The Rise of PAM4 and 64QAM: A Competitive Analysis of Optical Modules & Components

PAM4と64QAMの登場：光モジュールとコンポーネントの競争分析

米国調査会社ヘビーリーディング社（Heavy Reading）の調査レポート「PAM4と64QAMの登場：光モジュールとコンポーネントの競争分析」は、主要なネットワーク、光モジュール、半導体の技術と25G、100G、200G... もっと見る

出版社	出版年月	電子版価格	ページ数	言語
Heavy Reading ヘビーリーディング社	2019年2月7日	US$3,495 エンタープライズライセンス（PDF）ライセンス・価格情報・注文方法はこちら	102	英語

Table of Contents

Summary

米国調査会社ヘビーリーディング社（Heavy Reading）の調査レポート「PAM4と64QAMの登場：光モジュールとコンポーネントの競争分析」は、主要なネットワーク、光モジュール、半導体の技術と25G、100G、200G、400G、600Gポートの用途について詳述し、光モジュールとコンポーネントを開発しているほとんどのベンダについて特定し分析している。通信機器メーカー、サービスプロバイダ、光モジュールベンダ、半導体ベンダなどに関心を持たれる光モジュールとコンポーネントそれ自体に関する詳細な情報に加えて、投資家などのより幅広い読者にも興味深い市場やエコシステム全体の発展に関する洞察も記載している。この市場で急成長している50社の主要ベンダの製品と戦略を査定・分析し、約500の光モジュールや150以上の半導体コンポーネントについても記載している。

EXECUTIVE SUMMARY（PDF）

The shift to cloud services and virtualized networks has put the data center in the middle of our world and meant that connectivity within data centers and between data centers has a huge impact on the delivery of business and personal services. Hyperscale data centers are being installed across the world and these all need connecting. To meet this demand, optical module and component suppliers are delivering new solutions based on PAM4 coding and 64 quadrature amplitude modulation (QAM), providing coherent modulation that will drive down the cost of connectivity and increase the bandwidth of each connection.

Connections to many servers are already 25 gigabits per second (Gbit/s) and links between switches in large data centers are already 100 Gbit/s. The introduction of SFP28 and QSFP28 modules integrating new technologies and built using efficient manufacturing techniques has driven down the cost of these connections and allowed massive growth in the market. The next stage is the introduction of 100G single lambda solutions and cost-effective 400G modules for links between switches. The physical layer (PHY) devices needed for this next step are already becoming available, 12.8 terabits per second (Tbit/s) switch devices are in production, and the first 400G Octal Small Form Factor Pluggable-Double Density (QSFP-DD) and OSFP optical modules are sampling.

The rise of the hyperscale data center operator has dramatically changed the market. The switch to 25G and 100G from 10G and 40G has happened very quickly. The sheer scale and numbers of data centers being installed or upgraded means that the new technologies can be shipped in volume as soon as the price is right, the components have been qualified, and the production lines are operational. We are now seeing the first 400G PHY devices and optical modules for data centers becoming available and companies are vying for market position as we wait for the leading hyperscale operators to commit to large deployments.

Many of those companies that have benefited from 25G and 100G are putting their investments into single lambda PAM4 100G and 400G solutions for the data center. This has required new PAM4 PHY devices designed to meet the power constraints of 400G OSFP and QSFP-DD modules. A few companies have also invested in 50G and 200G PAM4 PHYs, enabling a cost-effective upgrade from 25G and 100G. Heavy Reading expects 50G SFP56 and 200G QSFP56 modules to be interim solutions, but it is unclear how widespread their use will be or for how long. 40G was an interim solution that lasted for many years.

