高密度相互接続PCB市場調査レポート-2032年までの予測

High Density Interconnect PCB Market Research Report - Forecast till 2032

高密度相互接続PCB市場調査レポート-2032年までの予測市場概要高密度相互接続PCB市場は、2023～2032年の調査期間中に17.3%の大幅なCAGRを示すと予測されている。HDIはHigh Density Interconnector（高密度... もっと見る

出版社	出版年月	電子版価格	ページ数	言語
Market Research Future マーケットリサーチフューチャー (MRFR)	2023年8月10日	US$7,250 ライセンス・価格情報注文方法はこちら	100	英語

目次
図表リスト

サマリー

高密度相互接続PCB市場調査レポート-2032年までの予測

市場概要
高密度相互接続PCB市場は、2023～2032年の調査期間中に17.3%の大幅なCAGRを示すと予測されている。HDIはHigh Density Interconnector（高密度相互接続基板）の略称で、小型の視覚障害と被覆開口イノベーションを利用した、適度に高いライン循環密度を持つ回路基板です。これは、電気的な実行を改善し、ハードウェアの重量とサイズを引き下げるために不可欠です。HDI PCBの計画は、技術革新の限界をプッシュし、主要な市場組織は、開発の最前線にあり、最も厳しい特定を満たしています。HDIプリント基板製造への関心は、革新的な飛躍とHDIプリント基板がハイテクアプリケーションに対応する様々な利点のために高まっています。より少ないスペースに、より少ないレイヤーで、より多くのイノベーションを絞り込むことは、特定のギアと最先端のハイライト、より良いライン、およびタイトな弾力性のための能力を必要とする多くのPCBメーカーを制限します。HDIプリント回路基板は、ミニチュアビア、ブラインドビア、スルーインクッション、スタックビア、スタッガードビアなど、複雑な要素を利用して基板領域を拡大しながら、実行性と利便性を向上させています。
市場セグメント別洞察
相互接続層別では、高密度相互接続（HDI）PCB市場は1層（1+N+1）HDI、2層以上（2+N+2）HDI、全層HDIに分類される。予測期間中、All Layers HDIセグメントの需要が急拡大する見込みです。
アプリケーション別では、高密度相互接続（HDI）PCB市場は民生用電子機器、自動車、軍事・防衛、ヘルスケア、産業・製造、その他に区分される。予測期間中、自動車セグメントは急成長が見込まれている。
地域別インサイト

アジア太平洋地域は、予測期間中、高密度相互接続PCB市場で大きなシェアを占めると予想される。
ハードウェア、航空、IT、テレコム、近代的、自動車ビジネスにおけるプリント回路シートの利用が増加していることが、評価取引に関するビジネス分野の拡大を促進している。技術革新への関心の高まり、中国や日本のような国の事業による研究開発への注目の高まり、政府の支援は、ビジネスセクターの拡大を促進する原動力の一部です。様々な最終用途分野での今後のアプリケーションを検討するためのプリント回路基板の研究開発における一貫した努力は、予測される期間中に市場開発を促進することになっている。最新のガジェットの利用拡大に伴うプリント回路シートへの関心の高まりが、予測期間中の市場拡大を促進すると思われる。例えば中国には、銅箔、ガラス繊維、タール、銅被覆カバー、PCBを最終部品とする近代的なチェーンが混在している。欧米諸国がアジアの購入者向けハードウェアに憧れを抱くようになり、市場は大幅に拡大した。
主要プレーヤー
世界の高密度相互接続（HDI）PCBの主要プレーヤーは、Compeq Manufacturing Co.Ltd.、AT & S Austria Technologie & Systemtechnik Aktiengesellschaft、Unimicron、Tripod Technology、Zhen Ding Techである。Unimicron、Epec, LLC、TTM Technologies Inc.、RayMing Technology、HiTech Circuits、NCAB Group Corporation、Millennium Circuits Limited、Tripod Technology、AKM Meadville、Meiko Electronics Co.

