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モールド配線デバイス(MID)市場:製品タイプ別(アンテナ&コネクティビティ、センサー)、プロセス別(レーザーダイレクトストラクチャリング、ツーショットモールド)、産業別(家電、通信、医療)、地域別 2030年までの世界予測


Molded Interconnect Device (MID) Market by Product Type (Antennae & Connectivity, Sensor),by Process (Laser Direct Structuring, Two-shot Molding), by Industry (Consumer Electronics, Telecommunication, Medical) and Geography Global Forecast up to 2030

モールド成形相互接続装置(MID)市場の現在の規模を推定するために、この調査では主に4つの作業を行った。市場およびその親市場、同業他社市場に関するデータを収集するため、綿密な二次調査を実施した。次の段... もっと見る

 

 

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2023年11月14日 US$4,500
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モールド成形相互接続装置(MID)市場の現在の規模を推定するために、この調査では主に4つの作業を行った。市場およびその親市場、同業他社市場に関するデータを収集するため、綿密な二次調査を実施した。次の段階では、バリューチェーン全体の業界専門家を対象に、これらの結論、仮説、サイジングを確認するための一次調査を実施した。全体的な市場規模を概算するために、トップダウンとボトムアップの2つの手法が用いられた。その後、データの三角測量と市場のブレークダウンを用いて、各セクションおよびサブセグメントの市場規模を推定した。
本レポートのために重要な質的・量的データを収集するため、主要調査段階で供給側と需要側の多数の一次情報源に質問を行った。供給側からの主な情報源としては、モールド成形相互接続デバイス(MID)分野の主要企業や組織のCEO、副社長、マーケティング担当役員、技術・イノベーション担当役員、関連役員などの業界専門家が挙げられた。市場統計、市場内訳、市場規模推定、市場予測、データ三角測量の計算を含む市場エンジニアリングの完了後、データを収集し、決定された重要な数値を確認・検証するために、かなりの量の一次調査が実施された。
市場エンジニアリングのプロセス全体を通して、トップダウンアプローチとボトムアップアプローチに加え、いくつかのデータ三角測量法を使用し、本調査で説明する依存性の高いサブ市場、および成型相互接続デバイス(MID)市場の規模を推定、検証しました。
成形相互接続装置(MID)市場:製品タイプ別
- アンテナおよび接続モジュール
- センサー
- コネクタ&スイッチ
- 照明システム
- その他
成形相互接続デバイス(MID)市場:プロセス別
- レーザーダイレクトストラクチャリング(LDS)
- ツーショット成形
- フィルム技術
