Flip Chip CSP (FCCSP) Package Market Size by Application
7.2.1 US & Canada Flip Chip CSP (FCCSP) Package Sales by Application (2018-2029)
7.2.2 US & Canada Flip Chip CSP (FCCSP) Package Revenue by Application (2018-2029)
7.3 US & Canada Flip Chip CSP (FCCSP) Package Sales by Country
7.3.1 US & Canada Flip Chip CSP (FCCSP) Package Revenue by Country: 2018 VS 2022 VS 2029
7.3.2 US & Canada Flip Chip CSP (FCCSP) Package Sales by Country (2018-2029)
7.3.3 US & Canada Flip Chip CSP (FCCSP) Package Revenue by Country (2018-2029)
7.3.4 United States
7.3.5 Canada
8 Europe
8.1 Europe Flip Chip CSP (FCCSP) Package Market Size by Type
8.1.1 Europe Flip Chip CSP (FCCSP) Package Sales by Type (2018-2029)
8.1.2 Europe Flip Chip CSP (FCCSP) Package Revenue by Type (2018-2029)
8.2 Europe Flip Chip CSP (FCCSP) Package Market Size by Application
8.2.1 Europe Flip Chip CSP (FCCSP) Package Sales by Application (2018-2029)
8.2.2 Europe Flip Chip CSP (FCCSP) Package Revenue by Application (2018-2029)
8.3 Europe Flip Chip CSP (FCCSP) Package Sales by Country
8.3.1 Europe Flip Chip CSP (FCCSP) Package Revenue by Country: 2018 VS 2022 VS 2029
8.3.2 Europe Flip Chip CSP (FCCSP) Package Sales by Country (2018-2029)
8.3.3 Europe Flip Chip CSP (FCCSP) Package Revenue by Country (2018-2029)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China Flip Chip CSP (FCCSP) Package Market Size by Type
9.1.1 China Flip Chip CSP (FCCSP) Package Sales by Type (2018-2029)
9.1.2 China Flip Chip CSP (FCCSP) Package Revenue by Type (2018-2029)
9.2 China Flip Chip CSP (FCCSP) Package Market Size by Application
9.2.1 China Flip Chip CSP (FCCSP) Package Sales by Application (2018-2029)
9.2.2 China Flip Chip CSP (FCCSP) Package Revenue by Application (2018-2029)
10 Asia (excluding China)
10.1 Asia Flip Chip CSP (FCCSP) Package Market Size by Type
10.1.1 Asia Flip Chip CSP (FCCSP) Package Sales by Type (2018-2029)
10.1.2 Asia Flip Chip CSP (FCCSP) Package Revenue by Type (2018-2029)
10.2 Asia Flip Chip CSP (FCCSP) Package Market Size by Application
10.2.1 Asia Flip Chip CSP (FCCSP) Package Sales by Application (2018-2029)
10.2.2 Asia Flip Chip CSP (FCCSP) Package Revenue by Application (2018-2029)
10.3 Asia Flip Chip CSP (FCCSP) Package Sales by Region
10.3.1 Asia Flip Chip CSP (FCCSP) Package Revenue by Region: 2018 VS 2022 VS 2029
10.3.2 Asia Flip Chip CSP (FCCSP) Package Revenue by Region (2018-2029)
10.3.3 Asia Flip Chip CSP (FCCSP) Package Sales by Region (2018-2029)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Market Size by Type
11.1.1 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Sales by Type (2018-2029)
11.1.2 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Revenue by Type (2018-2029)
11.2 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Market Size by Application
11.2.1 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Sales by Application (2018-2029)
11.2.2 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Revenue by Application (2018-2029)
11.3 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Sales by Country
11.3.1 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Revenue by Country: 2018 VS 2022 VS 2029
11.3.2 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Revenue by Country (2018-2029)
11.3.3 Middle East, Africa and Latin America Flip Chip CSP (FCCSP) Package Sales by Country (2018-2029)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 Amkor
12.1.1 Amkor Company Information
12.1.2 Amkor Overview
12.1.3 Amkor Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.1.4 Amkor Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Amkor Recent Developments
12.2 Taiwan Semiconductor Manufacturing
12.2.1 Taiwan Semiconductor Manufacturing Company Information
12.2.2 Taiwan Semiconductor Manufacturing Overview
12.2.3 Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.2.4 Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Taiwan Semiconductor Manufacturing Recent Developments
12.3 ASE Group
12.3.1 ASE Group Company Information
12.3.2 ASE Group Overview
12.3.3 ASE Group Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.3.4 ASE Group Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 ASE Group Recent Developments
12.4 Intel Corporation
12.4.1 Intel Corporation Company Information
12.4.2 Intel Corporation Overview
12.4.3 Intel Corporation Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.4.4 Intel Corporation Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Intel Corporation Recent Developments
12.5 JCET Group Co.,Ltd
12.5.1 JCET Group Co.,Ltd Company Information
12.5.2 JCET Group Co.,Ltd Overview
12.5.3 JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.5.4 JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 JCET Group Co.,Ltd Recent Developments
12.6 Samsung Group
12.6.1 Samsung Group Company Information
12.6.2 Samsung Group Overview
12.6.3 Samsung Group Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.6.4 Samsung Group Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Samsung Group Recent Developments
12.7 SPIL
12.7.1 SPIL Company Information
12.7.2 SPIL Overview
12.7.3 SPIL Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.7.4 SPIL Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 SPIL Recent Developments
12.8 Powertech Technology
12.8.1 Powertech Technology Company Information
12.8.2 Powertech Technology Overview
12.8.3 Powertech Technology Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.8.4 Powertech Technology Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Powertech Technology Recent Developments
12.9 Tongfu Microelectronics Co., Ltd
12.9.1 Tongfu Microelectronics Co., Ltd Company Information
12.9.2 Tongfu Microelectronics Co., Ltd Overview
12.9.3 Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.9.4 Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Tongfu Microelectronics Co., Ltd Recent Developments
12.10 Tianshui Huatian Technology Co., Ltd
12.10.1 Tianshui Huatian Technology Co., Ltd Company Information
12.10.2 Tianshui Huatian Technology Co., Ltd Overview
12.10.3 Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.10.4 Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Tianshui Huatian Technology Co., Ltd Recent Developments
12.11 United Microelectronics
12.11.1 United Microelectronics Company Information
12.11.2 United Microelectronics Overview
12.11.3 United Microelectronics Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.11.4 United Microelectronics Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 United Microelectronics Recent Developments
12.12 SFA Semicon
12.12.1 SFA Semicon Company Information
12.12.2 SFA Semicon Overview
12.12.3 SFA Semicon Flip Chip CSP (FCCSP) Package Sales, Price, Revenue and Gross Margin (2018-2023)
12.12.4 SFA Semicon Flip Chip CSP (FCCSP) Package Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 SFA Semicon Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Flip Chip CSP (FCCSP) Package Industry Chain Analysis
13.2 Flip Chip CSP (FCCSP) Package Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Flip Chip CSP (FCCSP) Package Production Mode & Process
13.4 Flip Chip CSP (FCCSP) Package Sales and Marketing
13.4.1 Flip Chip CSP (FCCSP) Package Sales Channels
13.4.2 Flip Chip CSP (FCCSP) Package Distributors
13.5 Flip Chip CSP (FCCSP) Package Customers
14 Flip Chip CSP (FCCSP) Package Market Dynamics
14.1 Flip Chip CSP (FCCSP) Package Industry Trends
14.2 Flip Chip CSP (FCCSP) Package Market Drivers
14.3 Flip Chip CSP (FCCSP) Package Market Challenges
14.4 Flip Chip CSP (FCCSP) Package Market Restraints
15 Key Finding in The Global Flip Chip CSP (FCCSP) Package Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer