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TABLE OF CONTENTS
1. EXECUTIVE SUMMARY
1.1. MARKET ATTRACTIVENESS ANALYSIS
1.1.1. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY INTERCONNECTION LAYERS
1.1.2. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY APPLICATION
1.1.3. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY REGION
2. MARKET INTRODUCTION
2.1. DEFINITION
2.2. SCOPE OF THE STUDY
2.3. MARKET STRUCTURE
2.4. KEY BUYING CRITERIA
2.5. MACRO FACTOR INDICATOR ANALYSIS
3. RESEARCH METHODOLOGY
3.1. RESEARCH PROCESS
3.2. PRIMARY RESEARCH
3.3. SECONDARY RESEARCH
3.4. MARKET SIZE ESTIMATION
3.5. FORECAST MODEL
3.6. LIST OF ASSUMPTIONS
4. MARKET DYNAMICS
4.1. INTRODUCTION
4.2. DRIVERS
4.2.1. INCREASING BENEFITS OF HIGH DENSITY INTERCONNECT TECHNOLOGY
4.2.2. RISING DEMAND OF HDI PCBS IN COMPLEX ELECTRONIC DEVICES
4.2.3. GROWING DEMAND FOR CIRCUIT MINIATURIZATION
4.2.4. DRIVERS IMPACT ANALYSIS
4.3. CHALLENGES
4.3.1. INTRODUCING HDI TECHNOLOGY IN PCB FOR SPACE APPLICATION
4.3.2. 5G TECHNOLOGY RELATED PCB DESIGN CHALLENGES
4.3.3. CHALLENGES FACED IN ANY-LAYER INTERCONNECTION HIGH DENSITY (ALV HDI) IN MASS PRODUCTIONS
4.3.4. RESTRAINTS IMPACT ANALYSIS
4.4. OPPORTUNITIES
4.4.1. TECHNOLOGICAL ADVANCEMENT IN HDI PCB
4.4.2. 5G TECHNOLOGY AS A GROWTH OPPORTUNITY FOR PCB DESIGNERS
4.4.3. RISING DEMAND FOR CONSUMER ELECTRONICS
4.5. IMPACT OF COVID-19
4.5.1. IMPACT ON SEMICONDUCTOR INDUSTRY
4.5.2. IMPACT ON THE MEDICAL ELECTRONIC INDUSTRY
4.5.3. IMPACT ON GLOBAL PCB SUPPLY CHAIN
4.5.4. RISING NEED FOR DIGITALIZATION OF THE SUPPLY CHAIN
5. MARKET FACTOR ANALYSIS
5.1. VALUE CHAIN ANALYSIS/SUPPLY CHAIN ANALYSIS
5.2. PORTER’S FIVE FORCES MODEL
5.3. BARGAINING POWER OF SUPPLIERS
5.4. BARGAINING POWER OF BUYERS
5.5. THREAT OF NEW ENTRANTS
5.6. THREAT OF SUBSTITUTES
5.7. INTENSITY OF RIVALRY
6. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY INTERCONNECTION LAYERS
6.1. INTRODUCTION
6.2. 1 LAYER (1+N+1) HDI
6.3. 2 OR MORE LAYERS (2+N+2) HDI
6.4. ALL LAYERS HDI
7. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY APPLICATION
7.1. INTRODUCTION
7.2. CONSUMER ELECTRONICS
7.3. AUTOMOTIVE
7.4. MILITARY AND DEFENSE
7.5. HEALTHCARE
7.6. INDUSTRIAL/ MANUFACTURING
7.7. OTHERS
8. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET SIZE ESTIMATION & FORECAST, BY REGION
8.1. INTRODUCTION
8.2. NORTH AMERICA
8.2.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
8.2.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.2.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.2.4. US
8.2.5. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.2.6. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.2.7. CANADA
8.2.8. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.2.9. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.2.10. MEXICO
8.2.11. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.2.12. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.3. EUROPE
8.3.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
8.3.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.3.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.3.4. UK
8.3.4.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.3.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.3.5. GERMANY
8.3.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.3.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.3.6. FRANCE
8.3.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.3.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.3.7. REST OF EUROPE
8.3.7.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.3.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.4. ASIA-PACIFIC
8.4.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
8.4.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.4.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.4.4. CHINA