成形相互接続デバイス(MID)市場:分野別
- 電気通信
- 家電
- 自動車
- 医療
- 産業用
- 軍事・航空宇宙
成形相互接続デバイス(MID)市場:地域別
- 北米
米国
カナダ
- 欧州
ドイツ
o イギリス
o フランス
o イタリア
o スペイン
o 残りのヨーロッパ(RoE)
- アジア太平洋(APAC)
o 中国
o 日本
o インド
o オーストラリア
o 韓国
o その他のアジア太平洋地域(RoAPAC)
- ラテンアメリカ(LATAM)
o ブラジル
o アルゼンチン
o その他の南米諸国
- 中東・アフリカ(MEA)
o アラブ首長国連邦
o トルコ
o サウジアラビア
o 南アフリカ
o その他の中東・アフリカ
モールド成形相互接続装置市場は、照明システム、センサー、コネクター&スイッチ、アンテナ&接続モジュール、その他などの製品カテゴリーに分けられる。2021年のモールド成形相互接続装置市場で最大の収益シェアを生み出したカテゴリーは、アンテナ&接続モジュールである。MIDは、ほぼすべてのタイプの接続デバイスに機械的および電気的コンポーネントを統合できるため、製品の小型化だけでなく新しい機能の創出も可能にする。
モールド成形相互接続デバイス市場は、フィルム法、ツーショットモールディング、レーザーダイレクトストラクチャリング(LDS)の3つのプロセスに分類される。2021年、モールド成形相互接続デバイス市場は、ツーショットモールディングセグメントが大きな収益シェアを占めている。手頃な価格で一貫性のあるMIDを製造する信頼性の高い確立された技術は、ツーショットモールディングである。部品は、2つの異なる成形サイクル、さまざまな恒温ポリマー、無電解めっき手順を使用する2ショット成形で製造される。
モールド成形相互接続デバイス市場は、民生用電子機器、自動車、医療、産業、軍事・航空宇宙、電気通信の各分野に分けられる。2021年のモールド成形相互接続デバイス市場で最大の収益シェアを占めるのは、民生用電子機器カテゴリである。エンターテインメント、通信、職場の生産性向上など、日常的な使用を目的とした電子ガジェットは民生用電子機器として知られている。コンシューマーエレクトロニクスには、仕事、遊び、コミュニケーションに使用されるほぼすべての電子機器が含まれる。
クラウドネイティブストレージ市場は、地域別に北米、欧州、アジア太平洋、中南米で調査されている。モールド成形相互接続デバイス市場は、2021年にアジア太平洋地域で最も高い収益シェアを記録した。この主な原因には、半導体デバイスや商品の生産者だけでなく、多くのアジアのOEMが含まれる。特に韓国、台湾、中国では、最先端の半導体製造サービスや電子システム組立サービスを提供することに長けている。さらに、半導体電子機器メーカーは、台湾や中国などに生産を委託することで大きな利益を得ている。
- 本レポートは、MID(Molded Interconnect Device)市場を牽引し、機会を提供している最も重要な属性を示しています。
- この調査レポートは、成形相互接続装置(MID)市場の成長を市場のいくつかのセグメントに基づいて詳細に分析します。
- 成形相互接続装置(MID)市場の過去と現在の動向予測を提示します。
- また、成型相互接続装置(MID)市場の主要企業の主要戦略や能力などの競争分析も提示しています。

