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This report contains market size and forecasts of Thin Wafers Temporary Bonding Equipment and Materials in China, including the following market information:
China Thin Wafers Temporary Bonding Equipment and Materials Market Revenue, 2016-2021, 2022-2027, ($ millions)
China top five Thin Wafers Temporary Bonding Equipment and Materials companies in 2020 (%)
The global Thin Wafers Temporary Bonding Equipment and Materials market size is expected to growth from US$ XX million in 2020 to US$ XX million by 2027; it is expected to grow at a CAGR of XX% during 2021-2027.
The China Thin Wafers Temporary Bonding Equipment and Materials market was valued at US$ XX million in 2020 and is projected to reach US$ XX million by 2027, at a CAGR of XX% during the forecast period.
QYResearch has surveyed the Thin Wafers Temporary Bonding Equipment and Materials Companies and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
China Thin Wafers Temporary Bonding Equipment and Materials Market, By Type, 2016-2021, 2022-2027 ($ Millions)
China Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, By Type, 2020 (%)
Chemical Debonding
Hot Sliding Debonding
Mechanical Debonding
Laser Debonding

China Thin Wafers Temporary Bonding Equipment and Materials Market, By Application, 2016-2021, 2022-2027 ($ Millions)
China Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, By Application, 2020 (%)
< 100 µm Wafers
below 40µm Wafers

Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Thin Wafers Temporary Bonding Equipment and Materials revenues in China market, 2016-2021 (Estimated), ($ millions)
Key companies Thin Wafers Temporary Bonding Equipment and Materials revenues share in China market, 2020 (%)
Further, the report presents profiles of competitors in the market, key players include:
3M
ABB
Accretech
AGC
AMD
Cabot
Corning
Crystal Solar
Dalsa
DoubleCheck Semiconductors
1366 Technologies
Ebara
ERS
Hamamatsu
IBM
Intel
LG Innotek
Mitsubishi Electric
Qualcomm
Robert Bosch
Samsung
Sumitomo Chemical

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目次

1 Introduction to Research & Analysis Reports
1.1 Thin Wafers Temporary Bonding Equipment and Materials Market Definition
1.2 Market Segments
1.2.1 Segment by Type
1.2.2 Segment by Application
1.3 China Thin Wafers Temporary Bonding Equipment and Materials Market Overview
1.4 Methodology & Sources of Information
1.4.1 Research Methodology
1.4.2 Research Process
1.4.3 Base Year

2 China Thin Wafers Temporary Bonding Equipment and Materials Overall Market Size
2.1 China Thin Wafers Temporary Bonding Equipment and Materials Market Size: 2021 VS 2027
2.2 China Thin Wafers Temporary Bonding Equipment and Materials Revenue, Prospects & Forecasts: 2016-2027
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints

3 Company Landscape
3.1 Top Thin Wafers Temporary Bonding Equipment and Materials Players in China Market
3.2 Top China Thin Wafers Temporary Bonding Equipment and Materials Companies Ranked by Revenue
3.3 China Thin Wafers Temporary Bonding Equipment and Materials Revenue by Companies
3.4 Top 3 and Top 5 Thin Wafers Temporary Bonding Equipment and Materials Companies in China Market, by Revenue in 2020
3.5 Companies Thin Wafers Temporary Bonding Equipment and Materials Product Type
3.6 Tier 1, Tier 2 and Tier 3 Thin Wafers Temporary Bonding Equipment and Materials Players in China Market
3.6.1 List of Tier 1 Thin Wafers Temporary Bonding Equipment and Materials Companies in China
3.6.2 List of Tier 2 and Tier 3 Thin Wafers Temporary Bonding Equipment and Materials Companies in China

4 Sights by Type
4.1 Overview
4.1.1 By Type - China Thin Wafers Temporary Bonding Equipment and Materials Market Size Markets, 2021 & 2027
4.1.2 Chemical Debonding
4.1.3 Hot Sliding Debonding
4.1.4 Mechanical Debonding
4.1.5 Laser Debonding
4.2 By Type - China Thin Wafers Temporary Bonding Equipment and Materials Revenue & Forecasts
4.2.1 By Type - China Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2016-2021
4.2.2 By Type - China Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2022-2027
4.2.3 By Type - China Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2016-2027

5 Sights by Application
5.1 Overview
5.1.1 By Application - China Thin Wafers Temporary Bonding Equipment and Materials Market Size, 2021 & 2027
5.1.2 < 100 µm Wafers
5.1.3 below 40µm Wafers
5.2 By Application - China Thin Wafers Temporary Bonding Equipment and Materials Revenue & Forecasts
5.2.1 By Application - China Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2016-2021
5.2.2 By Application - China Thin Wafers Temporary Bonding Equipment and Materials Revenue, 2022-2027
5.2.3 By Application - China Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share, 2016-2027