8.4.4.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.4.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.4.5. JAPAN
8.4.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.4.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.4.6. INDIA
8.4.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.4.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.4.7. REST OF ASIA-PACIFIC
8.4.7.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.4.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.5. MIDDLE EAST & AFRICA
8.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
8.6. SOUTH AMERICA
8.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
8.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
9. COMPETITIVE LANDSCAPE
9.1. INTRODUCTION
9.2. KEY DEVELOPMENTS & GROWTH STRATEGIES
9.3. COMPETITOR BENCHMARKING
9.4. VENDOR SHARE ANALYSIS, 2021(% SHARE)
10. COMPANY PROFILES
10.1. UNIMICRON, EPEC, LLC
10.1.1. COMPANY OVERVIEW
10.1.2. FINANCIAL OVERVIEW
10.1.3. SOLUTION/SERVICES OFFERED
10.1.4. KEY DEVELOPMENTS
10.1.5. SWOT ANALYSIS
10.1.6. KEY STRATEGIES
10.2. TTM TECHNOLOGIES INC.
10.2.1. COMPANY OVERVIEW
10.2.2. FINANCIAL OVERVIEW
10.2.3. SOLUTION/SERVICES OFFERED
10.2.4. KEY DEVELOPMENTS
10.2.5. SWOT ANALYSIS
10.2.6. KEY STRATEGIES
10.3. RAYMING TECHNOLOGY
10.3.1. COMPANY OVERVIEW
10.3.2. FINANCIAL OVERVIEW
10.3.3. SOLUTION/SERVICES OFFERED
10.3.4. KEY DEVELOPMENTS
10.3.5. SWOT ANALYSIS
10.3.6. KEY STRATEGIES
10.4. HITECH CIRCUITS
10.4.1. COMPANY OVERVIEW
10.4.2. FINANCIAL OVERVIEW
10.4.3. SOLUTION/SERVICES OFFERED
10.4.4. KEY DEVELOPMENTS
10.4.5. SWOT ANALYSIS
10.4.6. KEY STRATEGIES
10.5. NCAB GROUP CORPORATION
10.5.1. COMPANY OVERVIEW
10.5.2. FINANCIAL OVERVIEW
10.5.3. SOLUTION/SERVICES OFFERED
10.5.4. KEY DEVELOPMENTS
10.5.5. SWOT ANALYSIS
10.5.6. KEY STRATEGIES
10.6. MILLENNIUM CIRCUITS LIMITED
10.6.1. COMPANY OVERVIEW
10.6.2. FINANCIAL OVERVIEW
10.6.3. SOLUTION/SERVICES OFFERED
10.6.4. KEY DEVELOPMENTS
10.6.5. SWOT ANALYSIS
10.6.6. KEY STRATEGIES
10.7. TRIPOD TECHNOLOGY
10.7.1. COMPANY OVERVIEW
10.7.2. FINANCIAL OVERVIEW
10.7.3. SOLUTION/SERVICES OFFERED
10.7.4. KEY DEVELOPMENTS
10.7.5. SWOT ANALYSIS
10.7.6. KEY STRATEGIES
10.8. ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED
10.8.1. COMPANY OVERVIEW
10.8.2. FINANCIAL OVERVIEW
10.8.3. SOLUTION/SERVICES OFFERED
10.8.4. KEY DEVELOPMENTS
10.8.5. SWOT ANALYSIS
10.8.6. KEY STRATEGIES
10.9. AKM MEADVILLE
10.9.1. COMPANY OVERVIEW
10.9.2. FINANCIAL OVERVIEW
10.9.3. SOLUTION/SERVICES OFFERED
10.9.4. KEY DEVELOPMENTS
10.9.5. SWOT ANALYSIS
10.9.6. KEY STRATEGIES
10.10. MEIKO ELECTRONICS CO., LTD.
10.10.1. COMPANY OVERVIEW
10.10.2. FINANCIAL OVERVIEW
10.10.3. SOLUTION/SERVICES OFFERED
10.10.4. KEY DEVELOPMENTS
10.10.5. SWOT ANALYSIS
10.10.6. KEY STRATEGIES
10.11. SIERRA CIRCUITS INC.
10.11.1. COMPANY OVERVIEW
10.11.2. FINANCIAL OVERVIEW
10.11.3. SOLUTION/SERVICES OFFERED
10.11.4. KEY DEVELOPMENTS
10.11.5. SWOT ANALYSIS
10.11.6. KEY STRATEGIES
10.12. COMPEQ MANUFACTURING CO., LTD.
10.12.1. COMPANY OVERVIEW
10.12.2. FINANCIAL OVERVIEW
10.12.3. SOLUTION/SERVICES OFFERED
10.12.4. KEY DEVELOPMENTS
10.12.5. SWOT ANALYSIS
10.12.6. KEY STRATEGIES
10.13. AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)
10.13.1. COMPANY OVERVIEW
10.13.2. FINANCIAL OVERVIEW
10.13.3. SOLUTION/SERVICES OFFERED
10.13.4. KEY DEVELOPMENTS
10.13.5. SWOT ANALYSIS
10.13.6. KEY STRATEGIES
10.14. ADVANCED CIRCUITS
10.14.1. COMPANY OVERVIEW
10.14.2. FINANCIAL OVERVIEW
10.14.3. SOLUTION/SERVICES OFFERED
10.14.4. KEY DEVELOPMENTS
10.14.5. SWOT ANALYSIS
10.14.6. KEY STRATEGIES
10.15. DAP CORPORATION
10.15.1. COMPANY OVERVIEW
10.15.2. FINANCIAL OVERVIEW
10.15.3. SOLUTION/SERVICES OFFERED
10.15.4. KEY DEVELOPMENTS
10.15.5. SWOT ANALYSIS
10.15.6. KEY STRATEGIES