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目次

Table of Contents
1. Executive Summary
2. Industry Outlook
2.1. Industry Overview
2.2. Industry Trends
3. Market Snapshot
3.1. Market Definition
3.2. Market Outlook
3.2.1. Porter Five Forces
3.3. Related Markets
4. Market characteristics
4.1. Market Overview
4.2. Market Segmentation
4.3. Market Dynamics
4.3.1. Drivers
4.3.2. Restraints
4.3.3. Opportunities
4.4. DRO - Impact Analysis
5. Product Type: Market Size & Analysis
5.1. Overview
5.2. Antennae & Connectivity Modules
5.3. Sensors
5.4. Connectors & Switches
5.5. Lighting Systems
5.6. Others
6. Process: Market Size & Analysis
6.1. Overview
6.2. Laser Direct Structuring (LDS)
6.3. Two-Shot Molding
6.4. Film Techniques
7. Vertical : Market Size & Analysis
7.1. Overview
7.2. Telecommunications
7.3. Consumer Electronics
7.4. Automotive
7.5. Medical
7.6. Industrial
7.7. Military & Aerospace
8. Geography: Market Size & Analysis
8.1. Overview
8.2. North America (U.S., Mexico, Canada)
8.3. Europe (France, Germany, UK, Italy, Netherlands, Spain, Russia, Rest of Europe)
8.4. Asia Pacific (Japan, China, India, Australia, South East Asia, Rest of APAC)
8.5. Latin America (Brazil, Argentina)
8.6. Middle East & Africa (Saudi Arabia, UAE, South Africa, Rest of Middle East and Africa)
9. Competitive Landscape
9.1. Competitor Comparison Analysis
9.2. Market Developments
9.2.1. Mergers and Acquisitions, Legal, Awards, Partnerships
9.2.2. Product Launches and execution
10. Vendor Profiles
10.1. Molex (US)
10.1.1. Overview
10.1.2. Financial Overview
10.1.3. Product Offerings
10.1.4. Developments
10.1.5. Business Strategy
10.2. TE Connectivity (Switzerland)
10.2.1. Overview
10.2.2. Financial Overview
10.2.3. Product Offerings
10.2.4. Developments
10.2.5. Business Strategy
10.3. Amphenol Corporation (US)
10.3.1. Overview
10.3.2. Financial Overview
10.3.3. Product Offerings
10.3.4. Developments
10.3.5. Business Strategy
10.4. LPKF LASER & ELECTRONICS (GERMANY)
10.4.1. Overview
10.4.2. Financial Overview
10.4.3. Product Offerings
10.4.4. Developments
10.4.5. Business Strategy
10.5. Harting (Germany)
10.5.1. Overview
10.5.2. Financial Overview
10.5.3. Product Offerings
10.5.4. Developments
10.5.5. Business Strategy
10.6. Arlington Plating Company (US)
10.6.1. Overview
10.6.2. Financial Overview
10.6.3. Product Offerings
10.6.4. Developments
10.6.5. Business Strategy
10.7. MID Solutions (Germany)
10.7.1. Overview
10.7.2. Financial Overview
10.7.3. Product Offerings
10.7.4. Developments
10.7.5. Business Strategy
10.8. 2E Mechatronic (Germany)
10.8.1. Overview
10.8.2. Financial Overview
10.8.3. Product Offerings
10.8.4. Developments
10.8.5. Business Strategy
10.9. KYOCERA AVX (US)
10.9.1. Overview
10.9.2. Financial Overview
10.9.3. Product Offerings
10.9.4. Developments
10.9.5. Business Strategy
10.10. Taoglas (Dublin)
10.10.1. Overview
10.10.2. Financial Overview
10.10.3. Product Offerings
10.10.4. Developments
10.10.5. Business Strategy