6 Thin Wafers Temporary Bonding Equipment and Materials Companies Profiles
6.1 3M
6.1.1 3M Company Details
6.1.2 3M Business Overview
6.1.3 3M Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.1.4 3M Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.1.5 3M Recent Developments
6.2 ABB
6.2.1 ABB Company Details
6.2.2 ABB Business Overview
6.2.3 ABB Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.2.4 ABB Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.2.5 ABB Recent Developments
6.3 Accretech
6.3.1 Accretech Company Details
6.3.2 Accretech Business Overview
6.3.3 Accretech Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.3.4 Accretech Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.3.5 Accretech Recent Developments
6.4 AGC
6.4.1 AGC Company Details
6.4.2 AGC Business Overview
6.4.3 AGC Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.4.4 AGC Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.4.5 AGC Recent Developments
6.5 AMD
6.5.1 AMD Company Details
6.5.2 AMD Business Overview
6.5.3 AMD Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.5.4 AMD Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.5.5 AMD Recent Developments
6.6 Cabot
6.6.1 Cabot Company Details
6.6.2 Cabot Business Overview
6.6.3 Cabot Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.6.4 Cabot Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.6.5 Cabot Recent Developments
6.7 Corning
6.7.1 Corning Company Details
6.7.2 Corning Business Overview
6.7.3 Corning Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.7.4 Corning Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.7.5 Corning Recent Developments
6.8 Crystal Solar
6.8.1 Crystal Solar Company Details
6.8.2 Crystal Solar Business Overview
6.8.3 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.8.4 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.8.5 Crystal Solar Recent Developments
6.9 Dalsa
6.9.1 Dalsa Company Details
6.9.2 Dalsa Business Overview
6.9.3 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.9.4 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.9.5 Dalsa Recent Developments
6.10 DoubleCheck Semiconductors
6.10.1 DoubleCheck Semiconductors Company Details
6.10.2 DoubleCheck Semiconductors Business Overview
6.10.3 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.10.4 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.10.5 DoubleCheck Semiconductors Recent Developments
6.11 1366 Technologies
6.11.1 1366 Technologies Company Details
6.11.2 1366 Technologies Business Overview
6.11.3 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.11.4 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.11.5 1366 Technologies Recent Developments
6.12 Ebara
6.12.1 Ebara Company Details
6.12.2 Ebara Business Overview
6.12.3 Ebara Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.12.4 Ebara Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.12.5 Ebara Recent Developments
6.13 ERS
6.13.1 ERS Company Details
6.13.2 ERS Business Overview
6.13.3 ERS Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.13.4 ERS Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.13.5 ERS Recent Developments
6.14 Hamamatsu
6.14.1 Hamamatsu Company Details
6.14.2 Hamamatsu Business Overview
6.14.3 Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.14.4 Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.14.5 Hamamatsu Recent Developments
6.15 IBM
6.15.1 IBM Company Details
6.15.2 IBM Business Overview
6.15.3 IBM Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.15.4 IBM Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.15.5 IBM Recent Developments
6.16 Intel
6.16.1 Intel Company Details
6.16.2 Intel Business Overview
6.16.3 Intel Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.16.4 Intel Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.16.5 Intel Recent Developments
6.17 LG Innotek
6.17.1 LG Innotek Company Details
6.17.2 LG Innotek Business Overview
6.17.3 LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.17.4 LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.17.5 LG Innotek Recent Developments
6.18 Mitsubishi Electric
6.18.1 Mitsubishi Electric Company Details
6.18.2 Mitsubishi Electric Business Overview
6.18.3 Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.18.4 Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.18.5 Mitsubishi Electric Recent Developments
6.19 Qualcomm
6.19.1 Qualcomm Company Details
6.19.2 Qualcomm Business Overview
6.19.3 Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.19.4 Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.19.5 Qualcomm Recent Developments
6.20 Robert Bosch
6.20.1 Robert Bosch Company Details
6.20.2 Robert Bosch Business Overview
6.20.3 Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.20.4 Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.20.5 Robert Bosch Recent Developments
6.21 Samsung
6.21.1 Samsung Company Details
6.21.2 Samsung Business Overview
6.21.3 Samsung Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.21.4 Samsung Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.21.5 Samsung Recent Developments
6.22 Sumitomo Chemical
6.22.1 Sumitomo Chemical Company Details
6.22.2 Sumitomo Chemical Business Overview
6.22.3 Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Introduction
6.22.4 Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Revenue in China Market (2016-2021)
6.22.5 Sumitomo Chemical Recent Developments

7 Conclusion
8 Appendix
8.1 Note
8.2 Examples of Clients
8.3 Author Details
8.4 Disclaimer