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図表リスト

LIST OF TABLES
TABLE 1 MARKET SYNOPSIS 17
TABLE 2 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 41
TABLE 3 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 43
TABLE 4 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY REGION, 2018-2032 (USD MILLION) 46
TABLE 5 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 48
TABLE 6 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 49
TABLE 7 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 49
TABLE 8 US HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 50
TABLE 9 US HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 50
TABLE 10 CANADA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 50
TABLE 11 CANADA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 51
TABLE 12 MEXICO HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 51
TABLE 13 MEXICO HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 51
TABLE 14 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 55
TABLE 15 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 55
TABLE 16 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 56
TABLE 17 GERMANY HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 57
TABLE 18 GERMANY HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 57
TABLE 19 FRANCE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 57
TABLE 20 FRANCE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 58
TABLE 21 UK HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 58
TABLE 22 UK HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 58
TABLE 23 REST OF EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 59
TABLE 24 REST OF EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 59
TABLE 25 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 61
TABLE 26 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 62
TABLE 27 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 62
TABLE 28 CHINA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 63
TABLE 29 CHINA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 63
TABLE 30 JAPAN HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 63
TABLE 31 JAPAN HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 64
TABLE 32 INDIA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 64
TABLE 33 INDIA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 64
TABLE 34 REST OF ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 65
TABLE 35 REST OF ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 65
TABLE 36 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 67
TABLE 37 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 67
TABLE 38 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 68
TABLE 39 MIDDLE EAST & AFRICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 69
TABLE 40 MIDDLE EAST & AFRICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 69
TABLE 41 SOUTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 69
TABLE 42 SOUTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 70
TABLE 43 BUSINESS EXPANSIONS/ACQUISITIONS 73
TABLE 44 UNIMICRON: PRODUCTS/SOLUTIONS/SERVICES OFFERED 77
TABLE 45 EPEC, LLC: PRODUCTS/SOLUTIONS/SERVICES OFFERED 78
TABLE 46 EPEC, LLC: KEY DEVELOPMENTS 78
TABLE 47 TTM TECHNOLOGIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 81
TABLE 48 RAYMING TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 83
TABLE 49 HITECH CIRCUITS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 84
TABLE 50 NCAB GROUP CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 86
TABLE 51 NCAB GROUP CORPORATION: KEY DEVELOPMENTS 86
TABLE 52 MILENNIUM CIRCUITS LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 89
TABLE 53 TRIPOD TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 90
TABLE 54 ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 93
TABLE 55 AKM MEADVILLE: PRODUCTS/SOLUTIONS/SERVICES OFFERED 96
TABLE 56 MEIKO ELECTRONICS CO., LTD: PRODUCTS/SOLUTIONS/SERVICES OFFERED 99
TABLE 57 MEIKO ELECTRONICS CO., LTD: KEY DEVELOPMENTS 100
TABLE 58 SIERRA CIRCUITS INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 102
TABLE 59 COMPEQ MANUFACTURING CO. LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 104
TABLE 60 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT: PRODUCTS/SOLUTIONS/SERVICES OFFERED 106
TABLE 61 ADVANCED CIRCUIT.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 108
TABLE 62 DAP CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 109