11. Analyst Opinion
12. Annexure
12.1. Report Scope
12.2. Market Definitions
12.3. Research Methodology
12.3.1. Data Collation and In-house Estimation
12.3.2. Market Triangulation
12.3.3. Forecasting
12.4. Report Assumptions
12.5. Declarations
12.6. Stakeholders
12.7. LPKF Laser & Electronics (Germany)
12.8. Abbreviations

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図表リスト

Tables
TABLE 1. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 2. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR ANTENNAE & CONNECTIVITY MODULES, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 3. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR SENSORS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 4. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR CONNECTORS & SWITCHES, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 5. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR LIGHTING SYSTEMS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 6. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR OTHERS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 7. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 8. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR LASER DIRECT STRUCTURING (LDS), 2021-2030 (USD BILLION)
TABLE 9. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR TWO-SHOT MOLDING, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 10. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR FILM TECHNIQUES, 2021-2030 (USD BILLION)
TABLE 11. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY VERTICAL, 2021-2030 (USD BILLION)
TABLE 12. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR TELECOMMUNICATIONS, 2021-2030 (USD BILLION)
TABLE 13. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR CONSUMER ELECTRONICS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 14. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR AUTOMOTIVE, 2021-2030 (USD BILLION)
TABLE 15. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR MEDICAL, 2021-2030 (USD BILLION)
TABLE 16. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR INDUSTRIAL, 2021-2030 (USD BILLION)
TABLE 17. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR MILITARY & AEROSPACE, 2021-2030 (USD BILLION)
TABLE 18. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION)
TABLE 19. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 20. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 21. U.S MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 22. U.S MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 23. CANADA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 24. CANADA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 25. MEXICO MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 26. MEXICO MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 27. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION)
TABLE 28. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 29. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 30. GERMANY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 31. GERMANY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 32. U.K MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 33. U.K MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 34. FRANCE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 35. FRANCE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 36. ITALY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 37. ITALY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 38. SPAIN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 39. SPAIN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 40. ROE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 41. ROE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 42. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION)
TABLE 43. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 44. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 45. CHINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 46. CHINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 47. INDIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 48. INDIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 49. JAPAN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 50. JAPAN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 51. REST OF APAC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 52. REST OF APAC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 53. LATIN AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 54. LATIN AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 55. BRAZIL MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 56. BRAZIL MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 57. ARGENTINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 58. ARGENTINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 59. MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 60. MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 61. SAUDI ARABIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 62. SAUDI ARABIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 63. UAE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 64. UAE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 65. REST OF MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 66. REST OF MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 67. MOLEX (US): FINANCIALS
TABLE 68. MOLEX (US): PRODUCTS & SERVICES
TABLE 69. MOLEX (US): RECENT DEVELOPMENTS
TABLE 70. TE CONNECTIVITY (SWITZERLAND): FINANCIALS
TABLE 71. TE CONNECTIVITY (SWITZERLAND): PRODUCTS & SERVICES
TABLE 72. TE CONNECTIVITY (SWITZERLAND): RECENT DEVELOPMENTS
TABLE 73. AMPHENOL CORPORATION (US): FINANCIALS
TABLE 74. AMPHENOL CORPORATION (US): PRODUCTS & SERVICES
TABLE 75. AMPHENOL CORPORATION (US): RECENT DEVELOPMENTS
TABLE 76. LPKF LASER & ELECTRONICS (GERMANY): FINANCIALS
TABLE 77. LPKF LASER & ELECTRONICS (GERMANY): PRODUCTS & SERVICES
TABLE 78. LPKF LASER & ELECTRONICS (GERMANY): RECENT DEVELOPMENTS
TABLE 79. HARTING (GERMANY): FINANCIALS
TABLE 80. HARTING (GERMANY): PRODUCTS & SERVICES
TABLE 81. HARTING (GERMANY): RECENT DEVELOPMENTS
TABLE 82. ARLINGTON PLATING COMPANY (US): FINANCIALS
TABLE 83. ARLINGTON PLATING COMPANY (US): PRODUCTS & SERVICES
TABLE 84. ARLINGTON PLATING COMPANY (US): RECENT DEVELOPMENTS
TABLE 85. MID SOLUTIONS (GERMANY).: FINANCIALS
TABLE 86. MID SOLUTIONS (GERMANY).: PRODUCTS & SERVICES
TABLE 87. MID SOLUTIONS (GERMANY).: RECENT DEVELOPMENTS
TABLE 88. 2E MECHATRONIC (GERMANY): FINANCIALS
TABLE 89. 2E MECHATRONIC (GERMANY): PRODUCTS & SERVICES
TABLE 90. 2E MECHATRONIC (GERMANY): RECENT DEVELOPMENTS
TABLE 91. KYOCERA AVX (US): FINANCIALS
TABLE 92. KYOCERA AVX (US): PRODUCTS & SERVICES
TABLE 93. KYOCERA AVX (US): RECENT DEVELOPMENTS
TABLE 94. TAOGLAS (DUBLIN): FINANCIALS
TABLE 95. TAOGLAS (DUBLIN): PRODUCTS & SERVICES
TABLE 96. TAOGLAS (DUBLIN): RECENT DEVELOPMENTS

 