Coherent technology, originally developed for 100G long-haul networks, is now widely used for long-haul connections, including subsea, metro networks, and data center interconnect (DCI) between data centers. The market for DCI has grown rapidly, with many systems vendors offering solutions with 80 kilometers (km) to 500 km reach. For long-haul and metro applications, several leading equipment manufacturers continue to use in-house coherent digital signal processor (DSP) designs. Ciena has made its coherent DSP solution available to optical module vendors and Lumentum is now shipping 400G modules based on this design. The latest DSP application-specific integrated circuits (ASICs) are enabling 600G 64-Gbaud 64-QAM solutions and CFP2-DCO modules. The next step is the introduction of the 7 nanometer (nm) DSPs that will enable the cost-effective 400ZR modules planned for 400G links up to 100 km starting in 2020.

This continues to be a market in flux. Lumentum has completed the acquisition of Oclaro, Cisco has announced its intent to acquire Luxtera, and several Chinese optical module vendors have joined the charge to 400G in the data center. The PAM4 PHY devices required for 100G single lambda and 400G in the data center are proving to be very challenging to deliver. PAM4 PHY solutions in 28 nm and 14/16 nm technology have been sampling for more than 6 months and these are now being joined by 7 nm solutions.

The Rise of PAM4 and 64QAM: A Competitive Analysis of Optical Modules & Components identifies key networking, optical module, and semiconductor technologies, and details their application to 25G, 100G, 200G, 400G, and 600G ports, identifying and analyzing the full spectrum of vendors developing optical modules and components. The report includes not only granular information on the optical modules and components themselves—of interest to telecom equipment manufacturers, service providers, optical module vendors, and semiconductor vendors—but also insights into how the overall market and ecosystem is developing—of interest to a wide audience, including investors. The report evaluates and analyzes the products and strategies of 50 leading vendors in this rapidly growing market, including almost 500 optical modules and more than 150 semiconductor components.

COMPANIES COVERED

The Rise of PAM4 and 64QAM: A Competitive Analysis of Optical Modules & Components is published in PDF format.

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目次（PDF）

1. EXECUTIVE SUMMARY .................................................................................. 7
1.1 Key Findings ............................................................................................... 8
1.2 Companies Covered ..................................................................................... 9

2. 100/400G MARKETS & TECHNOLOGY ......................................................... 12
2.1 Market Overview ....................................................................................... 12
2.3 40G/100G Ethernet ................................................................................... 15
2.4 25/50/200G Ethernet ................................................................................. 18
2.5 400G Ethernet .......................................................................................... 18
2.6 InfiniBand ................................................................................................ 19
2.7 Fibre Channel ........................................................................................... 20
2.8 Sonet/SDH, DWDM and OTN ....................................................................... 21

3. OPTICAL MODULES FOR DATA CENTER & ENTERPRISE .............................. 22
3.1 25G, 50G, and 100G Optical Module Overview .............................................. 22
3.2 200G/400G Optical Module Overview ........................................................... 26
3.3 Active Cables ............................................................................................ 29
3.4 SFP28/56 Optical Modules .......................................................................... 32
3.5 QSFP28/QSFP56 Optical Modules................................................................. 37
3.6 QSFP-DD Optical Modules ........................................................................... 49
3.7 OSFP Optical Modules ................................................................................ 52
3.8 CFP Optical Modules .................................................................................. 53
3.9 CFP2 Optical Modules ................................................................................. 56
3.10 CFP4 Optical Modules ................................................................................. 59
3.11 CFP8 Optical Modules ................................................................................. 61
3.12 Cisco CPAK Optical Modules ........................................................................ 62

4. LONG-HAUL AND METRO SOLUTIONS ......................................................... 64
4.1 ODB, DPSK, DQPSK, and OOK Modulation .................................................... 64
4.2 DP-QPSK and Coherent Receiver ................................................................. 64
4.3 QAM Modulation ........................................................................................ 65
4.4 Metro/Long-Haul CFP Modules..................................................................... 66
4.5 Metro CFP2 Modules .................................................................................. 67
4.6 Long-Haul and Metro Transponder Modules .................................................. 69