 

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注文の手続きはどのようになっていますか?


1)お客様からの御問い合わせをいただきます。
2)見積書やサンプルの提示をいたします。
3)お客様指定、もしくは弊社の発注書をメール添付にて発送してください。
4)データリソース社からレポート発行元の調査会社へ納品手配します。
5) 調査会社からお客様へ納品されます。最近は、pdfにてのメール納品が大半です。


お支払方法の方法はどのようになっていますか?


納品と同時にデータリソース社よりお客様へ請求書(必要に応じて納品書も)を発送いたします。
お客様よりデータリソース社へ(通常は円払い)の御振り込みをお願いします。
請求書は、納品日の日付で発行しますので、翌月最終営業日までの当社指定口座への振込みをお願いします。振込み手数料は御社負担にてお願いします。
お客様の御支払い条件が60日以上の場合は御相談ください。
尚、初めてのお取引先や個人の場合、前払いをお願いすることもあります。ご了承のほど、お願いします。


データリソース社はどのような会社ですか?


当社は、世界各国の主要調査会社・レポート出版社と提携し、世界各国の市場調査レポートや技術動向レポートなどを日本国内の企業・公官庁及び教育研究機関に提供しております。
世界各国の「市場・技術・法規制などの」実情を調査・収集される時には、データリソース社にご相談ください。
お客様の御要望にあったデータや情報を抽出する為のレポート紹介や調査のアドバイスも致します。



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