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Summary

In order to estimate the present size of the moulded interconnect device (MID) market, the study covered four main tasks. To gather data about the market, as well as its parent and peer markets, in-depth secondary research was conducted. The following stage involved conducting primary research to confirm these conclusions, hypotheses, and sizing with industry experts throughout the value chain. Two methodologies were utilised to approximate the overall market size: top-down and bottom-up. The size of the market for each section and subsegment was then estimated using data triangulation and market breakdown.
Numerous primary sources from the supply and demand sides were questioned during the main research phase to gather crucial qualitative and quantitative data for this report. Industry specialists including CEOs, VPs, marketing directors, directors of technology and innovation, and associated executives from significant firms and organisations in the moulded interconnect device (MID) sector were the main sources from the supply side. Following the completion of market engineering, which involved the computation of market statistics, market breakdown, market size estimates, market forecasting, and data triangulation, a significant amount of primary research was carried out in order to collect data and confirm and validate the crucial figures that were determined.
Several data triangulation techniques, in addition to top-down and bottom-up approaches, have been used throughout the market engineering process to estimate and validate the size of the dependent submarkets described in this study, as well as the moulded interconnect device (MID) market.
Molded Interconnect Device (MID) Market based on Product Type:
• Antennae & Connectivity Modules
• Sensors
• Connectors & Switches
• Lighting Systems
• Others
Molded Interconnect Device (MID) Market based on Process:
• Laser Direct Structuring (LDS)
• Two-Shot Molding
• Film Techniques
Molded Interconnect Device (MID) Market, by Vertical:
• Telecommunications
• Consumer Electronics
• Automotive
• Medical
• Industrial
• Military & Aerospace
Molded Interconnect Device (MID) Market based on Geography:
• North America
o US
o Canada
• Europe
o Germany
o UK
o France
o Italy
o Spain
o Rest of Europe (RoE)
• Asia Pacific (APAC)
o China
o Japan
o India
o Australia
o South Korea
o Rest of Asia Pacific (RoAPAC)
• Latin America (LATAM)
o Brazil
o Argentina
o Rest of South America
• Middle East and Africa (MEA)
o UAE
o Turkey
o Saudi Arabia
o South Africa
o Rest of Middle East & Africa
The market for moulded connecting devices is divided into product categories such as lighting systems, sensors, connectors & switches, antennas & connectivity modules, and others. The category that generated the largest revenue share in the moulded interconnect device market in 2021 was antennas & connectivity modules. MIDs allow for the creation of new functionality as well as the downsizing of products because they can integrate mechanical and electrical components into nearly any type of connecting device.
The moulded interconnect device market is divided into three segments based on process: film methods, two-shot moulding, and laser direct structuring (LDS). In 2021, the moulded interconnect device market had a sizable revenue share from the two-shot moulding segment. A reliable and well-established technique for creating MIDs that is both affordable and consistent is two-shot moulding. The part is being made in two-shot moulding using two distinct moulding cycles, various thermostatic polymers, and an electroless plating procedure.
The market for moulded interconnect devices is divided into the following vertical segments: consumer electronics, automotive, medical, industrial, military & aerospace, and telecommunications. With the largest revenue share in the moulded interconnect device market in 2021, the consumer electronics category held the top spot. Electronic gadgets intended for daily use, such as those for entertainment, communications, and workplace productivity, are known as consumer electronics. Consumer electronics include almost all electronic equipment used for work, play, and communication.
The cloud native storage market is examined in North America, Europe, Asia Pacific, and Latin America based on region. The market for moulded interconnect devices saw its highest revenue share in the Asia Pacific region in 2021. The main causes of this include a number of Asian OEMs as well as producers of semiconductor devices and goods. In especially in South Korea, Taiwan, and China, the area has excelled in offering the most cutting-edge semiconductor fabrication services as well as electronic system assembly services. In addition, semiconductor electronics manufacturers gain a great deal from outsourcing their production to places like Taiwan and China.
• This report illustrates the most vital attributes of the Molded Interconnect Device (MID) Market, which are driving and providing opportunities.
• This research gives an in-depth analysis of the Molded Interconnect Device (MID) Market growth on the basis of several segments in the market.
• This report presents the predictions of the past and present trends of the Molded Interconnect Device (MID) Market.
• This study also presents the competitive analysis, such as key strategies and capabilities of major players of the Molded Interconnect Device (MID) Market.