5. 100g TO 600g SILICON DEVICES................................................................ 72
5.1 Coherent Transceiver Devices ..................................................................... 72
5.2 Gearbox/Mux Devices ................................................................................ 73
5.3 PAM4 PHY Devices ..................................................................................... 75
5.4 Multi-Lane CDR Devices ............................................................................. 78
5.5 Driver and Receiver Arrays ......................................................................... 80

6. OPTICAL MODULE VENDORS ...................................................................... 85
6.1 Acacia Communications Inc ........................................................................ 87
6.2 Accelink Technologies Co., Ltd. ................................................................... 87
6.3 Amphenol Corp. ........................................................................................ 87
6.4 Applied Optoelectronics Inc. ....................................................................... 88
6.5 Champion ONE.......................................................................................... 88
6.6 Cisco Systems Inc. .................................................................................... 88
6.7 ColorChip Inc. ........................................................................................... 89
6.8 Dust Photonics .......................................................................................... 89
6.9 Eoptolink Technology Inc. .......................................................................... 89
6.10 Finisar Corp. ............................................................................................. 89
6.11 FoxConn Interconnect Technology Limited .................................................... 90
6.12 Fujitsu Optical Components Ltd. .................................................................. 90
6.13 Gigalight (Shenzhen Gigalight Technology Co. Ltd.) ....................................... 90
6.14 Hisense Broadband Multimedia Technologies Co. Ltd. .................................... 90
6.15 InnoLight Technology Corp. ........................................................................ 91
6.16 Inphi Corp. ............................................................................................... 91
6.17 Intel Corp. ................................................................................................ 91
6.18 Kaiam Corp. ............................................................................................. 92
6.19 Lumentum Holdings ................................................................................... 92
6.20 Luxtera Inc. .............................................................................................. 92
6.21 Mellanox Technologies Ltd. ......................................................................... 93
6.22 Menara Networks ...................................................................................... 93
6.23 NEC Corp. ................................................................................................ 93
6.24 NeoPhotonics Corp. ................................................................................... 93
6.25 OE Solutions Co. Ltd. ................................................................................. 94
6.26 Oplink Communications LLC........................................................................ 94
6.27 Optcore Technology Co. Ltd. ....................................................................... 94
6.28 Shenzhen OPWAY Communication Co., Ltd ................................................... 94
6.29 ProLabs Ltd. ............................................................................................. 94
6.30 Reflex Photonics Inc. ................................................................................. 94
6.31 Smartoptics AS ......................................................................................... 95
6.32 Shenzhen Sourcelight Technology Co., Ltd. .................................................. 95
6.33 Source Photonics Inc. ................................................................................ 95
6.34 Sumitomo Electric Industries Ltd. ................................................................ 95
6.35 TE Connectivity Ltd. .................................................................................. 95
6.36 Wuhan RayOptek CO. Ltd. .......................................................................... 96

7. SILICON VENDORS ..................................................................................... 97
7.1 Achronix Semiconductor Corp. .................................................................... 97
7.2 Broadcom Corp. ........................................................................................ 98
7.3 Credo Semiconductor................................................................................. 98
7.4 Flex Logix Technologies Inc. ....................................................................... 99
7.5 Inphi Corp. ............................................................................................... 99
7.6 Integrated Device Technology ................................................................... 100
7.7 Intel Corp. .............................................................................................. 100
7.8 MACOM (M/A-COM) Technology Solutions Holdings Inc. ............................... 101
7.9 Marvell Technology Group Ltd ................................................................... 101
7.10 Max Linear Inc. ....................................................................................... 101
7.11 Mellanox Technologies Ltd. ....................................................................... 102
7.12 Microsemi Corp. ...................................................................................... 102
7.13 MoSys Inc. ............................................................................................. 102
7.14 MultiPhy Ltd. .......................................................................................... 103
7.15 NTT Electronics Corp................................................................................ 103
7.16 Semtech Corp. ........................................................................................ 103
7.17 Xilinx Inc. ............................................................................................... 104

8. TERMS OF USE

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