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Table of Contents
List of Tables/Graphs

Summary

High Density Interconnect PCB Market Research Report - Forecast till 2032

Market Overview
High-Density Interconnect PCB Market is projected to exhibit a significant CAGR of 17.3% during the review period 2023 - 2032. HDI is a truncation for High Density Interconnector, which is a circuit board with a moderately high line circulation density that utilizes miniature visually impaired and covered opening innovation. It is vital in improving electrical execution and bringing down the weight and size of hardware. HDI PCB plans push the limits of innovation, and key market organizations are at the very front of the development, meeting the most tough particulars. The interest for HDI PCB fabricating has been growing because of innovative leap forwards and the various benefits HDI PCBs accommodate high-tech applications. Squeezing more innovation into less space with less layers limits numerous PCB makers who need particular gear and the capacity for cutting edge highlights, better lines, and tighter resiliences. HDI printed circuit board plans utilize complex elements, for example, miniature vias, blind vias, through in-cushion, and stacked and staggered vias to expand board region while upgrading execution and convenience.
Market Segment Insights
By Interconnection Layers, the High Density Interconnect (HDI) PCB market has been categorized as 1 Layer (1+N+1) HDI, 2 or more layers (2+N+2) HDI, and All Layers HDI. During the projected period, the demand for All Layers HDI segment is expected to grow rapidly.
Based on Application, the High Density Interconnect (HDI) PCB market has been segmented into Consumer Electronics, Automotive, Military and Defense, Healthcare, Industrial/ Manufacturing, and Others. During the projected period, the automotive segment is expected to rise rapidly.
Regional Insights

Asia Pacific is expected to have a significant share of the High Density Interconnect PCB Market during the projected period.
The rising utilization of printed circuit sheets in the hardware, aviation, IT, and telecom, modern, and auto businesses is driving business sector extension regarding esteem deals. Developing interest for innovation, more noteworthy interest in Research and development by undertakings in nations like China and Japan, and government backing are a portion of the drivers driving business sector extension. Consistent endeavors in printed circuit board Research and development to examine forthcoming applications in various end-use areas are supposed to drive market development during the projected period. Developing interest for printed circuit sheets in view of the expanded utilization of modern gadgets is supposed to drive market extension during the gauge time frame. China, for instance, has a muddled modern chain that incorporates copper foil, glass fiber, tar, copper-clad covers, and PCBs as its last part. The market has extended significantly more as Western nations' longing for Asian purchaser hardware has taken off.
Major Players
The major players in the global High Density Interconnect (HDI) PCB are Compeq Manufacturing Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unimicron, Tripod Technology, and Zhen Ding Tech. Unimicron, Epec, LLC, TTM Technologies Inc., RayMing Technology, HiTech Circuits, NCAB Group Corporation, Millennium Circuits Limited, Tripod Technology, AKM Meadville, Meiko Electronics Co., Ltd., Sierra Circuits Inc., Compeq Manufacturing Co., Ltd., Advanced Circuits, and DAP Corporation.

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高密度相互接続PCB市場調査レポート-2032年までの予測

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ご注文は、お電話またはWEBから承ります。お見積もりの作成もお気軽にご相談ください。

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Market Research Future社はどのような調査会社ですか?

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データリソース社はどのような会社ですか?