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Table of Contents

Table of Contents
1. Executive Summary
2. Industry Outlook
2.1. Industry Overview
2.2. Industry Trends
3. Market Snapshot
3.1. Market Definition
3.2. Market Outlook
3.2.1. Porter Five Forces
3.3. Related Markets
4. Market characteristics
4.1. Market Overview
4.2. Market Segmentation
4.3. Market Dynamics
4.3.1. Drivers
4.3.2. Restraints
4.3.3. Opportunities
4.4. DRO - Impact Analysis
5. Product Type: Market Size & Analysis
5.1. Overview
5.2. Antennae & Connectivity Modules
5.3. Sensors
5.4. Connectors & Switches
5.5. Lighting Systems
5.6. Others
6. Process: Market Size & Analysis
6.1. Overview
6.2. Laser Direct Structuring (LDS)
6.3. Two-Shot Molding
6.4. Film Techniques
7. Vertical : Market Size & Analysis
7.1. Overview
7.2. Telecommunications
7.3. Consumer Electronics
7.4. Automotive
7.5. Medical
7.6. Industrial
7.7. Military & Aerospace
8. Geography: Market Size & Analysis
8.1. Overview
8.2. North America (U.S., Mexico, Canada)
8.3. Europe (France, Germany, UK, Italy, Netherlands, Spain, Russia, Rest of Europe)
8.4. Asia Pacific (Japan, China, India, Australia, South East Asia, Rest of APAC)
8.5. Latin America (Brazil, Argentina)
8.6. Middle East & Africa (Saudi Arabia, UAE, South Africa, Rest of Middle East and Africa)
9. Competitive Landscape
9.1. Competitor Comparison Analysis
9.2. Market Developments
9.2.1. Mergers and Acquisitions, Legal, Awards, Partnerships
9.2.2. Product Launches and execution
10. Vendor Profiles
10.1. Molex (US)
10.1.1. Overview
10.1.2. Financial Overview
10.1.3. Product Offerings
10.1.4. Developments
10.1.5. Business Strategy
10.2. TE Connectivity (Switzerland)
10.2.1. Overview
10.2.2. Financial Overview
10.2.3. Product Offerings
10.2.4. Developments
10.2.5. Business Strategy
10.3. Amphenol Corporation (US)
10.3.1. Overview
10.3.2. Financial Overview
10.3.3. Product Offerings
10.3.4. Developments
10.3.5. Business Strategy
10.4. LPKF LASER & ELECTRONICS (GERMANY)
10.4.1. Overview
10.4.2. Financial Overview
10.4.3. Product Offerings
10.4.4. Developments
10.4.5. Business Strategy
10.5. Harting (Germany)
10.5.1. Overview
10.5.2. Financial Overview
10.5.3. Product Offerings
10.5.4. Developments
10.5.5. Business Strategy
10.6. Arlington Plating Company (US)
10.6.1. Overview
10.6.2. Financial Overview
10.6.3. Product Offerings
10.6.4. Developments
10.6.5. Business Strategy
10.7. MID Solutions (Germany)
10.7.1. Overview
10.7.2. Financial Overview
10.7.3. Product Offerings
10.7.4. Developments
10.7.5. Business Strategy
10.8. 2E Mechatronic (Germany)
10.8.1. Overview
10.8.2. Financial Overview
10.8.3. Product Offerings
10.8.4. Developments
10.8.5. Business Strategy
10.9. KYOCERA AVX (US)
10.9.1. Overview
10.9.2. Financial Overview
10.9.3. Product Offerings
10.9.4. Developments
10.9.5. Business Strategy
10.10. Taoglas (Dublin)
10.10.1. Overview
10.10.2. Financial Overview
10.10.3. Product Offerings
10.10.4. Developments
10.10.5. Business Strategy

11. Analyst Opinion
12. Annexure
12.1. Report Scope
12.2. Market Definitions
12.3. Research Methodology
12.3.1. Data Collation and In-house Estimation
12.3.2. Market Triangulation
12.3.3. Forecasting
12.4. Report Assumptions
12.5. Declarations
12.6. Stakeholders
12.7. LPKF Laser & Electronics (Germany)
12.8. Abbreviations

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List of Tables/Graphs

Tables
TABLE 1. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 2. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR ANTENNAE & CONNECTIVITY MODULES, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 3. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR SENSORS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 4. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR CONNECTORS & SWITCHES, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 5. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR LIGHTING SYSTEMS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 6. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR OTHERS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 7. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 8. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR LASER DIRECT STRUCTURING (LDS), 2021-2030 (USD BILLION)
TABLE 9. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR TWO-SHOT MOLDING, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 10. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR FILM TECHNIQUES, 2021-2030 (USD BILLION)
TABLE 11. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY VERTICAL, 2021-2030 (USD BILLION)
TABLE 12. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR TELECOMMUNICATIONS, 2021-2030 (USD BILLION)
TABLE 13. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR CONSUMER ELECTRONICS, BY GEOGRAPHY, 2021-2030 (USD BILLION)
TABLE 14. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR AUTOMOTIVE, 2021-2030 (USD BILLION)
TABLE 15. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR MEDICAL, 2021-2030 (USD BILLION)
TABLE 16. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR INDUSTRIAL, 2021-2030 (USD BILLION)
TABLE 17. MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE FOR MILITARY & AEROSPACE, 2021-2030 (USD BILLION)
TABLE 18. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION)
TABLE 19. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 20. NORTH AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 21. U.S MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 22. U.S MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 23. CANADA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 24. CANADA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 25. MEXICO MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 26. MEXICO MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 27. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION)
TABLE 28. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 29. EUROPE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 30. GERMANY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 31. GERMANY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 32. U.K MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 33. U.K MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 34. FRANCE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 35. FRANCE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 36. ITALY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 37. ITALY MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 38. SPAIN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 39. SPAIN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 40. ROE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 41. ROE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 42. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY COUNTRY, 2021-2030 (USD BILLION)
TABLE 43. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 44. ASIA PACIFIC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 45. CHINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 46. CHINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 47. INDIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 48. INDIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 49. JAPAN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 50. JAPAN MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 51. REST OF APAC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 52. REST OF APAC MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 53. LATIN AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 54. LATIN AMERICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 55. BRAZIL MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 56. BRAZIL MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 57. ARGENTINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 58. ARGENTINA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 59. MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 60. MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 61. SAUDI ARABIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 62. SAUDI ARABIA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 63. UAE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 64. UAE MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 65. REST OF MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PRODUCT TYPE, 2021-2030 (USD BILLION)
TABLE 66. REST OF MIDDLE EAST AND AFRICA MOLDED INTERCONNECT DEVICE (MID) MARKET VALUE, BY PROCESS, 2021-2030 (USD BILLION)
TABLE 67. MOLEX (US): FINANCIALS
TABLE 68. MOLEX (US): PRODUCTS & SERVICES
TABLE 69. MOLEX (US): RECENT DEVELOPMENTS
TABLE 70. TE CONNECTIVITY (SWITZERLAND): FINANCIALS
TABLE 71. TE CONNECTIVITY (SWITZERLAND): PRODUCTS & SERVICES
TABLE 72. TE CONNECTIVITY (SWITZERLAND): RECENT DEVELOPMENTS
TABLE 73. AMPHENOL CORPORATION (US): FINANCIALS
TABLE 74. AMPHENOL CORPORATION (US): PRODUCTS & SERVICES
TABLE 75. AMPHENOL CORPORATION (US): RECENT DEVELOPMENTS
TABLE 76. LPKF LASER & ELECTRONICS (GERMANY): FINANCIALS
TABLE 77. LPKF LASER & ELECTRONICS (GERMANY): PRODUCTS & SERVICES
TABLE 78. LPKF LASER & ELECTRONICS (GERMANY): RECENT DEVELOPMENTS
TABLE 79. HARTING (GERMANY): FINANCIALS
TABLE 80. HARTING (GERMANY): PRODUCTS & SERVICES
TABLE 81. HARTING (GERMANY): RECENT DEVELOPMENTS
TABLE 82. ARLINGTON PLATING COMPANY (US): FINANCIALS
TABLE 83. ARLINGTON PLATING COMPANY (US): PRODUCTS & SERVICES
TABLE 84. ARLINGTON PLATING COMPANY (US): RECENT DEVELOPMENTS
TABLE 85. MID SOLUTIONS (GERMANY).: FINANCIALS
TABLE 86. MID SOLUTIONS (GERMANY).: PRODUCTS & SERVICES
TABLE 87. MID SOLUTIONS (GERMANY).: RECENT DEVELOPMENTS
TABLE 88. 2E MECHATRONIC (GERMANY): FINANCIALS
TABLE 89. 2E MECHATRONIC (GERMANY): PRODUCTS & SERVICES
TABLE 90. 2E MECHATRONIC (GERMANY): RECENT DEVELOPMENTS
TABLE 91. KYOCERA AVX (US): FINANCIALS
TABLE 92. KYOCERA AVX (US): PRODUCTS & SERVICES
TABLE 93. KYOCERA AVX (US): RECENT DEVELOPMENTS
TABLE 94. TAOGLAS (DUBLIN): FINANCIALS
TABLE 95. TAOGLAS (DUBLIN): PRODUCTS & SERVICES
TABLE 96. TAOGLAS (DUBLIN): RECENT DEVELOPMENTS

 

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